JPH0763817A - Burn-in test jig - Google Patents

Abstract

PURPOSE:To facilitate adaptation not only to a burn-in test of a multi-terminal LSI with a narrow pitch but also to breakage, the altering of the type of subject at a low cost with higher area efficiency and better exchangeability. CONSTITUTION:In a burn-in test jig in which internal terminals 10b of a circuit pattern formed in a base substrate 10 and terminals 1a of a subject 1 are connected electrically to perform a burn-in test, a contact substrate 14 having contacts 14b and 14c on upper and lower surfaces thereof is provided to connect internal terminals 10b of the base substrate 10 and terminals 1a of the subject 1 electrically through contacts 14B and 14C. A positioning plate 12 is provided having a positioning hole 12c which is adapted to let the subject 1 drop inside being positioned while positioning the base substrate 10 of the contact substrate 14, a pressurization mechanism to pressurize the subject 1 toward the contact substrate 14 and a split type reinforcing plate 11 to fix the positioning plate 12 and the base plate 10.

Description

Detailed Description of the Invention

[0001]

The present invention relates to, for example, QFP, SO.
Surface mount devices such as P and LCC, TC
The present invention relates to a burn-in test jig used when performing a burn-in test on an LSI such as P.

[0002]

2. Description of the Related Art The burn-in test is for accelerating extraction of latent defects such as poor recoverability and short life inherent in the inspection object by actually driving the inspection object such as LSI at high temperature. The test is usually performed on all LSIs.

When performing this burn-in test,
It is necessary to supply power and signals to each terminal of the object to be inspected, and to take out the signal from the object to be inspected from each terminal of the object to be inspected. An in-test jig is used.

Conventionally, as a burn-in test jig of this type, a jig as shown in FIGS. 10 and 11 is generally known. That is, the figure shows a burn-in test jig used when performing this burn-in test using an LSI such as QFP as the object to be inspected 1. This jig is a base on a flat plate. It is mainly composed of a substrate 2 and a plurality of sockets 3 arranged on the base substrate 2, and the base substrate 2 is mechanically reinforced by a frame-shaped reinforcing frame 4 arranged on the peripheral portion of the lower surface thereof. There is.

Each of the sockets 3 is for irremovably accommodating while positioning the device under test 1 such as an LSI during the burn-in test,
A storage part for this is provided, and the hinge 5
A lid 6 for opening and closing the inspected object 1 through a hook and a hook 7 for closing the lid 6 while pressing the lid 6 downward.
And are provided.

Then, the object 1 to be inspected in the socket 3
At a position corresponding to each terminal (outer lead) 1a of the above, a metal spring 8 having an upper end bent in an arc shape to have a spring property is arranged. The circuit pattern, which is soldered to the base substrate 2 in a state of being inserted into the base plate 2 and electrically connected to the metal spring 8, extends with the front and back surfaces of the base substrate 2 sideways. It reaches the external terminals 2a provided on the front and back surfaces.

Thus, when the object to be inspected 1 is housed in the socket 3 and the lid 6 is closed via the hook 7, the terminals 1a of the object to be inspected 1 and the metal springs 8 are electrically connected individually. Power and signals are individually supplied to the terminals 1a of the device under test 1 from the external terminals 2a that are connected to each other and extend from the metal springs 8, and the signals from the device under test 1 are supplied to the terminals of the device under test 1. 1a can be individually taken out through each external terminal 2a.

Here, as the functionality and capacity of the LSI have increased, the density of the terminals of the LSI has increased and the number of terminals has increased.
In the FP, those having a terminal pitch of 0.3 mm or less and 200 or more terminals are beginning to be put into practical use.

[0009]

However, in the above-mentioned conventional example, if an attempt is made to arrange a metal spring inside the socket in accordance with this pitch in order to accommodate a large number of terminals with a narrow pitch, this processing is quite difficult, Even if it is possible to deal with it, the mold for molding the socket becomes precise and complicated, and the price of the socket is considerably high, resulting in a heavy burden on the inspection price. Moreover, since the socket occupies a considerably large area, the number of sockets that can be mounted on one base substrate is limited, which makes it impossible to perform an efficient burn-in test.

In view of the above, the present invention is not only capable of coping with burn-in tests of many kinds of LSIs with narrow pitch multi-terminals using the same burn-in test jig, but also using sockets. The cost is low and the area efficiency is high, and the exchangeability is good so that it is possible to deal with damage and change of the type of the inspected object, and good burn-in test can be performed under a wide range of temperature conditions. The purpose is to provide things.

[0011]

In order to achieve the above object, a burn-in test jig according to the present invention comprises internal terminals of a circuit pattern formed on a base substrate and terminals of an object to be inspected. By connecting the
In a burn-in test jig for performing an in-test, a contact having contacts on both upper and lower surfaces and electrically connecting each internal terminal of the base substrate and each terminal of the inspection object through the contact. A substrate, a positioning plate for positioning the contact substrate with respect to the base substrate, and a positioning plate having a positioning hole into which the object to be inspected is dropped while positioning the object, and a pressure mechanism for pressurizing the object to be inspected toward the contact substrate. And a split-type reinforcing plate for fixing the positioning plate and the base plate.

Here, the upper and lower contacts of the contact board may be composed of a pressure conductive rubber electrically connected by a wiring pattern formed on the contact board, and the pressure conductive rubber may be formed inside the contact board. It is also possible to expose the rubber vertically and bury it, and form the contact points on the upper and lower surfaces of this pressure conductive rubber.

[0013]

According to the present invention configured as described above, the contact substrate is arranged at a predetermined position on the base substrate through the positioning plate, and the object to be inspected is dropped into the positioning hole of the positioning plate and added. By using a split type reinforcing plate that pressurizes with a pressure mechanism and fixes the positioning plate, thermal stress is relieved and each terminal of the DUT and the internal terminal of the base board are electrically connected individually. Good burn-in test can be performed under a wide range of temperature conditions.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a first embodiment. In FIG. 1, reference numeral 10 is a rectangular flat plate-shaped base substrate, and the base substrate 10 is used to connect an object to be inspected 1 such as an LSI to each terminal. A power supply and a signal are supplied through the (outer lead) 1a, and a signal is taken out from the DUT 1. Circuit patterns (not shown) for this purpose are formed on the front and back surfaces. External terminals 10a as input / output terminals with the outside are provided on the front and back surfaces, and internal terminals 10b as input / output terminals with the DUT 1 are provided on the front surface side at the ends of each circuit pattern. ing.

The base substrate 10 is made of a heat-resistant substrate material such as a BT plate, a polyimide substrate, and FR-5, and has aluminum or PPS arranged on the lower surface.
It is mechanically reinforced by a reinforcing plate 11 made of, for example. Further, FIG. 12 is a view of the back side of the surface of the base substrate 10 on which the object to be inspected is mounted. For example, the reinforcing plate 11 is divided into four units in this manner, Since there are the clearances t1 and t2 between the reinforcing plates which are adjacent to each other, the thermal expansion in the plane direction is alleviated and the distortion of the entire jig can be suppressed. Furthermore, as shown in FIG. 13, 16, 17,
Since the pressing structure is constituted by 18, 19, the pressure fixing component 20, and the sub pressure fixing component 21, the base substrate 10 draws an arc in the direction opposite to the surface on which the inspection object is mounted (see arrow B in FIG. 13). It is expected that the pressure applied to the center portion of the base substrate 10 will be weakened in particular. However, as shown in FIG. , 11b, the required strength can be obtained by widening the area S formed by 11b and 11b, and stable electrical connection can be obtained. Further, the distances of the gaps t1 and t2 are determined by the rigidity of the material used for the reinforcing plate 11, the coefficient of thermal expansion, the temperature band in which the inspection object is inspected, and the like. Similarly, the rigidity of the material used for the reinforcing plate 11, the coefficient of thermal expansion,
It is also possible to use a reinforcing plate that extends over two or more positioning plates in terms of the temperature band, the number of objects to be inspected mounted on one base plate, cost, workability, and the like.

On the upper surface of the base substrate 10, 6 is shown in the figure.
A total of 30 positioning plates 12 of 5 in each row are fixed by bolts 13 inserted into the reinforcing plate 11 through the bolt holes 12a, and the positioning plates 12 and the base substrate 10 are Between the contact board 1
4 is installed.

The contact substrate 14 is the base substrate 10 described above.
For electrically connecting each inner terminal 10b and each terminal 1a of the inspection object 1 individually via the contact substrate 14, and is made of, for example, heat resistant PWB or heat resistant FPC,
The upper and lower surfaces are provided with an upper contact 14 and a lower contact 14c, which are connected to both ends of a wiring pattern 14a inserted through the inside.

That is, each inner terminal 10b of the base substrate 10
And the respective lower contacts 14c of the contact substrate 14 are brought into contact with the respective terminals 1a of the DUT 1 and the respective upper contacts 14b of the contact substrate 14 so that the respective inner sides of the base substrate 10 are contacted via the contact substrates 14. A burn-in test is performed by electrically connecting the terminal 10b and each terminal 1a of the DUT 1.

Here, the base substrate 10 and the contact substrate 14,
The relative alignment between the contact substrate 14 and the DUT 1 is important.
4 for positioning with respect to the base substrate 10 and positioning of the DUT 1 with respect to the contact substrate 14.

That is, the positioning bosses 12b are provided at the four corners of the positioning plate 12 on the back surface side.
At the four corners of the contact substrate 14 corresponding to
And the base substrate 1
A through hole 10c is provided at a position corresponding to the positioning boss 12b when the positioning plate 12 is mounted on the 0. Furthermore, inside the positioning plate 12, for example, QF
In P, SOP, etc., a positioning hole 12c that is machined according to a pattern reference suitable for the shape of the DUT 1 is provided so as to be positioned at the side end of the lead.

As a result, the positioning boss 12b of the positioning plate 12 is inserted into the fixing hole 14d of the contact substrate 14, and in this state the positioning boss 12b is inserted into the base substrate 10.
After being inserted into the through hole 10c of the contact substrate 14, the contact substrate 14 is positioned with respect to the base substrate 10 by fixing the contact substrate 14 to the base substrate 10 via the bolts 13, that is, the internal electrodes 10b of the base substrate 10 and the contact substrate 14 Lower contact 14
c contact each other and drop the inspection object 1 inside the positioning hole 12c, thereby positioning the inspection object 1 with respect to the contact substrate 14, that is, each upper contact 14b of the contact substrate 14 and each inspection object 1. The terminals 1a are in contact with each other.

The positioning plate 12 is made of, for example, PP.
Heat-resistant plastic molded products such as S and LCP or PWB
It is desirable to use a processed product made of the same material as that having the same coefficient of thermal expansion in the plane direction as the contact substrate 14.

The inspection object 1 is positioned with respect to the contact substrate 14 at the side end of the terminal 1a. The upper contact 14b and the lower contact 14c of the contact board 14 are made of pressure conductive rubber. The contact points 14b and 14c made of the pressure conductive rubber can be formed by, for example, forming an opening with a resist, removing the resist after embedding the pressure conductive rubber in the opening, or by printing.

The pressure conductive rubber is a composite conductive material on a sheet consisting of silicone rubber and metal particles, and when pressed, the metal particles inside contact with each other so as to have conductivity. By using a pressure conductive rubber for the contacts 14b and 14c, the internal electrodes 10b of the base substrate 10, the lower contacts 14c of the contact substrate 14, the upper contacts 14b of the contact substrate 14 and the terminals of the DUT 1 are connected. It is possible to prevent the contact failure from occurring here by making surface contact with 1a and to prevent each terminal 1a of the inspection object 1 from being scratched.

As the pressure conductive rubber, an anisotropic pressure conductive rubber having conductivity in the thickness direction and no conductivity in the plane direction can be used. In this case, one continuous sheet is used. The upper contact point 14b and the lower contact point 14c can be made of pressure conductive rubber.

The anisotropic conductive rubber includes only a dispersion type in which conductive paths formed perpendicular to the sheet surface are evenly distributed on the sheet surface, and a conductive portion and rubber in which conductive paths are concentrated. There are two types of ubiquitous type in which the insulating part is separated and the conductive part is formed in accordance with the pattern of the inspection electrode.

The upper contact 14b of the contact board 14 should correspond to the terminal 1a of the inspection object 1 and its pitch P1 should be equal to the pitch of the terminals of the inspection object 1. And the lower contacts 14c are arranged alternately in two rows, so that the pitch P2 of the lower contacts 14c is sufficiently wide.

By performing the pitch conversion on the contact substrate 14 in this manner, it is possible to deal with the inspection object 1 having a narrow pitch. Then, each inspection object 1 is pressed downward to bring the terminals 1a into contact with the upper contacts 14b of the contact substrate 14, the lower contacts 14c of the contact substrate 14 and the internal electrodes 10b of the base substrate 10, respectively. The pressurizing mechanism 15 is provided for each row, and each pressurizing mechanism 15 is shown in FIG.
As shown in detail in FIG.
0 on the upper surface of 0, a support 17 vertically erected, a rotary claw 18 rotatably supported on the upper end of the support 17, and a U-shaped notch 19a for passing the rotary claw 18 at both ends. The pressure stay 19 is provided and a pressure portion 20 made of an elastic body and formed on the lower surface of the pressure stay 19 to press the upper surface of each inspection object 1 is mainly configured.

The pressure stay 19 is, for example, PPS or L.
A taper portion 19b made of a heat-resistant plastic such as CP or a material such as aluminum and having a gradually increasing wall thickness is provided from the inner surface to the end surface of the cutouts 19a at both ends, and a state matched to the shape of the cutouts 19a. After passing through the rotary claw 18 at, the rotary claw 18 is rotated so that the rotary claw 18 rides on the upper surface of the pressure stay 19 along the tapered portion 19b to obtain a pressure. ing.

Burning of the inspection object 1 using the above jig
In order to perform the in-test, first, the contact substrate 14 is attached at a predetermined position on the base substrate 10 via the positioning plate 12, and the DUT 1 to be inspected is placed in the positioning hole 12c of the positioning plate 12. Drop, then pressurizing mechanism 1
5 of the pressure stay 1 by attaching the stay 19,
The object to be inspected 1 is held by 9 so that it cannot be escaped, and the object to be inspected 1 is pressed downward. Then, each internal terminal 10 b of the base substrate 10 and each terminal 1 a of the DUT 1 are electrically connected via the contact substrate 14.

In this state, under high temperature, power and signals are supplied from the external terminals 10a of the base substrate 10 to the terminals 1a of the device under test 1 and signals from the terminals 1a of the device under test 1 are received. Burn-in test.

In this embodiment, the pressure unit 20
Although the upper surface of the body of the DUT 1 is pressed by, the pressing portion is formed of a conductive conductive rigid body, and the terminal (outer lead) 1a of the DUT 1 is pressed by the pressing portion. You can also do it.

Further, although an example in which a contact board having an outer shape substantially the same as the outer shape of the positioning plate is used is shown, a contact board extending over two or three positioning plates may be used.

FIG. 5 shows a second embodiment of the present invention. This embodiment is one in which metal is brought into electrical contact without using a pressure conductive rubber. Differences from the example are as follows.

That is, in this embodiment, the upper contact 24b connected to the wiring pattern 24a of the contact substrate 24 is made of a metal plate,
Similarly, the lower contacts 24c are each formed by a projection in which copper is deposited and the lower end surface of which is plated with gold. And
A lower cushioning material 25 made of, for example, silicon and having a thickness approximately equal to the height of the lower contact (projection) 24c is used as the contact substrate 24.
An upper cushioning material 26 made of silicon is similarly arranged on the lower surface of the lower contact 24c over the entire upper surface of the contact substrate 24 located outside the upper surface of the lower contact 24c. The concave portion 12d is formed on the lower surface of the positioning plate 12 corresponding to.

In the case of this embodiment, each terminal 1 of the inspection object 1 is
a and the respective upper contacts 24b of the contact substrate 24, the lower cushioning material 25 is mainly used for the inner terminals 1 of the base substrate 10.
0b and the lower contact point 24c of the contact substrate 24 are mainly absorbed by the upper cushioning material 26, respectively, so that metal-to-metal contact can be realized.

FIG. 6 shows a third embodiment in which the metal-to-metal contact is realized as in the second embodiment. In this embodiment, the end portion of the contact substrate 34 has a U-shape. A folded-back portion that is folded back and exposed inward is formed, and a wiring pattern 34a is provided along the surface of this folded-back portion, and metal upper contacts 34b and lower contacts 34c are formed at the ends of this wiring pattern 34a. Further, the intermediate cushioning material 35 fitted in the U-shaped folded-back portion is disposed on almost the entire lower surface of the contact substrate 34.

In the case of this embodiment, each terminal 1 of the inspection object 1 is
Since the intermediate cushioning material 35 is located on the extension of the contact portion between a and each upper contact 34b of the contact substrate 34, and the contact portion between each internal terminal 10b of the base substrate 10 and each lower contact 34c of the contact substrate 34, One piece of cushioning material can be used.

7 and 8 show a fourth embodiment, which corresponds to each terminal 1a of the inspection object 1 on the contact substrate 44 without performing pitch conversion on the contact substrate 44. An opening is provided at each position where the pressure conductive rubber 45 is embedded in each opening, and the upper surface of the pressure conductive rubber 45 serves as the upper contact 44b and the lower surface serves as the lower contact 44c.

By thus forming the contacts 44b and 44c using the pressure conductive rubber 45, the base substrate 10
The contact area between each internal terminal 10b and each terminal 1a of the DUT 1 is increased to increase the contact area, and the positioning of the contact substrate 44 and the DUT 1 is performed simultaneously through the positioning plate 12. By doing so, the positioning accuracy is improved, and thus such a configuration can be realized.

It is needless to say that the anisotropic pressure conductive rubber may be used as the pressure conductive rubber. In the case of this embodiment, as shown in FIG. 9, a metal layer 46 may be formed on the upper surface of the pressure conductive rubber 45, and the upper surface of this metal layer 46 may serve as the upper contact 44b.

[0042]

Since the present invention has the above-mentioned structure,
Even in a narrow-pitch, multi-terminal LSI, the burn-in test can be performed by reliably electrically connecting these terminals to the internal terminals of the base substrate. Moreover, since no socket is used, it is not necessary to prepare a mold having a complicated structure to reduce the cost, the occupied area is reduced as much as possible to improve the area efficiency, and the contact board can be replaced. There is an effect that it is possible to easily deal with damage or change of the type of the inspection object. Further, by using the split type reinforcing plate that fixes the positioning plate and the contact substrate, the thermal expansion of the plate can be absorbed and the distortion of the entire jig can be relaxed.

[0043]

[Brief description of drawings]

FIG. 1 is a main-portion cross-sectional view (enlarged cross-sectional view along the line AA in FIG. 2) showing a first embodiment.

FIG. 2 is likewise a plan view of a state in which a contact substrate and a positioning plate are superposed on each other.

FIG. 3 is likewise an overall plan view.

FIG. 4 is an enlarged sectional view taken along line BB of FIG.

FIG. 5 is a view corresponding to FIG. 1 showing a second embodiment.

FIG. 6 is a view corresponding to FIG. 1 showing a third embodiment.

FIG. 7 is a view corresponding to FIG. 2 showing a fourth embodiment.

FIG. 8 is likewise a view corresponding to FIG. 1.

FIG. 9 is a view, corresponding to FIG. 1, showing a modification of the fourth embodiment.

FIG. 10 is an overall plan view showing a conventional example.

FIG. 11 is likewise an enlarged cross-sectional view of a main part.

FIG. 12 is an overall plan view showing a first embodiment (a view on the back side of the surface on which the object to be inspected is mounted).

13 is a sectional view of FIG. 12 as seen from the side.

FIG. 14 is likewise an enlarged cross-sectional view of a main part.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Inspected object 1a Terminal 10 Base board 10a External terminal 10b Internal terminal 11 Reinforcing plate 11a 11b Contact part of reinforcing plates which are mutually adjacent 12 Positioning plate 12b Positioning boss 12c Positioning hole 14, 24, 34, 44 Contact board 14b, 24b , 34b, 44b Upper contact point 14c, 24c, 34c, 44c Lower contact point 15 Pressure mechanism 18 Rotating claw 19 Pressure stay 20 Pressure fixing part 21 Sub pressure fixing part 35, 36, 45 Cushioning material t1, t2 Gap with the reinforcing plate B Direction in which the base substrate becomes S Common area made up of the contact parts 11a and 11b

Claims (1)

[Claims] 1. A burn-in test jig for performing a burn-in test by electrically connecting each internal terminal of a circuit pattern formed on a base substrate to each terminal of an object to be inspected. In order to deal with various types of inspected objects having contacts on both upper and lower sides and electrically connecting each internal terminal of the base substrate and each terminal of various types of inspected objects through the contacts. A contact board having contacts arranged therein, a positioning plate having a positioning hole for positioning the contact board with respect to the base board, and positioning and dropping the various kinds of objects to be inspected, and the various kinds of objects to be inspected. A burn-in test jig comprising: a pressurizing mechanism for pressurizing toward the contact substrate; and a split-type reinforcing plate for fixing the positioning plate and the base plate.