JPH0774048B2 - Adsorption device - Google Patents

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to an adsorption device. That is, the present invention relates to an adsorption device that adsorbs and lifts a large number of thin materials such as printed wiring boards stacked one above the other one by one from the uppermost one and automatically moves them to another one.

[0002]

2. Description of the Related Art Manufacturing processes for printed wiring boards and other thin materials have become complicated and diversified, but automation is being further promoted to improve quality and reduce costs. For example, in printed wiring boards, circuit density and miniaturization have been advanced more and more recently, and in the manufacturing process thereof, manual work by hand may be a major obstacle to quality improvement, and automation is being further advanced. In a manufacturing process in such a situation, as a part of automation, a suction device such as an automatic loading machine that automatically moves thin materials such as stacked printed wiring boards one by one as follows. It was. That is, in a conventional suction device such as an automatic loading machine, the printed wiring boards and the like stacked on the lifting table are sucked by a suction unit having a plurality of suction pads facing each other on the upper side and sucked one by one. It was then lifted and transported to a conveyor in the processing process. That is,
It was adsorbed by suction air and moved to another place.

[0003]

By the way, the following problems have been pointed out in such a conventional adsorption device. That is, thin materials such as printed wiring boards stacked on a lifting table are pressed against each other due to stacking, the air between them is reduced and become a substantially vacuum state, and sticking and sticking to each other occurs. Was there. Further, such a sticking / adhesion phenomenon became more remarkable as the number of stacked printed circuit boards or the like and as the surface smoothness thereof became higher. It has been pointed out that due to such sticking / adhesion phenomenon, a few printed circuit boards or the like are adsorbed at the same time. That is, in the suction device such as the automatic feeding machine, the printed wiring boards and the like must be sucked, lifted and moved one by one as described above, but at that time, a plurality of the printed wiring boards are simultaneously overlapped and conveyed to the conveyor or the like in the processing step. As a result, the printed wiring board and the like are not processed as expected, various troubles occur in the processing process, and the device is damaged.

In view of such circumstances, the present invention has been made as a result of earnest research efforts by the inventor in order to solve the problems of the above-mentioned conventional examples. The purpose of the present invention is to propose an adsorption device that can adsorb, lift, and move thin materials one by one accurately by providing a suction hole and an outlet hole on the suction surface and combining pressurized air with suction air. To do.

[0005]

The technical means of the present invention for achieving this object are as follows. This adsorption device adsorbs and lifts a large number of thin materials stacked vertically one by one from the topmost one, and automatically moves them to another one. The thin material has a large number of through holes or is materially air-permeable. The suction surface of the suction device facing the thin material is provided with a plurality of suction holes for sucking the thin material with suction air, and blowout holes for pressurizing the compressed air between the thin materials. .

[0006]

Since the present invention comprises such means, it operates as follows. In this suction device, suction force is generated by the suction air to the suction hole provided on the suction surface, and the topmost thin material is sucked. At the same time, the pressurized air from the blowout hole provided on the suction surface passes through the through hole of the first thin material or the air permeability of the thin material causes the first thin material and the second thin material to pass through. It is pressed into between thin materials. So first
In addition, the thin materials are pressed against each other due to the stacking and are in a substantially vacuum state, and the sticking and adhesion phenomena of each other easily occur. On the other hand, in this adsorption device, an air flow film is generated between the first thin material and the second thin material that have been overlapped by the pressurized air that has been press-fitted, and a gap is formed. The thin material of the second sheet and the thin material of the second sheet are peeled off and separated / desorbed. Secondly, the flow of sucked air to the suction hole is reliably ensured through the through-hole of the first thin material and its breathability due to the airflow film or gap formed as described above. The suction force for the first thin material by the suction air is improved.

As described above, in this suction device, since the suction surface is provided with the suction hole and the blowout hole and the suction air is combined with the pressurized air, only the uppermost thin material is sucked and lifted by the suction surface. Be moved. In this way
The stacked thin materials are adsorbed, lifted and moved exactly one by one, and it is completely prevented that plural sheets such as a few adsorbed, lifted and moved at the same time.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on the embodiments shown in the drawings. 1A and 1B show a main part of an embodiment of an adsorption device according to the present invention. FIG. 1A is a front sectional view and FIG. 2B is a bottom view of an adsorption surface. 2A and 2B are front sectional views for explaining the operation of the same embodiment. FIG. 2A shows the printed wiring boards stacked, and FIG. 2B shows the state immediately before adsorption.
(3) The figure shows the state during adsorption. 3 is a front explanatory view of the entire adsorption device, and FIG. 4 is a side explanatory view of the same. This suction device is used, for example, as an automatic feeder A, an automatic receiver, etc., and is used in the manufacturing process of the printed wiring board P and other thin materials, and transfers the printed wiring board P and other thin materials. It is designed to be carried from side to side.

First, the printed wiring board P will be described. The printed wiring board P has various kinds such as a double-sided board for OA, a multi-layered board for computer, a flexible board for computer, etc., and a variety of manufacturing processes thereof. Further, in recent years, the printed wiring board P has been increasingly densified and miniaturized in its circuit, and its miniaturization, weight reduction, ultra-thinning, multi-layering, and the like are progressing. Now, such a printed wiring board P is manufactured as follows, for example. That is, the printed wiring board P is formed by cutting the material, drilling,
It is manufactured by following the steps of cleaning, polishing, through-hole plating, cleaning, polishing, cleaning, drying, resist application, exposure, development, etching, resist stripping, cleaning, drying, and so on.
First, a double-sided copper foil-clad laminate, in which copper foil is laminated on both sides of the material, that is, the insulating material, is cut into short pieces of work size, and then subjected to through-hole drilling, followed by cleaning and double-side polishing. After the processing is performed, through-hole plating is performed. That is, the inner wall of the through hole is plated so that the electric circuit on the front surface and the electric circuit on the rear surface are electrically connected. After that, washing, double-sided polishing treatment, washing, and drying are performed again, and then a process of sticking a photosensitive resist, which is a dry film, into a film shape is performed, and then a circuit photograph, which is a negative film of the circuit, is applied. After exposure, the resist is exposed and cured, leaving a circuit portion, and the other portion is dissolved and removed by spraying a developing solution. Then, in the etching machine, the copper foil in the circuit portion where the resist is hardened in this way is left, and the copper foil in the portion where the resist is dissolved and removed by the above is dissolved and removed by the jetting of the corrosive liquid. Then, the remaining resist of the above-mentioned cured circuit portion,
After it is dissolved and removed by spraying the stripping solution, it is washed and dried to obtain the printed wiring board P on which a predetermined circuit is formed.

The suction device is used, for example, to automatically insert or receive the printed wiring board P in the manufacturing process of the printed wiring board P. That is, for example, in each of the above-mentioned pretreatment steps, that is, each step of cleaning, polishing, cleaning, drying, etc., the printed wiring boards P are loaded one by one by the suction device which is the automatic loading machine A, and the predetermined processing is performed accordingly. ing. And
In this suction device, that is, the automatic loading machine A, the printed wiring boards P stacked in a large number in the upper and lower parts are
It is designed to be picked up and picked up one by one, and then automatically moved to another.

First, referring to FIGS. 3 and 4,
Reference numeral 1 denotes a frame which is a whole frame, and an elevating table 2 is attached to one end of the frame 1 so as to be able to ascend and descend, and a large number of printed wiring boards P are stacked on the elevating table 2. 3 is such a lifting table 2
Is a vertical shaft for assembling, and 4 is an elevating motor for the elevating operation. The suction unit 5 of the automatic loading machine A is arranged above the printed wiring board P on the lifting table 2, and the suction unit 5 has a closed box shape and a flat bottom surface. It is a suction surface 6, and the suction surface 6 is located opposite to the printed wiring board P on the lifting table 2. Further, the suction unit 5 having such a suction surface 6 is attached to the frame 1 so as to be vertically movable and horizontally movable. 7 is
This is a horizontal shaft for assembling the suction unit 5, and the suction unit 5 is attached to the lower side of the horizontal shaft 7, and the suction unit 5 interposes the horizontal shaft 7 and the up / down cylinder 8 is provided. It is possible to move up and down at the same time, and it is possible to move laterally at the slide motor 9. The suction unit 5 is connected to the printed wiring board P.
It is possible to reciprocate between the lifting table 2 on the delivery side and the conveyor 10 on the receiving side. The conveyor 10 is arranged on the other end side of the frame 1 and is driven by a conveyor motor 11. The mechanism for vertically moving and horizontally moving the suction unit 5 does not depend on the illustrated example.
Other known various methods can be adopted.

Next, referring to FIGS. 1 and 2,
The suction surface 6 of the suction unit 5 of the automatic feeding machine A has a large number of suction holes 12 for sucking the printed wiring board P with suction air B and a small number of blow holes for pressurizing the pressurized air C between the printed wiring boards P. 13 are provided. That is, the center of the upper portion of the suction unit 5 having a substantially box shape is connected to the suction device 15 (see FIG. 3) such as an external blower via the flexible duct 14, and the suction surface 6 on the lower surface of the suction unit 5 is connected. A large number of suction holes 12 are formed in each of the suction holes 12, and the suction air B is directed from each suction hole 12 to the suction device 15 inside the suction unit 5 and via the duct 14. At the same time, the suction surface 6 is formed with a small number of blow-out holes 13 between a large number of suction holes 12. The blowout hole 13 is connected to an external compressor such as an air compressor via a flexible connecting pipe 16 which is not communicated with the inside of the adsorption unit 5, and is connected to each blowout hole 13 from the compressor via the connecting pipe 16. The pressurized air C is supplied. The air volume of the pressurized air C is generally set to be smaller than that of the suction air B. In the illustrated example, the number of the blowout holes 13 is set to be smaller than that of the suction holes 12, but the suction holes 12 are The blow-out holes 13 may have different sizes. Further, even if the numbers and sizes are the same, it is possible to make the air volumes different.

As shown in FIG. 2A, the printed wiring board P is generally provided with a large number of through holes H. That is, in the printed wiring board P, for connection and conduction of electric circuits on both front and back surfaces, insertion and attachment of semiconductor components to be mounted around legs, further, for hooking during plating, for drilling guide pins, etc. Therefore, a large number of through holes H, which are various small holes, are formed.

The automatic charging device A, which is the adsorption device, is constructed as described above. Then it becomes as follows. In this automatic loading machine A, as shown in FIGS. 3 and 4, a plurality of printed wiring boards P stacked on the elevating table 2 on the delivery side are stacked one by one from the uppermost one, and the suction surfaces of the suction unit 5 are arranged. 6 is automatically adsorbed by the adsorbing unit 6, and is automatically lifted and moved sequentially by the advancing unit 5 moving up and down and moving horizontally to the left and right, and then conveyed to the conveyor 10 on the receiving side for processing such as cleaning, polishing, and drying. Be seen. At this time, in this automatic feeder A, as shown in FIGS. 1 and 2, first,
A suction force is generated by the suction air B to a large number of suction holes 12 provided on the suction surface 6 facing the printed wiring board P,
The uppermost first printed wiring board P is sucked toward the suction surface 6 (see (2) in FIG. 2). At the same time, the pressurized air C is discharged from the small number of blowout holes 13 provided on the suction surface 6,
Through such a through hole H of the first printed wiring board P, it is instantly press-fitted between the first printed wiring board P and the next second printed wiring board P (see FIG. 2). See (2) and (3). Then, it becomes the following first and second.

First, the printed wiring boards P are pressed against each other due to stacking, the air between them is reduced, and the printed wiring boards P are in a substantially vacuum state, so that sticking and adhesion phenomena are likely to occur ((1) in FIG. 2). (See Figures and Figures 3 and 4). On the other hand, in this automatic feeder A, an air flow film is generated by the pressurizing pressurized air C between the first printed wiring board P and the second printed wiring board P which have been overlapped, and a gap is generated. Since D is formed (see (3) in FIG. 2), the first printed wiring board P and the second printed wiring board P are reliably peeled off and separated / removed.

Secondly, the pressurized air C from the blowout hole 13 is set to have a high pressure but a small air volume,
The suction force of the suction air B to the suction hole 12 is improved. That is, as described above, the air flow film is generated between the first printed wiring board P and the second printed wiring board P by the pressurized air C, and the gap D is formed. Flow of suction air 13 to the suction hole 12,
That is, the flow of the suction air B that entrains the surrounding air is reliably ensured by passing through the gap D and the through hole H of the first printed wiring board P. Therefore, the suction force of the suction air B to the first printed wiring board P is improved.

As described above, in the automatic charging machine A which is the suction device, the suction surface 12 and the blowout hole 13 are formed in the suction surface 6.
By providing the negative pressure and the positive pressure, that is, combining the suction air B and the pressurized air C, first, the first printed wiring board P and the second printed wiring board P are reliably pulled. Secondly, it is peeled off for separation and desorption, and secondly, the suction surface 6
The suction power to the is also improved. Therefore, the first and second printed wiring board P, which is the uppermost one, is lifted by the first and second.
Only is attracted to the contacting suction surface 6 side, and suction,
Lifted and moved. In this way, the printed wiring boards P stacked on the elevating table 2 on the delivery side are
The sheets are picked up, lifted, and moved one by one in a precisely and regular manner, and are conveyed to the conveyor 10 on the receiving side.
At the same time, it is completely prevented that a plurality of printed wiring boards P such as two or three are sucked, lifted and moved, and the printed wiring boards P are sequentially carried to the processing step one by one.

In the illustrated embodiment, the suction device of the present invention is applied to the automatic loading machine A in the manufacturing process of the printed wiring board P, but the present invention is not limited to this. It can be applied to other various thin material manufacturing processes. For example, in the field of handling thin materials such as paper, timber, plastics, glass, printed matter, woven fabrics, and various other flat plate materials, etc., as long as they have through holes H or have air permeability in them. It is possible and can be used as an automatic feeder, an automatic receiver, etc. in the manufacturing process thereof. Note that when a thin material having air permeability is used as a target regardless of the through hole H, the pressurized air C from the blowout hole 13 described above is
Instead of the through hole H, the air permeability of the thin material causes
It is pressed in between the two sheets.

[0019]

As described above, the adsorbing device according to the present invention utilizes the air permeability of the through hole of the thin material, provides the adsorbing surface with the suction hole and the blowing hole, and combines the suction air with the pressurized air. As a result, the following effects are exhibited.

That is, the printed wiring board and other thin materials having through holes or air-permeable materials are adsorbed, lifted and moved exactly one by one. In other words, it is completely prevented that a plurality of sheets such as a few sheets are picked up, lifted and moved at the same time, and thus the plurality of sheets are not overlapped and conveyed to a conveyor or the like in the processing step, and thus a thin material Starting from the intended processing of the material, various troubles in the processing process and damage to the equipment can be avoided. As described above, the effects of the present invention are remarkably large, such as the problems existing in this type of conventional example are eliminated.

[Brief description of drawings]

FIG. 1 shows a main part of an embodiment of an adsorption device according to the present invention,
(1) is a front sectional view, and (2) is a bottom view of the suction surface.

FIG. 2 is a front sectional view for explaining the operation of the same embodiment, and (1) is a diagram showing stacked printed wiring boards,
FIG. 2 (2) shows the state immediately before adsorption, and FIG. 3 (3) shows the state during adsorption.

FIG. 3 is a front explanatory view of the entire suction device.

FIG. 4 is a side view illustrating the entire suction device.

[Explanation of symbols]

 1 frame 2 lifting table 3 vertical shaft 4 lifting motor 5 suction unit 6 suction surface 7 horizontal shaft 8 vertical cylinder 9 sliding motor 10 conveyor 11 conveyor motor 12 suction hole 13 outlet hole 14 duct 15 suction device 16 connection pipe A Automatic feeding machine B Suction air C Pressurization air D Gap H Through hole P Printed wiring board

Claims (1)

[Claims] 1. An adsorption device for adsorbing and lifting a large number of thin materials stacked one above the other one by one from the topmost one, and automatically moving them to another one, wherein the thin materials have a large number of penetrations. The suction surface of the suction device facing the thin material is formed with holes or has air permeability, and a plurality of suction holes for sucking the thin material by suction air together with a pressurizing air. A suction device for press-fitting between the thin materials is provided.