JPH078055Y2 - 粉体モールド装置 - Google Patents

粉体モールド装置

Info

Publication number
JPH078055Y2
JPH078055Y2 JP2701689U JP2701689U JPH078055Y2 JP H078055 Y2 JPH078055 Y2 JP H078055Y2 JP 2701689 U JP2701689 U JP 2701689U JP 2701689 U JP2701689 U JP 2701689U JP H078055 Y2 JPH078055 Y2 JP H078055Y2
Authority
JP
Japan
Prior art keywords
filter
powder
resin
bath
partition plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2701689U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02117075U (enExample
Inventor
邦雄 小林
美寿雄 寺島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2701689U priority Critical patent/JPH078055Y2/ja
Publication of JPH02117075U publication Critical patent/JPH02117075U/ja
Application granted granted Critical
Publication of JPH078055Y2 publication Critical patent/JPH078055Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Thermistors And Varistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2701689U 1989-03-09 1989-03-09 粉体モールド装置 Expired - Fee Related JPH078055Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2701689U JPH078055Y2 (ja) 1989-03-09 1989-03-09 粉体モールド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2701689U JPH078055Y2 (ja) 1989-03-09 1989-03-09 粉体モールド装置

Publications (2)

Publication Number Publication Date
JPH02117075U JPH02117075U (enExample) 1990-09-19
JPH078055Y2 true JPH078055Y2 (ja) 1995-03-01

Family

ID=31249158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2701689U Expired - Fee Related JPH078055Y2 (ja) 1989-03-09 1989-03-09 粉体モールド装置

Country Status (1)

Country Link
JP (1) JPH078055Y2 (enExample)

Also Published As

Publication number Publication date
JPH02117075U (enExample) 1990-09-19

Similar Documents

Publication Publication Date Title
US3396699A (en) Continuous coating apparatus
JPH078055Y2 (ja) 粉体モールド装置
JP2508696B2 (ja) スラッシュ成形装置
US3500991A (en) Pressure differential material handling device
CA1158107A (en) Method and apparatus for electrostatic coating with controlled particle cloud
GB1025493A (en) Molding process and apparatus
US2843711A (en) Thermo-electric surface heaters
JP6687399B2 (ja) 鋳物砂の加熱装置
CN211275336U (zh) 一种锂电池涂布机烘箱结构
JPS55141355A (en) Mold molding method and its device
US2842464A (en) Method of producing an electrical resistance on glass
CN207299771U (zh) 一种高效的lcm面板的烘干装置
JPS6246233B2 (enExample)
JPS622863B2 (enExample)
JPH08318531A (ja) 積層板用プリプレグの製造法及びプリプレグの乾燥装置
JPS5935774Y2 (ja) 焼結風量測定用風箱装置
JPS596237Y2 (ja) 板状塗装物の乾燥装置
JP2021030629A (ja) ３ｄプリンタ用のホットエンド、空気加熱装置、ユニット、及び３ｄプリンタ
JP2514533B2 (ja) 発泡合成樹脂製の模型の塗型層形成装置。
JPS60202614A (ja) 静電塗装法による平角絶縁電線の製造方法
JPS595709B2 (ja) 導電性床材とその製造方法
JPS607015A (ja) 静電粉体塗装法による絶縁電線の製造方法
JPH0621576Y2 (ja) コーティング材の塗布装置
CN209230175U (zh) 一种干燥pcl、pla复合发泡材料的装置
JPS6122240Y2 (enExample)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees