JPH0777136B2 - Thermosetting anisotropic conductive connection member - Google Patents
Thermosetting anisotropic conductive connection memberInfo
- Publication number
- JPH0777136B2 JPH0777136B2 JP2295060A JP29506090A JPH0777136B2 JP H0777136 B2 JPH0777136 B2 JP H0777136B2 JP 2295060 A JP2295060 A JP 2295060A JP 29506090 A JP29506090 A JP 29506090A JP H0777136 B2 JPH0777136 B2 JP H0777136B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- adhesive layer
- connecting member
- conductive adhesive
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は電気回路基板（以下基板という）間の接続に用
いられる加熱硬化型異方導電接続部材（以下接続部材と
いう）に関する。TECHNICAL FIELD The present invention relates to a heat-curable anisotropic conductive connection member (hereinafter referred to as a connection member) used for connecting electric circuit boards (hereinafter referred to as a board).
［従来の技術］ 異方導電接着剤はLCDとFPC、PCBとFPC等の接続に用いら
れるが、近年接続部の多ピン化、小ピッチ化が進み、ま
た耐熱性等の信頼度の向上を求められる結果、熱硬化型
接着剤が使用されるようになった。[Prior Art] Anisotropic conductive adhesives are used to connect LCDs to FPCs, PCBs to FPCs, etc., but in recent years the number of pins and pitches have been decreasing in the connecting parts, and reliability such as heat resistance has been improved. As a result of the demand, thermosetting adhesives have come to be used.
［発明が解決しようとする課題］ しかし熱硬化型異方導電接着剤により基板間を接続する
には、接続部にあらかじめ異方導電接着剤を仮圧着する
ため加熱するので、仮圧着後のポットライフが短くなる
という問題があった。[Problems to be Solved by the Invention] However, in order to connect the substrates with the thermosetting anisotropic conductive adhesive, the anisotropic conductive adhesive is heated in advance to temporarily bond it to the connection portion. There was a problem that the life was shortened.
［課題を解決するための手段］ 本発明は上記の問題を解決し、仮圧着後のポットライフ
の長い接続部材を提供するもので、これは、熱可塑性樹
脂と加熱硬化成分とを含む絶縁性接着剤中に導電性粒子
を分散した異方導電接着剤層とこれに密着させたセパレ
ータからなり、該異方導電接着剤層とセパレータとの密
着強度FSと、該異方導電接着剤層を電気回路基板の接続
部に温度10〜50℃、圧力3kg/cm2以上で仮圧着した際の
異方導電接着剤層に対する接続部の密着強度FCとの関係
が、FS＜FCであることを特徴とする加熱硬化型異方導電
接続部材である。[Means for Solving the Problems] The present invention solves the above problems and provides a connection member having a long pot life after temporary pressure bonding, which has an insulating property including a thermoplastic resin and a thermosetting component. An anisotropic conductive adhesive layer in which conductive particles are dispersed in an adhesive and a separator in close contact with the anisotropic conductive adhesive layer, the adhesion strength F S between the anisotropic conductive adhesive layer and the separator, and the anisotropic conductive adhesive layer The relationship between the adhesive strength F C of the connection part to the anisotropic conductive adhesive layer when temporarily pressure-bonded to the connection part of the electric circuit board at a temperature of 10 to 50 ° C and a pressure of 3 kg / cm 2 or more is F S <F C The heat-curable anisotropic conductive connecting member according to the present invention.
本発明を図面によって説明すると、第１図において、本
発明の接続部材１では、セパレータ２上に加熱硬化型接
着剤層３が密着されているが、この中には導電性粒子４
が分散され異方導電性を付与される。第２図は接続部材
１をリール状に巻いたもので、５はコアである。第３図
は、本発明の接続部材１による基板接続の一例で、基板
６と７のそれぞれの接続部８、９が接続部材１によって
接続されている。The present invention will be described with reference to the drawings. In FIG. 1, in a connecting member 1 of the present invention, a thermosetting adhesive layer 3 is closely adhered to a separator 2, in which conductive particles 4 are included.
Are dispersed and anisotropic conductivity is imparted. In FIG. 2, the connection member 1 is wound in a reel shape, and 5 is a core. FIG. 3 shows an example of substrate connection by the connecting member 1 of the present invention, in which the connecting portions 8 and 9 of the substrates 6 and 7 are connected by the connecting member 1.
基板間の接続部材は基板の種類によって異なるが、接続
部材と少なくとも一方の基板の接続部との密着強度がセ
パレータとの密着強度を上まわつておればよい。The connecting member between the substrates differs depending on the type of the substrate, but the adhesive strength between the connecting member and the connecting portion of at least one of the substrates should be higher than the adhesive strength with the separator.
基板の接続部表面にはつぎの構成が例示される。すなわ
ち、LCDの場合にはITOとガラス、PCBの場合には、ガラ
スエポキシあるいはガラスエポキシとCu箔との接着剤
と、Auメッキ層、Snメッキ層あるいはハンダメッキ層、
FPCの場合には、ポリイミドあるいはポリイミドとCu箔
との接着剤あるいはポリエステルあるいはBTレジンと、
Auメッキ層、Snメツキ層、ハンダメッキ層あるいはAgペ
ースト、カーボンペースト等である。The following configuration is exemplified on the surface of the connecting portion of the substrate. That is, ITO and glass in the case of LCD, adhesive in the case of PCB, glass epoxy or glass epoxy and Cu foil, and Au plating layer, Sn plating layer or solder plating layer,
In the case of FPC, polyimide or an adhesive of polyimide and Cu foil or polyester or BT resin,
An Au plating layer, a Sn plating layer, a solder plating layer, an Ag paste, a carbon paste, or the like.
絶縁性接着剤に混入される加熱硬化成分としては、エポ
キシ樹脂系、アクリル系、ウレタン系、シリコーン系、
クロロプレン系、ニトリル系などが例示されるが、これ
らは導通の信頼性を向上させるため剥離強度、耐熱性、
可撓性を改善するよう熱可塑性樹脂とブレンドすること
が効果的であり、例としてポリアミド系、ポリエステル
系、アイオノマー系、EVA、EAA、EMA、EEAなどのポリオ
レフィン系、NBR、SBR等の各種合成ゴム系のもの、さら
にはこれらの変性物、複合物があげられる。いずれの場
合も、硬化剤、加硫剤、制御剤、劣化防止剤、耐熱添加
剤、熱伝導向上剤、粘着付与剤、軟化剤、着色剤、各種
カップリング剤、金属不活性剤等が適宜添加されること
が望ましい。The thermosetting components mixed in the insulating adhesive include epoxy resin type, acrylic type, urethane type, silicone type,
Examples include chloroprene-based and nitrile-based materials, but these improve peeling strength, heat resistance, and
It is effective to blend with a thermoplastic resin to improve flexibility, and examples include polyamide-based, polyester-based, ionomer-based, polyolefin-based such as EVA, EAA, EMA and EEA, and various synthetics such as NBR and SBR. Examples thereof include rubber-based ones, and modified products and composites thereof. In any case, a curing agent, a vulcanizing agent, a control agent, a deterioration inhibitor, a heat resistance additive, a thermal conductivity improver, a tackifier, a softening agent, a coloring agent, various coupling agents, a metal deactivator, etc. are appropriately used. It is desirable to be added.
さらに、前記基板の接続部に対し、10〜50℃の温度範囲
において良好な密着性と、本接着時に十分な反応速度、
剥離強度を得るために、この絶縁性接着剤は、10〜50℃
における粘度が1000ポイズ以下である液状エポキシ樹脂
100重量部、加熱硬化型潜在性硬化剤ならびに溶融温度
が80℃以上の熱可塑性樹脂20〜1000重量部および粘着付
与剤５〜500重量部とを含んだものとすることが最も有
効である。これは微視的に10〜50℃において固体状態に
ある熱可塑性樹脂マトリクス中に液状のエポキシ樹脂が
分散した構造をとっており、これによって10〜50℃とい
う低温においても基板との密着性が良好になるととも
に、接続部材としてフィルム状の形を保持し、良好な作
業性を得ることができる。Furthermore, with respect to the connection part of the substrate, good adhesion in a temperature range of 10 to 50 ° C., a sufficient reaction rate at the time of main adhesion,
In order to obtain peel strength, this insulating adhesive is 10 ~ 50 ℃
Liquid epoxy resin with a viscosity of 1000 poise or less
It is most effective to include 100 parts by weight, a heat-curable latent curing agent, 20 to 1000 parts by weight of a thermoplastic resin having a melting temperature of 80 ° C. or higher, and 5 to 500 parts by weight of a tackifier. Microscopically, it has a structure in which a liquid epoxy resin is dispersed in a thermoplastic resin matrix that is in a solid state at 10 to 50 ° C, and as a result, the adhesion to the substrate is maintained even at a low temperature of 10 to 50 ° C. In addition to being good, a film-like shape can be maintained as a connecting member, and good workability can be obtained.
導電性粒子としては、ニッケル、ハンダ、金、銀、パラ
ジウムなどの金属粒子、タングステンカーバイトなどの
セラミック粒子、カーボン粒子、表面をメッキ等の方法
で金属被覆したプラスチック粒子等が例示される。導通
の信頼性を得るために、粒径はできるだけ均一にするこ
とがよく、低ピッチレベル例えば0.1mmや0.2mmピッチの
接続部におけるリークを防ぐという観点から、粒子径は
平均25μｍ以下であることが望ましいが、粒子が小さす
ぎると接着剤が薄く強度が弱くなるため、平均５μｍ以
上であることが好ましい。また粒子には粘着性がないた
め、接続まえの状態で異方導電接着剤表面に粒子が露出
しないことが好ましく、このため異方導電接着剤層の厚
さは導電性粒子の平均粒子径の1.2倍以上にすることが
よい。しかし厚すぎると、ヒートシール時に接着剤がフ
ローしきれずに導通不良を生じ、さらにオーバーフロー
により接着剤が流れ出して周囲に悪影響を与える危険性
があるため、100μｍ以下とすることがよい。Examples of the conductive particles include metal particles such as nickel, solder, gold, silver and palladium, ceramic particles such as tungsten carbide, carbon particles, and plastic particles whose surface is coated with metal by a method such as plating. The particle size should be as uniform as possible in order to obtain reliability of conduction, and the particle size should be 25 μm or less on average from the viewpoint of preventing leakage at the connection part at a low pitch level such as 0.1 mm or 0.2 mm pitch. However, if the particles are too small, the adhesive becomes thin and the strength becomes weak. Therefore, the average particle size is preferably 5 μm or more. Further, since the particles are not tacky, it is preferable that the particles are not exposed on the surface of the anisotropic conductive adhesive before connection, and therefore the thickness of the anisotropic conductive adhesive layer is the average particle diameter of the conductive particles. It should be 1.2 times or more. However, if the thickness is too thick, the adhesive may not flow completely at the time of heat sealing, resulting in poor conduction, and further, the adhesive may flow out due to overflow and adversely affect the surroundings. Therefore, the thickness is preferably 100 μm or less.
セパレータは、異方導電接着剤をフィルム状に保持する
とともに、仮圧着時に異方導電接着剤層を基板側へ転写
した後剥がされるため、易剥離性をもつことが必要で、
例えば合成紙、ポリプロピレンフィルム、シリコーンに
より離脱処理した紙やポリエステルフィルム、ふっ素樹
脂フィルム等が例示される。The separator holds the anisotropic conductive adhesive in the form of a film, and is peeled off after transferring the anisotropic conductive adhesive layer to the substrate side during temporary pressure bonding, so it is necessary to have easy peeling property.
Examples thereof include synthetic paper, polypropylene film, paper treated with silicone for release, polyester film, and fluororesin film.
本発明の接続部材は作業性の面からリール状にすること
がよく、このためセパレータは製造時に接着剤を塗布す
る面が、反対側の面より密着性のよいことが望まれ、こ
の点で最も良好なものは、ふっ素樹脂フィルムあるいは
両面にそれぞれの面の剥離し易さの度合いを変えてシリ
コーン離型処理を施したポリエステルフィルムである。
ふっ素樹脂フィルムとしてはPTFE、FEP、ETFE、PFA、PC
TFE、PVDF等が例示され、これらは表面に微小な凹凸を
有しているため、溶液状態の接着剤を塗布した面には表
面の凹凸に対するアンカー効果によって良好な密着性が
得られ、接着剤が乾燥した後では、塗布面ほどアンカー
効果が得られないため、リール状としたときに逆側に接
着剤が得られることがない。またシリコーン処理したポ
リエステルフィルムは、剥離し難い方の面に接着剤を設
けることによって逆側へ取られることを防ぐことができ
る。剥離性の度合いは、シリコーンの処理量によって調
節できるが、処理量が少ないとシリコーン被膜に微小な
欠陥を生じ、この欠陥の量によって剥離性が変わるもの
と考えられる。From the viewpoint of workability, the connecting member of the present invention is preferably in the form of a reel. Therefore, it is desired that the surface of the separator on which the adhesive is applied has better adhesion than the surface on the opposite side. The most preferable one is a fluororesin film or a polyester film which has been subjected to silicone release treatment on both sides by changing the degree of ease of peeling on each side.
PTFE, FEP, ETFE, PFA, PC as fluororesin film
TFE, PVDF, etc. are exemplified, and since these have minute irregularities on the surface, good adhesion can be obtained on the surface coated with the adhesive in the solution state due to the anchoring effect on the irregularities of the surface. After drying, since the anchor effect is not obtained as much as the coated surface, the adhesive is not obtained on the opposite side when formed into a reel shape. Further, the silicone-treated polyester film can be prevented from being taken on the opposite side by providing an adhesive on the surface which is difficult to peel off. The degree of releasability can be adjusted by the treatment amount of silicone, but it is considered that when the treatment amount is small, minute defects occur in the silicone coating, and the releasability changes depending on the amount of this defect.
上記した接続部材を用いて基板間を接続するには、まず
この接続部材を基板のどちらか一方の接続部上に載置
し、10〜50℃の温度で3kg/cm2以上の圧力を加えて仮圧
着し、ついでセパレータを剥がした後、約150℃以上、1
0〜50kg/cm2、20〜60秒の条件で本接続を達成する。仮
圧着の際接着剤の表面の基板への密着性をよくするため
に、圧着子として厚さ0.05mm以上、硬度20〜80度の弾性
体を用いると微妙な凹凸に対する追従性がよく、エアー
を巻き込み難く効果的である。To connect between the substrates using the above-mentioned connecting member, first place this connecting member on one of the connecting parts of the substrate and apply a pressure of 3 kg / cm 2 or more at a temperature of 10 to 50 ° C. Temporary pressure bonding, then peel off the separator, then
This connection is achieved under conditions of 0 to 50 kg / cm 2 and 20 to 60 seconds. In order to improve the adhesion of the surface of the adhesive to the substrate during temporary pressure bonding, using an elastic body with a thickness of 0.05 mm or more and a hardness of 20 to 80 degrees as a crimping element gives good followability to subtle unevenness, It is hard to get involved and is effective.
以上によって加熱硬化型異方導電接着剤層を仮圧着して
後でも、硬化の反応性を低下させることなく、ポットラ
イフが長い接続部材を得ることができる。As described above, even after the thermosetting anisotropic conductive adhesive layer is temporarily pressure-bonded, it is possible to obtain a connecting member having a long pot life without lowering the reactivity of curing.
［実施例］ カルボキシル基含有の熱可塑性SBR（スチレン−ブタジ
エンラバー）100重量部とテルペンフェノール系粘着付
与剤50重量部を、トルエン:MEK＝8:2の混合溶剤に25重
量％となるように溶解し、これに液状エポキシ樹脂（AE
R331L:旭化成）50重量部、マイクロカプセル型エポキシ
硬化剤（ノバキュアHX−3741:旭化成）50重量部、粒径
約10μｍの球形フェノール樹脂にAg、Auの２層メッキを
施した比重約1.2の導電性粒子20重量部を混合して異方
導電性接着剤をつくった。これをナイフコーターで、セ
パレータとなる厚さ75μｍのPTFEフィルム（ニトフロン
テープNo.900:日東電工）にコーティングし、送風乾燥
させて、総厚さ100μｍ（接着剤層の厚さ25μｍ）と
し、これを3mm幅にスリットして巻取り接着部材を得
た。[Example] 100 parts by weight of a carboxyl group-containing thermoplastic SBR (styrene-butadiene rubber) and 50 parts by weight of a terpene phenol-based tackifier were added to a mixed solvent of toluene: MEK = 8: 2 to be 25% by weight. Dissolve in liquid epoxy resin (AE
R331L: Asahi Kasei) 50 parts by weight, microcapsule type epoxy curing agent (Novacure HX-3741: Asahi Kasei) 50 parts by weight, spherical phenolic resin with a particle size of about 10 μm Ag / Au two-layer plating Conductivity with a specific gravity of about 1.2 An anisotropic conductive adhesive was prepared by mixing 20 parts by weight of the conductive particles. This is coated with a knife coater on a PTFE film (Nitoflon tape No.900: Nitto Denko) with a thickness of 75 μm to serve as a separator and dried by air blowing to give a total thickness of 100 μm (adhesive layer thickness of 25 μm). This was slit into a width of 3 mm to obtain a winding adhesive member.
これを、ガラス上にITO膜により0.2ビッチのパターンが
形成されたLCDの接続部に載置し、室温27℃において加
熱することなく、圧着子として厚さ1mm、ゴム硬度70度
のシリコーンゴムを取付けた治具で10kg/cm2の圧力で１
秒間押し付け仮圧着したが、セパレータであるPTFEフィ
ルムを容易に剥がし取ることができた。仮圧着直後およ
び仮圧着より２週間25℃、50％RHの室内に放置した後、
0.2mmピッチのFPCを170℃20kg/cm2、30秒にて本接着
し、抵抗値、剥離強度を測定した結果を表１に示す。This is placed on the connection part of the LCD with a 0.2-bit pattern formed on the glass by the ITO film, and without heating at room temperature 27 ° C, a silicone rubber with a thickness of 1 mm and a rubber hardness of 70 degrees is used as a crimp. 1 at a pressure of 10 kg / cm 2 with the attached jig
Although it was pressed for a second and temporarily pressure-bonded, the PTFE film as the separator could be easily peeled off. Immediately after temporary pressure bonding and for 2 weeks after temporary pressure bonding, leave it in a room at 25 ° C and 50% RH,
Table 1 shows the results of measuring the resistance value and the peel strength of the FPC having a pitch of 0.2 mm by main bonding at 170 ° C. and 20 kg / cm 2 for 30 seconds.
［発明の効果］ 以上のように本発明により、熱硬化型樹脂の反応性の低
下を招くことなく仮圧着後のポットライフを長く維持す
ることができるため、組立工程に制約がなく、効率の良
い作業を行なうことができる。また10〜50℃という常温
に近い温度範囲で仮圧着できるため、仮圧着機の温度制
御をほとんど必要とせず、圧着子の交換等のメンテナン
スも容易であり、火傷の心配もなく作業性がよく、加熱
のためのコストも低減できる。また液状エポキシ樹脂と
熱可塑性樹脂をブレンドすることによって、仮圧着時の
エッジでの接着剤の切れがよくなり、作業性が向上す
る。また圧着子に厚さ0.05mm以上、硬度20〜80度の弾性
体を用いることによって仮圧着する基板への密着性が増
し、エアーの巻き込みも少なくなるので歩留りが向上す
る。 EFFECTS OF THE INVENTION As described above, according to the present invention, the pot life after temporary pressure bonding can be maintained for a long time without lowering the reactivity of the thermosetting resin. You can do good work. In addition, since temporary pressure bonding can be performed in the temperature range of 10 to 50 ° C, which is close to room temperature, temperature control of the temporary pressure bonding machine is almost unnecessary, maintenance such as replacement of the crimp is easy, and there is no worry of burns and workability is good. Also, the cost for heating can be reduced. Further, by blending the liquid epoxy resin and the thermoplastic resin, the adhesive is cut off easily at the edge during temporary pressure bonding, and the workability is improved. Further, by using an elastic body having a thickness of 0.05 mm or more and a hardness of 20 to 80 degrees for the crimping element, the adhesion to the substrate to be temporarily pressure-bonded is increased and the entrainment of air is reduced, so that the yield is improved.
第１図は本発明の接続部材の断面図、第２図は本発明の
リール状にした接続部材の斜視図、第３図は本発明の接
続部材により２枚の基板を接続したときの断面図であ
る。 １…接続部材、２…セパレータ、３…加熱硬化型接続部
材、４…導電性粒子、５…コア、６、７…基板、８、９
…接続部。FIG. 1 is a sectional view of a connecting member of the present invention, FIG. 2 is a perspective view of a reel-shaped connecting member of the present invention, and FIG. 3 is a sectional view when two substrates are connected by the connecting member of the present invention. It is a figure. DESCRIPTION OF SYMBOLS 1 ... Connection member, 2 ... Separator, 3 ... Thermosetting connection member, 4 ... Conductive particles, 5 ... Core, 6, 7 ... Substrate, 8, 9
… Connection.
Claims (4)
性接着剤中に導電性粒子を分散した異方導電接着剤層と
これに密着させたセパレータからなり、該異方導電接着
剤層とセパレータとの密着強度FSと、該異方導電接着剤
層を電気回路基板の接続部に温度10〜50℃、圧力3kg/cm
2以上で仮圧着した際の異方導電接着剤層に対する接続
部の密着強度FCとの関係が、FS＜FCであることを特徴と
する加熱硬化型異方導電接続部材。1. An anisotropic conductive adhesive layer comprising an anisotropic conductive adhesive layer in which conductive particles are dispersed in an insulating adhesive containing a thermoplastic resin and a thermosetting component and a separator adhered to the anisotropic conductive adhesive layer. And the adhesion strength F S between the separator and the anisotropic conductive adhesive layer at the connection part of the electric circuit board at a temperature of 10 to 50 ° C. and a pressure of 3 kg / cm.
A heat-curable anisotropically conductive connecting member characterized in that the relationship with the adhesive strength F C of the connection portion to the anisotropically conductive adhesive layer when provisionally pressure-bonded at 2 or more is F S <F C.
0重量部、加熱硬化型の潜在性硬化剤ならびに熱可塑性
樹脂の20〜1000重量部および粘着付与剤５〜500重量部
を含み、該液状エポキシ樹脂の10〜50℃における粘度は
1000ポイズ以下、該熱可塑性樹脂の溶融温度は80℃以上
である請求項１に記載の接続部材。2. The insulating adhesive is a liquid epoxy resin 10.
0 part by weight, 20 to 1000 parts by weight of a heat-curable latent curing agent and a thermoplastic resin and 5 to 500 parts by weight of a tackifier, and the viscosity of the liquid epoxy resin at 10 to 50 ° C is
The connecting member according to claim 1, wherein the melting temperature of the thermoplastic resin is 1000 poises or less and the melting temperature of the thermoplastic resin is 80 ° C or more.
である請求項１に記載の接続部材。3. The conductive particles have an average particle size of 5 to 25 μm.
The connecting member according to claim 1, which is
粒子の平均粒子径の1.2倍以上、100μｍ以下である請求
項１および３に記載の接続部材。4. The connecting member according to claim 1, wherein the thickness of the anisotropic conductive adhesive layer is 1.2 times or more the average particle diameter of the conductive particles and 100 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295060A JPH0777136B2 (en) | 1990-10-31 | 1990-10-31 | Thermosetting anisotropic conductive connection member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295060A JPH0777136B2 (en) | 1990-10-31 | 1990-10-31 | Thermosetting anisotropic conductive connection member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04169080A JPH04169080A (en) | 1992-06-17 |
| JPH0777136B2 true JPH0777136B2 (en) | 1995-08-16 |
Family
ID=17815798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2295060A Expired - Fee Related JPH0777136B2 (en) | 1990-10-31 | 1990-10-31 | Thermosetting anisotropic conductive connection member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777136B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4661914B2 (en) * | 1995-02-07 | 2011-03-30 | 日立化成工業株式会社 | Electrode connection method |
| JP3928753B2 (en) * | 1996-08-06 | 2007-06-13 | 日立化成工業株式会社 | Multi-chip mounting method and manufacturing method of chip with adhesive |
| CN103360976B (en) | 2006-04-26 | 2016-08-03 | 日立化成株式会社 | Splicing tape and use its solar module |
| JP2015135748A (en) * | 2014-01-17 | 2015-07-27 | デクセリアルズ株式会社 | Anisotropic conductive film, connection structure, method for manufacturing connection structure, and apparatus for manufacturing connection structure |
| JP6241326B2 (en) * | 2014-03-07 | 2017-12-06 | デクセリアルズ株式会社 | Anisotropic conductive film and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6155809A (en) * | 1984-08-27 | 1986-03-20 | 日立化成工業株式会社 | Conductive adhesive film wind |
| JPS62117206A (en) * | 1985-11-18 | 1987-05-28 | 株式会社リコー | Anisotropic conductive sheet |
-
1990
- 1990-10-31 JP JP2295060A patent/JPH0777136B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04169080A (en) | 1992-06-17 |
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