JPH04290489A - Manufacture of heat seal connector and connection by means of the obtained connector - Google Patents

Abstract

PURPOSE:To improve connection stability by scattering charged particles contributing to electrical connection at the time of heat seal connection at least on a heat seal connection part while conductive paste is not solidified or half- solidified, then adhering the particles to be fixed and applying heat seal adhesive agent. CONSTITUTION:A pattern 2 is formed of conductive paste with circuit conductive particles 5 scattered on a base 1, connection conductive particles 6 are scattered on a heat seal connection part while the conductive paste is not solidified or half-solidified, and they are adhered to be fixed through a drying process if they have not been solidified yet or through a drying process after press-fitting if they are half-solidified. Then the connection conductive particles 6 which have not been adhered and fixed on the pattern 2 are removed by means of high pressure air stream or shaking, and heat seal adhesive agent 4 is applied on the base 1 to provide a heat seal connector.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a heat-seal connector for connecting wiring boards having fine electric circuit patterns (hereinafter referred to as patterns) and a method of making connections using the resulting connector.

0002

[Prior Art] Conventionally, in manufacturing heat-seal connectors for connecting electrical circuits, (a) as shown in FIGS. 4(a) and 4(b), After forming the pattern 2 with a conductive paste, a drying process is performed, and then a heat seal adhesive 4 containing conductive particles 3 uniformly dispersed is applied to at least the heat seal connection portion, that is, the portion that contacts the pattern of the wiring board to be heat seal connected. how to apply,

000
3) (B) As shown in FIG. 4(c), conductive particles (hereinafter referred to as circuit conductive particles) 5 that contribute to the formation of an electric circuit are placed on the base material 1, and electricity between the wiring board during heat-sealed connection is placed on the base material 1. conductive particles that contribute to physical connections (hereinafter referred to as connection conductive particles)
After forming a pattern 7 with a conductive paste or ink containing at least two or more types of functionally specific conductive particles in 6, a heat seal adhesive 8 that does not contain conductive particles is applied to at least the heat seal connection portion through a drying process. method (see Japanese Patent Publication No. 62-500828),

(c) As shown in FIG. 4(d), a first layer pattern 2 is formed on a base material 1 using a conductive paste containing conductive particles for a circuit, and after a drying process, a pattern 2 for a circuit is formed. and conductive particles 5, 6 for connection
A similar second layer pattern 9 is layered using a conductive paste containing conductive paste, and after a drying process, 1
A method is known in which a heat-sealing adhesive 8 containing no conductive particles is applied to the surface.

[0005]

[Problems to be Solved by the Invention] The above-mentioned conventional techniques cannot avoid the following disadvantages. In the method (a), since the conductive particles 6 for connection are dispersed and blended in the heat seal adhesive 4, care must be taken to prevent poor dispersion when applying this. If these conductive particles are poorly dispersed, electrical insulation between the patterns 2 cannot be maintained in areas where the density is high, and electrical connection cannot be made satisfactorily after heat sealing in areas where the density is low. This may cause unstable continuity, or even a state where continuity is impossible. Therefore, when using this method, advanced manufacturing and management techniques are required not only for the dispersion state during the production of the heat seal adhesive but also for the dispersion state during the coating process. In addition, a screen printing method is often used as a simple coating method, but in this case, the connecting conductive particles 6
Since the screen printing plate is clogged, plate conditions must be selected in order to maintain printing accuracy and prevent a decrease in printing work efficiency that would occur due to clogging removal.

In the method (b), since the pattern 7 is formed by screen printing, it is expected that the connecting conductive particles 6 will clog the screen printing plate in the same way as in the method (a). . To avoid this, it is necessary to make it easier for the connecting conductive particles 6 to pass through the screen printing plate by reducing the mesh number of the screen printing plate to increase the opening, or by decreasing the particle size of the conductive particles. Must be. However, in the former case, the scope of use is limited because a screen printing plate of 200 mesh or more, which is necessary for printing fine patterns, cannot be used. In the latter case, the particle size will be smaller than the printing thickness of pattern 7 and will be buried in the pattern. The conductive particles 6 for connection are made to protrude above the pattern 7, and the pressure during the heat sealing process is concentrated on these conductive particles, increasing the contact area and improving the stability of the connection, but in the latter case. It is clear that this effect is diminished.

In the method (c), in order to prevent the connecting conductive particles 6 from being buried in the pattern in the method (b), the pattern 2 of the first layer and the pattern 9 of the second layer are formed in stages. It is characterized by its formation. Since the function of the pattern is achieved by the conductive paste applied to the first layer, the second layer containing the conductive particles 6 for connection is
Since the conductive paste applied to each layer is not restricted by the conduction resistance of the pattern, it may be applied as thinly as possible. Therefore, the connecting conductive particles 6 in the second layer pattern 9 applied over the first layer pattern 2 which has undergone the drying process can be made to protrude from the second layer pattern 9. However, the manufacturing process always includes a step of aligning the patterns 2 and 9 of the first and second layers, which is a significant disadvantage when attempting to form a fine pattern.

[0008]

[Means for Solving the Problems] The present invention solves the above-mentioned conventional problems, and provides a method for manufacturing a heat-seal connector that can connect substrates having fine wiring patterns with high reliability, and The objective is to provide a connection method using a connector. That is, the present invention forms an electric circuit pattern on an electrically insulating base material using a conductive paste containing conductive particles that contribute to the formation of an electric circuit, and when the conductive paste is in an unsolidified or semi-solidified state, during heat seal connection. conductive particles that contribute to electrical connection,
After spraying at least on the heat-sealed connection area, if it is in an unsolidified state, the conductive paste is immediately dried and solidified, and the scattered conductive particles are adhesively fixed on the conductive paste, and if it is in a semi-solidified state, the conductive paste is The particles are crimped onto the conductive paste and fixed with adhesive, the conductive paste is dried and completely solidified,
A method for producing a heat-seal connector, which comprises applying a heat-seal adhesive to at least the heat-sealed connection area after removing conductive particles that have not been adhesively fixed;
The gist of this paper is a connection method in which a heat seal connector manufactured by this method is used for connection between wiring boards.

[0009] As described above, in the present invention, conductive particles for connection are sprinkled on at least a heat-sealed connection portion having an unsolidified or semi-solidified pattern formed by a conductive paste containing conductive particles for circuits, and a drying process is performed. The electrical conductive particles are bonded and fixed, the conductive particles for connection are made to protrude from the pattern, and the pressure during the heat sealing process is concentrated on the conductive particles, increasing the number of conductive particles contributing to the electrical connection, thereby improving the connection stability. The present invention relates to a method of manufacturing heat seal connectors for circuit connection and a connection method using these connectors. According to the manufacturing method of the present invention, since the conductive particles for connection are sprinkled when the conductive paste forming the pattern is in an unsolidified or semi-solidified state, the conductive particles are conductive due to the adhesive properties of the conductive paste itself. Can be attached to paste. Furthermore, a reliable connection can be obtained by using the connector of the present invention.

[0010] The above-mentioned unsolidified state is a state in which the conductive paste has only been applied and printed, but has not undergone a heating process. In this case, the conductive paste is in a solution state, so the surface tension of the conductive paste itself increases the adhesion ability of the surface.
The conductive particles for connection can be easily bonded. However, conductive particles whose particle size is smaller than the coating thickness of the conductive paste sink into the paste and do not protrude. In addition, the semi-solid state means that the conductive paste is "weak" after being applied and printed.
After going through a heating process, it is dry to the touch. In this case, the solvent in the conductive paste is lost and the fluidity becomes lower than that of unsolidified paste, and the resin component is not completely crosslinked. Therefore, the conductive particles for connection can be attached to the conductive paste, but in order to obtain stronger adhesion,
It is necessary to increase the bonding area through a crimping process. Even if the particle size is smaller than the coating thickness, the fluidity of the conductive paste is low, so there is little chance of it sinking in, although it depends on the pressure applied. A completely solidified state is a state in which sufficient thermal energy is applied to the conductive paste to completely crosslink the resin component, and the conductive particles cannot be bonded together.

The present invention will be explained below with reference to the drawings. Figure 1
As shown in (a) and (b), a pattern 2 is formed on a base material 1 using a conductive paste in which circuit conductive particles 5 are dispersed, and when the conductive paste is in an unsolidified or semi-solidified state, a heat seal connection portion is formed. Then, as shown in (c), the conductive particles 6 for connection are scattered, and if they are not solidified, they are adhesively fixed through a drying process, and if they are semi-solidified, they are crimped and then adhesively fixed through a drying process. As shown in d), the conductive particles 6 for connection that were adhesively fixed on the pattern 2 are removed by appropriate means such as high-pressure air flow or shaking, and as shown in Apply sealing adhesive 4 to obtain a heat-sealed connector.

FIG. 2 schematically shows an apparatus for carrying out the above method. In (a), a conductive paste supplying machine 10 is placed on a base material 1.
A conductive paste in which circuit conductive particles 5 are dispersed is printed through a screen mesh 11. Next, as shown in (b), the connection conductive particles 6 are sprinkled onto the base material 1 from the connection conductive particle container 12 through the dispersion pipe 13 and fixed with adhesive. The material 1 is scanned with a cleaning roll 14 to remove the connecting conductive particles 6 that are not fixed on the conductive paste. FIG. 3(a) shows a heat seal connector 15 of the present invention, a liquid crystal display (LCD) 16 as an example of a display device, and an LCD drive circuit 1.
7 is mounted on the input/output electrode 19 (Fig. 3(b)
(b) shows how to connect via (a)
An enlarged partial vertical cross-sectional view taken along the line XX of FIG. In addition to LCDs, display devices of the present invention include light emitting diode displays (LEDs), electroluminescence (EL) displays,
Examples include electrochemical displays (ECD) and plasma displays (PDP). In addition to this, it is also used to connect printed circuit boards, etc.

[0013] The conductive paste may be one that is commercially available, and in particular, when using the screen printing method, which is known as a method for producing patterns with high precision and at low cost, it should be selected from those having a suitable viscosity and deformability. do. Also,
If the circuit resistance value of the pattern is limited, silver, copper,
It is necessary to choose a mixture of solder and other metal powders with various conductivities as conductive particles for circuits, but if this is not the case, a carbon paste containing carbon powder as conductive particles for circuits is inexpensive. Yes, applicable. Of course, a conductive paste prepared by dispersing and mixing metal powder and carbon powder may also be used. Since the connector manufactured by the manufacturing method of the present invention is a heat-sealed connector, in order to maintain the pattern formed with this conductive paste during the heat-sealing process, it is necessary to resist the heat applied during the heat-sealing process. It is necessary to have durability, and it is more preferable to use a thermosetting conductive paste.

[0014] If conductive particles for connection are sprinkled onto an unsolidified conductive paste, it can be firmly adhesively fixed through a drying process, but when the solvent evaporates and the paste is in a semi-solidified state, Since the resin component of the conductive paste is not in a hardened state and its fluidity is reduced, adhesion will be insufficient if it is simply sprayed, so it is better to perform a compression process and then a complete drying process after spraying. It is preferable to appropriately select the thickness of the conductive paste in consideration of keeping the conduction resistance of the pattern low and mechanical strength against scratching, bending, etc.

[0015] Since the conductive particles for connection perform one of their functions by protruding from the conductive paste, when dispersing the conductive particles with the conductive paste in an unsolidified state, the conductive paste Either make the conductive particle diameter larger than the coating thickness, make the conductive particle density smaller than that of the unsolidified conductive paste, or adjust the time from the end of conductive particle dispersion to the conductive paste drying process. Therefore, it is necessary to prevent the conductive particles from being completely buried in the conductive paste. When dispersing conductive particles while the conductive paste is in a semi-solidified state, the fluidity of the conductive paste is reduced, so even if conductive particles are used with a particle size smaller than the thickness of the conductive paste, they will not be buried in the conductive paste. It can be used without being damaged. In addition to these conditions, the conductive particle diameter is determined by the width of the pattern of the wiring board to be connected, but it is preferably in the range of 5 to 200 μm, preferably 10 to 50 μm. The conductive particles for connection are selected from materials such as metal powder and carbon powder, similar to the conductive particles for circuits described above, but metal powder has an insulating film formed on its surface by oxidation, sulfurization, etc. Since there is a disadvantage that the connection resistance increases after sealing, it is preferable to perform gold plating treatment. In addition, metal carbides can be cited as chemically stable materials although their specific resistance is not as low as that of metals, such as tungsten carbide.

When the conductive particles for connection are to be sprinkled onto the conductive paste, the method of dispersion may be determined by taking into consideration physical properties such as the particle size distribution, apparent specific gravity, and angle of repose of the conductive particles. As methods for dispersing powder and granules, there are known methods such as a dispersion pipe method, a roller method, and a scatter method, but the most suitable method is selected depending on the physical properties of the conductive particles described above. However, when spraying using these methods, the material costs for the conductive particles themselves increase because they are spread over the entire surface of the conductive paste, and the process of removing conductive particles that are not adhered to the conductive paste takes time, resulting in high costs. You will be at a disadvantage. In such cases, a screen mesh patterned with openings to include heat seal connections may be used, as used in the prior art. In this method, unlike conventional methods, dry conductive particles are sieved off from the screen mesh, so the screen mesh is less likely to be clogged, and unlike the methods (b) and (c) above, the pattern 2 of the above-mentioned conductive particles because they are not related to formation.
A screen mesh with an opening of ~10 times can be chosen. Tetron (manufactured by Toray Industries, Teijin Co., Ltd., trade name), nylon (manufactured by DuPont, USA, trade name), stainless steel, etc. are commercially available and can be obtained at low cost. If there is a problem such as scattering to places other than the base material and contaminating the working environment, it is preferable to use a stainless steel mesh to suppress the generation of static electricity in order to have an antistatic effect. In the method of sieving off conductive particles using a screen mesh, it is preferable to apply vibrational energy such as a sound wave or an ultrasonic wave to the screen mesh to make the conductive particles fall more efficiently.

The conductive particles for connection that are adhesively fixed to the conductive paste through the drying process protrude from the surface of the conductive paste and perform their function, but the conductive particles scattered in areas where there is no conductive paste are scattered between the patterns. This will cause a short circuit, so it must be removed. Even after the drying process, these conductive particles only lightly adhere to the substrate and can be easily removed and recovered by vacuum suction, so expensive materials such as gold-plated conductive particles are used. It is also possible to do so. However, it is more preferable to use brushing in combination with a method such as removing static electricity accumulated on the conductive particles and the base material with static eliminating air or the like, which will be more efficient.

[0018] In order to take advantage of the features of the above-mentioned manufacturing method,
It is preferable to use a screen printing method to apply and form a pattern using conductive paste, and the screen mesh material may be made of Tetron, nylon, stainless steel, etc., and preferably in order to maintain dimensional stability. stainless steel mesh is desired. The number of meshes is preferably 200 meshes or more, preferably 300 meshes or more, since the aim of the present invention is a fine pattern, as described above. Other screen printing plate conditions may be determined by considering the printing thickness, which determines the conduction resistance of the formed pattern, and the working conditions during printing.

[0019] It is necessary to apply a heat-sealing adhesive to the pattern formed by the conductive paste, which is manufactured by the above-described method and sprinkled with conductive particles for connection, so as to include at least the heat-sealed connection portion. Generally known adhesives can be used as the heat seal adhesive, including thermoplastic, thermosetting, or a blend of thermoplastic and thermosetting resins. To give more detailed examples, examples of thermoplastic adhesives include polyester adhesives, polyamide adhesives, ionomer adhesives, ethylene vinyl alcohol copolymers (EVA), and ethylene acrylic acid copolymers (E
AA), polyolefins such as ethylene methacrylic acid copolymer (EMA), and ethylene ethyl acrylate copolymer (EEA), various synthetic rubbers, and modified products and composites thereof. Thermosetting adhesives include epoxy, urethane, acrylic, silicone,
Examples include synthetic rubbers such as chloroprene-based and nitrile-based rubbers, and mixtures thereof. In either case, curing agents, vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, thermal conductivity improvers, tackifiers, softeners, coloring agents, and the like may be added as appropriate. When metal particles are selected as the conductive particles for connection, in order to prevent the formation of an insulating film on the surface of the metal particles, it is preferable that the heat seal adhesive contains as few impurity ions as possible, and metal deactivators are also used. It is also possible to add .

[0020] When the heat-sealing adhesive is heated during the heat-sealing operation, it needs to wet both the heat-seal connector and the wiring board to which it is adhered to maintain adhesive strength. Although it is desirable that the coating thickness be as thick as possible, if it is too thick, the conductive particles for connection that protrude from the conductive paste may not be able to contact the wiring pattern on the adherend, or it may take a long time under pressure and temperature to make the connection. Since a large amount of conductive paste is required, it is desirable that the conductive paste coating thickness be approximately twice the protruding height of the conductive particles or less. If it is too thin, the conductive particles will act as a support and the adhesive will wet the adherend. Therefore, it is desirable that the height be equal to or higher than the protrusion height of the conductive particles. However, when the conductive paste is in a semi-solidified state and a heat-sealed connector is obtained by scattering conductive particles for connection with a particle size smaller than the thickness of the conductive paste, depending on the pressure during the heat-sealing process, the conductive particles may melt into the conductive paste. The minimum thickness of the heat-sealing adhesive at this time may be the coating thickness of the conductive paste.

In addition to the above, the base material of the heat seal connector for electrical circuit connection according to the manufacturing method of the present invention can be used not only at room temperature but also in heat sealing during heat sealing work in order to connect wiring boards having fine patterns. Dimensional stability is required even near temperatures. It is also required to efficiently conduct the heat sealing temperature during heat sealing work to the heat sealing adhesive, so the material must be selected from this point as well. Specific examples include polyester, polyimide, polycarbonate, polyphenylene sulfide, etc., but since their thermal conductivity is about the same, it is especially important to use these base materials when high thermal conductivity is required. It is also possible to increase the thermal conductivity by reducing the thickness. In other words, the thickness of the film is 10
The thickness is preferably ~50 μm, more preferably 40 μm.
It is better to set it to less than m.

[0022]

[Function] As described above, according to the manufacturing method of the present invention, there is no need to control or adjust the dispersion state of the connecting conductive particles, which has been disadvantageous in the past, and there is no need to control or adjust the dispersion state of the connecting conductive particles, which has been disadvantageous in the past, and there is no need to prevent clogging of the screen printing plate. Since the connecting conductive particles protrude from the conductive paste, the pressure during the heat sealing process is concentrated on the conductive particles, increasing the contact area and stabilizing the contact resistance.

[0023]

[Example] Step 1 Silver paste Dotite XA-256 (manufactured by Fujikura Kasei Co., Ltd., trade name) was screen printed on a polyester film Lumirror (manufactured by Toray Industries, Inc., trade name) with a pitch of 0.
A linear pattern of 5 mm and line width of 0.25 mm was obtained. Next, nickel powder classified to have a particle size of 60 μm or less is sprinkled onto this film using a scattering tube at a rate of 100 particles/mm2 or more, and a heating process is performed to dry the silver paste while adhering the nickel powder. Fix it. By removing the nickel powder that did not adhere to the silver paste using a cleaning roll, a film in which the nickel powder was localized on the silver paste was obtained. In this case, the insulation resistance between the linear patterns of silver paste is 200 MΩ or more (DC50
V), which was equivalent to that without spraying nickel powder. Step 2 The linear pattern obtained in Step 1 was dried at 120°C for 10 minutes to make it semi-solid, and the conductive carbon powder, which had been classified to have a particle size of 30 μm or less, was heat-sealed so as to have an opening at the connection part. It was spread onto the film through a patterned stainless steel screen plate, the adhesion to the silver paste was strengthened using a pressure roll, and the silver paste was further heated and dried to completely solidify the silver paste. When the carbon powder that was not adhesively fixed to the silver paste was removed and the surface condition of the silver paste was observed, it was confirmed that the carbon powder was protruding from the silver paste. Step 3 A heat seal adhesive was applied to the film on which the nickel powder obtained in Step 2 was sprinkled and adhesively fixed, to obtain a heat seal connector. This is indium-tin oxide vapor deposited film (
ITO) When heat-sealed to a glass substrate with electrodes, the resistance value including the circuit at the time of connection was 20Ω on average, standard deviation 2
It was Ω.

[0024]

[Comparative example] Silver paste Dotite XA-25 was added to polyester film Lumirror (manufactured by Toray Industries, Inc., trade name).
6 (manufactured by Fujikura Kasei Co., Ltd., trade name) was screen printed to obtain a linear pattern with a pitch of 0.5 mm and a line width of 0.25 mm. Next, this film was subjected to a drying process at 120°C for 1 hour to completely harden the silver paste, and a heat seal adhesive containing 15% by weight of nickel powder classified to a particle size of 60 μm or less was applied. A heat seal connector was obtained. This was heat-sealed to a glass electrode with an ITO electrode, and the resistance value including the circuit at the time of connection was measured. It was confirmed that the average resistance was 30Ω and the standard deviation was 15Ω, and that the connection resistance had a large variation and had low reliability.

[0025]

[Effects of the Invention] As is clear from the above examples, since the conductive particles for connection are localized on the pattern made of conductive paste, there is no risk of short circuit between adjacent patterns even if the pattern is minute. Therefore, the density of the conductive particles can be increased, and since they protrude from the pattern surface, the pressure during the heat sealing process is concentrated on the conductive particles.
Due to both effects, the number of conductive particles contributing to electrical connection increases, and connection stability can be improved.

[Brief explanation of the drawing]

FIG. 1: (a) is a plan view of a base material on which a pattern has been formed by the method of the present invention, (b) is a partially enlarged sectional view taken along the line A vertical cross-sectional view when conductive particles are scattered on the conductive paste, (d) is a vertical cross-sectional view when conductive particles other than those on the conductive paste in (c) are removed, (
e) is a longitudinal cross-sectional view when heat-sealing adhesive is applied on top of (d).

[Fig. 2] (a) is an explanatory diagram of an apparatus for obtaining the state of (b) in Fig. 1, (b) is an explanatory diagram of an apparatus for obtaining the state of (c) of Fig. 1, and (c) is an explanatory diagram of an apparatus for obtaining the state of (c) in Fig. 1. FIG. 2 is an explanatory diagram of an apparatus for obtaining the state shown in FIG. 1(d).

[Fig. 3] (a) is an explanatory diagram of a connection structure for connecting an LCD and a wiring board equipped with its drive circuit using the heat seal connector of the present invention, and (b) is along the line X-X in (a). FIG. 3 is a partially enlarged vertical cross-sectional view.

FIG. 4(a) is a plan view of a base material on which a pattern has been formed using the conventional method, (b) is a partially enlarged vertical cross-sectional view of a heat seal connector formed using the conventional method (a), and (c) is a plan view of a base material formed with a pattern using the conventional method (a).
(d) is a partially enlarged vertical cross-sectional view of a heat-seal connector produced by the conventional method (c); FIG.

[Explanation of symbols]

1 Base material
10 Conductive paste supply machine 2 pattern
11 Screen mesh 3 Conductive particles
12 Conductive particle container 4 Heat seal adhesive
13 Spraying pipe 5 Conductive particles for circuit 14 Cleaning roll 6 Conductive particles for connection 1
5 Heat seal connector 7 pattern
16 LCD8 Electrical insulation adhesive
17 Drive circuit 9 pattern
18 Wiring board 19 Input/output electrode

Claims (7)

[Claims] Claim 1: An electric circuit pattern is formed on an electrically insulating base material using a conductive paste containing conductive particles that contribute to the formation of an electric circuit, and when the conductive paste is in an unsolidified or semi-solidified state, during heat seal connection. After dispersing conductive particles that contribute to electrical connection at least to the heat-sealed connection area, immediately dry the conductive paste if it is not solidified.
The solidified and scattered conductive particles are adhesively fixed on the conductive paste, and in the case of a semi-solidified state, the scattered conductive particles are pressure-bonded and adhesively fixed on the conductive paste, and the conductive paste is dried and completely solidified. A method for producing a heat-seal connector, which comprises applying a heat-seal adhesive to at least the heat-seal connection portion after removing conductive particles that have not been adhesively fixed. 2. The manufacturing method according to claim 1, wherein the conductive particles adhesively fixed onto the conductive paste are dispersed by a scattering tube method, a roller method, a scatter method, or a combination thereof. 3. The manufacturing method according to claim 1, wherein the conductive particles adhesively fixed onto the conductive paste are dispersed through a screen mesh patterned in correspondence with the heat-sealed connections. 4. The manufacturing method according to claim 1, wherein the conductive particles adhesively fixed onto the conductive paste are classified so as to have a particle size larger than the thickness of the electric circuit pattern. 5. The manufacturing method according to claim 1, wherein the electric circuit pattern is formed by screen printing. 6. A heat seal connector manufactured by the manufacturing method according to claim 1 is used to connect a display device such as a liquid crystal display device, an electroluminescent display, a plasma display, etc. and a wiring board on which a driving circuit thereof is mounted. connection method. 7. A connection method for connecting two or more independent wiring boards using a heat seal connector manufactured by the manufacturing method according to claim 1.