JPH0755002Y2 - ワイヤボンダの荷重制御構造 - Google Patents

ワイヤボンダの荷重制御構造

Info

Publication number
JPH0755002Y2
JPH0755002Y2 JP1990129429U JP12942990U JPH0755002Y2 JP H0755002 Y2 JPH0755002 Y2 JP H0755002Y2 JP 1990129429 U JP1990129429 U JP 1990129429U JP 12942990 U JP12942990 U JP 12942990U JP H0755002 Y2 JPH0755002 Y2 JP H0755002Y2
Authority
JP
Japan
Prior art keywords
ultrasonic horn
capillary
drive block
motor
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990129429U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0487645U (enExample
Inventor
博 寺島
Original Assignee
トーソク株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トーソク株式会社 filed Critical トーソク株式会社
Priority to JP1990129429U priority Critical patent/JPH0755002Y2/ja
Publication of JPH0487645U publication Critical patent/JPH0487645U/ja
Application granted granted Critical
Publication of JPH0755002Y2 publication Critical patent/JPH0755002Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1990129429U 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造 Expired - Lifetime JPH0755002Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990129429U JPH0755002Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990129429U JPH0755002Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造

Publications (2)

Publication Number Publication Date
JPH0487645U JPH0487645U (enExample) 1992-07-30
JPH0755002Y2 true JPH0755002Y2 (ja) 1995-12-18

Family

ID=31876829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990129429U Expired - Lifetime JPH0755002Y2 (ja) 1990-11-30 1990-11-30 ワイヤボンダの荷重制御構造

Country Status (1)

Country Link
JP (1) JPH0755002Y2 (enExample)

Also Published As

Publication number Publication date
JPH0487645U (enExample) 1992-07-30

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