JPH0747862Y2 - Displayed multilayer ceramic electronic components - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a laminated ceramic electronic component with a display in which mounting defects on a substrate and cracks from the surface are small.

[Prior Art] Conventionally, in a laminated ceramic electronic component formed by stacking thin ceramic sheets having a thickness of several μm to several tens of μm, a display symbol for distinguishing the product type and a plurality of terminals is a ceramic mark on the outer surface of the component. It was attached to the surface.

In the prior art, the display-integrated multilayer ceramic electronic component is generally manufactured as follows. First, a plurality of ceramic sheets on which electrodes and the like are formed are laminated in a predetermined order, and a ceramic sheet having a display symbol formed on the surface thereof is laminated at a position to be a surface layer of these sheet layers. Next, these laminated sheets were pressure-bonded, and the pressure-bonded body was fired to manufacture.

The display symbol is printed on a ceramic green sheet before firing by using ceramic pastes having different color tones, and this printed portion is simultaneously fired and fixed during firing of the ceramic member.

However, in the above-mentioned conventional multilayer ceramic electronic component, since the display is printed on the surface of the ceramic sheet located on the surface layer, the printed display symbol is a convex surface which is one step higher than the peripheral portion. Therefore, when mounting the component on a board or the like, a mounting defect often occurs. This is because, when a component is moved by vacuum suction onto the mounting head of the mounting machine, if a printed symbol A as shown in FIG. This is because it does not come into close contact with, and is in a floating state as shown in FIG. 6, so that air leakage occurs at that portion, causing adsorption failure. In addition, if the display is printed on the ceramic on the surface of the component that is directly affected by external force, cracks (8 in FIG. 7) easily occur from the edge of this printed portion to the inside of the component, and cracks during mounting or It was one of the causes of chipping.

[Problems to be Solved by the Invention] The present invention solves the problems of the above-mentioned conventional techniques, and provides a multilayer ceramic electronic component with a display in which mounting defects on a substrate or the like and occurrence of cracks from the component surface are significantly reduced. Is intended.

[Means and Actions for Solving the Problems] The above problem is the appearance of a laminated ceramic electronic component with a display characterized in that various display symbols indicating a product type and the like are formed at an internal position where they can be clearly identified through a thin ceramic layer. Solved by.

The multilayer ceramic electronic component with display of the present invention has a thickness of several μ
An electronic component that is made by stacking thin ceramic sheets of about m to several tens of μm, and the sheet on which a display symbol for distinguishing the product type and a plurality of terminals is printed at the time of stacking corresponds to the layer next to the surface layer. It is manufactured by stacking and press-bonding it at the position to be fired and firing it. Further, the above-mentioned display symbol is baked and fixed at the same time when the pressure-bonded body is baked.

The multilayer ceramic electronic component with display of the present invention has a thickness of several μ
Since a thin ceramic sheet of about m to several tens of μm is used, even if one ceramic green sheet is overlaid on the printed ceramic sheet, the display should be clearly confirmed after pressure bonding and firing. You can

The laminated ceramic electronic component with a display of the present invention has a structure in which the printed ceramic sheet is placed under the unprinted ceramic green sheet to eliminate the unevenness of the printed display exposed on the surface of the component. The surface became smooth. Therefore, the mounting machine used for mounting the component on the substrate moves the component securely by vacuum suction, so that the mounting failure is significantly reduced. Moreover, since the unevenness of the component surface which is directly affected by the external force is eliminated, cracks generated from the component surface are reduced. As a result, the cracks and chips of the components that occur during mounting on the board are significantly reduced, and the mounting yield is significantly improved.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention is not limited by the following embodiments.

[Example] A multilayer ceramic capacitor with a display, which is one of the multilayer ceramic electronic components with a display of the present invention, will be described as an example with reference to FIGS. 1, 2, 3, and 4.

FIG. 1 and FIG. 2 show a monolithic ceramic capacitor with a display, which is individually cut to form external electrodes. FIG. 3 shows how to stack the ceramic sheets. Fourth
The figure shows the types of ceramic sheets used in this example.

In the figure, 1 is an external electrode and 2 is an internal electrode. 3 is a display printed on the ceramic green sheet. Reference numeral 4 is a ceramic green sheet, and 5 is a ceramic sheet on which the display 3 is printed. Reference numerals 6 and 7 are ceramic sheets on which internal electrodes A pattern and B pattern are formed.

An example of a multilayer ceramic capacitor with a display, which is one of the multilayer ceramic electronic components with a display of the present invention, whose side sectional view and perspective view are shown in FIGS. 1 and 2, respectively, has the following configuration. The ceramic green sheet is made into a chiller by mixing a ceramic dielectric material containing TiO ₂ as a main component with an organic vehicle consisting of polyvinyl butyral and an organic solvent, and then forming it to a thickness of 45 μm using a reverse coater to a predetermined size. It was cut into. Also on the sheet
The ceramic sheets 6 and 7 are obtained by printing the internal electrodes 2 with patterns A and B using Pd paste. Further, a ceramic sheet 5 with a display is formed by screen-printing the display 3 on the ceramic green sheet using a printing paste. The printing paste is a ceramic powder obtained by adding 10 wt% of Mn ₃ O ₄ to TiO ₂ and an organic vehicle composed of ethyl cellulose and terpineol, and kneaded.

The four types of ceramic sheets shown in the plan view in FIG. 4 are stacked in the order shown in FIG. At that time, the ceramic sheet 5 with the display is located in the layer next to the surface layer. The ceramic sheets stacked in this order are thermocompressed and then heated at 1250 ° C for 2
It is manufactured by sintering for a period of time and applying external electrodes thereto.

The display of the laminated ceramic capacitor with a display of this example could be clearly confirmed. Further, since the surface of the capacitor is formed smooth, problems such as defects, cracks, and chips during mounting on the substrate are significantly reduced as compared with the prior art.

[Advantages of the Invention] By using the laminated monolithic ceramic electronic component of the present invention, defective mounting on the substrate and cracks from the component surface, which were caused by irregularities on the component surface, do not occur, and the mounting yield is remarkably high. Improved.

In addition, the multilayer ceramic electronic component with a display of the present invention can be manufactured very easily because the cost and manufacturing method thereof are not significantly different from those of the prior art.

[Brief description of drawings]

1 and 2 show a monolithic ceramic capacitor which is one embodiment of a monolithic ceramic electronic component with display according to the present invention. FIG. 1 is a side sectional view of the monolithic ceramic capacitor, and FIG. It is the same perspective view. FIG. 3 is a perspective view showing the order in which four types of ceramic sheets used in this embodiment are stacked. FIG. 4 is a plan view showing four types of ceramic sheets used in this example. FIG. 5, FIG. 6 and FIG. 7 are display type laminated ceramic capacitors manufactured by a conventional technique, and FIG. 5 and FIG. 6 are plan views and side views showing adsorption of laminated ceramic capacitors by a mounting machine. FIG. FIG. 7 is a side sectional view showing a crack generated from an edge portion of a printed display of a laminated ceramic capacitor with a display. Explanation of symbols 1 ... External electrode 2 ... Internal electrode 3 ... Display 4 ... Ceramic green sheet 5 ... Displayed ceramic sheet 6 ... Ceramic sheet on which internal electrode A is formed 7 ... Internal electrode B is formed Ceramic sheet 8 …… Crack 9 …… Mounting head of mounting machine 10 …… Air flow 11 …… Mounting head contact part of mounting machine

Claims (1)

[Scope of utility model registration request] 1. A monolithic ceramic electronic component with a display, wherein various display symbols are integrally fired and baked together with a ceramic member at an internal position that can be clearly identified through a thin ceramic layer having no unevenness on the surface.