JPH07504536A - 基板をクリーンルームに移す装置 - Google Patents
基板をクリーンルームに移す装置Info
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- JPH07504536A JPH07504536A JP5515271A JP51527193A JPH07504536A JP H07504536 A JPH07504536 A JP H07504536A JP 5515271 A JP5515271 A JP 5515271A JP 51527193 A JP51527193 A JP 51527193A JP H07504536 A JPH07504536 A JP H07504536A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L1/00—Enclosures; Chambers
- B01L1/04—Dust-free rooms or enclosures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Clinical Laboratory Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- External Artificial Organs (AREA)
- Warehouses Or Storage Devices (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Packaging For Recording Disks (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.基板(102)を含むカセット(101)を収容するための箱(1)と、箱 (1)を密閉する箱庭(2)とを備え、この箱庭が箱底(1)内で鎖錠機構によ って鎖錠および解錠可能であり、鎖錠機構が箱底(2)に回転可能に支承された 揺動円板(25)を備え、この揺動円板が特に送り棒(24a,24b;324 a,324b)を介して鎖錠要素(21a,21b;321a,321b)を駆 動し、この鎖錠要素が箱(1)の鎖錠スリット(11a,11b)に係合し、揺 動円板(25)が係合穴(26a,26b)を備え、この係合穴に、スルースゲ ート(4)内に設けられた回転円板(45)の鎖錠ピン(41a,41b)が係 合し、この回転円板が装置の駆動装置によって駆動されて、箱(1)内での箱底 (2)の鎖錠および解錠を開始する揺動運動を行い、更に、箱(1)を正しい姿 勢に配向するための収容フレーム(3)と、箱(1)を収容フレーム(3)に錠 止するための錠止機構を備えている、基板をクリーンルーム(100)に移すた めの装置において、錠止機構(31a,31b;43;44a,44b;49a ,49b;50a,50b:141,144,147,148,149)が回転 円板(45)に機械的に連結され、それによって箱(1)内での箱底(2)の鎖 錠を開始する揺動円板(25)の揺動運動が、収容フレーム(3)内での箱(1 )の錠止を解除し、箱(1)内での箱底(2)の解錠を開始する回転円板(45 )の揺動運動が、収容フレーム(3)内での箱(1)の錠止を行うことを特徴と する装置。 2.カム円板(43;143)を回転円板(45)に固定連結することにより、 錠止機構(31a,31b;43;44a,44b;49a,49b;50a, 50b;141,144,147,148,149)と鎖錠機構(21a,21 b;24a,24b;25;29a,29b;209a,209b;210a, 210b;212a,212b;310a,310b;312a,312b;3 21a,321b;324a,324b;331a,331b;331a′,3 31b′;332a,332b;333a,333b;334,335)の連結 が行われ、カム円板(43;143)が切換カム(51a,51b)を備え、こ の切換カムの中を各々1本のピン(50a,50b)が案内され、このピンがそ れぞれ他の送り棒(44a,44b)に連結され、この送り棒が回転円板(45 )の回転運動を、箱(1)の肩部(12a,12b)に当てられる錠止要素(3 1a,31b)の揺動運動に変換することを特徴とする請求の範囲第1項の装置 。 3.錠止要素(31a,31b)がピン(35a,35b)の一端に設けられ、 このピンの他端が揺動レバー(32a,32b)を備え、この揺動レバーが他の 送り棒(44a,44b)によって付勢され、各々のピン(35a,35b9と 同軸に揺動ばね(37)が設けられ、この揺動レバーの第1の端部がピン(35 a,35b)に連結され、第2の端部が収容フレーム(3)に支持され、それに よって他の送り棒(44a,44b)を引っ込めたときに錠止要素(31a,3 1b)が揺動ばね(37)のばね力によって収容フレーム(3)の凹部(39) からその錠止位置へ揺動させられることを特徴とする請求の範囲第2項の装置。 4.カム円板(43;143)の切換カム(51a,51b)が第1の範囲(5 1a′,51b′)にわたって一定の半径を有し、切換カム(51a,51b) がそれに続く第2の範囲(51a′′,51b′′)を備え、この第2の範囲に おいて切換カム(51a,51b)の半径が大きくなり、それによってこの第2 の範囲をピン(50a,50b)が通過することにより、他の送り棒(44a, 44b)が摺動運動し、従って錠止要素(31a,31b)が揺動することを特 徴とする請求の範囲第2項の装置。 5.錠止機構(31a,31b;43;44a,44b;49a,49b;50 a,50b;141,144,147,148,149)と鎖錠機構(21a, 21b;24a,24b;25;29a,29b;209a,209b;210 a,210b;212a,212b;310a,310b;312a,312b ;321a,321b;324a,324b;331a,331b;331a′ ,331b′;332a,332b;333a,333b;334,335)を 駆動する駆動装置(52,53,54,56,57,58;141,144,1 47,148,149)が完全にスルースゲート(4)の内室(4′)の中に設 けられていることを特徴とする請求の範囲第1〜4項のいずれか一つの装置。 6.駆動装置が回転点(57)に枢着支承された湾曲部材(56)を備え、この 湾曲部材内に、減速歯車装置を備えたモータ(58)が収容され、モータ軸にね じスピンドル(54)がフランジ止めされ、このねじスピンドルが二叉部材(5 3)のねじに係合し、この二叉部材が第2の枢着点(52)を介して回転円板( 45)に固定連結されたカム円板(43)を枢着していることを特徴とする請求 の範囲第5項の装置。 7.駆動装置が減速歯車装置付モータ(141)を備え、このモータの軸(14 1′)にウォーム(144)がフランジ止めされ、このウォームがウォームホイ ール(147)にかみ合い、ウォームホイールがピニオン(149)に固定連結 され、ピニオン(149)が平歯車として形成されたカム円板(143)にかみ 合っていることを特徴とする請求の範囲第5項の装置。 8.鎖錠要素(21a;21b)が少なくとも一つの滑り材(29a;29b) を備え、この滑り材が箱底(2)のケーシング(22)の下面(23)上を滑り 、滑り材(29a,29b)と協働するストッパー(28a,28b)が設けら れ、このストッパーが特にトグルレバーとして作用する送り棒(24a,24b )によって開始される、箱(1)の鎖錠スリット(11a,11b)の方への鎖 錠要素(21a,21b)の直線的な摺動運動を制限し、送り棒(24a,24 b)がこの摺動方向に更に移動するときに、鎖錠要素(21a,21b)の傾動 を生じることを特徴とする請求の範囲第1項の装置。 9.錠止要素(321a,321b)が少なくとも1個のスライダ(331a, 331b)を備え、このスライダが案内要素(331a,331b′)上で摺動 可能に案内され、少なくとも一方のスライダ(331a,331b)が回転可能 に支承された閂(333a,333b)に枢着され、この閂が、特にトグルレバ ーとして作用する送り棒(324a,324b)によって開始される、箱(1) の鎖錠スリット(11a,11b)の方への錠止要素(321a,321b)の 直線的な摺動運動を、回転点(304)の回りに行われる、閂(333a,33 3b)の特にくちばし状端部(333a′,333b′)の回転運動に変換し、 この回転運動によって箱底(2)が箱(1)内で鎖錠されることを特徴とする請 求の範囲第1項の装置。 10.各々1個のヒンジ(212a,212b;312a,312b)を介して 揺動円板(25)に枢着された送り棒(24a,24b;324a,324b) が、箱(1)内での箱庭(2)の鎖錠を行うその運動時に、ヒンジ(212a, 212b;312a,312b)の死点を越えて移動させられることを特徴とす る請求の範囲第8項または第9項の装置。 11.クリーンルーム(100)のための通気装置(200)が設けられ、この 通気装置によって、クリーンルーム(100)内に収容された基板(102)の 周りを流れる清浄空気流れ(RL)がクリーンルームに供給可能であり、この清 浄空気(RL)がクリーンルーム(100)に収容された少なくとも一つの基板 (102)を流過した後でクリーンルーム(100)から排出可能であることを 特徴とする請求の範囲第1項の装置。 12.クリーンルーム(100)に統合された通気装置(200)が、クリーン ルーム(100)を流過する清浄空気流れ(RL)を排出するための通気ユニッ ト(212)を備えていることを特徴とする請求の範囲第11項の装置。 13.クリーンルーム(100)を流過する清浄空気流れ(RL)を安定化する ための格子要素(203)がクリーンルーム(100)内に設けられていること を特徴とする請求の範囲第11項の装置。 14.清浄空気流れ(RL)の方向が、周りを清浄空気が流れる基板(102) の表面に対して平行であることを特徴とする請求の範囲第11項の装置。 15.清浄空気流れ(RL)が、基板(102)を収容するクリーンルーム(1 00)の部分(100a)を流過した後で、クリーンルーム(100)に統合さ れた昇降装置(5)へ案内されることを特徴とする請求の範囲第11項の装置。 16.クリーンルーム(100)の格子要素(203)が、清浄空気流れ(RL )の流れ方向において昇降装置(5)の手前に配置されていることを特徴とする 請求の範囲第13項および第15項の装置。 17.スルースゲート(4)を降ろす昇降装置が、駆動されるねじスピンドル( 163)によって昇降方向(Z)に移動可能なキャリッジ(162)を備え、こ のキャリッジの支持アーム(164)がスルースゲート(4)に作用しているこ とを特徴とする請求の範囲第15項の装置。 18.基板固定装置(105,106)が箱(1)の中に設けられていることを 特徴とする請求の範囲第1項の装置。 19.基板固定装置が箱底(2)と協働する鋏状伸縮格子(105)を備え、こ の鋏状伸縮格子によって、箱底(2)の持上げ運動が、鋏状伸縮格子(105) に連結された押しつけ帯片(106)の、カセット(101)内に収容された基 板(102)に対する押しつけ運動に変換されることを特徴とする請求の範囲第 18項の装置。 20.基板を含むカセット(101)を収容するための箱(1)を備えた、クリ ーンルーム(100)に基板を移すための装置において、クリーンルーム(10 0)用の通気装置(200)が設けられ、この通気装置によって、クリーンルー ム(100)内に収容された基板(102)の周りを流れる清浄空気流れ(RL )がクリーンルームに供給可能であり、この清浄空気(RL)がクリーンルーム (100)に収容された少なくとも一つの基板(102)を流過した後でクリー ンルーム(100)から排出可能であることを特徴とする装置。 21.クリーンルーム(100)に統合された通気装置(200)が、クリーン ルーム(100)を流過する清浄空気流れ(RL)を排出するための通気ユニッ ト(212)を備えていることを特徴とする請求の範囲第20項の装置。 22.クリーンルーム(100)を流過する清浄空気流れ(RL)を安定化する ための格子要素(203)がクリーンルーム(100)内に設けられていること を特徴とする請求の範囲第21項の装置。 23.清浄空気流れ(RL)の方向が、周りを清浄空気が流れる基板(102) の表面に対して平行であることを特徴とする請求の範囲第22項の装置。 24.清浄空気流れ(RL)が、基板(102)を収容するクリーンルーム(1 00)の部分(100a)を流過した後で、クリーンルーム(100)に統合さ れた昇降装置(5)へ案内されることを特徴とする請求の範囲第20項の装置。 25.クリーンルーム(100)の格子要素(203)が、清浄空気流れ(RL )の流れ方向において昇降装置(5)の手前に配置されていることを特徴とする 請求の範囲第24項の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4207341A DE4207341C1 (ja) | 1992-03-09 | 1992-03-09 | |
DE4207341.3 | 1992-03-09 | ||
PCT/EP1992/002931 WO1993018543A2 (de) | 1992-03-09 | 1992-12-17 | System zum einschleusen von substraten in reinsträume |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07504536A true JPH07504536A (ja) | 1995-05-18 |
JP3244505B2 JP3244505B2 (ja) | 2002-01-07 |
Family
ID=6453534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51527193A Expired - Lifetime JP3244505B2 (ja) | 1992-03-09 | 1992-12-17 | 基板をクリーンルームに移す装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5628683A (ja) |
EP (2) | EP0805480B1 (ja) |
JP (1) | JP3244505B2 (ja) |
KR (1) | KR950700607A (ja) |
AT (2) | ATE177876T1 (ja) |
DE (3) | DE4207341C1 (ja) |
WO (1) | WO1993018543A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021118A (ja) * | 2011-07-11 | 2013-01-31 | Toshiba Corp | ウェハ搬送容器保護ケース |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4425208C2 (de) * | 1994-07-16 | 1996-05-09 | Jenoptik Technologie Gmbh | Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
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-
1992
- 1992-03-09 DE DE4207341A patent/DE4207341C1/de not_active Expired - Fee Related
- 1992-12-17 US US08/295,678 patent/US5628683A/en not_active Expired - Lifetime
- 1992-12-17 DE DE59209948T patent/DE59209948D1/de not_active Expired - Fee Related
- 1992-12-17 WO PCT/EP1992/002931 patent/WO1993018543A2/de active IP Right Grant
- 1992-12-17 AT AT93901038T patent/ATE177876T1/de not_active IP Right Cessation
- 1992-12-17 AT AT97111117T patent/ATE214518T1/de not_active IP Right Cessation
- 1992-12-17 DE DE59209659T patent/DE59209659D1/de not_active Expired - Fee Related
- 1992-12-17 EP EP97111117A patent/EP0805480B1/de not_active Expired - Lifetime
- 1992-12-17 EP EP93901038A patent/EP0630520B1/de not_active Expired - Lifetime
- 1992-12-17 JP JP51527193A patent/JP3244505B2/ja not_active Expired - Lifetime
-
1994
- 1994-09-09 KR KR1019940703152A patent/KR950700607A/ko not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013021118A (ja) * | 2011-07-11 | 2013-01-31 | Toshiba Corp | ウェハ搬送容器保護ケース |
TWI498261B (zh) * | 2011-07-11 | 2015-09-01 | Toshiba Kk | Wafer transfer container protection box |
Also Published As
Publication number | Publication date |
---|---|
ATE214518T1 (de) | 2002-03-15 |
EP0805480B1 (de) | 2002-03-13 |
KR950700607A (ko) | 1995-01-16 |
US5628683A (en) | 1997-05-13 |
EP0630520B1 (de) | 1999-03-17 |
EP0805480A2 (de) | 1997-11-05 |
EP0630520A1 (de) | 1994-12-28 |
DE59209659D1 (de) | 1999-04-22 |
JP3244505B2 (ja) | 2002-01-07 |
WO1993018543A2 (de) | 1993-09-16 |
DE59209948D1 (de) | 2002-04-18 |
WO1993018543A3 (de) | 1993-10-28 |
EP0805480A3 (de) | 1997-12-10 |
DE4207341C1 (ja) | 1993-07-15 |
ATE177876T1 (de) | 1999-04-15 |
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