JPH036523A - Liquid crystal display device - Google Patents

Liquid crystal display device

Info

Publication number
JPH036523A
JPH036523A JP14150489A JP14150489A JPH036523A JP H036523 A JPH036523 A JP H036523A JP 14150489 A JP14150489 A JP 14150489A JP 14150489 A JP14150489 A JP 14150489A JP H036523 A JPH036523 A JP H036523A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
wiring board
integrated circuit
display element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14150489A
Other languages
Japanese (ja)
Inventor
Hirosaku Nonomura
野々村 啓作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP14150489A priority Critical patent/JPH036523A/en
Publication of JPH036523A publication Critical patent/JPH036523A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To simplify a constitution, to reduce the cost and size, and to make the device thin by constituting the liquid crystal display device with a wiring board, a semiconductor integrated circuit element for driving the liquid crystal display element, and a rigid metallic cover body which is fitted in surface contact with the opposite surface of the wiring board and covers the neighborhood of the semiconductor integrated circuit element. CONSTITUTION:The display device is constituted of the liquid crystal display element 21, the wiring board 22 which is connected electrically to the liquid crystal display element 21 while arranged in parallel, an electronic component 23 as the semiconductor integrated circuit element, such as an integrated circuit and a large-scale integrated circuit, which drives the liquid crystal display element 21, and the metallic cover body 24 which covers the neighborhood of the electronic component 23. Namely, the wiring board 22 is pressed by the cover body 24, so the wiring board 22 is prevented from deforming by wrapping, etc. Consequently, the device can be manufactured at low cost without making the constitution complex and the thickness and size of the liquid crystal display device are reduced.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、たとえば電子卓上計算機、ファクシミリおよ
び電子手帳などの電子機器に有利に実施することができ
る液晶表示装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a liquid crystal display device that can be advantageously implemented in electronic devices such as electronic desktop calculators, facsimile machines, and electronic notebooks.

従来の技術 第3図は、典型的な先行技術の断面図である。Conventional technology FIG. 3 is a typical prior art cross-sectional view.

液晶表示装置1は、たとえば集積回路(IC)あるいは
大規i集積回路(LS I )などの電子部品2が装着
されたプリント配線基板(PWB)3上に、ゴムコ木り
タ4および可撓性配線基板(FBC)5を介して液晶表
示素子6を積重し、その;α晶表示素子6の周縁辺に支
持金具7を嵌着して、前記液晶表示素子21と配線基板
3とが固定される。前記液晶表示素子6と配線基板3と
は、前記ゴムコオ・フタ4と可撓性配線基板5とによっ
て電気的に接続されるとともに、配線基板3に設けられ
たスルーホール8によって電気的に接続されている。ま
た不要輻射(FCC)を防止するために、前記液晶表示
装置1とは別に金属製シールド板9が設けられている。
A liquid crystal display device 1 includes a printed wiring board (PWB) 3 on which an electronic component 2 such as an integrated circuit (IC) or a large-scale integrated circuit (LSI) is mounted, and a rubber stripper 4 and flexible wiring. Liquid crystal display elements 6 are stacked with substrates (FBC) 5 interposed therebetween, and a supporting metal fitting 7 is fitted around the periphery of the α-crystal display element 6, whereby the liquid crystal display element 21 and the wiring board 3 are fixed. Ru. The liquid crystal display element 6 and the wiring board 3 are electrically connected by the rubber cover/lid 4 and the flexible wiring board 5, and are also electrically connected by a through hole 8 provided in the wiring board 3. ing. Further, in order to prevent unnecessary radiation (FCC), a metal shield plate 9 is provided separately from the liquid crystal display device 1.

このような先行技術では、液晶表示装置1の各構成部品
、つまり液晶表示素子6、プリンI・配線基板3、電子
部品2およびシールド板9などがこの順序で積重するよ
うに構成されており、これらの各構成部品の厚さの和に
対応して液晶表示装置1を含む装置全体の厚さが決定さ
れることになり、比較的厚みが大きくなってしまうとい
う問題があった。
In such prior art, each component of the liquid crystal display device 1, that is, the liquid crystal display element 6, the printer I/wiring board 3, the electronic component 2, the shield plate 9, etc. is configured to be stacked in this order. , the thickness of the entire device including the liquid crystal display device 1 is determined according to the sum of the thicknesses of these components, resulting in a relatively large thickness.

このような問題を解決するために従来では、第4図に示
されるように配線基板3に、電子部品2が嵌まり込むこ
とができる嵌合孔10を形成し、この嵌き孔10に前記
電子部品2を嵌合させた状嬰でその電子部品2の接続端
子を配線基板3に電気的に接続する構成が用いられてい
る。
In order to solve this problem, conventionally, a fitting hole 10 into which the electronic component 2 can fit is formed in the wiring board 3 as shown in FIG. A configuration is used in which the connection terminals of the electronic component 2 are electrically connected to the wiring board 3 while the electronic component 2 is fitted.

しかしながら、このような先行技術では、配線基板3に
電子部品2が嵌まり込む嵌き孔10が形成されているた
めに、その配線基板3上で配線可能な面積が少なくなっ
てしまい、電子部品2が配置される背後部分に前記スル
ーホール8を設けることができず、したがって配線基板
3の表面に所望する配線パターンを形成することが不可
能となる場合が生じてしまう、また配線基板3に所望す
る配線パターンで配線層11を形成することが可能であ
っても、その配線M11の配線パターンがきわめで4密
度となってしまい、このような複雑な配線パターンを形
成するために製造コストが高価になってしまうという問
題があった。
However, in such prior art, since the wiring board 3 is formed with the fitting hole 10 into which the electronic component 2 is fitted, the area on the wiring board 3 that can be wired is reduced. It is not possible to provide the through hole 8 in the rear part where the wiring board 2 is arranged, and therefore it may become impossible to form a desired wiring pattern on the surface of the wiring board 3. Even if it is possible to form the wiring layer 11 with a desired wiring pattern, the wiring pattern of the wiring M11 will have an extremely high density of 4, and the manufacturing cost will increase to form such a complicated wiring pattern. The problem was that it was expensive.

発明が解決しようとする課題 したがって本発明の目的は、上述の技術的課題を解決し
、構成を複雑化することなく安価に製造することができ
、小形化、薄形化を図ることがてきるようにした液晶表
示装置を提供することである。
Problems to be Solved by the Invention Therefore, an object of the present invention is to solve the above-mentioned technical problems, to be able to manufacture the product at low cost without complicating the structure, and to achieve miniaturization and thinning. An object of the present invention is to provide a liquid crystal display device.

課題を解決するための手段 本発明は、液晶表示素子と、 剛性電気絶縁性基板の両表面に導体が形成され。Means to solve problems The present invention includes a liquid crystal display element; Conductors are formed on both surfaces of a rigid electrically insulating substrate.

これらの両表面の導体が相互に対向して平行に配置され
た状態で電気的に接続される配線基板と、配!!基板の
前記液晶表示素子とは反対側の表面に配置され、その反
対側に形成されている導体に電気的に接続される液晶表
示素子駆動用の半導体集積回路素子と、 配線基板の前記反対側の表面に面接触して取「すけられ
、半導体集積回路素子付近を覆う剛性の金属製カバ一体
とを含むことを特徴とする液晶表示装置である。
A wiring board that is electrically connected with the conductors on both surfaces facing each other and arranged in parallel, and a wiring board! ! a semiconductor integrated circuit element for driving the liquid crystal display element disposed on the surface of the substrate opposite to the liquid crystal display element and electrically connected to a conductor formed on the opposite side; and the opposite side of the wiring board. This liquid crystal display device is characterized in that it includes a rigid metal cover that is removed in surface contact with the surface of the semiconductor integrated circuit element and covers the vicinity of the semiconductor integrated circuit element.

作  用 本発明に従えば、両表面に導体が形成された配線基板の
液晶表示素子が配置された側とは反対側の表面に、その
液晶表示素子駆動用の半導体集積回路素子が接続され、
この半導体集積回路素子付近を覆って剛性の金属製カバ
一体が配線基板の前記反対側表面に面接触して取付けら
れる。したがって前記カバ一体によって配線基板は押さ
えられているので、その配線基板の反りなどの変形を防
止することができる。その結果、従来のように配線基板
の歪みや反りが生じない程度に配線基板の厚みを薄くす
ることが可能となり、したがって装置全体の厚みを配線
基板の厚みに対応して薄くすることができる。これによ
って液晶表示装置の薄形化および小形化を図ることがで
きる。
According to the present invention, a semiconductor integrated circuit element for driving the liquid crystal display element is connected to the surface of the wiring board having conductors formed on both surfaces, opposite to the side on which the liquid crystal display element is arranged,
A rigid metal cover is attached to cover the vicinity of the semiconductor integrated circuit element in surface contact with the opposite surface of the wiring board. Therefore, since the wiring board is held down by the cover, deformation such as warping of the wiring board can be prevented. As a result, it is possible to reduce the thickness of the wiring board to such an extent that distortion and warpage of the wiring board does not occur as in the conventional case, and therefore, the thickness of the entire device can be reduced in accordance with the thickness of the wiring board. This allows the liquid crystal display device to be made thinner and smaller.

しかも前記半導体St積回路素子は、カバ一体によって
覆われているので、半導体集積回路素子および配線基板
上の導体へのたとえばノイズなどの不要輻射を防止する
ことができ、たとえば液晶駆動電流などにノイズなどが
入るおそれはなく、電気的性能の信頼性が向上される。
Moreover, since the semiconductor integrated circuit element is covered with an integral cover, it is possible to prevent unnecessary radiation such as noise to the semiconductor integrated circuit element and the conductors on the wiring board. There is no risk of such things getting in, and the reliability of electrical performance is improved.

実施例 第1図は、本発明の一実施例の液晶表示装置20を示す
拡大断面図である。たとえば反射型液晶表示装置20は
、基本的に、液晶表示素子21と、この液晶表示素子2
1と平行に配置された状って電気的に接続される配線基
板22と、配線基板22に接続される、たとえば集積回
路(IC)あるいは大規模集積回路(LS I )など
の前記液晶表示素子21を駆動するための半導体集積回
路素子である電子部品23と、電子部品23付近を覆う
剛性の金属製カバ一体24とを含む。
Embodiment FIG. 1 is an enlarged sectional view showing a liquid crystal display device 20 according to an embodiment of the present invention. For example, the reflective liquid crystal display device 20 basically includes a liquid crystal display element 21 and a liquid crystal display element 2.
1, and the liquid crystal display element, such as an integrated circuit (IC) or a large-scale integrated circuit (LSI), connected to the wiring board 22. It includes an electronic component 23 which is a semiconductor integrated circuit element for driving the electronic component 21, and a rigid metal cover unit 24 that covers the vicinity of the electronic component 23.

前記液晶表示素子21は、相互に対向する表面間に液晶
が封入された一対の透明なガラス基板25.26と、ガ
ラス基板25上に配置される偏向板27と、ガラス基板
26の背後側に配置される反射板28とを有する。ガラ
ス基板25の前記ガラス基板26に対向する表面には、
セグメント電極29が形成され、ガラス基板26のセグ
メント電fI29に対向する表面には共通電極30が形
成される。セグメント電極29は、ゴムコネクタ31に
よって配線基板22の一表面に形成された導体である配
線層32に選択的に接続される。このコネクタ31は、
ゴムなどの弾発性を有する電気絶縁性材料から成る長手
棒状体35と、棒状体35内に前記配線132の配線パ
ターンに対応した間隔で個別的に配置された銅などの導
電性材料から成る接続片36とから成る。このようなコ
ネクタ31によって、セグメント電極2つと配線層32
との個別的に電気的接続が行われる。また前記ガラス基
板26上の共通電極30は、可撓性配線基板37によっ
て配線層33に接続される。配線基板22の配線113
3が形成された側とは反対側の表面には、導体である配
線層38a、38bが形成される。この配線層38には
、前記電子部品23の接続端子39a、39bIJc個
別的に接続される。電子部品23の接続端子39bが接
続された配線層38bは配線基板22をその厚み方向に
連通ずるスルーホール・10によって池方表面側に形成
された配線層33に接続される。したがって電子部品2
3の接続端子39L)と液晶表示素子21の共通;極3
6とは電気的に接続される。また′:S7一部品23の
接続端子39;Lは、スルーホール41によって配線1
132に接続される。したがって接続端子39aとセグ
メント電fgI29とは電気的に接続される。
The liquid crystal display element 21 includes a pair of transparent glass substrates 25 and 26 in which liquid crystal is sealed between surfaces facing each other, a deflection plate 27 disposed on the glass substrate 25, and a polarization plate 27 on the back side of the glass substrate 26. and a reflective plate 28 arranged therein. On the surface of the glass substrate 25 facing the glass substrate 26,
A segment electrode 29 is formed, and a common electrode 30 is formed on the surface of the glass substrate 26 facing the segment electrode fI29. The segment electrodes 29 are selectively connected to a wiring layer 32, which is a conductor, formed on one surface of the wiring board 22 by a rubber connector 31. This connector 31 is
A longitudinal rod-like body 35 made of an electrically insulating material having elasticity such as rubber, and a conductive material such as copper arranged individually within the rod-like body 35 at intervals corresponding to the wiring pattern of the wiring 132. It consists of a connecting piece 36. With such a connector 31, two segment electrodes and a wiring layer 32 can be connected.
A separate electrical connection is made with the Further, the common electrode 30 on the glass substrate 26 is connected to the wiring layer 33 by a flexible wiring board 37. Wiring 113 of wiring board 22
Wiring layers 38a and 38b, which are conductors, are formed on the surface opposite to the side where 3 is formed. Connection terminals 39a and 39bIJc of the electronic component 23 are individually connected to this wiring layer 38. The wiring layer 38b to which the connection terminal 39b of the electronic component 23 is connected is connected to the wiring layer 33 formed on the surface side of the board through a through hole 10 that communicates with the wiring board 22 in its thickness direction. Therefore, electronic component 2
3 connection terminal 39L) and the liquid crystal display element 21; pole 3
6 is electrically connected. Also, the connection terminal 39;L of the S7 part 23 is connected to the wiring 1 by the through hole 41.
132. Therefore, the connection terminal 39a and the segment voltage fgI29 are electrically connected.

配線基板22の配線層38が形成された側の表面には、
第2図に示されるように、鉄またはアルミニウムなどの
金属製材料に電気絶縁性材料から成る被覆層を形成した
カバ一体24が配置される。
On the surface of the wiring board 22 on which the wiring layer 38 is formed,
As shown in FIG. 2, a cover unit 24 is disposed in which a covering layer made of an electrically insulating material is formed on a metal material such as iron or aluminum.

このカバ一体24には、電子部品23の本体23εtが
嵌まり込む複数の嵌き孔43が形成され、周縁部には複
数の切欠き44が形成され、接地されている。これらの
液晶表示素子21、配線基板22およびカバ一体24は
、ベゼルと呼ばれる金属製支持部材45によって固定さ
れる。この支持部材・15には、前記カバ一体24に形
成された切欠き44に対応した間隔で複数の係合爪46
が形成される。このような支持部材45によって、前記
液晶表示素子21、配線基板22およびカバ一体24を
固定するに当たっては、前記切欠き44に係合爪46が
嵌まり込んだ状態で、その係合爪46を内側に折り曲げ
ることによって、その折曲げ部分によって前記カバ一体
24が係止される。このようにして液晶表示素子21、
配線基板22およびカバ一体24が支持部材45によっ
て固定された状態では、液晶表示素子21のガラス基板
25は、前記コネクタ31と、支持部材45の支持部4
8とによって挟持され、ガラス基板26の前記可撓性配
線基板37が接続された部分子士近は、シリコンなどの
弾発性および可撓性を有する材料から成る緩衝部材4つ
によって支持されている。
This cover unit 24 has a plurality of fitting holes 43 into which the main body 23εt of the electronic component 23 is fitted, and a plurality of notches 44 are formed in the peripheral edge and are grounded. These liquid crystal display element 21, wiring board 22, and cover assembly 24 are fixed by a metal support member 45 called a bezel. This support member 15 has a plurality of engaging pawls 46 at intervals corresponding to the notches 44 formed in the cover unit 24.
is formed. When fixing the liquid crystal display element 21, the wiring board 22, and the cover unit 24 using such a support member 45, the engaging claw 46 is inserted into the notch 44, and then the engaging claw 46 is inserted into the notch 44. By bending inward, the cover unit 24 is locked by the bent portion. In this way, the liquid crystal display element 21,
When the wiring board 22 and the cover assembly 24 are fixed by the support member 45, the glass substrate 25 of the liquid crystal display element 21 is connected to the connector 31 and the support portion 4 of the support member 45.
8 and to which the flexible wiring board 37 of the glass substrate 26 is connected is supported by four buffer members made of an elastic and flexible material such as silicon. There is.

したがって液晶表示装置20に振動および衝撃力などが
作用しても、液晶表示素子21と配線基板22とカバ一
体24とが相互にずれてしまうことはない。
Therefore, even if vibrations, impact forces, etc. act on the liquid crystal display device 20, the liquid crystal display element 21, the wiring board 22, and the cover unit 24 will not be displaced from each other.

また配線基板22は、カバ一体24によって押さえられ
ているので、その厚みTを薄くすることができ、たとえ
ば厚みT = O−6m m以下である。
Further, since the wiring board 22 is held down by the cover unit 24, its thickness T can be made thin, for example, the thickness T = O-6 mm or less.

つまり、配線基板22の厚みTを薄くしても、前述した
ようにカバ一体24が面接触しな状怪で押圧しているの
で、配線基板22が反りや弯曲を生じることはなく、コ
ネクタ31および可撓性配線基板37との確実な電気的
接続状態を維持することができるとともに、電子部品2
3を確実に基板22上に電気的に接続された状態で閑持
することができる。これら電子部品23を覆うようにカ
バ一体24が設けられ、しがもそのカバ一体24はアル
ミニウムまたは鉄などの導電性材v4から成るので、外
部からの不要輻射を防止することができる。
In other words, even if the thickness T of the wiring board 22 is reduced, since the cover unit 24 is pressed without surface contact as described above, the wiring board 22 will not warp or curve, and the connector 31 will not warp or curve. It is possible to maintain a reliable electrical connection state with the electronic component 2 and the flexible wiring board 37.
3 can be securely held on the board 22 in a state where it is electrically connected. An integrated cover 24 is provided to cover these electronic components 23, and since the integrated cover 24 is made of a conductive material v4 such as aluminum or iron, unnecessary radiation from the outside can be prevented.

発明の効果 本発明によれば、液晶表示素子駆動用の半導体集積回路
素子を剛性の金属製カバ一体によって覆うようにしたの
で、その半導体!l&積回路素子が接続される配線基板
を支持して、配線基板のたわみあるいは反りなどを防止
することができ、これによって配線基板を従来のように
反りまたはたわみなどを考慮した厚みを必要とせず、し
たがって配線基板を先行技術に比べて薄くすることがで
きる。
Effects of the Invention According to the present invention, since the semiconductor integrated circuit element for driving the liquid crystal display element is covered with a rigid metal cover, the semiconductor! It is possible to support the wiring board to which the integrated circuit element is connected and prevent the wiring board from bending or warping, thereby eliminating the need for the wiring board to be thick enough to take warp or bending into consideration, unlike conventional wiring boards. Therefore, the wiring board can be made thinner than in the prior art.

これによって液晶表示装置の薄形化および小形化を計る
ことができる。また前記半導体tA積回路素子はカバ一
体によって覆われているので、外部からの不要輻射を防
止して液晶駆動信号にたとえばノイズなどが入ってしま
うことを防止することができ、これによって確実な液晶
駆動動作を行うことができ、信頼性を向上することがで
きる。
This allows the liquid crystal display device to be made thinner and smaller. In addition, since the semiconductor tA integrated circuit element is covered with an integrated cover, it is possible to prevent unnecessary radiation from the outside and prevent noise from entering the liquid crystal drive signal, thereby ensuring reliable liquid crystal display. The driving operation can be performed and the reliability can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第10は本発明の一実施例の液晶表示装置20を示す拡
大断面図、第2(2Iは第1図に示される液晶表示装置
20の分解斜視図、第311Wは典型的な先行技術の断
面図、第4図は他の先行技術を示す断面図である。
No. 10 is an enlarged cross-sectional view showing a liquid crystal display device 20 according to an embodiment of the present invention, No. 2 (2I is an exploded perspective view of the liquid crystal display device 20 shown in FIG. 1, and No. 311W is a cross-sectional view of a typical prior art. FIG. 4 is a sectional view showing another prior art.

Claims (1)

【特許請求の範囲】  液晶表示素子と、 剛性電気絶縁性基板の両表面に導体が形成され、これら
の両表面の導体が相互に対向して平行に配置された状態
で電気的に接続される配線基板と、配線基板の前記液晶
表示素子とは反対側の表面に配置され、その反対側に形
成されている導体に電気的に接続される液晶表示素子駆
動用の半導体集積回路素子と、 配線基板の前記反対側の表面に面接触して取付けられ、
半導体集積回路素子付近を覆う剛性の金属製カバー体と
を含むことを特徴とする液晶表示装置。
[Claims] Conductors are formed on both surfaces of a liquid crystal display element and a rigid electrically insulating substrate, and the conductors on both surfaces are electrically connected to each other while being arranged in parallel and facing each other. a wiring board; a semiconductor integrated circuit element for driving a liquid crystal display element disposed on a surface of the wiring board opposite to the liquid crystal display element and electrically connected to a conductor formed on the opposite side; mounted in surface contact with the opposite surface of the substrate,
A liquid crystal display device comprising: a rigid metal cover body that covers the vicinity of a semiconductor integrated circuit element.
JP14150489A 1989-06-03 1989-06-03 Liquid crystal display device Pending JPH036523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14150489A JPH036523A (en) 1989-06-03 1989-06-03 Liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14150489A JPH036523A (en) 1989-06-03 1989-06-03 Liquid crystal display device

Publications (1)

Publication Number Publication Date
JPH036523A true JPH036523A (en) 1991-01-14

Family

ID=15293493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14150489A Pending JPH036523A (en) 1989-06-03 1989-06-03 Liquid crystal display device

Country Status (1)

Country Link
JP (1) JPH036523A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190690A (en) * 2000-12-22 2002-07-05 Murata Mfg Co Ltd Electronic component module
US6743398B2 (en) * 2001-04-24 2004-06-01 Teruaki Itoh Serum/clot separation surface determination apparatus
JP2006337250A (en) * 2005-06-03 2006-12-14 Non-Destructive Inspection Co Ltd Method for measuring depth of treatment using eddy current, and measuring apparatus using the same
JP2007334220A (en) * 2006-06-19 2007-12-27 Hitachi Displays Ltd Liquid crystal display device
WO2010125925A1 (en) * 2009-04-28 2010-11-04 オムロン株式会社 Electronic component mounting device and method for producing the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190690A (en) * 2000-12-22 2002-07-05 Murata Mfg Co Ltd Electronic component module
JP4608777B2 (en) * 2000-12-22 2011-01-12 株式会社村田製作所 Electronic component module
US6743398B2 (en) * 2001-04-24 2004-06-01 Teruaki Itoh Serum/clot separation surface determination apparatus
JP2006337250A (en) * 2005-06-03 2006-12-14 Non-Destructive Inspection Co Ltd Method for measuring depth of treatment using eddy current, and measuring apparatus using the same
JP2007334220A (en) * 2006-06-19 2007-12-27 Hitachi Displays Ltd Liquid crystal display device
WO2010125925A1 (en) * 2009-04-28 2010-11-04 オムロン株式会社 Electronic component mounting device and method for producing the same
JP2010258370A (en) * 2009-04-28 2010-11-11 Omron Corp Electronic component mounting device, and method of manufacturing the same
KR101244047B1 (en) * 2009-04-28 2013-03-15 오므론 가부시키가이샤 Electronic component mounting device and method for producing the same
US9093282B2 (en) 2009-04-28 2015-07-28 Omron Corporation Electronic component mounting device and method for producing the same

Similar Documents

Publication Publication Date Title
JP3920786B2 (en) Liquid crystal display
US4514042A (en) Thin structure of display panel
US4688074A (en) Connecting structure for a display device
JP2916824B2 (en) Liquid crystal display
US20090016030A1 (en) Circuit board, connection structure, and apparatus
EP1615193B1 (en) Flat-panel display unit
JPH036523A (en) Liquid crystal display device
JPH05188388A (en) Liquid crystal display device
JPH1026939A (en) Planar display device
JPH05273572A (en) Packaging method and packaging structure for panel
JPH1048599A (en) Liquid crystal display device
JPH05313184A (en) External circuit structure for driving liquid crystal display element
JP2001318618A (en) Flexible wiring board and display panel
JP2638427B2 (en) Liquid crystal display
JPH0792454A (en) Structure and method of mounting display device
JP2864612B2 (en) Semiconductor device
JP2007329316A (en) Wiring substrate and mounting structure
JP2904449B2 (en) Mounting structure in electronic equipment
JPH05185787A (en) Portable semi-conductor storage device
JPH10288771A (en) Liquid crystal display device
JP3301941B2 (en) Liquid crystal display
JPS62143086A (en) Liquid crystal display unit
JP4146679B2 (en) Liquid crystal display
JP2000100982A (en) Electronic part package
JPH0864722A (en) Hybrid integrated circuit device