JPH0783176B2 - Soldering method for fine lead pitch parts - Google Patents
Soldering method for fine lead pitch partsInfo
- Publication number
- JPH0783176B2 JPH0783176B2 JP63247227A JP24722788A JPH0783176B2 JP H0783176 B2 JPH0783176 B2 JP H0783176B2 JP 63247227 A JP63247227 A JP 63247227A JP 24722788 A JP24722788 A JP 24722788A JP H0783176 B2 JPH0783176 B2 JP H0783176B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pad
- lead
- pads
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はQFP（Quad Flat Package）等の微小ピッチリー
ドのはんだ付け方法に関する。The present invention relates to a soldering method for fine pitch leads such as QFP (Quad Flat Package).
（従来の技術） 従来、QFPのリードはんだ付けは第３図に示すように、
実装基板上のはんだ付けパッドにクリームはんだを塗布
し（第３図（ａ））、その上にQFPのリードをマウント
し（第３図（ｂ））、その後リフロー炉によりはんだを
溶かしてはんだ付けパッドとリードをはんだ付けしてい
た。(Prior Art) Conventionally, QFP lead soldering is performed as shown in FIG.
Cream solder is applied to the soldering pad on the mounting board (Fig. 3 (a)), the QFP leads are mounted on it (Fig. 3 (b)), and then the solder is melted by a reflow oven and soldered. The pads and leads were soldered.
その後、リードピッチ（リードのセンター間間隔）が1m
m未満、リード間の間隔が0.5mm以下というように微小に
なって来たため、個々のはんだ付けパッドにクリームは
んだを塗布することが困難になって来た。After that, the lead pitch (the distance between the centers of the leads) is 1 m
Since the distance between the leads is less than 0.5 m and the distance between the leads is 0.5 mm or less, it has become difficult to apply the cream solder to each soldering pad.
そこで第４図（ａ）に示すようにはんだ付けパッドをつ
なぐような形でクリームはんだを塗布し、その上から第
４図（ｂ）に示すようにパッドの位置に対応させて部品
のリードを置き、その後はんだを溶かし、溶けたはんだ
の集中性を利用して第４図（ｃ）のようにリードとパッ
ドをはんだ付けしている。Therefore, as shown in FIG. 4 (a), cream solder is applied in such a form as to connect the soldering pads, and the lead of the component is made to correspond to the position of the pad as shown in FIG. 4 (b). After placing, the solder is melted, and the leads and pads are soldered as shown in FIG. 4 (c) by utilizing the concentration of the melted solder.
この場合、クリームはんだの量、塗布形状ははんだブリ
ッジを発生させないように予め設計し、それに基づき、
スクリーン印刷等によってはんだをパッドに塗布してい
る。In this case, the amount of cream solder and the coating shape are designed in advance so that solder bridges do not occur, and based on that,
Solder is applied to the pads by screen printing or the like.
（発明が解決しようとする課題） しかしながら、はんだの塗布量、塗布形状が設計されて
いるとはいえ、作業時における塗布量のばらつきや部品
リードのはんだ付着性のばらつきにより第４図（ｄ）に
示すようなはんだブリッジが生じることを完全に防止し
切れないという問題があった。(Problems to be Solved by the Invention) However, although the solder coating amount and the coating shape are designed, FIG. However, there is a problem in that it is not possible to completely prevent the occurrence of a solder bridge as shown in FIG.
本発明の目的は、上記従来の問題点に鑑みて、余剰のは
んだ玉を受け溜めるパッドを有する実装基板を用いて、
はんだ付けパッドをつなぐような形で塗布されたクリー
ムはんだをスポット加熱噴流で溶かしつつこの加熱噴流
を移動させることによりはんだブリッジの生じないはん
だ付け方法を提供することにある。In view of the above-mentioned conventional problems, the object of the present invention is to use a mounting board having a pad for receiving an excessive solder ball,
It is an object of the present invention to provide a soldering method in which a solder bridge is not generated by melting a cream solder applied in the form of connecting soldering pads with a spot heating jet while moving the heating jet.
（課題を解決するための手段） 本発明は、上記の目的を達成するために次の手段構成を
有する。(Means for Solving the Problem) The present invention has the following means configuration in order to achieve the above object.
即ち、本発明のはんだ付け方法は、部品リード接続用パ
ッドが微小間隔において配列され、該パッド列の端のパ
ッドの隣にはんだ溜り用パッドが設けられている基板に
部品リードをはんだ付けする際に、部品リード接続用パ
ッド列を前記微小間隔部分も含めてはんだコートし、該
はんだコートの上からパッドの位置に対応させて部品の
リードを載置し両者を加熱してパッドとリードをはんだ
付けする方法において前記パッド対応部分の少なくとも
１箇所にスポット加熱噴流を当て該パット部分のはんだ
を溶かしてはんだ玉を形成させ次いでスポット加熱噴流
をパッドの配列方向へ移動させ前記リードとパッドを順
次はんだ付けしつつ余剰はんだをはんだ溜り用パッドへ
吹き寄せることを特徴とする微小リードピッチ部品のは
んだ付け方法である。That is, the soldering method of the present invention is used when soldering component leads to a board in which component lead connection pads are arranged at minute intervals, and a solder pool pad is provided next to a pad at the end of the pad row. , The component lead connection pad row is solder-coated including the minute gap portion, and the component leads are placed from above the solder coat corresponding to the position of the pad and both are heated to solder the pad and the lead. In the attaching method, a spot heating jet is applied to at least one portion of the pad corresponding portion to melt the solder in the pad portion to form a solder ball, and then the spot heating jet is moved in the pad arranging direction to sequentially solder the lead and the pad. It is a soldering method for minute lead pitch components characterized by blowing excess solder onto the solder pool pad while attaching. .
また、上記発明方法を実施するのに用いる実装基板は、
基板上、被はんだ付け部品のリードと同配置に配列され
たパッド列の端のパッドの隣に、はんだ溜り用パッドを
有する実装基板である。In addition, the mounting board used to carry out the above-mentioned method of the invention is
A mounting board having a solder pool pad next to a pad at an end of a pad row arranged in the same arrangement as a lead of a component to be soldered on the board.
（作 用） 以下、上記本発明の実装基板を用いた上記本発明方法の
作用を説明する。(Operation) The operation of the method of the present invention using the mounting substrate of the present invention will be described below.
微小間隔で配列されたパッド列のパッドをつなぐように
してはんだコートされた上に、パッドとリードが対応す
るよう部品を配置した状態で、いずれかのパッド上のは
んだをスポット加熱用の噴流で加熱するとその部分のは
んだが溶解し、その部分にあるパッドとリードははんだ
付けされる。With the components coated so that the pads and leads correspond to each other, the solder on one of the pads is applied with a jet stream for spot heating. When heated, the solder in that part is melted and the pads and leads in that part are soldered.
この状態から加熱噴流を隣接パッドの方へ移動させると
余剰の溶解はんだが噴流に押されて移動するとともに隣
のパッド部分のはんだが溶解しその部分のパッドとリー
ドがはんだ付けされる、 その過程でパッドとパッドの間隔部分のはんだは溶解状
態での表面張力により先のパッドと後のパッドの方へ分
かれて付着する。従って、間隙部分にははんだは存在し
なくなる。続いて加熱噴流を更に隣のパッドの方へ移動
させると前と同様に余剰の溶解はんだが噴流に押されて
移動するとともにそのパッドとリードの部分のはんだが
溶解してはんだ付けされ、間隙部分のはんだも前後に分
かれて付着する。以後同様の過程を繰り返し各パッドと
対応するリードははんだ付けされ、間隙部分ははんだが
途切れる。このように間隙部分にはんだブリッジが生じ
ないのは加熱噴流を吹き付けつつ移動させることにより
余剰のはんだを一方へ吹き寄せることになるからであ
る。この吹き寄せられた余剰はんだは最終的に何らかの
処理が必要であるが、この処理は次のような実装基板を
用いることにより適切に行われる。If the heating jet is moved from this state to the adjacent pad, the excess molten solder is pushed and moved by the jet, and the solder in the adjacent pad portion is melted and the pad and lead in that portion are soldered. Then, the solder in the space between the pads is attached to the front pad and the rear pad separately due to the surface tension in the molten state. Therefore, there is no solder in the gap. Then, when the heating jet is further moved to the adjacent pad, excess molten solder is pushed and moved by the jet as before, and the solder on the pad and lead is melted and soldered, and the gap Solder also separates before and after and adheres. After that, the same process is repeated and the leads corresponding to the pads are soldered, and the solder is interrupted in the gaps. The reason why the solder bridge does not occur in the gap portion is that the excess solder is blown toward one side by moving the heating jet while blowing. The excess solder that has been blown over requires some processing finally, but this processing is appropriately performed by using the following mounting board.
本発明で用いる実装基板は、被はんだ付け部品のリード
と同配置に配列されたパッド列の最も端のパッドの隣に
リードとははんだ付けしないはんだ溜り用パッドを有す
るので、吹き寄せて来た余剰はんだは最後にこのはんだ
溜り用パッドへ集めることにより、リードとはんだ付け
するパッド部分から完全に除去することができる。The mounting board used in the present invention has a solder pool pad which is not soldered to the lead next to the endmost pad of the pad row arranged in the same arrangement as the lead of the component to be soldered. The solder can be finally removed from the lead and the portion of the pad to be soldered by finally collecting the solder on the pad for soldering.
以上のように、本発明のはんだ付け方法はこのような実
装基板を用いることにより、パッドへのはんだの塗布量
のばらつきや部品リードのはんだ付着性のばらつきがあ
っても、スポット加熱噴流の移動により余剰のはんだを
除去できるのではんだブリッジを生ずることがなくな
る。As described above, the soldering method of the present invention uses such a mounting substrate to move the spot heating jet even if there are variations in the amount of solder applied to the pads or variations in the solder adhesion of component leads. As a result, excess solder can be removed, so that a solder bridge will not occur.
（実 施 例） 以下、本発明方法の実施例および本発明方法の実施に用
いる実装基板の例を図面を参照して説明する。(Examples) Examples of the method of the present invention and examples of a mounting substrate used for carrying out the method of the present invention will be described below with reference to the drawings.
第１図は、本発明方法の実施例を示す図である。実装基
板８の上に、第４図（ａ）に示すような状態でクリーム
はんだを塗布し、その上に第４図（ｂ）に示すようにQF
P7を置き、パッド上のはんだ部分ヘノズル６によってス
ポット状に熱風を付き付けてはんだを溶解する。ノズル
６への熱風は熱風発生装置５で発生され、熱風伝送管４
およびノズル保持ヘッド１を経て供給される。一方パッ
ドの配列に沿っての移動は２軸直交ロボット２によって
行われる。この移動は、リードおよびパッドの配列状態
に応じて予め記憶させてあるデータニ基づいてCPU等の
制御により行われる。FIG. 1 is a diagram showing an embodiment of the method of the present invention. The solder paste is applied onto the mounting substrate 8 in the state shown in FIG. 4 (a), and the QF is applied on the cream solder as shown in FIG. 4 (b).
P7 is placed, and hot air is applied in spots by the nozzle 6 to the solder portion on the pad to melt the solder. The hot air to the nozzle 6 is generated by the hot air generating device 5, and the hot air transmission pipe 4
And the nozzle holding head 1. On the other hand, the movement along the pad array is performed by the biaxial orthogonal robot 2. This movement is performed by the control of the CPU or the like based on the data stored in advance according to the arrangement state of the leads and pads.
第２図は、本発明方法の実施に用いる実装基板のパッド
の配列の一例である。QFPのリードのはんだ付けを行う
パッド９、９、…９、の配列の両端にはんだ溜り用パッ
ド10、10が設けられている。FIG. 2 is an example of an arrangement of pads on a mounting board used for carrying out the method of the present invention. The solder pool pads 10, 10 are provided at both ends of the array of pads 9, 9, ... 9 for soldering the QFP leads.
ノズル６からの加熱噴流によって、リードとパッドがは
んだ付けされるとともに、順次吹き寄せられて来た余剰
のはんだはパッドの列の終りではんだ溜り用パッド10に
移される。The leads and pads are soldered by the heating jet from the nozzle 6, and the surplus solder sequentially blown is transferred to the solder pool pad 10 at the end of the row of pads.
このように、本発明方法により、リードとパッドのはん
だ付けを行いつつ余剰はんだをパッド列の端の方へ吹き
寄せ最後に余剰はんだの受け皿であるはんだ溜り用パッ
ドへ移してしまうのではんだブリッジを生ずることがな
くなる。As described above, according to the method of the present invention, while soldering the lead and the pad, the excess solder is blown toward the end of the pad row and finally transferred to the solder pool pad which is the tray of the excess solder, so that a solder bridge is generated. Will disappear.
（発明の効果） 以上説明したように、本発明のはんだ付け方法は熱風を
ノズルで噴流にしこれを目的とする部分に局部的に吹き
付けはんだを溶解してはんだ付けを行い、この加熱噴流
を移動させて順次はんだ付けを行って行くとともに噴流
の吹き寄せ作用を利用して余剰のはんだを順送りに移動
させて行くので、最初のはんだの塗布量にばらつきがあ
ったり、部品リードのはんだ付着性のばらつきがあった
りしても、パッド間にはんだブリッジを生ずることはな
く、順次吹き寄せられて来た余剰はんだは、はんだ付け
パッド列の最も端のパッドの隣のはんだ溜り用パッドに
移すことができるので、余剰はんだをはんだ付けパッド
列から完全に除去することができるという利点がある。(Effect of the Invention) As described above, in the soldering method of the present invention, hot air is jetted by a nozzle to locally melt the sprayed solder on a target portion of the hot air to perform soldering, and the heated jet is moved. Then the solder is sequentially soldered and the excess solder is used to move the solder forward in sequence.Therefore, there are variations in the initial solder coating amount, and variations in the solder adhesion of the component leads. Even if there is, there is no solder bridge between the pads, and the surplus solder that has been sequentially blown can be transferred to the solder pool pad next to the end pad of the soldering pad row. The advantage is that the excess solder can be completely removed from the soldering pad row.
第１図は本発明のはんだ付け方法の実施例を示す図、第
２図は本発明方法の実施に用いる実装基板のパッド配列
の一例を示す図、第３図、第４図は従来のはんだ付けの
方法を示す図である。 １……ノズル保持ヘッド、２……２軸直交ロボット、３
……ヒータ付ワークステージ、４……熱風伝送管、５…
…熱風発生装置、６……ノズル、７……QFP、８……実
装基板、９……はんだ付けパッド、10……はんだ溜り用
パッド。FIG. 1 is a diagram showing an embodiment of a soldering method of the present invention, FIG. 2 is a diagram showing an example of a pad array of a mounting substrate used for carrying out the method of the present invention, and FIGS. 3 and 4 are conventional solders. It is a figure which shows the attachment method. 1 ... Nozzle holding head, 2 ... 2-axis orthogonal robot, 3
... Work stage with heater, 4 ... Hot air transmission tube, 5 ...
... Hot air generator, 6 ... Nozzle, 7 ... QFP, 8 ... Mounting board, 9 ... Soldering pad, 10 ... Solder pad.
Claims (1)
て配列され、該パッド列の端のパッドの隣にはんだ溜り
用パッドが設けられている基板に部品リードをはんだ付
けする際に、部品リード接続用パッド列を前記微小間隔
部分も含めてはんだコートし、該はんだコートの上から
パッドの位置に対応させて部品のリードを載置し両者を
加熱してパッドとリードをはんだ付けする方法において
前記パッド対応部分の少なくとも１箇所にスポット加熱
噴流を当て該パット部分のはんだを溶かしてはんだ玉を
形成させ次いでスポット加熱噴流をパッドの配列方向へ
移動させ前記リードとパッドを順次はんだ付けしつつ余
剰はんだをはんだ溜り用パッドへ吹き寄せることを特徴
とする微小リードピッチ部品のはんだ付け方法。1. When soldering a component lead to a substrate in which component lead connection pads are arranged with a minute gap and a solder pool pad is provided next to a pad at an end of the pad row, A method of solder-coating a lead-connecting pad row including the minute gap portion, placing leads of components on the solder coat corresponding to the positions of the pads, and heating the both to solder the pads to the leads. While applying a spot heating jet to at least one place of the pad corresponding portion to melt the solder in the pad portion to form a solder ball and then move the spot heating jet in the pad arranging direction to sequentially solder the lead and the pad. A method for soldering a fine lead pitch component, which comprises blowing excess solder onto a pad for solder pool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63247227A JPH0783176B2 (en) | 1988-09-30 | 1988-09-30 | Soldering method for fine lead pitch parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63247227A JPH0783176B2 (en) | 1988-09-30 | 1988-09-30 | Soldering method for fine lead pitch parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0294696A JPH0294696A (en) | 1990-04-05 |
| JPH0783176B2 true JPH0783176B2 (en) | 1995-09-06 |
Family
ID=17160345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63247227A Expired - Fee Related JPH0783176B2 (en) | 1988-09-30 | 1988-09-30 | Soldering method for fine lead pitch parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783176B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0870173A (en) * | 1994-08-30 | 1996-03-12 | Matsushita Electric Ind Co Ltd | Circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62178572U (en) * | 1986-04-30 | 1987-11-12 |
-
1988
- 1988-09-30 JP JP63247227A patent/JPH0783176B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0294696A (en) | 1990-04-05 |
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