JPH04169080A - Hot setting type anisotropic conductive connection member - Google Patents

Hot setting type anisotropic conductive connection member

Info

Publication number
JPH04169080A
JPH04169080A JP29506090A JP29506090A JPH04169080A JP H04169080 A JPH04169080 A JP H04169080A JP 29506090 A JP29506090 A JP 29506090A JP 29506090 A JP29506090 A JP 29506090A JP H04169080 A JPH04169080 A JP H04169080A
Authority
JP
Japan
Prior art keywords
adhesive layer
anisotropic conductive
conductive adhesive
separator
connecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29506090A
Other languages
Japanese (ja)
Other versions
JPH0777136B2 (en
Inventor
Satoshi Odajima
智 小田嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2295060A priority Critical patent/JPH0777136B2/en
Publication of JPH04169080A publication Critical patent/JPH04169080A/en
Publication of JPH0777136B2 publication Critical patent/JPH0777136B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

PURPOSE:To retain a pot life for a long time after temporary pressing by specifying a relation between the adhesive strength, of an anisotropic conductive adhesive layer and a separator, and the adhesive strength of a connection part to the anisotropic conductive adhesive layer when the anisotropic conductive adhesive layer is pushed to the connection part of an electric circuit substrate under a specific condition. CONSTITUTION:A connection member is composed of an anisotropic conductive adhesive layer 3, in which conductive particles 4 are dispersed in an insulation adhesive containing a heat setting component, and a separator 2 made to adhere to the anisotropic conductive adhesive layer 3. The relation between Fs and Fc is made Fs<Fc, where Fs: adhesive strength of the anisotropic conductive adhesive layer 3 and the separator 2, and Fc: adhesive strength of a connection part to the anisotropic conductive adhesive layer 3 when the anisotropic conductive adhesive layer 3 is pushed to the connection part of an electric circuit substrate at a temperature of 10-50 deg.C and a pressure of 3kg/cm<2> or more. This can retain a pot life for a long time after temporary pressing.

Description

【発明の詳細な説明】 ［産業上の利用分野コ 本発明は電気回路基板（以下基板という）間の接続に用
いられる加熱硬化型異方導電接続部材（以下接続部材と
いう）に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat-curable anisotropically conductive connecting member (hereinafter referred to as a connecting member) used for connection between electric circuit boards (hereinafter referred to as a board).

［従来の技術］ 異方導電接着剤はＬＣＤとＦＰＣ，ＰＣＢとＦＰＣ等の
接続に用いられるが、近年接続部の多ピン化、小ピツチ
化が進み、また耐熱性等の信頼度の向上を求められる結
果、熱硬化型接着剤が使用されるようになった。[Prior art] Anisotropic conductive adhesives are used to connect LCDs and FPCs, PCBs and FPCs, etc., but in recent years, the number of pins and pitches of connections has increased, and improvements in reliability such as heat resistance have been made. As a result of this need, thermosetting adhesives have come into use.

［発明が解決しようとするＩＩＩ（］ しかし熱硬化型異方導電接着剤により基板間を接続する
には、接続部にあらかじめ異方導電接着剤を仮圧着する
ため加熱するので、仮圧着後のポットライフが短くなる
という問題があった。[Three to be solved by the invention (]) However, in order to connect substrates using a thermosetting anisotropic conductive adhesive, heating is required in advance to temporarily press the anisotropic conductive adhesive onto the connection part, so There was a problem that the pot life was shortened.

［課題を解決するための手段］ ゛本発明は上記の問題を解決し、仮圧着後のボッ１　ト
ライフの長い接続部材を提供するもので、これは、加熱
硬化成分を含む絶縁性接着剤中に導電性粒子を分散した
異方導電接着剤層とこれに密着させたセパレータからな
り、該異方導電接着剤層とセパレータとの密着強度ＦＳ
と、該異方導電接着剤層を電気回路基板の接続部に温度
１０〜５０’Ｃ。[Means for Solving the Problems] ゛The present invention solves the above problems and provides a connecting member with a long bot life after temporary pressure bonding, which is made by using an insulating adhesive containing a heat curing component. It consists of an anisotropic conductive adhesive layer in which conductive particles are dispersed and a separator that is in close contact with this, and the adhesion strength FS between the anisotropic conductive adhesive layer and the separator is
Then, apply the anisotropic conductive adhesive layer to the connecting portion of the electric circuit board at a temperature of 10 to 50'C.

圧力３　ｋｇ／ｃｄ以上で押し付けた際の異方導電接着
剤層に対する接続部の密着強度ＦＣどの関係が、ＦＳ＜
ＦＣであることを特徴とする加熱硬化型異方導電接続部
材である。The adhesion strength FC of the connection part to the anisotropic conductive adhesive layer when pressed at a pressure of 3 kg/cd or more is FS<
This is a heat-curable anisotropically conductive connecting member characterized by being FC.

本発明を図面によっそ説明すると、第１図において、本
発明の接続部材上では、セパレータ２上に加熱硬化型接
着剤層３が密着されているが、この中には導電性粒子４
が分散され異方導電性を付与される。第２図は接続部材
上をリール状に巻いたもので、５はコアである。第３図
は、本発明の接続部材上による基板接続の一例で、基板
６と７のそれぞれの接続部８，９が接続部材上によって
接続されている。To explain the present invention with reference to the drawings, in FIG. 1, on the connecting member of the present invention, a heat-curable adhesive layer 3 is closely adhered to a separator 2, and conductive particles 4 are included in this layer 3.
are dispersed and given anisotropic conductivity. FIG. 2 shows a connection member wound into a reel, and 5 is a core. FIG. 3 shows an example of substrate connection on the connecting member of the present invention, in which the connecting portions 8 and 9 of the substrates 6 and 7 are connected on the connecting member.

基板間の接続部材は基板の種類によって異なるが、接続
部材と少なくとも一方の基板の接続部との密着強度がセ
パレータとの密着強度を上まわっておればよい。The connection member between the substrates varies depending on the type of substrate, but it is sufficient that the adhesion strength between the connection member and the connection portion of at least one of the substrates exceeds the adhesion strength between the connection member and the separator.

基板の接続部表面にはつぎの構成が例示される。The following configuration is exemplified on the surface of the connection portion of the board.

すなわち、ＬＣＤの場合にはＩＴ○とガラス、ＰＣＢの
場合には、ガラスエポキシあるいはガラスエポえ、羨。In other words, in the case of LCD, it is IT○ and glass, and in the case of PCB, it is glass epoxy or glass epoxy.

。箔、、）接着剤、、Ａｕ）ツキ層、８ｎメツキ層ある
いはハンダメツキ層、ＦＰＣの場合には、ポリイミドあ
るいはポリイミドとＣｕ箔との接着剤あるいはポリエス
テルあるいはＢＴレジンと、Ａｕメツキ層＋　Ｓｎメツ
キ層、ハンダメツキ層あるいはＡｇペースト、カーボン
ペースト等である。. foil, ) adhesive, , Au) plating layer, 8n plating layer or solder plating layer, in the case of FPC, polyimide or adhesive of polyimide and Cu foil, polyester or BT resin, Au plating layer + Sn plating layer , solder plating layer, Ag paste, carbon paste, etc.

絶縁性接着剤に混入される加熱硬化成分としては、エポ
キシ樹脂系、アクリル系、ウレタン系。Heat curing components mixed into insulating adhesives include epoxy resin, acrylic, and urethane.

シリコーン系、クロロプレン系、ニトリル系などが例示
されるが、これらは導通の信頼性を向上させるため剥離
強度、耐熱性、可撓性を改善するよう熱可塑性樹脂とブ
レンドすることが効果的であり、例としてポリアミド系
、ポリエステル系、アイオノマー系、ＥＶＡ、ＥＡＡ、
ＥＭＡ、ＥＥＡなどのポリオレフィン系、ＮＢＲ，Ｓ、
ＢＲ等の各種合成ゴム系のもの、さらにはこれらの変性
物、複合物があげられる。いずれの場合も、硬化剤。Examples include silicone-based, chloroprene-based, and nitrile-based, but it is effective to blend these with thermoplastic resins to improve peel strength, heat resistance, and flexibility in order to improve continuity reliability. , Examples include polyamide-based, polyester-based, ionomer-based, EVA, EAA,
Polyolefins such as EMA and EEA, NBR, S,
Examples include various synthetic rubbers such as BR, as well as modified products and composites thereof. In both cases, hardener.

加硫剤、制御剤、劣化防止剤、耐熱添加剤、熱伝導向上
剤、粘着付与剤、軟化剤、着色剤、各種カップリング剤
、金属不活性剤等が適宜−添加されることが望ましい。It is desirable that vulcanizing agents, control agents, deterioration inhibitors, heat-resistant additives, thermal conductivity improvers, tackifiers, softeners, coloring agents, various coupling agents, metal deactivators, and the like be added as appropriate.

さらに、前記基板の接続部に対し、１０〜５０℃の温度
範囲において良好な密着性と、本接着時に十分な反応速
度、剥離強度を得るために、この絶縁性接着剤は、１０
〜５０℃における粘度が１０００ボイズ以下である液状
エポキシ樹脂１００重量部、加熱硬化型潜在性硬化剤な
らびに溶融温度が８０℃以上の熱可塑性樹脂２０〜１０
００重量部および粘着付与剤５〜５００重量部とを含ん
だものとすることが最も有効である。これは微視的に１
０〜５０℃において固体状態にある熱可塑性樹脂マトリ
クス中に液状のエポキシ樹脂が分散した構造をとってお
り、これによって１０〜５０℃という低温においても基
板との密着性が良好になるとともに、接続部材としてフ
ィルム状の形を保持し、良好な作業性を得ることができ
る。Furthermore, in order to obtain good adhesion to the connection part of the substrate in the temperature range of 10 to 50°C, and sufficient reaction speed and peel strength during main bonding, this insulating adhesive is
100 parts by weight of a liquid epoxy resin with a viscosity of 1000 voids or less at ~50°C, a heat-curable latent curing agent, and 20 to 10 parts of a thermoplastic resin with a melting temperature of 80°C or higher.
It is most effective to contain 0.00 parts by weight and 5 to 500 parts by weight of a tackifier. This is microscopically 1
It has a structure in which liquid epoxy resin is dispersed in a thermoplastic resin matrix that is in a solid state at 0 to 50 degrees Celsius, and this allows for good adhesion to the substrate even at low temperatures of 10 to 50 degrees Celsius, as well as excellent connection. It is possible to maintain a film-like shape as a member and obtain good workability.

導電性粒子としては、ニッケル、ハンダ、金、銀、パラ
ジウムなどの金属粒子、タングステンカーバイドなどの
セラミック粒子、カーボン粒子、表面をメツキ等の方法
で金属被覆したプラスチック粒子等が例示される。導通
の信頼性を得るために、粒径はできるだけ均一にするこ
とがよく、低ピンチレヘル例えば０．１ａ＋＋やＱ、２
ｍ＋ピッチの接続部におけるリークを防ぐという観点か
ら、粒子径は平均２５．以下であることが望ましいが、
粒子が小さすぎると接着剤が薄く強度が弱くなるため、
平均５ｐ以上であることが好ましい、また粒子には粘着
性がないため、接続まえの状態で異方導電接着剤層表面
に粒子が露出しないことが好ましく、このため異方導電
接着剤層の厚さは導電性粒子の平均粒子径の１．２倍以
上にすることがよい。しかじ厚すぎると、ヒートシール
時に接着剤がフローしきれずに導通不良を生じ、さらに
オーバーフローにより接着剤が流れ出して周囲に悪影響
を与える危険性があるため、１００μｓ以下とすること
がよい。Examples of the conductive particles include metal particles such as nickel, solder, gold, silver, and palladium, ceramic particles such as tungsten carbide, carbon particles, and plastic particles whose surfaces are coated with metal by a method such as plating. In order to obtain reliable conduction, the particle size should be as uniform as possible, with a low pinch level such as 0.1a++, Q, 2
From the viewpoint of preventing leakage at the m+pitch connection, the average particle size is 25. It is desirable that the following is true, but
If the particles are too small, the adhesive will be thin and weak, so
It is preferable that the average particle size is 5p or more, and since the particles do not have adhesive properties, it is preferable that the particles are not exposed on the surface of the anisotropically conductive adhesive layer before connection. Therefore, the thickness of the anisotropically conductive adhesive layer The diameter is preferably 1.2 times or more the average particle diameter of the conductive particles. However, if it is too thick, the adhesive will not flow completely during heat sealing, resulting in poor conductivity, and there is also a risk that the adhesive will flow out due to overflow and have an adverse effect on the surroundings, so it is preferable to make it 100 μs or less.

セパレータは、異方導電接着剤をフィルム状に保持する
とともに、仮圧着時に異方導電接着剤層を基板側へ転写
した後剥がされるため、易剥離性をもつことが必要で、
例えば合成紙、ポリプロピレンフィルム、シリコーンに
より離脱処理した紙やポリエステルフィルム、ふっ素樹
脂フィルム等が例示される。The separator holds the anisotropically conductive adhesive in the form of a film and is peeled off after the anisotropically conductive adhesive layer is transferred to the substrate during temporary pressure bonding, so it must be easily removable.
Examples include synthetic paper, polypropylene film, silicone-treated paper, polyester film, and fluororesin film.

本発明の接続部材は作業性の面からリール状にすること
がよく、このためセパレータは製造時に接着剤を塗布す
る面が１反対側の面より密着性のよいことが望まれ、こ
の点で最も良好なものは、ふっ素樹脂フィルムあるいは
面画にそれぞれの面の剥離し易さの度合いを変えてシリ
コーン離型処理を施したポリエステルフィルムである。The connecting member of the present invention is preferably formed into a reel from the viewpoint of workability. Therefore, it is desirable that the surface of the separator to which adhesive is applied during manufacture has better adhesion than the opposite surface. The most favorable is a fluororesin film or a polyester film in which the surface pattern is subjected to silicone release treatment to vary the degree of ease of peeling on each surface.

ふっ素樹脂フィルムとしてはＰＴＦＥ、ＦＥＰ、ＥＴＦ
Ｅ、’ＰＦＡ、ＰＣＴ、ＦＥ、ＰＶＤＦ等が例示され、
これらは表面に微小な凹凸を有しているため、溶液状態
の接着剤を塗布した面には表面の凹凸に対するアンカー
効果によって良好な密着性が得られ、接着剤が乾燥した
後では、塗布面はどアンカー効果が得られないため、リ
ール状としたときに逆側に接着剤が取られることがない
。またシリコーン処理したポリエステルフィルムは、剥
離し難い方の面に接着剤を設けることによって逆側へ取
られることを防ぐことができる。剥離性の度合いは、シ
リコーンの処理量によって調節できるが、処理量が少な
いとシリコーン被膜に微小な欠陥を生じ、この欠陥の量
によって剥離性が変わるものど考えられる。Fluororesin films include PTFE, FEP, and ETF.
E, 'PFA, PCT, FE, PVDF, etc. are exemplified,
Since these have minute irregularities on the surface, good adhesion is achieved on the surface coated with solution adhesive due to the anchoring effect of the surface irregularities, and after the adhesive dries, the coated surface Since no side anchor effect is obtained, the adhesive will not be removed from the opposite side when it is made into a reel. Furthermore, by providing an adhesive on the side that is difficult to peel off, the silicone-treated polyester film can be prevented from being removed to the opposite side. The degree of releasability can be adjusted by the amount of silicone treated, but if the amount of treatment is small, minute defects will occur in the silicone coating, and it is thought that the releasability will change depending on the amount of these defects.

上記した接続部材を用いて基板間を接続するには、まず
この接続部材を基板のどちらか一方の接続部上に載置し
、１０〜５０℃の温度で３ｋｇ／ｃｍ２以上の圧力を加
えて仮圧着し、ついでセパレータを剥がした後、約１５
０℃以上、１０〜５０ｋｇ／ｄ、２０〜６０秒の条件で
本接続を達成する。仮圧着の際接着剤の表面の基板への
密着性をよくするために、圧着子として厚さ０．０５＋
ｍ以上、硬度２０〜８０度の弾性体を用いると微妙な凹
凸に対する追従性がよく、エアーを巻き込み難く効果的
である。To connect between boards using the above-mentioned connecting member, first place this connecting member on the connecting part of one of the boards, and apply a pressure of 3 kg/cm2 or more at a temperature of 10 to 50°C. After temporary pressure bonding and then peeling off the separator, about 15
The main connection is achieved under the conditions of 0° C. or higher, 10 to 50 kg/d, and 20 to 60 seconds. In order to improve the adhesion of the adhesive surface to the substrate during temporary crimping, use a crimping element with a thickness of 0.05+.
Using an elastic body with a hardness of 20 to 80 degrees and a hardness of 20 to 80 degrees is effective because it has good ability to follow subtle irregularities and is difficult to entrain air.

以上によって加熱硬化型異方導電接着剤層を仮圧着した
後でも、硬化の反応性を低下させることなく、ポットラ
イフが長い接続部材を得ることができる。As described above, even after temporarily press-bonding the heat-curable anisotropically conductive adhesive layer, a connecting member with a long pot life can be obtained without reducing the reactivity of curing.

［実施例］ カルボキシル基含有の熱可塑性ＳＢＲ（スチレン−ブタ
ジェンラバー）１００重量部とテルペンフェノール系粘
着付与剤５０重量部を、トルエン＝ＭＥＫ＝８　：　２
の混合溶剤に２５重量％となるように溶解し、これに液
状エポキシ樹脂（ＡＥＲ３３１Ｌ：旭化成）５０重量部
、マイクロカプセル型エポキシ硬化剤（ツバキュアＨＸ
−３７４Ｊ：旭化成）５０重量部、粒径約１０μの球形
フェノール樹脂にＡｇ、Ａｕの２層メツキを施した比重
的１．２の導電性粒子２０重量部を混合して異方導電性
接着剤をつくった。これをナイフコーターで、セパレー
タとなる厚さ７５ρのＰＴＦＥフィルムにヒフロンテー
プＮｏ。９００：日東電工）にコーティングし、送風乾
燥させて、総厚さｌｏｏ庫（接着剤層の厚さ２５庫）と
し、これを３Ｉ幅にスリットして巻取り接着部材を得た
。[Example] 100 parts by weight of carboxyl group-containing thermoplastic SBR (styrene-butadiene rubber) and 50 parts by weight of a terpene phenol tackifier were mixed into toluene=MEK=8:2
To this, 50 parts by weight of liquid epoxy resin (AER331L: Asahi Kasei) and microcapsule type epoxy curing agent (Tsubacure HX) were dissolved in a mixed solvent of
-374J: Asahi Kasei) 50 parts by weight of a spherical phenolic resin with a particle size of approximately 10μ mixed with 20 parts by weight of conductive particles with a specific gravity of 1.2 plated with two layers of Ag and Au to create an anisotropic conductive adhesive. I made it. Using a knife coater, apply No. HYFLON tape to a 75ρ thick PTFE film that will serve as a separator. 900 (Nitto Denko) and dried with air to obtain a total thickness of LOOO (adhesive layer thickness: 25 mm), which was slit into a 3I width to obtain a wound adhesive member.

これを、ガラス上にＩＴＯ膜により０．２ピツチのパタ
ーンが形成されたＬＣＤの接続部に載置し、室温２７℃
において加熱することなく、圧着子トシて厚さｌｎａ、
ゴム硬度７０度のシリコーンゴムを取付けた治具で１０
ｋｇ／ｃｄの圧力で１秒間押し付は仮圧着したが、セパ
レータであるＰＴＦＥフィルムを容易に剥がし取ること
ができた。仮圧着直後および仮圧着より２週間２５℃、
５０％ＲＨの室内に放置した後、０．２ｍ＋ピッチのＦ
ＰＣを１７０℃２０ｋｇ／ａｔ、３０秒にて本接着し、
抵抗値、剥離強度を測定した結果を表１に示す。This was placed on the connection part of an LCD with a 0.2 pitch pattern formed on glass using an ITO film at a room temperature of 27°C.
The thickness of the crimper is lna, without heating.
10 with a jig fitted with silicone rubber with a rubber hardness of 70 degrees.
Temporary pressure bonding was achieved by pressing at a pressure of kg/cd for 1 second, but the PTFE film serving as a separator could be easily peeled off. 25℃ immediately after temporary crimping and for 2 weeks after temporary crimping,
After leaving it in a room with 50% RH, F of 0.2m+pitch
Adhere the PC at 170℃, 20kg/at, 30 seconds,
Table 1 shows the results of measuring the resistance value and peel strength.

表１ ［発明の効果コ 以上のように本発明により、熱硬化型樹脂の反応性の低
下を招くことなく仮圧着後のポットライフを長く維持す
ることができるため、組立工程に制約がなく、効率の良
い作業を行なうことができる。また１０〜５０’Ｃとい
う常温に近い温度範囲で仮圧着できるため、仮圧着機の
温度制御をほとんど必要とせず、圧着子の交換等のメン
テナンスも容易であり、火傷の心配もなく作業性がよく
、加熱のためのコストも低減できる。また液状エポキシ
樹脂と熱可塑性樹脂をブレンドすることによって、仮圧
着時のエツジでの接着剤の切れがよくなり、作業性が向
上する。また圧着子に厚さ０゜０５ｍ以上、硬度２ｏ〜
８０度の弾性体を用いることによって仮圧着する基板へ
の密着性が増し、エアーの巻き込みも少なくなるので歩
留りが向上する。Table 1 [Effects of the invention] As described above, according to the present invention, the pot life after temporary pressure bonding can be maintained for a long time without causing a decrease in the reactivity of the thermosetting resin, so there are no restrictions on the assembly process. Able to work efficiently. In addition, since temporary crimping can be performed at a temperature range of 10 to 50'C, which is close to room temperature, there is almost no need to control the temperature of the temporary crimping machine, and maintenance such as replacing crimpers is easy, and there is no risk of burns and work efficiency is improved. In addition, the cost for heating can also be reduced. Furthermore, by blending liquid epoxy resin and thermoplastic resin, the adhesive can be easily cut at the edges during temporary pressure bonding, improving workability. In addition, the thickness of the crimping element is 0°05m or more, and the hardness is 2o~
By using an 80 degree elastic body, the adhesion to the substrate to be temporarily bonded is increased, and air entrainment is also reduced, resulting in an improvement in yield.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の接続部材の断面図、第２図は本発明の
リール状にした接続部材の斜視図、第３図は本発明の接
続部材により２枚の基板を接続したときの断面図である
。 １・・・接続部材、　　２・・・セパレータ、３・・加
熱硬化型接続部材、　４・・・導電性粒子。 ５・・・コア、　６．７・・・基板、　８．９・・・接
続部。Fig. 1 is a cross-sectional view of the connecting member of the present invention, Fig. 2 is a perspective view of the reel-shaped connecting member of the present invention, and Fig. 3 is a cross-sectional view of two substrates connected by the connecting member of the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1... Connection member, 2... Separator, 3... Heat-curable connection member, 4... Conductive particles. 5... Core, 6.7... Board, 8.9... Connection part.

Claims (1)

【特許請求の範囲】 １）加熱硬化成分を含む絶縁性接着剤中に導電性粒子を
分散した異方導電接着剤層とこれに密着させたセパレー
タからなり、該異方導電接着剤層とセパレータとの密着
強度Ｆ＿Ｓと、該異方導電接着剤層を電気回路基板の接
続部に温度１０〜５０℃、圧力３ｋｇ／ｃｍ＾２以上で
押し付けた際の異方導電接着剤層に対する接続部の密着
強度Ｆ＿Ｃとの関係が、Ｆ＿Ｓ＜Ｆ＿Ｃであることを特
徴とする加熱硬化型異方導電接続部材。 ２）上記絶縁性接着剤は、液状エポキシ樹脂１００重量
部、加熱硬化型の潜在性硬化剤ならびに熱可塑性樹脂の
２０〜１０００重量部および粘着付与剤５〜５００重量
部を含み、該液状エポキシ樹脂の１０〜５０℃における
粘度は１０００ポイズ以下、該熱可塑性樹脂の溶融温度
は８０℃以上である請求項１に記載の接続部材。 ３）上記導電性粒子の平均粒子径は５〜２５μｍである
請求項１に記載の接続部材。 ４）上記異方導電接着剤層の厚さは上記導電性粒子の平
均粒子径の１．２倍以上、１００μｍ以下である請求項
１および３に記載の接続部材。[Claims] 1) An anisotropically conductive adhesive layer comprising conductive particles dispersed in an insulating adhesive containing a heat-curable component and a separator in close contact with the anisotropically conductive adhesive layer, the anisotropically conductive adhesive layer and the separator. adhesion strength F_S to the anisotropic conductive adhesive layer and the contact strength of the anisotropic conductive adhesive layer when pressed to the connection part of the electrical circuit board at a temperature of 10 to 50°C and a pressure of 3 kg/cm^2 or more. A heat-curable anisotropically conductive connecting member characterized in that the relationship with adhesion strength F_C is F_S<F_C. 2) The above-mentioned insulating adhesive contains 100 parts by weight of a liquid epoxy resin, 20 to 1000 parts by weight of a heat-curable latent curing agent and a thermoplastic resin, and 5 to 500 parts by weight of a tackifier, and the liquid epoxy resin The connecting member according to claim 1, wherein the viscosity of the thermoplastic resin at 10 to 50°C is 1000 poise or less, and the melting temperature of the thermoplastic resin is 80°C or higher. 3) The connecting member according to claim 1, wherein the conductive particles have an average particle diameter of 5 to 25 μm. 4) The connection member according to Claims 1 and 3, wherein the thickness of the anisotropic conductive adhesive layer is 1.2 times or more and 100 μm or less the average particle diameter of the conductive particles.
JP2295060A 1990-10-31 1990-10-31 Thermosetting anisotropic conductive connection member Expired - Fee Related JPH0777136B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2295060A JPH0777136B2 (en) 1990-10-31 1990-10-31 Thermosetting anisotropic conductive connection member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2295060A JPH0777136B2 (en) 1990-10-31 1990-10-31 Thermosetting anisotropic conductive connection member

Publications (2)

Publication Number Publication Date
JPH04169080A true JPH04169080A (en) 1992-06-17
JPH0777136B2 JPH0777136B2 (en) 1995-08-16

Family

ID=17815798

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0824270A3 (en) * 1996-08-06 1999-06-09 Hitachi Chemical Co., Ltd. A method of mounting a plurality of electronic parts on a circuit board
JP2008300360A (en) * 1995-02-07 2008-12-11 Hitachi Chem Co Ltd Connecting method of electrode
JP2011061241A (en) * 2006-04-26 2011-03-24 Hitachi Chem Co Ltd Adhesive
JP2015135748A (en) * 2014-01-17 2015-07-27 デクセリアルズ株式会社 Anisotropic conductive film, connection structure, method for manufacturing connection structure, and apparatus for manufacturing connection structure
KR20160130768A (en) * 2014-03-07 2016-11-14 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film and method for producing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155809A (en) * 1984-08-27 1986-03-20 日立化成工業株式会社 Conductive adhesive film wind
JPS62117206A (en) * 1985-11-18 1987-05-28 株式会社リコー Anisotropic conductive sheet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155809A (en) * 1984-08-27 1986-03-20 日立化成工業株式会社 Conductive adhesive film wind
JPS62117206A (en) * 1985-11-18 1987-05-28 株式会社リコー Anisotropic conductive sheet

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300360A (en) * 1995-02-07 2008-12-11 Hitachi Chem Co Ltd Connecting method of electrode
EP0824270A3 (en) * 1996-08-06 1999-06-09 Hitachi Chemical Co., Ltd. A method of mounting a plurality of electronic parts on a circuit board
US6158115A (en) * 1996-08-06 2000-12-12 Hitachi Chemical Company, Ltd. Method of mounting a plurality of electronic parts on a circuit board
US6479757B1 (en) 1996-08-06 2002-11-12 Hitachi Chemical Company, Ltd. Method of mounting a plurality of electronic parts on a circuit board
US6841022B2 (en) 1996-08-06 2005-01-11 Hitachi Chemical Company, Ltd. Adhesive-coated electronic parts on a connection sheet
JP2011061241A (en) * 2006-04-26 2011-03-24 Hitachi Chem Co Ltd Adhesive
JP2011066448A (en) * 2006-04-26 2011-03-31 Hitachi Chem Co Ltd Bonding tape and solar cell module using the same
JP2012216843A (en) * 2006-04-26 2012-11-08 Hitachi Chem Co Ltd Adhesive tape and solar cell module using the same
US8969707B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same
US8969706B2 (en) 2006-04-26 2015-03-03 Hitachi Chemical Company, Ltd. Adhesive tape and solar cell module using the same
JP2015135748A (en) * 2014-01-17 2015-07-27 デクセリアルズ株式会社 Anisotropic conductive film, connection structure, method for manufacturing connection structure, and apparatus for manufacturing connection structure
KR20160130768A (en) * 2014-03-07 2016-11-14 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film and method for producing same

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