JPH0749731Y2 - フレキシブル基板の接続構造 - Google Patents
フレキシブル基板の接続構造Info
- Publication number
- JPH0749731Y2 JPH0749731Y2 JP1986033447U JP3344786U JPH0749731Y2 JP H0749731 Y2 JPH0749731 Y2 JP H0749731Y2 JP 1986033447 U JP1986033447 U JP 1986033447U JP 3344786 U JP3344786 U JP 3344786U JP H0749731 Y2 JPH0749731 Y2 JP H0749731Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- anisotropic conductive
- flexible substrate
- solder plating
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 39
- 238000007747 plating Methods 0.000 claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000002245 particle Substances 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 239000010408 film Substances 0.000 description 32
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986033447U JPH0749731Y2 (ja) | 1986-03-07 | 1986-03-07 | フレキシブル基板の接続構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986033447U JPH0749731Y2 (ja) | 1986-03-07 | 1986-03-07 | フレキシブル基板の接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62145288U JPS62145288U (en, 2012) | 1987-09-12 |
JPH0749731Y2 true JPH0749731Y2 (ja) | 1995-11-13 |
Family
ID=30841065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986033447U Expired - Lifetime JPH0749731Y2 (ja) | 1986-03-07 | 1986-03-07 | フレキシブル基板の接続構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0749731Y2 (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7444593B2 (ja) * | 2019-12-13 | 2024-03-06 | シャープ株式会社 | 表示装置、表示装置の製造方法およびプリント配線基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5939418U (ja) * | 1982-09-03 | 1984-03-13 | 日本ビクター株式会社 | 選択回路 |
JPS60236469A (ja) * | 1984-05-09 | 1985-11-25 | アルプス電気株式会社 | 電気素子の端子接続方法 |
-
1986
- 1986-03-07 JP JP1986033447U patent/JPH0749731Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62145288U (en, 2012) | 1987-09-12 |
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