JPH076799A - Method for connecting electronic part - Google Patents

Abstract

PURPOSE:To eliminate the generation of shortcircuitting between electrodes adjacent to each other, and to reduce the unevenness of connection resistance by including a process for arranging a perforated plate member on an electrode terminal of an electronic part and a process for arranging conductive grains on the electrode terminal. CONSTITUTION:A perforated plate member 3 having a perforated part 2, through which conductive grains 1 can be passed, and a circuit board 6 made of a TAB base film, on which the adhesive agent 5 is transferred on electrodes 4, are held so that the perforated part 2 and the electrode 4 are positioned to each other. Next, the conductive grains 1 are moved on the perforated plate member 3 and arranged on the electrode 4. At this stage, the circuit board 6 and the perforated plate member 3 are separated by a specified distance to arrange only one layer of the conductive grains 1 on the electrode 4. Next, the grains 1 entering between the electrodes 4 is eliminated by air blow, and the electrode 4 and an electrode of another circuit board are connected to each other by the insulating adhesive agent through the conductive grains 1. Wiring structure, which can reduce the unevenness of the connection resistance, is thereby obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting electronic parts, and more particularly, to a liquid crystal display and an external drive circuit (T).
It can be applied to the connection technology of electric circuit parts (wiring boards) such as AB), and in particular, it can cope with a fine pitch without short-circuiting between adjacent electrodes, and the number of conductive particles on each electrode. The present invention relates to a method of connecting electronic components that can reduce variations in connection resistance between the electrodes by keeping constant.

[0002]

2. Description of the Related Art Conventionally, a method for interconnecting electrode terminals has been reported in, for example, Japanese Patent Application Laid-Open No. 3-289070, in which conductive particles are selectively applied to electrode terminals on which an adhesive is formed. A method of arranging and obtaining a connection, specifically, the electrode terminal of the first electric circuit substrate and the electrode terminal of the second electric circuit substrate are electrically connected to each other through conductive fine particles, In the method of interconnecting electrode terminals held and fixed with an adhesive, an adhesive is formed on at least one of the electrode terminals protruding from the substrate surface of the electric circuit substrate,
After the conductive fine particles are adhered to the adhesive, the first electric circuit substrate and the second electric circuit substrate are pressure-contacted and connected with each other by using the insulating adhesive, so that they are arranged at high density. Another advantage is that the electrode terminals can be connected while maintaining the electrical insulation of the adjacent electrode terminals.

Conventionally, there are roughly two types of methods for connecting electronic parts interposing conductive particles, and one is to fix the conductive particles on the electrode of one circuit board as in the above-mentioned known example. After that, it is a method of dealing with a fine pitch by connecting to the other circuit board, and the other method is to connect the upper and lower circuit boards through an adhesive such as an anisotropic conductive film in which conductive particles are dispersed. It is a method of connecting.

[0004]

However, in the conventional method of connecting the upper and lower circuit boards through the adhesive in which the conductive particles are dispersed, the particles of the conductive particles in the adhesive are used in order to cope with the fine pitch. When the density is increased, conductive particles also exist between the adjacent electrodes, so that there is a problem that short circuits easily occur between the adjacent electrodes.

Further, the above-mentioned known example, Japanese Patent Laid-Open No. 3-289.
In the conventional method of Japanese Patent Publication No. 070, since the upper and lower circuit boards are connected after the conductive particles are fixed on the electrodes of the one circuit board in advance, the above method is more effective than the case where the adhesive in which the conductive particles are dispersed is used. It has an advantage that it can handle fine pitches. However, in this method, conductive particles are dispersed and arranged in an electric field on a flat substrate, and the electrodes of the circuit board on which the adhesive layer is formed are brought into close contact with the flat substrate on which the conductive particles are dispersed, thereby When the conductive particles are arranged on the electrodes of the circuit board, and the conductive particles are arranged on the flat board by such dispersion, the arrangement density of the conductive particles on the flat board varies, and as a result, they are arranged on the electrodes of the circuit board. The number of conductive particles also varies.

For this reason, the number of conductive particles on each electrode is likely to change, and when the number of conductive particles on the electrode changes in this way, the variation in connection resistance between the electrodes becomes large. there were. Moreover, when the density of the conductive particles on the flat substrate is extremely low, an open electrode may be generated. Therefore, the present invention can cope with a fine pitch without short-circuiting between adjacent electrodes, and can make the number of conductive particles on each electrode constant to reduce variations in connection resistance between each electrode. It is an object of the present invention to provide a method of connecting electronic components that can be used.

[0007]

The invention according to claim 1 is
The electrode terminal of the first electronic component and the electrode terminal of the second electronic component are electrically connected via conductive particles, and the first electronic component and the second electronic component are connected by an insulating adhesive. In the method for connecting electronic components to be fixed, a step of disposing an aperture plate member having an aperture through which the conductive particles can pass on the electronic component so that the aperture is on the electrode terminal, and ,
And a step of arranging the conductive particles on the electrode terminals in the opening by passing through the opening of the hole plate member.

The invention according to claim 2 is characterized in that, in the invention according to claim 1, the aperture plate member is formed of a mesh having a thickness smaller than a particle diameter of the conductive particles. . According to a third aspect of the present invention, in the second aspect of the invention, the aperture plate member is formed of a mesh in which the width of the aperture is smaller than twice the particle diameter of the conductive particles. It is a thing.

According to a fourth aspect of the present invention, in the above-described first aspect of the invention, the aperture plate member comprises a mask having a predetermined diameter and a predetermined number of holes formed in a predetermined pattern. It is what The invention according to claim 5 is
In the invention according to claim 4, the aperture plate member is
A mask having a hole diameter smaller than twice the particle diameter of the conductive particles.

According to a sixth aspect of the present invention, in the above-mentioned first to fifth aspects, when the conductive particles are passed through the aperture of the aperture plate member, the conductive particles are generated by a magnetic force of a magnet. It is characterized in that suction is performed in the direction of the electrode terminal in the opening.

[0011]

According to the invention of claim 1, the electrode terminals of the first electronic component and the electrode terminals of the second electronic component are electrically connected to each other through conductive particles, and the first electronic component and the first electronic component are connected. In the method of connecting an electronic component, which is fixed to the electronic component of 2 with an insulating adhesive, an aperture plate member having an aperture through which the conductive particles can pass is provided so that the aperture is on the electrode terminal. After being placed on the electronic component, the conductive particles are configured to pass through the aperture of the aperture plate member and be arranged on the electrode terminals in the aperture.

For this reason, the apertures of the aperture plate member are configured so that a predetermined number of conductive particles are inserted, and the aperture plate member is placed on the electronic component so that the apertures are located at the predetermined positions on the electrode terminals. Since a predetermined number of conductive particles can be passed through the opening and arranged on the electrode terminals in the opening, the predetermined number of conductive particles are arranged at a predetermined position on the electrode of the electronic component. be able to. Therefore, the conductive particles can be arranged so as not to come between the adjacent electrodes, and a fine pitch can be accommodated without causing an open short circuit between the adjacent electrodes. Moreover, since a predetermined number of conductive particles can be formed at a predetermined position on each electrode, the number of conductive particles on each electrode can be made constant, and variation in connection resistance between each electrode can be reduced. be able to.

According to a second aspect of the present invention, in the first aspect of the present invention, the aperture plate member is formed of a mesh having a thickness smaller than the particle diameter of the conductive particles. Therefore, when the mesh is thicker than the particle diameter of the conductive particles, the conductive particles are stacked in two or more layers in the opening, and when the mesh is removed, the conductive particles overflow and the array is disturbed. If you use a mesh with a thickness smaller than the particle size of the conductive particles, the conductive particles that fill the openings can be made into a single layer. The particles can be arranged in a single layer on the electrode terminals. At this time, it is desirable that there is an adhesive layer on the electrode terminals. Moreover, the number of conductive particles can be controlled more accurately by making the number of openings on the electrode terminals equal using this mesh.

According to a third aspect of the present invention, in the above-mentioned second aspect of the present invention, the aperture plate member is made of a mesh in which the width of the aperture is smaller than twice the particle diameter of the conductive particles. To configure. Therefore, the width of the openings of the mesh can be set to a width that allows only one conductive particle to pass, and one conductive particle can pass from one opening. Therefore, the number of openings on the electrode terminal can be increased. By making them equal, the number of conductive particles on each electrode terminal can be made equal.

According to a fourth aspect of the present invention, in the above-mentioned first aspect of the invention, the aperture plate member is composed of a mask in which a predetermined diameter and a predetermined number of holes are formed in a predetermined pattern. To do. Therefore, the effect of the invention described in claim 1 can be obtained, and conductive particles do not enter between the electrodes by covering the electrodes with a mask and forming the mask holes only on the electrodes. Therefore, it is not necessary to blow air to remove the conductive particles that have entered between the electrodes, and the position of the conductive particles on the electrode terminals can be changed appropriately by changing the positions of the holes. be able to. Furthermore, since each hole pattern can be changed appropriately, it can be widely applied.

According to a fifth aspect of the present invention, in the above-mentioned fourth aspect of the invention, the aperture plate member is constituted by a mask having a diameter smaller than twice the particle diameter of the conductive particles. Therefore, the hole diameter of the mask can be set to a size that allows only one conductive particle to pass therethrough, and the same effect as that of the invention described in claim 3 can be obtained. In the invention according to claim 6, in the invention according to any one of claims 1 to 5, when the conductive particles are passed through the opening, the conductive particles are directed toward the electrode terminal in the opening by a magnetic force of a magnet. It is configured to suck. Therefore, the magnetic force of the magnet can give a force to the conductive particles in the direction of the electrode terminals in the openings to facilitate the passage of the conductive particles into the openings. It can be arranged reliably.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a diagram showing a method of connecting electronic components in accordance with Embodiment 1 of the present invention (claim 1). In the present embodiment, as shown in FIG. 1A, it is composed of a perforated plate member 3 having perforations 2 through which the conductive particles 1 can pass, and a TAB base film having an adhesive 5 transferred onto the electrodes 4. The circuit board 6 is aligned in the left-right direction so that the apertures 2 and the electrodes 4 are aligned, and each aperture plate member 3 and the circuit board 6 are held. At this time, in the vertical direction, as shown in FIG. 2, the heads of the conductive particles 1 passing through the apertures 2 and arranged on the electrodes 4 and the upper end of the aperture plate member 3 have the same height. The aperture plate member 3 and the circuit board 6 are separated by a specific distance L.

Next, as shown in FIGS. 1 (b) and 1 (c),
By moving the conductive particles 1 on the aperture plate member 3,
The conductive particles 1 are passed through the opening 2 and the electrode 4 inside the opening 2 is passed.
Arrange on top. At this time, the circuit board 6 and the aperture plate member 3 are
Since the conductive particles 1 are separated by a specific distance, only one layer of the conductive particles 1 is arranged on the electrode 4. Next, as shown in FIGS. 1D and 1E, the conductive particles 1 that have entered between the electrodes 4 are removed by air blow, so that the conductive particles 1 are formed only on the electrodes 4 on which the adhesive 5 is formed. Arrange.

Then, the wiring structure can be obtained by connecting the electrode 4 of the circuit board 6 and the electrode of another circuit board or the like through the conductive particles 1 with an insulating adhesive. As described above, in this embodiment, the opening portion 2 through which the conductive particles 1 can pass.
After arranging the perforated plate member 3 with the perforated portion 2 on the circuit board 6 so that the perforated portion 2 is on the electrode terminal 4, the conductive particles 1 are opened by passing through the perforated portion 2 of the perforated plate member 3. It is configured to be arranged on the electrode terminals 4 in the holes 2. Therefore, the aperture portion 2 of the aperture plate member 3 is configured so that a predetermined number of conductive particles 1 are inserted, and the aperture plate member 3 is placed so that the aperture portion 2 is located at a predetermined position on the electrode terminal 4. Since it can be arranged on the circuit board 6 and a predetermined number of conductive particles 1 can be passed through the openings 2 and arranged on the electrode terminals 4 in the openings 2, the electrodes 4 on the circuit board 6 can be arranged. A predetermined number of conductive particles 1 can be arranged at a predetermined position. Therefore, the conductive particles 1 can be arranged so as not to come between the adjacent electrodes 4, and a fine pitch can be accommodated without causing an open short between the adjacent electrodes 4. Moreover, since a predetermined number of conductive particles 1 can be formed at a predetermined position on each electrode 4, the number of conductive particles 1 on each electrode 4 can be made constant, and the connection resistance between the electrodes 4 can be reduced. Can be reduced. (Embodiment 2) FIG. 3 is a diagram showing a method of connecting electronic components in accordance with Embodiment 2 of the present invention (claim 2). In this embodiment, the circuit board 6 has a TAB base film (pitch 0.20 mm, electrode 4 width 0.1 mm, electrode 4 height 35 μm).
m) is used, and the conductive particles 1 are micropearls Au (the core of which is resin and Ni is plated on the outside, and Au on the outside).
A plating material having a particle size of 40 μm) is used. In this embodiment, first, the UV curable adhesive 5 is applied to the electrode 4 by 10 μm.
TAB base film circuit board 6 formed with a thickness of m
And the width of the opening 2 shown in FIGS. 3 (e) and 3 (f) is 80 μm.
And the aperture plate member 3 made of a mesh having a line width of 20 μm (pitch is 0.10 mm and half of the pitch of the TAB electrodes 4) and a thickness of 20 μm, as shown in FIG. A distance between the lower end of the aperture plate member 3 and the upper end of the TAB base film circuit board 6 is held at a distance of 45 μm. Next, as shown in FIGS. 3B to 3D, the conductive particles 1 are passed through the apertures 2 of the aperture plate member 3 to form the adhesive 5 according to the same process as that of the first embodiment. Arranged on the electrode 4. After removing the perforated plate member 3 from the circuit board 6, the conductive particles 1 that have entered between the electrodes 4 are removed by air blow as in the first embodiment. At this time, a squeegee 7 is used as the moving means of the conductive particles 1. In addition, 4, 3, 2, 1 conductive particles 1 pass from one opening portion 2 of the mesh aperture plate member 3, but the number of conductive particles on one electrode 4 is substantially equal.

Then, the wiring structure can be obtained by connecting the electrode 4 of the circuit board 6 and the electrode of another circuit board or the like with the adhesive through the conductive particles 1. in this way,
In this embodiment, the aperture plate member 3 is configured to have a mesh whose thickness is smaller than the particle diameter of the conductive particles. Therefore, if the mesh is thicker than the particle diameter of the conductive particles, the conductive particles are stacked in two or more layers in the opening, and when the mesh is removed, the conductive particles overflow and the array is disturbed.
As described above, when the mesh perforated plate member 3 having a thickness smaller than the particle diameter of the conductive particle 1 is used, the number of the conductive particles 1 filled in the perforated portion 2 can be one, so that the mesh perforated plate member 3 can be formed. It is possible to surely arrange the conductive particles 1 on the electrode terminals 4 in a single layer so that the arrangement is not disturbed when removed from the circuit board 6. Moreover, by using the mesh aperture plate member 3 to equalize the number of apertures 2 on the electrode terminals 4, the number of conductive particles 1 can be controlled more accurately. (Embodiment 3) FIG. 4 is a diagram showing a method of connecting electronic components in accordance with Embodiment 3 of the present invention (claim 4). In the second embodiment, the case where a mesh is used for the aperture plate member 3 has been described, but in the present embodiment, instead of the mesh for the aperture plate member 3, a hole diameter of 80 μm shown in FIGS. 4 (e) and (f) is used. Thickness 20
Using the aperture plate member 3 composed of a mask having a μm and a pitch of 0.20 mm, the process of arranging the conductive particles 1 is as shown in FIG.
As shown in (a) to (d), since it is the same as the second embodiment, the description thereof is omitted.

Thus, in this embodiment, the aperture plate member 3
Of a mask having a predetermined diameter and a predetermined number of holes formed in a predetermined pattern. For this reason,
Since it is possible to prevent the conductive particles 1 from entering between the electrodes 4 by covering the space between the electrodes 4 with the mask aperture plate member 3 and arranging the mask holes 2 only in the electrodes 4.
You don't have to blow air, and
By appropriately changing the number and positions of the holes, the number and positions of the conductive particles 1 on the electrode terminals 4 can be appropriately changed. Furthermore, since each opening pattern can be changed appropriately,
Can deal with a wide range. (Embodiment 4) FIG. 5 is a diagram showing a method of connecting electronic components in accordance with Embodiment 4 of the present invention (claim 3). In this embodiment, the circuit board 6 has a TAB base film (pitch 0.24 mm, electrode 4 width 0.12 mm, electrode 4 height 40).
micropearl Au (the core of which is resin and Ni is plated on the outside, and A is used on the outside).
The u-plating having a grain size of 350 μm) is used. In this embodiment, first, the UV curable adhesive 5 is applied on the electrode 4
The TAB base film circuit board 6 formed with a thickness of 0 μm and the width of the opening 2 shown in FIGS. 5 (e) and 5 (f) is 40 μm.
As shown in FIG. 5 (a), a mesh aperture plate member 3 made of a mesh having a line width of 20 μm and a line width of 20 μm (pitch of 60 μm and 1/4 of the pitch of the TAB electrode 4) and a thickness of 20 μm 3 and the TAB base film circuit board 6 are kept at a distance of 50 μm from each other, and are arranged on the electrodes 4 according to the same process as that of the first embodiment, as shown in FIGS. 5B to 5D. The aperture plate member 3 is attached to the circuit board 6
Conductive particles 1 that have entered between the electrodes 4 after being removed from the
Are removed by air blow as in the first embodiment. A squeegee 7 is used as the moving means of the conductive particles 1. At this time,
Since only one conductive particle 1 passes from one hole 2 of the mesh hole plate member 3, the number of conductive particles on one electrode 4 becomes equal.

Then, the wiring structure can be obtained by connecting the electrode 4 of the circuit board 6 and the electrode of another circuit board or the like with the adhesive through the conductive particles 1. in this way,
In this embodiment, the aperture plate member 3 is configured so that the aperture 2 has a width smaller than twice the particle diameter of the conductive particles 1. Therefore, the width of the aperture 2 of the mesh aperture plate member 3 is set to a width in which one conductive particle 1 cannot pass,
Since one conductive particle 1 can pass through one opening 2, the number of conductive particles 1 on the electrode terminals 4 can be made equal. (Embodiment 5) FIG. 6 is a diagram showing a method of connecting electronic components in accordance with Embodiment 5 of the present invention (claim 5). In the fourth embodiment, the case where a mesh is used for the aperture plate member 3 has been described, but in the present embodiment, instead of the mesh for the aperture plate member 3, a hole diameter of 40 μm shown in FIGS. 6 (e) and (f) is used. Thickness 20
When the aperture plate member 3 composed of a mask having a μm and a pitch of 0.24 mm is used, the conductive particles 1 are arranged in the process shown in FIG.
As shown in (a) to (d), it is the same as the third embodiment, and therefore its explanation is omitted.

As described above, in this embodiment, the aperture plate member 3
Is composed of a mask having a diameter smaller than twice the particle diameter of the conductive particles 1. Therefore, the hole diameter of the mask aperture plate member 3 can be set to a size through which only one conductive particle 1 can pass, and the same effect as that of the above-described fourth embodiment can be obtained. (Embodiment 6) FIG. 7 is a diagram showing a method of connecting electronic components in accordance with Embodiment 6 of the present invention (claim 6). In the present embodiment, only the characteristic part according to claim 6 will be specifically described.
In this embodiment, as shown in FIG. 7, a magnet 8 is arranged below the TAB circuit board 6, and the conductive particles 1 are plated with Ni.

As described above, in this embodiment, when the conductive particles 1 are passed through the aperture 2 of the aperture plate member 3, the conductive particles 1 are attracted by the magnetic force of the magnet. For this reason,
Since the magnetic force of the magnet can apply a force in the direction of the electrode 4 in the opening 2 to the conductive particles 1 to facilitate passage through the opening 2, the conductive particles 1 can be reliably arranged on the electrode 4. it can.

[0025]

According to the present invention, it is possible to cope with a fine pitch without causing a short circuit between adjacent electrodes, and to make the number of conductive particles on each electrode constant so that the connection resistance between the electrodes varies. There is an effect that can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a method of connecting electronic components according to a first embodiment of the present invention.

FIG. 2 is a diagram showing details of the positional relationship among the conductive particles, the aperture plate member, and the circuit board according to the first embodiment of the present invention.

FIG. 3 is a diagram showing a method of connecting electronic components according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a method of connecting electronic components according to a third embodiment of the present invention.

FIG. 5 is a diagram showing a method of connecting electronic components according to a fourth embodiment of the present invention.

FIG. 6 is a diagram showing a method of connecting electronic components according to a fifth embodiment of the present invention.

FIG. 7 is a diagram showing a method of connecting electronic components according to a sixth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductive particle 2 Opening part 3 Opening plate member 4 Electrode 5 Adhesive 6 Circuit board 7 Squeegee 8 Magnet

Claims (6)

[Claims] 1. An electrode terminal of a first electronic component and an electrode terminal of a second electronic component are electrically connected via conductive particles, and the first electronic component and the second electronic component are connected to each other. In a method of connecting electronic components fixed by an insulating adhesive, a perforated plate member having an aperture through which the conductive particles can pass is arranged on the electronic component so that the aperture is on the electrode terminal. And a step of arranging the conductive particles on the electrode terminals in the apertures by passing the conductive particles through the apertures of the aperture plate member. . 2. The method of connecting electronic components according to claim 1, wherein the aperture plate member is formed of a mesh having a thickness smaller than the particle diameter of the conductive particles. 3. The method of connecting electronic components according to claim 2, wherein the aperture plate member is formed of a mesh having aperture widths smaller than twice the particle diameter of the conductive particles. 4. The method of connecting electronic components according to claim 1, wherein the aperture plate member comprises a mask having a predetermined diameter and a predetermined number of holes formed in a predetermined pattern. 5. The method of connecting electronic components according to claim 4, wherein the aperture plate member is a mask having a hole diameter smaller than twice the particle diameter of the conductive particles. 6. The conductive particles are attracted toward the electrode terminals in the opening by the magnetic force of a magnet when the conductive particles are passed through the opening of the hole plate member. Item 6. A method of connecting electronic components according to items 1 to 5.