JP2000150094A - Contact pin arranging method and ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To arrange one ends of contact pins in a matrix in the two dimensional direction at desirable pitches and provide a socket capable of assembling in a short time by stacking a plurality of contact pins to be arranged in parallel at desirable pitches within a single surface through a heat resistant, electrical insulating spacer. SOLUTION: By arranging the tip of a spring part 2b in each positioning groove of a spacer 7, dispersion of pitches in a spring part 2b is corrected, and the spring part 2b can correspond to the electrode pitch of a package. When lead frames are stacked through the spacer 7, a contact pin 2 in the stacking direction is positioned with a flat part 7a of the spacer 7 and correctly arranged, and short caused by contact of the contact pins can be prevented. When stacked 16 lead frames are fixed by arranging a fastening plate on opposite sides of a first fixing part 2c with a bolt, a plurality of contact pins 2 are accurately arranged in a matrix, and an aggregate of total 256 pins of 16×16 is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for arranging contact pins and an IC socket for inspecting electrical characteristics of a semiconductor device such as an IC package using the contact pins arranged by the method. And an IC socket that needs to be arranged in a matrix at a narrow pitch.

[0002]

2. Description of the Related Art As the density of semiconductor elements has increased, a ball grid array (B) has been used as a semiconductor element in which solder balls for connection are arranged in an array or matrix as electrodes.
GA: Ball Grid Array, Pin Grid Array (PGA:
Pin Grid Array (LGA) or Land Grid Array without solder balls (LGA: Land Grid Array)
The demand for such IC packages is rapidly increasing.

[0003] In these IC packages, the pitch between electrodes is changed from 1.0 mm to 0.8 mm as the density of semiconductor elements increases.
→ 0.5 mm → 0.4 mm, etc. tend to be smaller. In general, a burn-in test is performed on a semiconductor device after manufacturing. In the burn-in test, the semiconductor element (IC package) is mounted on an IC socket having a plurality of contact pins connected at one end to an electrode of the semiconductor element (IC package) and the other end to a connection terminal of an external tester. The electrical characteristics are tested by heating under predetermined conditions. At this time, the electrical connection between the IC socket and the semiconductor element (IC package) is made by mechanical contact between the contact pins on the IC socket side and the electrodes on the semiconductor element (IC package) side.

[0004]

In an IC socket, one end of each contact pin needs to properly contact a corresponding electrode of a semiconductor element (IC package). However, the contact pins have a residual stress when processing the lead frame constituting them, or when resin molding the intermediate portion in order to hold a plurality of contact pins at a predetermined arrangement pitch, or deformation when handling the lead frame. For example, the pitch at one end contacting the electrode on the semiconductor element (IC package) side tends to vary.

In order to accurately maintain the pitch, conventionally, in the assembly of an IC socket, pitch correcting pins are arranged vertically and horizontally between a plurality of contact pins arranged in a matrix. Then, after correcting the pin pitch with the pitch correcting pin, the pitch correcting pin was pulled out to assemble the IC socket. However, the plurality of contact pins arranged in a matrix have a fine arrangement pitch of about 0.5 mm. For this reason, arranging the pitch correcting pins between the contact pins must be performed with the latest attention, which is very time-consuming and troublesome. For example, when 20 contact pins are arranged vertically and horizontally, a total of 42 pitch correction pins must be arranged, 21 in each of the vertical and horizontal directions. Therefore, there is a problem that it takes time and effort to assemble the IC socket by arranging the contact pins with high accuracy in a matrix.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and a method of arranging a plurality of contact pins in a matrix form with high accuracy and a method of assembling the same in a simple, short and efficient manner. It is an object to provide a possible IC socket.

[0007]

In order to achieve the above object, in the method of arranging contact pins according to the present invention, a plurality of contact pins arranged in parallel on a single plane at a desired pitch are provided with heat resistance and electric resistance. One end of the contact pin is arranged in a matrix at a desired pitch in a two-dimensional direction by laminating via a spacer having a desired thickness having an insulating property.

In order to achieve the above object, the present invention provides
In the C socket, an IC socket having a plurality of contact pins arranged in a matrix according to the electrode pitch of the semiconductor element at one end and the pitch of the electrical connection terminals of the external connection body at the other end, At one end of the plurality of contact pins, a spacer of a desired thickness having heat resistance and electrical insulation that determines an arrangement pitch is arranged in any one of two-dimensional directions arranged in a matrix. The configuration was

Preferably, the spacer has a positioning portion for positioning one end of the contact pin on the entire surface or a part thereof.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a contact pin arranging method of the present invention and an IC socket using a plurality of contact pins arranged in a matrix with high accuracy by the method will be described below with reference to FIGS. It will be described in detail based on. First, as the IC socket of the present invention, the electrode pitch
A total of 256 IC packages (fine pitch BGA) of 0.5 mm, 16 × 16 electrodes, and a connection terminal pitch of 1.27 mm for external connection bodies, 16 × 16 terminals, 2 in total
An IC socket to be enlarged and converted into 56 sockets will be described with reference to FIGS.

As shown in FIGS. 1 to 3, the IC socket 1 has a plurality of contact pins 2, an IC mounting base 6, and an outer frame 10 arranged in a matrix. The contact pin 2 is composed of a plurality of lead frames made of, for example, a 0.1 mm-thick beryllium copper alloy plate in which 16 leads are arranged in parallel in the arrangement plane. The contact pin 2 has a lead 2a at one end, and a spring portion 2b formed in an arc shape at the other end. The contact pin 2 is connected to the pitch of the connection terminal of the external tester to which the lead 2a is connected (= 1.27 mm), and the tip of the spring portion 2b is set to the electrode pitch of the IC package to be mounted (= 0.5 mm). , Respectively. The contact pin 2 is provided with a first fixing portion 2c in which the vicinity of the spring portion 2b is fixed with an electrically insulating synthetic resin in the arrangement direction of the leads 2a, and the other end of the contact pin 2 is fixed with the synthetic resin in the arrangement direction. Two fixing portions 2d are provided.

The first fixing portion 2c is formed in a concave shape in which the portion of the spring portion 2b is opened, and has bolt holes HB (see FIG. 6) on both sides. The second fixing part 2d is a lead 2a
And a pin hole 2e is formed on both sides. At this time, one end of the plurality of contact pins 2 is arranged in a matrix at a desired pitch in a two-dimensional direction by an arrangement method described below.

First, the contact pins 2 are formed by bending one end and the other end of the 16 leads of the lead frame substantially parallel to the arrangement surface, and then connecting the lead frame via the spacer 7. 1 superimposed on 1 fixed part 2c
Six sheets are laminated. The spacer 7 determines the arrangement pitch in the vertical and horizontal directions at the tip of the contact pin 2 on the spring portion 2b side. The spacer 7 is a plate-shaped member as shown in FIG.
A plurality of protrusions 7b provided on the upper edge of the flat portion 7a form a positioning groove 7c for positioning the tip of the spring portion 2b in the longitudinal direction. At this time, the flat portion 7a is set so that the thickness is slightly smaller than the interval in the stacking direction of the tip of the spring portion 2b in the stacking direction of the lead frame,
The positioning groove 7c sets the groove width larger than the width of the tip of the spring portion 2b. For example, the spring portion 2b of the contact pin 2
When the arrangement pitch in the two-dimensional direction on the distal end side is 0.5 mm, and the thickness on the distal end side of the spring portion 2b is 0.1 mm, the interval in the stacking direction of the lead frame is 0.4 mm, and the flat portion 7
The thickness of a is 0.34 mm, and the width of the tip of the spring portion 2b is 0.1 m.
m, the groove width of the positioning groove 7c is 0.15 mm, and the plurality of protrusions 7
The interval of b and the thickness of the projection 7e (see FIG. 6) are set to 0.5 mm, which is the same as the arrangement pitch of the contact pins 2.

Therefore, as shown in FIG. 6, by disposing the tip of the spring portion 2b in each positioning groove 7c, the variation in the pitch of the plurality of spring portions 2b due to processing or the like is corrected. Can correspond to the electrode pitch of the package. Further, when the lead frames are stacked via the spacers 7, the plurality of contact pins 2 in the stacking direction are positioned and accurately arranged at the flat portions 7a of the spacers 7, and the contact pins 2 in the stacking direction are mutually aligned. Short circuits due to contact can also be prevented. At this time, the spacer 7 is
The pitch of the tip of a spring portion 2b in the direction of arrow Y, which will be described later, for laminating the lead frame is accurately regulated by the thickness of the convex portion 7e (see FIG. 6) formed at the center of the flat portion 7a. be able to. Also, as shown in FIG. 5, if the taper surface FTP is formed by chamfering the positioning groove 7c side of the protrusion 7b as shown in FIG. 5, the work of arranging the contact pins 2 in the positioning groove 7c can be easily performed. Can be.

Further, since the spacer 7 is used for a burn-in test, it is necessary that the spacer 7 has heat resistance and electric insulation in a test temperature range. For example, a liquid crystal polymer, a polyetherimide resin, or a polyphenylene sulfide (PPS) ) Can be used as a raw material, such as an electrically insulating synthetic resin, ceramics, or a metal whose surface has been subjected to insulation treatment.

Then, the sixteen stacked lead frames are mounted by fixing clamping plates 3 and 4 on both sides of the first fixing portion 2c and fixing them with bolts 5 inserted into the bolt holes. A plurality of contact pins 2 corresponding to the electrode pitch of the IC package are assembled into a 16 × 16 pin aggregate having a total of 256 pins arranged in a matrix. At this time, as shown in FIGS. 2 and 3, the stopper 2 f of the contact pin 2 slightly protrudes above the fastening plates 3 and 4 from the first fixing portion 2 c. In FIG. 1, a direction indicated by an arrow X is a direction parallel to the lead frame, and a direction indicated by an arrow Y is a stacking direction of the lead frame.

The pin assembly assembled in this manner is inserted into an opening 10a formed in the center of the outer frame 10 as shown in FIGS.
Fixed to 0. At this time, the pin 11 penetrates the outer frame body 10 and abuts on the lower end of the first fixing portion 2c.
It penetrates the outer frame body 10 and is inserted into the pin hole 2e of the second fixing portion 2d.

Here, since FIG. 1 shows the pin assembly inserted into the outer frame 10, the lid 14 shown in FIGS. 2 and 3 is omitted. In FIG. 2, the lid 14 is opened and closed about a hinge pin 14a, and is locked by a projection 10b provided on a wall surface of the outer frame body 10 by a hook 14b. Further, the spacer 7 is omitted in FIGS. 1 to 3 because of its small thickness.

As shown in FIG. 2, a 16 × 1 through-hole is provided on the spring portion 2 b side of the contact pin 2 at a pitch (= 0.5 mm) equal to the electrode pitch of the IC package 20.
6, Attach the IC mounting table 6 formed with a total of 256 pieces,
The IC socket 1 can be easily and efficiently assembled in a short time. Therefore, the plurality of contact pins 2 are held at the same pitch by the IC mounting table 6 and the spacer 7 at one end side as the pitch of the electrodes of the IC package 20.

At this time, 20 × 2 with an arrangement pitch of 0.5 mm
It took about 30 minutes to 1 hour to assemble an IC socket having 0 = 400 contact pins by a conventional assembling method using pitch correcting pins because the work was complicated and the work time varied. On the other hand, in the IC socket 1 using the contact pin arrangement method of the present invention, about 2
It was very easy to assemble in 0 minutes.

The IC mounting table 6 is made of polyetherimide resin, liquid crystal polymer, polyphenylene sulfide (PP)
It is formed of an electrically insulating synthetic resin such as S), ceramic, or metal whose surface has been subjected to insulation treatment. When inspecting the IC package 20 using the IC socket 1, the IC package 20 is placed in a positioning groove (not shown) of the IC mounting table 6 as shown in FIG.
Close. At the same time, the outer frame 10 is placed on an external tester (not shown), and the other end of the contact pin 2 is brought into direct contact with the connection terminal of the external tester.

Then, as shown in FIG. 2, the pressure plate 15 incorporated in the lid 14 pushes the IC package 20 by the spring force from the first spring 16 disposed between the pressure plate 15 and the lid 14.
Push down with the mounting base 6. At this time, the IC mounting table 6
Is biased in the direction of the pressure plate 15 by a second spring 17 disposed between the outer frame 10 and the second spring 17. Therefore, in the IC socket 1, the tips of the contact pins 2 protrude upward from the IC mounting table 6 and appropriately contact the corresponding electrodes (not shown) of the IC package 20. As a result, the IC socket 1 is configured such that each electrode of the IC package 20 is connected to an external connection terminal, and the electric characteristics of the IC package 20 can be inspected without using an expensive multilayer printed circuit board.
Burn-in test can be performed at low cost.

At this time, the IC socket 1 has a contact pin 2 formed with a spring portion 2b formed in an arc shape. Therefore, in the IC socket 1, the contact pins 2 are always in contact with the electrodes of the IC package 20 at a constant contact pressure, and the IC mounting table 6 is regulated in the lowered position by the stoppers 2 f of the plurality of contact pins 2. , The maximum contact pressure is also kept at a constant value.

Here, the spacer 7 positions the tip of the spring portion 2b of the contact pin 2 by a plurality of positioning grooves 7c formed by the projections 7b. For this reason, if this purpose can be achieved, a plurality of protrusions 8b provided on the upper edge of the flat portion 8a to form the positioning groove 8c, for example, like the spacer 8 shown in FIG.
The cross section may be formed in a polygonal projection such as a triangle, a rhombus, a pentagon, a hexagon, a circle, or an ellipse in addition to a rectangle. Further, the positioning groove 8c can be formed into various shapes such as a channel shape if the variation in the pitch of the plurality of spring portions 2b due to processing or the like can be corrected and the tip of the spring portion 2b can be properly positioned. .

When the spacer has projections and projections on both the front and back surfaces, the adjacent spacer is a flat plate without projections and projections, and a spacer having projections and projections is arranged next to the spacer. become. Further, the spacer is formed in a gate shape having legs 9b on both sides of the bridge portion 9a like the spacer 9 shown in FIG. 8, and the tip of the spring portion 2b is formed by a plurality of protrusions 9c provided on the bridge portion 9a. The positioning groove 9d for positioning may be formed in the longitudinal direction.

In the above embodiment, in addition to the spacer 7, I
The case where the pitch of the plurality of contact pins 2 is maintained at the same pitch as the electrodes of the IC package 20 by the C mounting table 6 has been described. However, since the pitch of one end of the plurality of contact pins 2 can be kept equal to the pitch of the electrodes of the IC package 20 by only the spacer 7,
The IC mounting table 6 is not always necessary.

[0027]

According to the first and second aspects of the present invention, a method of arranging a plurality of contact pins which can be arranged in a matrix with high accuracy and a simple and efficient assembly in a short time. And a simple IC socket. According to the third aspect of the present invention, the effect of arranging a plurality of contact pins in a matrix with high accuracy is further improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of an IC socket using contact pins arranged according to the contact pin arrangement method of the present invention.

FIG. 2 is a sectional side view of the IC socket of FIG.

FIG. 3 is a sectional front view of the IC socket of FIG. 1;

FIG. 4 is a perspective view showing a spacer used in the method of arranging contact pins according to the present invention, omitting an intermediate portion.

FIG. 5 is an enlarged perspective view showing a structure of a positioning groove of the spacer of FIG. 4;

FIG. 6 is a side view showing a state where the contact pins of the lead frame are positioned by the spacer of FIG. 4 in a cross section of the spacer.

FIG. 7 is an enlarged view of a main part showing a modified example of a projection forming a positioning groove of the spacer, in which the spacer is sectioned.

FIG. 8 is a perspective view showing another embodiment of the spacer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC socket 2 Contact pin 6 IC mounting stand 7 Spacer 7a Flat part 7b Projection 7c Positioning groove 7d Side edge 7e Convex part 8 Spacer 9 Spacer 9a Bridge part 9b Leg 9c Projection 9d Positioning groove 10 Case 20 IC package

 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Masato Sakata 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd. F-term (reference) 2G003 AA07 AC01 AG01 AH04 AH05 5E024 CA01 CB10

Claims (3)

[Claims] An end of the contact pin is formed by laminating a plurality of contact pins arranged in parallel at a desired pitch in a single plane via a spacer having a desired thickness having heat resistance and electrical insulation. Are arranged in a matrix at a desired pitch in a two-dimensional direction. 2. An IC socket having a plurality of contact pins arranged in a matrix so that one end corresponds to an electrode pitch of a semiconductor element and the other end corresponds to a pitch of an electrical connection terminal of an external connection body. At one end of the plurality of contact pins, a spacer of a desired thickness having heat resistance and electrical insulation that determines an arrangement pitch is arranged in any one of two-dimensional directions arranged in a matrix. An IC socket comprising: 3. The IC socket according to claim 2, wherein a positioning portion for positioning one end of the contact pin is formed on the entire surface or a part of the spacer.