JPH09135105A - Manufacture of laminated chip parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture laminated chip parts whereby the variation in printing quality of a character or a symbol is reduced, thinning and stripping-off are not caused during handling and an adsorption mistake cased by ruggedness on the surface of the parts for character or the symbol at the time of handling in an automatic mounting machine. SOLUTION: Multiple green sheets are laminated and integrally pressed. The obtained laminated block is cut and divided into each chip and calcined to obtain the laminated chip parts. Before calcining, a printing process for printing the character or the symbol incidating a product number of a marker, etc., on the surface and a press process for pressing the part of the printed character or the sign so as to execute fill-up for the portion of the height of the character or the sign in the laminated block and straightening the surface are included. There are two methods, printing on the green sheets and printing on the laminated block where laminated process is executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated chip part having a surface on which characters or symbols indicating a product number, a marker, etc. are printed. More specifically, the present invention relates to a method of manufacturing a laminated chip component in which necessary characters or symbols are printed on the surface before firing, and then the characters or symbols are embedded in a laminated block by pressurizing to flatten the surface. It is a thing. This technique is not particularly limited, but is useful for, for example, a surface mount type laminated dielectric filter incorporated in an automobile telephone, a mobile telephone, etc. used in the microwave band.

[0002]

2. Description of the Related Art As is well known, with the miniaturization of electronic equipment, further miniaturization of electronic components incorporated therein is required, and various surface-mountable multilayer chip components have been developed. This is manufactured by a process in which a large number of ceramic green sheets (unfired sheets) are laminated in a predetermined order, pressure-bonded and integrated, and then the obtained laminated block is cut into individual chips and fired. To do.

For example, even in a dielectric filter, a laminated structure is partially used. For its manufacture, a large number of dielectric green sheets are laminated, and a dielectric green sheet in which a large number of internal conductor patterns are regularly arrayed vertically and horizontally on the surface so as to be sandwiched between them when laminated is incorporated. A method in which a dielectric green sheet having an outer surface ground pattern is arranged on the outer layer, pressure-bonded and integrated, and cut vertically and horizontally to separate each dielectric chip, and a necessary conductive material is attached to the side surface of the chip for firing. Has been adopted.

FIG. 5 shows an example of the structure of a two-stage interdigital laminated dielectric filter. In addition to a simple dielectric sheet (dielectric sheet not having a conductor pattern) 10, a dielectric sheet 12 having a resonator conductor pattern printed on its surface by screen printing using a conductive paste
A dielectric sheet 14 having an outer surface ground pattern printed on its entire surface, a dielectric sheet 16 having both an outer surface ground pattern 15a and two input / output electrode patterns 15b insulated from it, and a load if necessary. A dielectric sheet 18 or the like on which a capacitance pattern is printed is prepared. The dielectric sheet 12 on which the conductor pattern in the resonator is printed is arranged in the center, and the required number of simple dielectric sheets 10 are laminated on both sides.
Further, the dielectric sheet 18 on which the load capacitance pattern is formed is placed, and the necessary number of the simple dielectric sheets 10 are laminated,
The dielectric sheet 14 having the outer surface ground pattern formed thereon is arranged on the uppermost layer, and the dielectric sheet 16 having the outer surface earth pattern and the input / output electrode pattern formed thereon is arranged on the lowermost layer, and they are pressure-bonded to be integrated. The lowermost dielectric sheet 16 is laminated so that the outer surface ground pattern and the input / output electrode pattern appear on the outer surface (lower surface in FIG. 5). After that, the outer surface ground conductor 20 and the input / output terminal 2 are provided on the side surface of the chip.
A laminated dielectric filter 24 is obtained by applying a conductive material of 2 and baking it.

In this example, the in-resonator conductor pattern is a step impedance type, and the open end portion is made wide to suppress the harmonic components of the second and third harmonics. In addition, the load capacitance pattern serves to shorten the length of the conductor in the resonator by adding the load capacitance.

As described above, in the method of manufacturing such a laminated dielectric filter, usually, a dielectric green sheet having a large area is used so that a large number can be obtained.
A method is adopted in which a necessary pattern is formed and integrated by pressure bonding, and the obtained laminated block is cut lengthwise and widthwise to be separated into individual chips and fired.

By the way, in such a laminated chip component,
It is necessary to display on the surface a letter indicating the product number or a symbol such as a marker indicating the orientation when the product is attached. Therefore, characters or symbols are formed by the following method. The first method, as shown in FIG. 3A, is a method of stamping characters or symbols indicating a product number or a marker on the surface of the baked product. That is, a large number of green sheets are laminated in a laminating step, they are pressure-bonded and integrated in a pressing step, they are separated into individual chips in a cutting step, and then fired in a firing step to obtain a laminated chip component. This is a method of printing necessary characters or symbols on the surface of the fired laminated chip component by a stamp method or the like. The second method is
As shown in FIG. 3B, this is a method of stamping a character or symbol indicating a product number or a marker on the surface of the cut chip. That is, in the cutting step as in the first method,
The chips are separated into individual chips, and at this stage, necessary characters or symbols are printed on the chip surface by a stamping method or the like. Then, it is a method of obtaining a laminated chip component by firing in a firing step. The third method is a method of printing characters or symbols indicating a product number or a marker on the surface of the laminated block before cutting. As shown in FIG. 3C, a large number of green sheets are laminated in a laminating step and are pressed and integrated in a pressing step to form a laminated block. At this stage, the required characters or symbols are printed on the surface of the obtained laminated block. After that, it is a method of separating into individual chips in a cutting step and firing in a firing step to obtain a laminated chip component.

[0008]

In any case, the laminated chip component manufactured by the conventional method has a printed character or symbol (indicated here by the character "A") as shown in FIG. 32 is formed so as to rise from the surface of the laminated chip component 30. FIG. 4B shows the X ₁ -X ₂ cross section of FIG. In FIG. 4, the height of the character or symbol portion 32 is exaggerated in order to make the drawing easy to understand. However, since such unevenness exists on the surface of the laminated chip component, there is a problem that a suction error is likely to occur when the laminated chip component is handled by an automatic mounting machine. In an automatic mounter, components are often sucked and transferred by a vacuum suction type suction head, but if there are irregularities on the component surface, air leakage occurs and reliable holding / conveying cannot be performed.

The first method for stamping a fired laminated chip part or the second method for stamping a cut chip requires a lot of man-hours for stamping on a chip-by-chip basis, and the quality of printed characters or symbols. There is a drawback that there are large variations. Furthermore, the third method of cutting and firing after printing is that the printed characters or symbols formed by being raised from the surface of the laminated block are rubbed or peeled off while being handled in the next cutting step or firing step. It may fall, and product quality may be impaired.

The object of the present invention is that the variation in print quality of characters or symbols is small, blurring or peeling does not occur during handling, and adsorption due to unevenness of the component surface due to characters or symbols when handled by an automatic mounting machine. It is an object of the present invention to provide a method of manufacturing a layered chip component that does not cause mistakes.

[0011]

SUMMARY OF THE INVENTION The present invention is directed to a laminated chip component in which a large number of green sheets are laminated, pressure-bonded and integrated, and the obtained laminated block is cut into individual chips and fired. It is a manufacturing method. Here, the features of the present invention are as follows.
Before firing, a printing process that prints letters or symbols indicating the product number or marker on the surface, and then press the printed letters or symbols (before firing, of course) to increase the height of the letters or symbols in the laminated block. The point is that it includes a pressing step of filling the surface by a certain amount to flatten the surface.

Specifically, there are a method of printing on a green sheet and a method of printing on a laminated block that has undergone a laminating step. Since the method of printing on the green sheet undergoes a pressing process in which a large number of laminated green sheets are pressed and integrated by pressure, the characters or symbols printed in the pressing process are embedded in a laminated block to flatten the surface. can do. Further, in the case of printing characters or symbols on the surface of the laminated block, another press step for embedding the printed characters or symbols in the laminated block and flattening the surface is then provided. Note that the character or symbol portion is usually heated to 900 ° C. or higher, and therefore it is preferably formed using a ceramic paste or the like.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION In the printing step before firing, characters or symbols indicating a product number or a marker are printed on the surface. The printed letter or symbol portion is thoroughly dried of the ink before the subsequent pressing step. By pressurizing in the subsequent pressing process, the portion of the character or symbol that is printed and raised is embedded by the height, and as a result, the upper surface of the character or symbol portion is flush with other portions that are not printed. As a result, the surface becomes flat. Since these steps can be performed before the chips are separated into individual chips, a large number of chips can be simultaneously processed, which is a method suitable for mass production.

The ink used in the present invention is selected from materials capable of withstanding the firing temperature received in the firing step (for example, about 900 ° C. or higher in the case of a laminated dielectric filter). For example, a material of the same type as the glaze used for the pottery may be used. When printing on the green sheet on which the outer conductor pattern is formed, a material is selected so that bleeding does not easily occur when printed on the dry film of the silver paste used for forming the outer conductor pattern. In particular, when printing on a green sheet instead of printing at the layered block stage, a sheet attack (the solvent of the ink penetrates into the green sheet to perforate the green sheet or swell the green sheet) Therefore, select a solvent that does not cause such a situation.

The laminated chip component is sucked by a suction head of an automatic mounting machine and attached to a substrate. Since the laminated chip component obtained by the method of the present invention is flattened without unevenness due to printing on the surface, air leakage does not occur during adsorption and no grip failure occurs. In other words, trouble is unlikely to occur during mounting work. Further, since the product number and the like are displayed in the process in the middle of manufacturing, it can be distinguished from other products and can be checked by an image processing device or the like. Furthermore, since the printed characters or symbols are embedded, they are resistant to rubbing during handling, and there is no risk of the printed characters being scratched or peeled off during the manufacturing process or during handling, and there is no damage or contamination. It is especially effective for

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a process explanatory view showing an example of a method of manufacturing a laminated chip part according to the present invention. In the printing process, characters or symbols indicating a product number or a marker are printed on the outer surface of the green sheet located in the outermost layer. When an external conductor pattern or the like is formed on the printed surface, characters or symbols indicating a product number or a marker are printed on the external conductor pattern. Next, in the laminating step, a large number of green sheets are laminated in an appropriate order. For example, in the case of manufacturing a laminated dielectric filter, a large number of dielectric green sheets are laminated, and the dielectric green sheet having an internal conductor pattern formed so as to be sandwiched between them is incorporated in a predetermined position to form an outermost layer. A dielectric green sheet having an outer ground pattern is to be placed on. Next, a large number of the laminated green sheets are pressed together in a pressing process to be pressure-bonded and integrated, and the raised character or symbol portion is embedded by the height to flatten the surface. In the cutting step, the obtained laminated block is cut lengthwise and breadthwise into individual chips. At this stage, a conductive material is attached to the side surface of the chip if necessary. This is the case, for example, when forming an input / output terminal or forming a necessary outer surface ground pattern. Finally, in the firing step, the cut chips are fired. Through these steps, it is possible to manufacture a laminated chip component with a letter or symbol indicating a product number, a marker, or the like.

The product number of a product is described by letters (usually alphabets and numbers). The marker is a circle or the like that is attached to indicate the orientation when the laminated chip component is mounted. The ink used here has a chip firing temperature (for example, 900
It is an electrically insulating material such as a ceramic paste that can withstand (above ℃). For example, it may be of the same type as that used as a glaze for ware. The color of the ink is appropriately selected according to the color of the surface of the component, but since the external earth conductor coating formed by baking silver paste is white, it is black or the like when it is formed on it. You can use the ink. However, it is necessary to select a material that is unlikely to cause bleeding when a silver paste is applied and printed on a dried film. It is also desirable to use a material that is hard to peel off. In this method, in order to print on the green sheet, the ink may cause a sheet attack, so that it is necessary to select a solvent that does not cause a sheet attack.

FIG. 1B shows the steps of another embodiment of the method of the present invention. First, a large number of green sheets are laminated in the laminating step, and are pressed and integrated by pressure in the first pressing step. In this way, a laminated block is obtained. Next, in a printing step, characters or symbols indicating a product number or a marker are printed on the surface of the laminated block. The process up to this point may be the same as the conventional technique. Then, in the second pressing step, the laminated block is pressed again, and the printed character or symbol portion is embedded in the laminated block by the height thereof. After that, as in the case of the first embodiment, in the cutting step, the laminated block is cut in the vertical and horizontal directions to be separated into individual chips, and the chips are baked in the baking step.

The ink and the like used may be the same as in the case of the first embodiment. According to this method, printing is performed on the surface of the laminated block which is pressure-bonded and integrated in the first pressing step, so that sheet attack hardly occurs and the degree of freedom in selecting a solvent is large. Although the pressing step is required twice, the second pressing step does not add such a troublesome step because the raised character or symbol portion is simply pushed into the laminated block.

FIG. 2 shows the laminated chip component finally obtained by the method of the present invention. The portion 32 of the printed character or symbol (denoted here by using the character “A”) is embedded in the pressing process, so that the surface of the laminated chip component 30 is completely flattened. (B) in FIG. 2 represents the X ₃ -X ₄ section of the FIG. 2 (a). In addition, in FIG. 2, in order to make the drawing easy to understand, a portion 14 of a character or a symbol is shown.
Is exaggerated in height.

The present invention is applicable not only to the above-mentioned laminated dielectric filter but also to a laminated capacitor, laminated inductor and VC.
Needless to say, the present invention can be applied to various multilayer chip components such as O, RF switch substrates, composite module substrates, and the like.

[0022]

As described above, according to the present invention, characters or symbols indicating a product number or a marker are printed on the surface before firing,
Since the printed character or symbol portion is embedded in the pressing process to flatten the surface, a laminated chip component that can be reliably sucked and held by a suction head or the like can be obtained. In the present invention,
Since the printed characters or symbols are embedded, even if the surface is rubbed during the subsequent cutting or baking process or during handling, the printed part will not be scratched or peeled off, and high product quality can be maintained. . Further, since the printed characters or symbols are printed, they have excellent heat resistance and solvent resistance. Further, in this method, since the product number or the like is already displayed in the process in the middle of manufacturing, it can be easily distinguished from other products in the middle of manufacturing, and can be easily checked by an image processing device or the like.

[Brief description of the drawings]

FIG. 1 is a process explanatory view showing an embodiment of a manufacturing method according to the present invention.

FIG. 2 is an explanatory view showing an example of a laminated chip part manufactured by the method of the present invention.

FIG. 3 is a process explanatory diagram of a conventional technique.

FIG. 4 is an explanatory view showing an example of a layered chip component manufactured by a conventional method.

FIG. 5 is an exploded perspective view showing a structural example of a laminated dielectric filter.

[Explanation of symbols]

 30 Multilayer chip component 32 Printed characters or symbols

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Claims (4)

[Claims] 1. A method of manufacturing a laminated chip component, comprising laminating a plurality of green sheets, press-bonding them together, cutting the obtained laminated block to separate the chips into individual chips, and firing them. A printing step for printing characters or symbols indicating a product number or a marker on the surface, and a pressing step for flattening the surface by subsequently embedding a portion of the printed characters or symbols under pressure into the laminated block. Method for manufacturing laminated chip component. 2. A printing step of printing a letter or a symbol indicating a product number or a marker on the outer surface of the outermost green sheet, a stacking step of stacking a number of green sheets, and a pressure-bonding integral operation of the stacking step. The step of pressing and embedding the printed characters or symbols to flatten the surface, the step of cutting the obtained laminated block to separate it into individual chips, and firing the separated chips A method for manufacturing a laminated chip component, comprising a firing step. 3. A lamination step of laminating a large number of green sheets, a first pressing step of pressurizing the green sheets to integrate them, and a letter or a symbol indicating a product number or a marker is printed on the surface of the obtained laminated block. A second press step of embedding a printed character or symbol portion in a laminated block to flatten the surface, and a cutting step of cutting the laminated block and separating it into individual chips. A method of manufacturing a laminated chip component, comprising a firing step of firing the separated chips. 4. The method for manufacturing a laminated chip component according to claim 1, wherein the letter or symbol portion is formed of an electrically insulating material.