JPH0770025B2 - Method of manufacturing thin film magnetic head - Google Patents
Method of manufacturing thin film magnetic headInfo
- Publication number
- JPH0770025B2 JPH0770025B2 JP62229841A JP22984187A JPH0770025B2 JP H0770025 B2 JPH0770025 B2 JP H0770025B2 JP 62229841 A JP62229841 A JP 62229841A JP 22984187 A JP22984187 A JP 22984187A JP H0770025 B2 JPH0770025 B2 JP H0770025B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- substrate
- thin film
- magnetic head
- film magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】 〔概要〕 パターニングされたレジストを介してイオンミルにより
基板上にコイルパターンを形成する薄膜磁気ヘッドの製
造方法に関し、 イオンミル後のレジスト除去を完全に行うことを目的と
し、 基板上に絶縁保護膜を設け、該絶縁保護膜上にコイルパ
ターン形状のイオンミルに対するレジストを形成した
後、該基板にイオンミルを施して前記絶縁保護膜をパタ
ーニングし、次に該基板に酸素プラズマ処理を施し、そ
の後該基板のレジスト洗浄処理を施す構成とする。DETAILED DESCRIPTION OF THE INVENTION [Outline] A method for manufacturing a thin film magnetic head in which a coil pattern is formed on a substrate by an ion mill through a patterned resist, which aims to completely remove the resist after the ion mill, An insulating protective film is provided on the insulating protective film, a resist for an ion mill having a coil pattern shape is formed on the insulating protective film, the substrate is subjected to an ion mill to pattern the insulating protective film, and then the substrate is subjected to oxygen plasma treatment. After that, a resist cleaning process is performed on the substrate.
〔産業上の利用分野〕 本発明はパターニングされたレジストを介してイオンミ
ルにより基板上にコイルパターンを形成する薄膜磁気ヘ
ッドの製造方法に関する。[Field of Industrial Application] The present invention relates to a method of manufacturing a thin film magnetic head in which a coil pattern is formed on a substrate by an ion mill through a patterned resist.
イオンミルにより薄膜磁気ヘッドのコイルを製造する場
合、イオンミルマスク(レジスト)を介してイオンビー
ムにより基板を照射後レジストを洗浄して除去する。安
定した均一な磁気ヘッド特性を得るためにイオンミル後
のレジストは完全に除去する必要がある。When a coil of a thin film magnetic head is manufactured by an ion mill, the substrate is irradiated with an ion beam through an ion mill mask (resist) and then the resist is washed and removed. In order to obtain stable and uniform magnetic head characteristics, it is necessary to completely remove the resist after the ion mill.
従来の薄膜磁気ヘッドの製造方法においては、基板上に
絶縁保護膜(Al2O3)を設け、この保護膜上にコイルパ
ターン形状のイオンミルマスク(レジスト)を形成した
後イオンミルを施して保護膜のパターニングを行い、こ
の後洗浄溶液を用いてレジスト除去を行っていた。In the conventional method of manufacturing a thin film magnetic head, an insulating protective film (Al 2 O 3 ) is provided on a substrate, an ion mill mask (resist) having a coil pattern shape is formed on the protective film, and then an ion mill is applied to protect it. The film was patterned, and then the cleaning solution was used to remove the resist.
前記従来の薄膜磁気ヘッド製造方法においては、イオン
ミル後のレジスト洗浄工程においてレジストが完全に除
去できなかった。この原因はイオンビーム照射によりレ
ジスト表面に熱硬化等により変質層が形成され、この変
質層により洗浄溶液の洗浄効果が低減するものと考えら
れる。In the conventional thin-film magnetic head manufacturing method, the resist could not be completely removed in the resist cleaning step after the ion mill. It is considered that this is because an altered layer is formed on the surface of the resist by heat curing due to ion beam irradiation, and the altered layer reduces the cleaning effect of the cleaning solution.
本発明は上記従来技術の欠点に鑑みなされたものであっ
て、洗浄工程前にレジスト変質層を除去して洗浄溶液に
よりレジストを完全よ除去して安定した特性の薄膜コイ
ルを作成可能な薄膜磁気ヘッドの製造方法の提供を目的
とする。The present invention has been made in view of the above-mentioned drawbacks of the prior art, and a thin film magnetic capable of producing a thin film coil with stable characteristics by removing the resist-altered layer before the cleaning step and completely removing the resist with a cleaning solution. An object is to provide a method for manufacturing a head.
第1図に本発明の基本原理工程を示す。基板(ウェハ)
1上に絶縁保護膜2が設けられ、この絶縁保護膜2上に
コイルパターン形状のイオンミルに対するレジスト3が
形成される(a図)。この基板1にイオンビーム(矢印
A)を照射してイオンミルを行う(b図)。これにより
絶縁保護膜2がパターニングされる(c図)。このとき
レジスト3の表面には変質レジスト3aが形成される。次
にこの基板1に酸素プラズマ処理を施し変質レジスト3a
を除去する(d図)。次にレジスト3を有機溶剤の超音
波洗浄等により洗浄して除去する(e図)。FIG. 1 shows the basic principle process of the present invention. Substrate (wafer)
An insulating protective film 2 is provided on the insulating protective film 1, and a resist 3 for a coil pattern-shaped ion mill is formed on the insulating protective film 2 (FIG. A). The substrate 1 is irradiated with an ion beam (arrow A) to perform an ion mill (FIG. B). As a result, the insulating protective film 2 is patterned (Fig. C). At this time, the altered resist 3a is formed on the surface of the resist 3. Next, the substrate 1 is subjected to an oxygen plasma treatment to change the quality of the resist 3a.
Are removed (Fig. D). Next, the resist 3 is cleaned and removed by ultrasonic cleaning of an organic solvent or the like (Fig. E).
〔作用〕 レジスト洗浄工程前の酸素プラズマ処理によりレジスト
表面の変質層が除去され洗浄工程でのレジスト除去が完
全に行われる。[Operation] The deteriorated layer on the resist surface is removed by the oxygen plasma treatment before the resist cleaning step, and the resist is completely removed in the cleaning step.
第2図に本発明実施例の工程を示す。フェライト基板10
上に絶縁保護膜(Al2O3)11が設けられ、この絶縁保護
膜11上にレジスト12のパターンが形成される(a図)。
この基板10にイオンビームを照射してイオンミルを施
し、絶縁保護膜11をパターニングする。このイオンミル
処理後に100W×10分の酸素ブラズマ処理を施す。これに
よりレジスト12の表面に形成されたレジスト変質層(第
1図c参照)が除去される。次にアセトン溶液1分×3
回及びイソプロピルアルコール溶液1分×1回によるレ
ジスト除去のための超音波洗浄を行う。これによりレジ
スト12は完全に除去される。次に絶縁保護膜11のパター
ンに沿ってチタン層(Ti)13のパターンを蒸着し、さら
にこのチタン層13上に金層(Au)14のパターンを蒸着形
成する(b図)。この金パターン14が薄膜コイルを構成
する。このような金パターン14によるコイルは基板10上
に多数形成される。金パターン形成後に基板10を各チッ
プ毎に分割して切出し上部フェライト基板16を接着剤15
により固定し薄膜コイルチップを形成する(c−1,c−
2図)。c−2図はチップ上面図である。17は薄膜
(金)コイルであり、Bはヘッド浮上面、Gはギャップ
間隔を示す。FIG. 2 shows steps of the embodiment of the present invention. Ferrite board 10
An insulating protection film (Al 2 O 3 ) 11 is provided on the insulating protection film 11, and a pattern of a resist 12 is formed on the insulating protection film 11 (FIG. A).
The substrate 10 is irradiated with an ion beam and subjected to an ion mill to pattern the insulating protective film 11. After this ion mill treatment, 100 W × 10 minutes oxygen plasma treatment is applied. As a result, the resist alteration layer (see FIG. 1c) formed on the surface of the resist 12 is removed. Next, acetone solution 1 min x 3
And ultrasonic cleaning for removing the resist by isopropyl alcohol solution 1 minute × 1 time. As a result, the resist 12 is completely removed. Next, a pattern of a titanium layer (Ti) 13 is vapor-deposited along the pattern of the insulating protection film 11, and a pattern of a gold layer (Au) 14 is vapor-deposited and formed on the titanium layer 13 (FIG. B). This gold pattern 14 constitutes a thin film coil. A large number of such coils of the gold pattern 14 are formed on the substrate 10. After forming the gold pattern, the substrate 10 is divided into chips and cut out, and the upper ferrite substrate 16 is bonded with an adhesive 15.
And the thin film coil chip is formed (c-1, c-
(Fig. 2). Figure c-2 is a top view of the chip. Reference numeral 17 is a thin film (gold) coil, B is the air bearing surface of the head, and G is the gap distance.
以上説明したように、本発明においては、レジスト洗浄
工程前に酸素プラズマ処理を施してレジスト表面の変質
レジストを除去しているため、洗浄工程において有機溶
剤による洗浄作用が有効に発揮されレジストは完全に除
去され、従って安定で均一な特性の薄膜コイルが得られ
る。As described above, in the present invention, since the altered resist on the resist surface is removed by performing the oxygen plasma treatment before the resist cleaning step, the cleaning action by the organic solvent is effectively exhibited in the cleaning step and the resist is completely removed. Therefore, a thin film coil having stable and uniform characteristics can be obtained.
第1図は本発明の基本原理工程説明図、第2図は本発明
実施例の工程説明図である。 1,10……基板、2,11……絶縁保護膜、3,12……レジス
ト、3a……変質レジスト、17……コイル。FIG. 1 is a process explanatory view of the basic principle of the present invention, and FIG. 2 is a process explanatory view of an embodiment of the present invention. 1,10 …… Substrate, 2, 11 …… Insulation protective film, 3, 12 …… Resist, 3a …… Altered resist, 17 …… Coil.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小笹 以久男 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭59−104718(JP,A) 特開 昭61−177615(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) The inventor, Hisao Ozasa, 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, Fujitsu Limited (56) References JP-A-59-104718 (JP, A) JP-A-61-177615 (JP, A)
Claims (3)
け、該絶縁保護膜(2,11)上にコイルパターン形状のイ
オンミルに対するレジスト(3,12)を形成した後、該基
板(1,10)にイオンミルを施して前記絶縁保護膜(2,1
1)をパターニングし、次に該基板(1,10)に酸素プラ
ズマ処理を施して前記イオンミルにより生じたレジスト
表面の変質層を除去し、その後該基板(1,10)をレジス
ト洗浄剤により洗浄処理して前記レジスト(3,12)を除
去することを特徴とする薄膜磁気ヘッドの製造方法。1. An insulating protective film (2,11) is provided on a substrate (1,10), and a resist (3,12) for a coil pattern-shaped ion mill is formed on the insulating protective film (2,11). After that, the substrate (1, 10) is ion-milled to form the insulating protective film (2, 1).
1) is patterned, then the substrate (1, 10) is subjected to oxygen plasma treatment to remove the altered layer on the resist surface generated by the ion mill, and then the substrate (1, 10) is washed with a resist cleaning agent. A method of manufacturing a thin film magnetic head, characterized in that the resist (3, 12) is removed by treatment.
うことを特徴とする特許請求の範囲第1項記載の薄膜磁
気ヘッドの製造方法。2. The method of manufacturing a thin film magnetic head according to claim 1, wherein the oxygen plasma treatment is performed for about 100 W × 10 minutes.
イソプロピルアルコール溶液を用いて行うことを特徴と
する特許請求の範囲第1項又は第2項記載の薄膜磁気ヘ
ッドの製造方法。3. The method of manufacturing a thin film magnetic head according to claim 1, wherein the resist cleaning process is performed using an acetone solution and an isopropyl alcohol solution.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62229841A JPH0770025B2 (en) | 1987-09-16 | 1987-09-16 | Method of manufacturing thin film magnetic head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62229841A JPH0770025B2 (en) | 1987-09-16 | 1987-09-16 | Method of manufacturing thin film magnetic head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6473519A JPS6473519A (en) | 1989-03-17 |
JPH0770025B2 true JPH0770025B2 (en) | 1995-07-31 |
Family
ID=16898522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62229841A Expired - Fee Related JPH0770025B2 (en) | 1987-09-16 | 1987-09-16 | Method of manufacturing thin film magnetic head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0770025B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007087505A2 (en) | 2006-01-25 | 2007-08-02 | Wellstat Therapeutics Corporation | Compounds for the treatment of metabolic disorders |
WO2007087504A2 (en) | 2006-01-25 | 2007-08-02 | Wellstat Therapeutics Corporation | Compounds for the treatment of metabolic disorders |
EP2266946A2 (en) | 2003-02-13 | 2010-12-29 | Wellstat Therapeutics Corporation | Compound For The Treatment Of Metabolic Disorders |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59104718A (en) * | 1982-12-08 | 1984-06-16 | Comput Basic Mach Technol Res Assoc | Production of thin film magnetic head |
JPH0772930B2 (en) * | 1985-01-31 | 1995-08-02 | シャープ株式会社 | Method of manufacturing thin film magnetic head |
-
1987
- 1987-09-16 JP JP62229841A patent/JPH0770025B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2266946A2 (en) | 2003-02-13 | 2010-12-29 | Wellstat Therapeutics Corporation | Compound For The Treatment Of Metabolic Disorders |
WO2007087505A2 (en) | 2006-01-25 | 2007-08-02 | Wellstat Therapeutics Corporation | Compounds for the treatment of metabolic disorders |
WO2007087504A2 (en) | 2006-01-25 | 2007-08-02 | Wellstat Therapeutics Corporation | Compounds for the treatment of metabolic disorders |
Also Published As
Publication number | Publication date |
---|---|
JPS6473519A (en) | 1989-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |