JP3150084B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket and, more particularly, to an IC socket used for mounting an IC on a printed circuit board for an IC screening test.
For C socket.

[0002]

2. Description of the Related Art In general, in a process of testing the electrical characteristics of an IC, a screening test (usually abbreviated as BT) is performed in order to eliminate minute defects of the IC. In this BT implementation, the IC under test is
T board (abbreviation of printed board for screening test,
The test is carried out by mounting a plurality of IC sockets called BT sockets mounted on a BT board. As one conventional example of this type of IC socket, an IC socket disclosed in Japanese Patent Application Laid-Open No.
FIG. 2A is a side view including a partial cross section in a closed state of the socket. FIG.
(B) is a side view including a partial cross section of the conventional example in an open state. As shown in FIGS. 2A and 2B, in the conventional example, an upper lid 12 opened and closed with respect to a lower lid 13 is provided.
In the closed state, the upper lid 12 is locked to the lower lid 13 by the latch 4. In the upper lid 12,
A pressing spring 15 to which a pressing plate 14 is attached is provided, and a carrier 16
In contrast, the contact 7 is arranged at a position corresponding to the lead 10 of the IC 11 to be tested, and the contact 7 penetrates the bottom of the lower lid 13 and is fixed by soldering to the BT board. You. When performing BT of the IC 11 to be tested, the upper lid 12 is closed and locked to the lower lid 13 by the latch 4, and the leads 10 of the IC 11 on the lower lid 13 are pressed from above by the upper lid 12. , The closed state is maintained. In this closed state, the leads 10 of the IC 11 placed on the lower lid 13 and the contacts 7 are in an electrically connected state, whereby the conditions for starting the BT of the IC 11 are set. When the upper lid 12 is closed and locked to the lower lid 13, the portion of the upper lid 12 that contacts the molded portion of the IC 11 is partially repeated so that no load is applied to the molded portion sealing the IC 11. A structure is formed in which the lead 10 and the contact 7 are effectively in contact with each other and a conductive state is obtained.

In this conventional example, in the above structure, the upper cover 12 is provided with a pressing spring 15 to which a pressing plate 14 is attached. The pressing plate 14 and the pressing spring 15 When opening the upper lid 12
And a coil spring (not shown) provided at a hinge portion of the lower lid 13 causes an inertia shock due to a restoring force of the IC1.
1 functions as a suppressing means for avoiding the occurrence of unconvergence in which the upper cover 1 jumps out from the lower cover 13 to the outside.
When the IC is opened, the IC 11 is pressed against the lower lid 13 by the pressing means by the pressing plate 14 and the pressing spring 15, as shown in FIG.
11 is prevented from jumping out.

[0004]

In the above-mentioned conventional IC socket, when the upper lid is closed and locked to the lower lid, as described above, a load is not applied to the molded portion sealing the IC. In addition, the portion of the upper lid corresponding to the mold portion of the IC has a shape of a partially-removed hole, and BT is performed in this state. Is becoming thinner at the request of the user, which causes a difference in the fluidity of the resin at the time of sealing and the shrinkage ratio of the upper and lower portions of the resin portion. There is a problem that "warpage" and "undulation" occur in the sealing portion, and the flatness of the lead of the IC is deteriorated. However, it cannot be corrected at all during BT. Disadvantages That.

[0005] It is an object of the present invention to address the above disadvantages,
An object of the present invention is to provide an IC socket that can solve the above-described problems by providing a flat plate that supports an IC to be tested from both upper and lower surfaces on a substrate and an upper cover of the BT socket at the time of BT. .

[0006]

An IC socket according to the present invention includes a substrate having a predetermined contact and a lead of the IC as a means for sandwiching and mounting the IC during a screening test of the IC to be tested. in the IC socket formed by a lid which serves to contact against the contacts, the via definitive heat treatment screening tests performed during <br/>, the resin sealing portion of the test subject IC And a resin sealing portion correcting means functioning to correct the distorted shape.

The resin sealing portion correcting means includes a first flat correction plate attached to a surface of the substrate facing the resin sealing portion of the IC to be tested via a predetermined elastic material;
It is characterized in Rukoto and a second plate-shaped correction plate which is attached via a predetermined elastic material on the opposite surface of the resin sealing portion of the test subject IC of the lid.

[0008]

Next, the present invention will be described with reference to the drawings.

FIG. 1A is a perspective view showing an appearance of an embodiment of the present invention in an open state, and FIG. 1B is a side view including a partial cross section of the embodiment in a closed state. . As shown in FIGS. 1A and 1B, in the present embodiment, a lid 2 that is opened and closed via a hinge including a “coil spring” 3 is provided on a substrate 1, and is in a closed state. In, the lid 2 is locked to the substrate 1 by the latch 4. The lid 2, through a spring 8 is provided with plate-shaped correction plate 5, the substrate 1, flat straightening plate 6 which IC11 to be tested is placed, via a spring 9 fitted Have been. Further, in order to be able to cope with the BT of a plurality of ICs 11 to be tested,
Corresponding to the thickness dimension of a lid 2 which is plate-shaped矯<br/> Seiita 5 is added through a "spring" 8, tabular via the "spring" 9
The space in the closed state between the substrate 1 to which the correction plate 6 is added is set so as to match the thickness of the ICs 11 arranged in an overlapping manner.

When the IC 11 is mounted on the IC socket according to the BT, the lid 2 is closed with respect to the substrate 1 so that the flat plate-shaped correction members respectively attached to the lid 2 and the substrate 1 are closed. The ICs 11 are pressurized by the plates 5 and 6 in the direction of being sandwiched, and the lid 2 is closed and locked to the substrate 1 by the latch 4 so that the external contact 7 is electrically connected to the leads 10 of the IC 11. In this state, the BT is normally performed. Moreover, these "springs" 8 and 9 and the flat correction plates 5 and 6
Accordingly, even when the thickness of the test target IC 11 changes, the pressurizing action of the flat correction plates 5 and 6 is always maintained in a normal state, and the BT can be performed. In this case, unlike the conventional example, in the present embodiment, the "springs" 8 and 9 provided in association with the flat correction plates 5 and 6, respectively, are provided. A "spring" having a higher "spring constant" is used in comparison with the related art, and the purpose of use of the "spring" is not to maintain the IC as in the above-described conventional example. As described above, in a state where the IC is sandwiched from above and below, the IC 1 is inserted through the flat surfaces of the correction plates 5 and 6.
Heat treatment is performed by pressing and heating 1. By such a heat treatment, an IC
The “warp” and “undulation” in the mold section 11 are corrected, and thereby the flatness of the leads of the IC 11 is improved.

That is, according to the present invention, in the process of mounting an IC in an IC socket and conducting BT of the IC by establishing continuity between a lead of the IC and a contact, a sealing portion of the IC is formed into a flat plate shape. By pressurizing and heating by sandwiching between the correction plates, a remarkable effect that the distortion shape of the sealing portion can be corrected is realized.

Next, an example of the present embodiment will be described. In the present embodiment shown in FIG. 1, in the present embodiment, a flat plate sandwiching the lid 2 and the IC 11 is used.
Of the heat-resistant resin P so as to withstand the temperature condition of heat treatment in BT of 125 ° C.
EI (polyetherimide), PES (polyethersulfone), PSF (polysulfone) and the like are used, and are molded as a flat correction plate. The contact 7 provided on the substrate 1 is made of, for example, a "spring" material such as beryllium copper or titanium copper plated with Au. The correction plates 5 and 6 are fixed to the substrate 1 and the lid 2 at the ends of the coil-shaped “springs” 8 and 9 respectively. The lid 2 is closed, and the lid 2 is locked to the substrate 1 by the latch 4. Then, an appropriate amount of pressurization is performed by the correction plates 5 and 6 corresponding to the “springs” 8 and 9 along the vertical direction so as to sandwich the mold sealing portion of the IC 11. IC11
The electrical connection between the leads 10 is realized by pressing about 5 kg. The “springs” 8 and 9 used in this embodiment have a displacement of 0.1 mm.
In this case, a material having a "spring constant" of about 0.5 kg / cm is used.

[0013]

As described above, the present invention is applied to an IC socket formed with a lid and a substrate for sandwiching an IC to be tested at the time of BT. Each plate is fixed via a "spring"
The straightening plate is used to correct the distortion shape such as “warp” and “undulation” generated in the resin sealing portion of the IC through the heat treatment at the time of performing the BT by the straightening plate. Has an effect that the flatness can be always maintained in a normal state.

[Brief description of the drawings]

FIG. 1 is a perspective view and a side view including a partial cross section showing an embodiment of the present invention.

FIG. 2 is a side view including a partial cross section in a closed state and a side view including a partial cross section in an open state of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Lid 3 Coil spring 4 Latch 5, 6 Straightening plate 7 Contact 8, 9 Spring 10 Lead 11 IC 12 Upper lid 13 Lower lid 14 Pressing plate 15 Push spring 16 Carrier

Claims (1)

(57) [Claims] 1. A means for sandwiching and mounting an IC during a screening test of an IC to be tested, wherein the IC has a function of pressing a contact having a predetermined contact and pressing a lead of the IC against the contact. And an IC socket formed with a lid that performs the screening test, through a heat treatment at the time of performing the screening test.
The functional resin sealing portion correcting means to correct the C of the resin sealing portion of the distorted shape, comprises in combination, the resin sealing portion
Correcting means for resin sealing of the IC to be tested on the substrate
A first elastic member attached to the opposite surface of the portion via a predetermined elastic material.
A flat correction plate and a resin of the IC to be tested on the lid
A third portion attached to the opposing surface of the sealing portion via a predetermined elastic material.
2. An IC socket comprising: a flat correction plate according to claim 2 ;