JPH0769386B2 - Semiconductor device testing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention is suitable for use in electrical measurement and testing of semiconductor devices, particularly semiconductor devices having external leads molded inwardly in a J shape in the periphery. The improvement of simple test equipment.

[Conventional technology]

As a test device for testing the electrical characteristics of semiconductor devices,
A structure as shown in FIG. 5 and FIG. 6 is considered. To briefly explain this, reference numeral 1 in the drawing is a holder having an accommodation space 1a that opens upward, and a side wall of the accommodation space 1a of the holder 1 is provided around the semiconductor device 2 to be tested. The same number of contacts 3 that make a 1: 1 contact with the external leads 2a are arranged and held at the same pitch.

Reference numeral 4 denotes a suspending tool which has a mounting base 4a for positioning and holding the semiconductor device 2 on its upper part and which is moved up and down. 5 forms a pair with the mounting base 4a and sandwiches the semiconductor device 2 with a constant gap S therebetween. The pressing tool 5 is configured to move up and down together with the hanging tool 4 and the semiconductor device 2 held by the mounting table 4a.

According to such a configuration, the semiconductor device 2 is placed on the mounting table 4a, and the pressing tool 5 is lowered to sandwich the semiconductor device 2 between the mounting table 4a and the semiconductor device 2 and then the three devices are integrated. By pushing the holder 1 into the accommodation space 1a of the holder 1, the external lead 2a of the semiconductor device 2 comes into contact with a predetermined pressing force by the leaf spring action of the contactor 3 arranged in the holder 1. Become. Then, a measurement test or the like of the electrical characteristics of the semiconductor device 2 is conducted in such an electrically conductive state, and after the end, the semiconductor device 2 and the suspending tool 4 and the pressing tool 5 sandwiching the semiconductor device 2 are The operation related to one measurement test is completed by rising again as a unit.

[Problems to be solved by the invention]

However, in the device having such a structure, a part of the surface layer portion of the external lead 2a of the semiconductor device 2, for example, solder plating or its oxide film is scraped off by the contact 3, and as shown by A in FIG. 7, for example. In addition, the problem of depositing on the contact surface of the contactor 3 occurs. Further, such a deposit A gradually increases as the number of measurements and tests increases, and as a result, the external lead
There is a risk of causing a problem such that a good contact state between the contact 2a and the contactor 3 cannot be maintained, and it is desired to take some measures that can solve such a problem.

The present invention has been made in view of the above-mentioned circumstances, and eliminates foreign matter generated by the contact operation of the external lead with respect to the contactor.
It is an object of the present invention to obtain a semiconductor device test apparatus that can be scraped off and removed at every lifting operation to always ensure a stable contact state.

[Means for solving problems]

The semiconductor device testing apparatus according to the present invention has a dimension substantially equal to the external dimension including the external leads of the semiconductor device, on the bottom surface of the platform of the hanging tool that is operated to position and hold the semiconductor device. The chip is provided, and the chip is configured to scrape off foreign matter adhering to the surface of the contact that contacts the external lead of the semiconductor device.

[Action]

According to the present invention, the side surface of the chip provided on the bottom surface of the mounting table of the hanging tool makes sliding contact with the contactor contact surface during the lifting operation of the hanging tool for each measurement, and adheres to the surface. It removes foreign substances such as metal oxides, and can always maintain a good contact surface.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings.

1 and 2 show an embodiment of a semiconductor device testing apparatus according to the present invention. In these figures, the same or corresponding parts as those in FIGS. 5 to 7 described above are designated by the same reference numerals. Is attached and the description thereof is omitted.

By the way, according to the present invention, the outer dimensions of the bottom 4a of the mount 4a of the suspending tool 4 which holds the semiconductor device 2 while positioning and holding the semiconductor device 2 and the external lead 2a of the semiconductor device 2 are substantially equal. A contact 3 provided with a chip 10 having dimensions, and contacting the external lead 2a of the semiconductor device 2 by the chip 10.
The feature is that the foreign material (deposit) A such as a metal oxide attached to the surface is scraped off.

That is, according to the present invention, in order to measure and test the semiconductor device 2, the semiconductor device 2 is placed on the mounting table 4a and is sandwiched by the pressing tool 5, and the hanging tool 4 is shown in FIG. ) When they are moved down as indicated by the middle arrow and pushed into the holder 1 as shown in FIG. 1B, the contact surface of the contact 3 in the holder 1 is contacted with the contact surface during the previous measurement or test. As shown by A in the figure, the foreign matter adhered to the contact surface slides down with the side end surface of the chip 10, and
Will be scraped off. This is chip 10 at this time
However, it can be easily understood from the fact that while the contactor 3 is being spread out, the contactor 3 is brought into sliding contact with the contact surface by frictional force at the same time. As a result, as shown in FIG. 7C, the foreign matter A attached to the contact 3 is easily and surely removed, and a good contact surface of the contact 3 is always maintained, so that an appropriate measurement and test can be performed. It can be done.

It should be noted that the present invention is not limited to the structure of the embodiment described above, and the shape, structure, etc. of each part of the device can be freely modified or changed, and various modified examples can be considered. Further, the semiconductor device 2 to be tested in the test apparatus of the present invention is not limited to the one having the external leads 2a on the four peripheral sides as shown in FIG. 4 (a). It will be easily understood that the semiconductor device 2 may have the external leads 2a only on two sides of the outer circumference as shown in FIG.

〔The invention's effect〕

As described above, according to the semiconductor device testing apparatus of the present invention, the semiconductor device is positioned and held, and the bottom surface of the platform of the hanging tool that is vertically moved includes the external leads of the semiconductor device. A chip having a dimension approximately equal to the external dimension was provided, and foreign matter adhering to the surface of the contact that comes into contact with the external lead of the semiconductor device was scraped off by this chip. When the hanging tool is moved up and down for the measurement of, the contact surface of the contact makes sliding contact with the chip side surface of the bottom surface of the mounting table, and the foreign substances such as metal oxides adhering to the surface are scraped off and removed. Thus, there are various excellent effects such as the prevention of accumulation of foreign matter and the ability to always maintain a good contact surface of the contact.

[Brief description of drawings]

1 and 2 are a sectional view and a plan view of an essential part showing an embodiment of a semiconductor device testing apparatus according to the present invention.
(A), (b) and (c) are explanatory diagrams of the operation thereof, and FIGS. 4 (a) and (b) are schematic perspective views showing a suitable semiconductor device applied to the present invention, FIG. 5 and FIG. FIG. 7 is a cross-sectional view of a main part showing a conventional example and its plan view, and FIG. 7 is an enlarged cross-sectional view for explaining the problem. 1 ... Holder, 2 ... Semiconductor device, 2a ... External lead,
3 ... Contactor, 4 ... Hanging tool, 4a ... Stand, 5 ...
Pressing tool, 10 ... Chip, A ... Foreign matter (deposit).

Claims (1)

[Claims] 1. A semiconductor test in which a semiconductor device having external leads on its periphery is pushed into a contact group to press the respective contacts on the outside of each external lead to measure and test electrical characteristics and the like. In the device, a suspending tool that has a mounting base for positioning and holding the semiconductor device and is moved up and down so as to face the semiconductor device in the contact group when descending, and a substantially same size as the outer shape of the semiconductor device. And a chip for removing foreign matter such as metal oxides from the external leads, which is deposited on the contact surface of the contact, by slidingly contacting the bottom of the mounting table of the hanging tool. Semiconductor device testing equipment.