KR20170105159A - Printed circuit board manufacturing for the core board prepreg automatic lay-up device - Google Patents

Printed circuit board manufacturing for the core board prepreg automatic lay-up device Download PDF

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Publication number
KR20170105159A
KR20170105159A KR1020160027743A KR20160027743A KR20170105159A KR 20170105159 A KR20170105159 A KR 20170105159A KR 1020160027743 A KR1020160027743 A KR 1020160027743A KR 20160027743 A KR20160027743 A KR 20160027743A KR 20170105159 A KR20170105159 A KR 20170105159A
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South Korea
Prior art keywords
prepreg
core substrate
substrate
core
unit
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KR1020160027743A
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Korean (ko)
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KR101786600B1 (en
Inventor
김영수
조영욱
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거산산업주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a core substrate for manufacturing a printed circuit board and a prepreg automatic layup apparatus, which are capable of automatically aligning prepregs on both upper and lower surfaces of a core substrate for producing printed circuit boards.
The core substrate and the prepreg automatic layup apparatus for manufacturing a printed circuit board of the present invention are configured such that the core substrate is taken out from the carrier 101 in which the core substrate A is housed by using the substrate transfer means 102, A core substrate supply unit 100 to be mounted on the alignment plate 302;
A prepreg feeder 200 for loading a plurality of prepregs B and picking up the uppermost prepreg through the prepreg conveying means 205 and stacking the uppermost prepreg on the alignment plate 302 of the stacking alignment unit 300;
A single core substrate supplied from the core substrate supply unit 100 and two stacked prepregs supplied from the prepreg supply unit 200 are laminated on the alignment plate 302 in a sandwich form, (300).
According to the present invention, since the core substrate and the prepreg can be automatically supplied and aligned automatically, it is possible to construct a more precise inner layer, thereby significantly improving the productivity and quality at the time of manufacturing the printed circuit board.

Figure P1020160027743

Description

Technical Field [0001] The present invention relates to a core board for manufacturing printed circuit boards and a prepreg automatic lay-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a core substrate and a prepreg automatic layup apparatus for manufacturing a printed circuit board. More particularly, the present invention relates to a core substrate for manufacturing a printed circuit board, To a core board for manufacturing printed circuit boards and a prepreg automatic layup apparatus capable of improving quality.

BACKGROUND ART Printed circuit boards are manufactured by using a copper-clad laminate in which a copper foil is laminated on a thin substrate made of a material such as a paper-phenol resin or a glass-epoxy resin, Refers to a thin plate-like electronic component obtained by completing a copper foil for wiring by a technique such as etching, etching, or the like, in which electrical components such as an integrated circuit, a resistor, or a switch are mounted or an electrical connection is made between elements.

BACKGROUND ART [0002] In the past, printed circuit boards mainly consisted of a single-sided printed circuit board on which only a single-sided conductor circuit was formed. However, not only a double-sided printed circuit board on which conductor circuits were formed on both sides of the substrate, And a printed circuit board having various functions and various functions such as a multilayer printed circuit board which is a printed circuit board composed of a conductor circuit in the inner layer.

Particularly, in recent years, electronic products are required to be thinned and finely patterned in accordance with miniaturization, high density, thinning, packaging, and the like, so that the use of multilayer printed circuit boards capable of high density has been greatly increased.

A general manufacturing process of the multilayer printed circuit board is shown in FIG.

An aluminum plate supply part 11 for supplying an aluminum plate to the front of a conveying conveyor 10 installed in a transverse direction, an inner layer printed with circuits printed on both sides of the prepreg, And a lay-up part 12 for sequentially stacking the sheets in multiple stages.

A press 13 is provided on the side of the layup part 12 or in a separate space to press the laminated unfinished multilayer printed circuit board into a complete multi-layer printed circuit board.

Of course, foreign matter removing means 14 composed of a roller system or a vacuum system is provided on the conveying conveyor 10 so as to remove foreign substances on the aluminum plate, and the layup part 12 is provided with a conveying conveyor 10 It will be appreciated that a conventional loader is provided for feeding the aluminum plate supplied by the layup part 12 to the layup part 12. [

The operation of the automatic PCB stacking system 20 will now be described. An operator is positioned on the aluminum plate supply part 11 and the layup part 12 to supply the aluminum plate to the conveying conveyor 10.

The aluminum plate is intended to prevent damage to the laminated copper foil sheet and to keep the copper foil sheet and the inner layer laminated in a flat state.

The aluminum plate supplied to the conveying conveyor 10 is conveyed to the layup part 12 in a state where various foreign substances are removed by the foreign substance removing means 14 and the aluminum plate transferred to the layup part 12 is conveyed to the loader 12, On the base plate of the layup part (12).

The operator applies the inner layer having the prepreg on both sides thereof on the upper surface of the aluminum plate laid on the base plate, the copper foil sheet is spread on the upper surface of the inner layer, and finally the aluminum plate is laid, The lamination of the printed circuit board is completed.

The above operation is continuously pressed by the press to form the complete multi-layer printed circuit board.

On the other hand, in the manufacturing of the printed circuit board as described above, when forming an inner layer in which prepregs are closely contacted to both sides of the core substrate on which the circuit is printed, it is essential to align the centers of the core substrate and the prepregs precisely .

However, conventionally, in a stacking unit in which a plurality of prepregs cured to a B-stage are cured, a prep sheet is taken out one by one by an operator, and the prepregs are stacked by hand in an aligning device for aligning the prepreg with the core substrate. So that the work efficiency and productivity are deteriorated.

In addition, a prepreg in a solid state, which is not completely cured in the process of supplying the prepreg to the aligning device by manual operation by the operator, is fed in a folded state, or a foreign substance There is a problem that defective feed rate is increased frequently in the manufacturing process of the multilayer printed circuit board, and productivity is lowered.

The conventional technology for solving such a problem does not exist at present, and a representative similar technology having technology relevance will be described as follows.

Japanese Patent Application Laid-Open No. 10-1268121 discloses a substrate stacking table in which a plurality of layup substrates are stacked in a zigzag form; A pair of substrate side separation parts provided on both sides of the substrate laminate for picking up and lifting both sides of the uppermost layer lay-up substrate among the plurality of lay-up substrates stacked on the substrate laminate; The substrate is separated from the substrate side separation part and enters the space between the layup substrate raised by the substrate side separation part and the layup substrate thereunder to completely lift up and separate the layup substrate A substrate front separator; A substrate transferring means for transferring the uppermost layer lay-up substrate by entering between the uppermost layer lay-up substrate and the lower layer lay-up substrate lifted by the substrate side separating portion and the substrate front separating portion; And a lay-up substrate automatic separating / feeding device including the above-

Patent Registration No. 10-1268121 (Feb.

In the conventional art as described above, in the process of supplying the layup substrate, in which the prepregs are overlapped on the upper and lower surfaces of the core substrate, to the manufacturing equipment used for manufacturing the multilayer printed circuit board, The present invention provides a method for automatically feeding a multilayer substrate and automatically separating the multilayer substrate and automatically feeding the multilayer substrate to a subsequent process. It is possible to automate the post-lamination process of the core substrate and the prepreg, There is no technical structure that can solve the problem caused by stacking. Therefore, it is possible to improve productivity of printed circuit board through automatic stacking and automatic alignment by automatic supply of core substrate and prepreg, There is an urgent need to develop a core substrate for circuit board fabrication and a prepreg automatic layup apparatus.

The core substrate and the prepreg automatic layup apparatus for manufacturing a printed circuit board of the present invention have been developed in order to solve the conventional problems as described above. In the carrier substrate 101 in which a plurality of core substrates are housed, A core substrate supply unit 100 which is taken out by using the substrate transfer means 102 and is stacked on the alignment plate 302 of the stack alignment unit 300;

A plurality of prepregs are stacked and the uppermost prepreg is picked up through the prepreg conveying means 205 having the vacuum adsorption unit 205b to be stacked on the alignment plate 302 of the stack alignment unit 300, A supply unit 200;

A single core substrate supplied by using the substrate transfer means 102 of the core substrate supply unit 100 and two prepregs supplied through the prepreg transfer means 205 of the prepreg supply unit 200 are connected to the alignment plate And a laminate alignment unit 300 for aligning the core substrate and the prepreg in a center portion of the alignment plate 302 by using an alignment body after lamination in a sandwich form on the substrate 302.

The core substrate supply unit 100 is provided with a grip portion 101a on the inner side so as to accommodate a plurality of core substrates in the longitudinal direction and a core substrate gripped by the grip portion 101a on the upper side, A carrier 101 having an opening 101b formed therein so as to be able to be inserted and removed;

The core substrate accommodated in the carrier 101 is clamped and discharged vertically upward from the carrier 101. The core substrate is then rotated and transported horizontally and then transferred onto the alignment plate 302 of the laminate alignment unit 300 A substrate transferring means (102) for loading the core substrate onto the substrate;

After the carrier 101 is put in one side, the carrier 101 waits until all of the core boards housed in the carrier 101 are discharged, and then the carrier 101, (103).

The prepreg supply unit 200 includes guide means capable of vertically elevating at one side thereof, a loading table 201 for loading a plurality of prepregs at an upper side thereof,

And a rack 202a symmetrically arranged on the front and rear sides of the pinion 201c provided on the bottom surface of the mounting table 201 so as to be in mesh with the pinion 201c so that the right and left widths can be manually adjusted, 201 for aligning the left and right sides of the prepreg loaded on the loading table 201;

A second aligning body 203 for aligning the front and rear sides of the prepregs mounted on the stacking table 201 so as to be positionally adjustable by using magnetic force before and after the top surface of the stacking table 201;

A platform 204 having a ball screw 204b for moving the pallet 201 up and down and a first motor 204c for driving the ball screw 204b to move the pallet 201 up and down;

And a prepreg transporting unit 205 for picking up the prepregs stacked on the upper surface of the stacking unit 201 by vacuum suction and stacking them on the alignment plate 302 of the stacking alignment unit 300 .

The stacking and aligning unit 300 includes an aligning plate 302 formed on the base plate 301 by forming guide grooves 302a inwardly in four directions;

A ball screw 303 formed in a cross shape on the upper surface of the base plate 301 when viewed in a plan view and driven individually by respective motors 304 by forming a left screw 303a and a right screw 303b at both ends thereof;

The third and fourth aligning bodies 305 and 306, which are respectively installed at both ends of the respective ball screws 303 to collect and align the core substrate and the prepreg, which are stacked on the aligning plate 302, ).

The core substrate and the prepreg automatic layup apparatus for manufacturing a printed circuit board of the present invention can supply a single core substrate for the construction of an inner layer and automatic feeding and alignment of two prepregs through the above- It is possible to achieve the object of improving the productivity and quality of the substrate.

The core substrate and prepreg automatic layup apparatus for manufacturing a printed circuit board of the present invention can automatically align and automatically align a core substrate and a prepreg in the construction of an inner layer for manufacturing a printed circuit board, It is possible to form the inner layer so that the productivity and quality of the printed circuit board can be greatly improved.

Further, by fully automating the supply of the prepreg having flexibility, it is possible not only to reduce the specific gravity of the manual work to reduce the labor cost, but also to prevent the defective supply of the prepreg and to significantly reduce the defective rate of the printed circuit board have.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a configuration according to an embodiment of a core board for manufacturing a printed circuit board and a prepreg automatic layup apparatus of the present invention. FIG.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a core board for manufacturing a printed circuit board and a prepreg automatic layup apparatus.
3 is a front view of a prepreg supply portion according to an embodiment of a core board for manufacturing a printed circuit board of the present invention and a prepreg automatic layup apparatus.
4 is a plan view of a prepreg supply portion according to an embodiment of a core board for manufacturing a printed circuit board of the present invention and a prepreg automatic layup apparatus.
5 is a plan view of a prepreg transporting means according to an embodiment of a core substrate for manufacturing a printed circuit board of the present invention and a prepreg automatic layup apparatus.
6 is a side view of prepreg transporting means according to an embodiment of a core substrate for manufacturing a printed circuit board of the present invention and a prepreg automatic layup apparatus.
FIG. 7 is a plan view of a lamination alignment portion according to an embodiment of a core board for manufacturing a printed circuit board of the present invention and a prepreg automatic layup apparatus. FIG.
8 is a side view of the lamination alignment portion according to the embodiment of the core substrate and prepreg automatic layup apparatus for producing a printed circuit board of the present invention.
9 is a schematic view showing a general manufacturing process of a multilayer printed circuit board;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the structure and operation of a core board for manufacturing a printed circuit board and a prepreg automatic layup apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The core substrate and the prepreg automatic layup apparatus for manufacturing a printed circuit board according to the present invention are characterized in that the core substrates are taken out from the carrier 101 in which a plurality of core substrates A are housed by using the substrate transfer means 102, A core substrate supply unit 100 mounted on the alignment plate 302 of the unit 300;

A plurality of prepregs B are stacked and the uppermost prepreg is picked up through the prepreg conveying means 205 having the vacuum suction unit 205b to be stacked on the alignment plate 302 of the stacking alignment unit 300 A prepreg supply unit 200;

A single core substrate supplied by using the substrate transfer means 102 of the core substrate supply unit 100 and two prepregs supplied through the prepreg transfer means 205 of the prepreg supply unit 200 are connected to the alignment plate And a laminate alignment unit 300 for aligning the core substrate and the prepreg in a center portion of the alignment plate 302 by using an alignment body after lamination in a sandwich form on the substrate 302.

The core substrate supply unit 100 draws one by one the core substrates from the carrier 101 in which the plurality of core substrates A are accommodated by using the substrate transfer means 102, 302), a grip portion 101a is formed on the inner side so as to accommodate the plurality of core substrates in the longitudinal direction, and the core substrate held by the grip portion 101a is vertically inserted into the upper portion thereof A carrier 101 on which an opening 101b is formed so as to be able to be pulled out;

After the core substrate accommodated in the carrier 101 is clamped and discharged vertically upward from the carrier 101, the core substrate is horizontally rotated to move along the rail, and then the alignment plate 302) for transferring the core substrate;

After the carrier 101 is put in one side, the carrier 101 waits until all of the core boards housed in the carrier 101 are discharged, and then the carrier 101, (103).

The carrier 101 is provided on the inner wall of the carrier 101 with a grip portion 101a capable of gripping the edge of the core substrate 101. The carrier 101 is individually installed so as to be able to grip the core substrate in a vertical direction, A plurality of gripping portions 101a are provided at regular intervals.

The gripper 101a is provided with a grasping portion 101a that is elastically opened and closed by a coil spring so as to cope with warpage of the core substrate in the course of grasping the core substrate and to prevent damage to the core substrate while firmly grasping the core substrate. (101a).

The substrate transfer means 102 includes a clamping portion 102a for clamping the core substrate one by one from the prepreg supply portion 200 in the carrier 101 and a vertical transfer portion 102b for vertically transferring the clamping portion A rotation driving unit 102c that rotates the clamping unit about a horizontal axis parallel to the ground, and a horizontal transfer unit 102d for horizontally moving the clamping unit.

The clamping portion 102a may include a fingering member coupled to the core substrate to press the core substrate, and a pneumatic cylinder for pivoting the hinge-coupled fingers to enable clamping of the core substrate.

The vertical conveying section 102c and the horizontal conveying section 102d selectively convey various conveying means well known in the technical field of the present invention such as a ball screw system that enables precise conveyance of the clamping unit or a system that uses a cylinder and an LM guide Of course, can be applied.

The rotary drive unit 102b may be a direct drive system that directly rotates the clamping unit using a servo motor or an indirect drive system that indirectly rotates the clamping unit by engaging a rack with a pinion driven by the motor. It is possible to selectively apply it.

The conveying conveyor 103 is installed side by side on one side of the lamination aligning part 300 when viewed in a plan view and the carrier 101 is seated until the core substrate is completely discharged from the carrier 101 in which the core substrate is housed A charging unit 103b installed at one end of the waiting unit in the vertical direction with respect to the waiting unit for charging a carrier 101 accommodating a plurality of core substrates; And a discharge portion 103c installed vertically to the standby portion and discharging the carrier 101 from which the core substrate is completely discharged.

The prepreg feeding unit 200 picks up the prepreg at the uppermost position through the prepreg conveying means 205 having the vacuum suction unit 205b by stacking a plurality of prepregs B, A loading unit 201 having guide means vertically movable up and down on one side for loading on the alignment plate 302, and a plurality of prepregs mounted on the upper side; And a rack 202a symmetrically arranged on the front and rear sides of the pinion 201c provided on the bottom surface of the mounting table 201 so as to be in mesh with the pinion 201c so that the right and left widths can be manually adjusted, 201 for aligning the left and right sides of the prepreg loaded on the loading table 201; A second aligning body 203 for aligning the front and rear sides of the prepregs mounted on the stacking table 201 so as to be positionally adjustable by using magnetic force before and after the top surface of the stacking table 201; A platform 204 having a ball screw 204b for moving the pallet 201 up and down and a first motor 204c for driving the ball screw 204b to move the pallet 201 up and down; And a prepreg transporting unit 205 for picking up the prepregs stacked on the upper surface of the stacking unit 201 by a vacuum suction method and stacking them on the alignment plate 302 of the stacking alignment unit 300.

More specifically, a guide block 201a is installed on one side surface of the table 201 in a vertical direction, and a guide rail 201a is installed on the platform 204 in the vertical direction, 204a in the vertical direction.

In addition, the loading table 201 is formed in a flat plate shape and has guide grooves 201b recessed inwardly on the left and right sides when seen in a plan view, and a plurality of pinions 201c are provided on the bottom surface at regular intervals.

remind The first alignment body 202 is provided with a rack 202a which is symmetrically formed on both sides of the pinion 201c provided on the bottom surface of the mounting table 201 so as to be engaged with the pinion 201c, The widths of the first alignment bodies 202 provided on both sides of the mounting table 201 can be manually adjusted by providing them on both left and right sides of the mounting table 201 so as to be movable inward and outward along the guide grooves 201b of the mounting table 201, .

Therefore, by controlling the widths of the first alignment bodies 202 so that both side first alignment bodies 202 are simultaneously in contact with both sides of the prepreg in a state in which a plurality of prepregs are mounted on the upper surface of the stage 201, The prepreg loaded on the upper surface of the stand 201 is aligned with the center of the stand 201.

The second aligning body 203 can be attached to the upper surface of the stacking belt 201 using a magnetic force so that the second aligning body 203 is stacked on the upper surface of the stacking belt 201, And is attached and fixed on the front and rear upper surfaces of the loading table 201 so as to be in close contact with the front and rear surfaces of the prepreg so as not to swing in the front and rear direction of the loading table 201.

The first motor 204c is vertically installed on the upper end of the platform 204 and the ball screw 204b is installed in a direction perpendicular to the drive shaft of the first motor 204c to rotate the nut of the ball screw 204b The housing is coupled to one side of the loading table 201 and a guide rail 204a combined with the guide block 201a provided on one side of the loading table 201 is installed on one side of the loading table 201 to drive the first motor 204c The stacking table 201 is moved up and down in the vertical direction.

The prepreg transporting means 205 is configured to transport the prepreg from the prepreg feeder 200 to the vacuum cleaner 200. The suction openings 205a for picking up and picking up the prepregs one by one by a vacuum adsorption method, A vertical transfer unit for transferring the vacuum suction unit 205b in the vertical direction and a horizontal transfer unit for transferring the vacuum suction unit 205b in the horizontal direction.

It is a matter of course that the vacuum adsorption part 205b has a pneumatic line (not shown) for generating a negative pressure of the adsorption port 205a.

Since the vertical transfer unit 205c and the horizontal transfer unit 205d have the same technical structure as the vertical transfer unit 102c and the horizontal transfer unit 102d of the substrate transfer unit 102, Is omitted.

The lamination aligning unit 300 includes a core substrate A supplied by using the substrate transporting unit 102 of the core substrate supply unit 100 and a prepreg transporting unit 205 of the prepreg supply unit 200. [ A plurality of prepregs B are stacked on the alignment plate 302 in the form of a sandwich, and then aligned in the center of the alignment plate 302 to align the prepreg with the core substrate. An alignment plate 302 formed on the base plate 301 by forming a groove 302a; A ball screw 303 formed in a cross shape on the upper surface of the base plate 301 when viewed in a plan view and driven individually by respective motors 304 by forming a left screw 303a and a right screw 303b at both ends thereof; The third and fourth aligning bodies 305 and 306, which are respectively installed at both ends of the respective ball screws 303 to collect and align the core substrate and the prepreg, which are stacked on the aligning plate 302, .

The alignment plate 302 is provided with a support frame at a predetermined height above the base plate 301, and an alignment plate 302 is fixed to the upper end of the support frame.

The alignment plate 302 is formed with a plurality of guide grooves 302a inwardly at four corners thereof and each guide groove 302a has a length corresponding to the size of the core substrate or the prepreg Is formed to have a corresponding length.

The ball screw 303 has a left screw 303a and a right screw 303b formed at both ends of the ball screw 303. The ball screw 303 is provided on the upper surface of the base plate 301 in a cross- The motor 304 of FIG.

The third and fourth alignment bodies 305 and 306 are respectively coupled to the nut housings screwed to the left and right screws 303a and 303b of the respective ball screws 303, A third alignment body 305 screwed to the left screw 303a of the ball screw 303 and a third aligning body 305 screwed to the right screw 303b when the motor 304 rotates forward or reverse, The distance between the third aligning body 305 and the fourth aligning body 306 is adjusted while the body 306 moves simultaneously inwardly or outwardly so that one sheet Aligns the core substrate and the two prepregs to the center of the alignment plate 302.

At the same time, guide means such as guide rods or guide rails for precisely moving the third and fourth alignment bodies 305 and 306, whose widths are adjusted in the ball screw 303, are provided on both sides of the respective ball screws 303 As shown in FIG.

Hereinafter, the operation of the core board for manufacturing a printed circuit board and the prepreg automatic layup apparatus to which the present invention is applied will be described.

In order to stack and align the prepregs B on the upper and lower portions of the core substrate A using the core substrate for fabricating a printed circuit board and the prepreg automatic layup apparatus of the present invention, The carrier 101 in which a plurality of core substrates are accommodated is supplied through the input portion of the supply portion 100.

In addition, a plurality of prepregs are stacked on the loading table 201 of the prepreg supplying unit 200.

As shown in (2), a single prepreg located at the uppermost position among a plurality of prepregs stacked on the loading table 201 of the prepreg feeding unit 200 is picked up by the vacuum adsorption method using the prepreg conveying means 205, (300). ≪ / RTI >

Subsequently, one of the plurality of core substrates housed in the carrier 101 of the core substrate supply unit 100 is taken out using the clamping unit 102a of the substrate transferring unit 102 and horizontally rotated as shown in (3) And stacked on top of the prepregs stacked on the alignment plate 302 of the lamination aligning unit 300.

Next, a single prepreg located at the uppermost one of a plurality of prepregs stacked on the loading table 201 of the prepreg feeding unit 200 is picked up by the vacuum suction method using the prepreg conveying unit 205, And is mounted on the upper portion of the core substrate mounted on the alignment plate 302 of the unit 300.

When a single core substrate and two prepregs are laminated in a sandwich form on the alignment plate 302, the third and fourth alignment members 305 and 306 installed on all sides of the alignment plate 302 are inserted into the ball screw 303, A single core substrate which is simultaneously moved inward of the alignment plate 302 by the alignment plate 302 and is stacked on the alignment plate 302 and the two prepregs are simultaneously collected and aligned at the center of the alignment plate 302, The lamination and alignment of the inner layers for the first layer are automatically completed.

As described above, when the lamination and alignment of the inner layer by a single core substrate and two prepregs are automatically completed at the center of the alignment plate 302 of the lamination aligning unit 300, the completed inner layer is subjected to a separate clamping device The carrier 101 is moved in the direction of (5) to (6) as shown in (6) to (7), if the core substrate stored in the carrier 101 is exhausted by repeating the above- It is possible to completely automate the constitution work of the inner layer for stacking and aligning the prepregs on the upper and lower portions of one core substrate, thereby improving the quality of the printed circuit board and improving the productivity.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

A: Core substrate B: Prepreg
100: Core substrate supply part 101: Carrier
102: substrate conveying means 103: conveying conveyor
200: prepreg supply unit 201:
202: first alignment body 203: second alignment body
204: platform frame 205: prepreg conveying means
300: stacking part 301: base plate
302: alignment plate 303: ball screw
304: motor 305: third alignment body
306: fourth aligning body

Claims (4)

A core substrate supply unit 100 for picking up a plurality of core substrates from a carrier 101 containing a plurality of core substrates by using the substrate transfer means 102 and stacking the core substrates on the alignment plate 302 of the stacking alignment unit 300, Wow;
A plurality of prepregs are stacked and the uppermost prepreg is picked up through the prepreg conveying means 205 having the vacuum adsorption unit 205b to be stacked on the alignment plate 302 of the stack aligning unit 300, A supply unit 200;
A single core substrate supplied by using the substrate transfer means 102 of the core substrate supply unit 100 and two prepregs supplied through the prepreg transfer means 205 of the prepreg supply unit 200 are connected to the alignment plate (300) stacking the core substrate and the prepreg in a sandwich form on the substrate (302) and aligning the core substrate and the prepreg at the center of the alignment plate (302) using an alignment body Core board for manufacturing substrates and prepreg automatic lay - up device.
The method of claim 1, further comprising:
The core substrate supply unit 100 is provided with a grip portion 101a on the inner side so as to accommodate a plurality of core substrates in the longitudinal direction and a core substrate gripped by the grip portion 101a on the upper side, A carrier 101 having an opening 101b formed therein so as to be able to be inserted and removed;
The core substrate accommodated in the carrier 101 is clamped and discharged vertically upward from the carrier 101. The core substrate is then rotated and transported horizontally and then transferred onto the alignment plate 302 of the laminate alignment unit 300 A substrate transferring means (102) for loading the core substrate onto the substrate;
After the carrier 101 is put in one side, the carrier 101 waits until all of the core boards housed in the carrier 101 are discharged, and then the carrier 101, And a prepreg automatic lay-up device (103).
The method of claim 1, further comprising:
The prepreg supply unit 200 includes guide means capable of vertically elevating at one side thereof, a loading table 201 for loading a plurality of prepregs at an upper side thereof,
And a rack 202a symmetrically arranged on the front and rear sides of the pinion 201c provided on the bottom surface of the mounting table 201 so as to be in mesh with the pinion 201c so that the right and left widths can be manually adjusted, 201 for aligning the left and right sides of the prepreg loaded on the loading table 201;
A second aligning body 203 for aligning the front and rear sides of the prepregs mounted on the stacking table 201 so as to be positionally adjustable by using magnetic force before and after the top surface of the stacking table 201;
A platform 204 having a ball screw 204b for moving the pallet 201 up and down and a first motor 204c for driving the ball screw 204b to move the pallet 201 up and down;
And a prepreg transporting unit 205 for picking up the prepregs stacked on the upper surface of the stacking unit 201 by a vacuum suction method and stacking the picked up prepregs on the alignment plate 302 of the stacking arrangement unit 300 Core board and prepreg automatic lay - up device for printed circuit board manufacturing.
The method of claim 1, further comprising:
The lamination aligning unit 300 includes an alignment plate 302 formed on the base plate 301 by forming guide grooves 302a inwardly in four directions;
A ball screw 303 formed in a cross shape on the upper surface of the base plate 301 when viewed in a plan view and driven individually by respective motors 304 by forming a left screw 303a and a right screw 303b at both ends thereof;
The third and fourth aligning bodies 305 and 306, which are respectively installed at both ends of the respective ball screws 303 to collect and align the core substrate and the prepreg, which are stacked on the aligning plate 302, ) And the prepreg automatic layup apparatus (10).
KR1020160027743A 2016-03-08 2016-03-08 Printed circuit board manufacturing for the core board prepreg automatic lay-up device KR101786600B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115776779A (en) * 2022-12-15 2023-03-10 方泰(广东)科技有限公司 Hot melt core is folded and composing device in advance

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100375743B1 (en) * 2001-03-27 2003-03-10 (주)케이.씨.텍 Apparatus for transferring a board
KR200335332Y1 (en) * 2003-08-28 2003-12-06 (주)에이에스티 The lead frames loading apparatus with an elevator
KR101220202B1 (en) * 2011-06-29 2013-01-21 넥스타테크놀로지 주식회사 A loading unit for auto shillings apparatus of the substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115776779A (en) * 2022-12-15 2023-03-10 方泰(广东)科技有限公司 Hot melt core is folded and composing device in advance
CN115776779B (en) * 2022-12-15 2024-02-20 墨芯科技(深圳)有限公司 Hot melt core board prestack and typesetting equipment

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