JPH0745945B2 - Clean room underfloor two-layer structure - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an underfloor two-layer structure of a clean room, and particularly to an underfloor two-layer structure of a clean room suitable for a clean room such as a semiconductor manufacturing factory.

[Conventional technology]

Since semiconductor manufacturing requires a dust-free environment, the manufacturing is usually performed in a clean room. In a clean room, clean air is blown into the clean room through a HEPA (high performance) filter installed on the ceiling surface, the air in the room is sucked from the floor surface with a ventilation structure, and air is circulated through the HEPA filter on the ceiling surface again. The method is adopted and clean air is downflowed (laminar flow) in the room. Further, in the underfloor chamber having the aeration structure, process devices such as a pump, a storage tank, and a cylinder for supplying a chemical liquid and gas to the semiconductor manufacturing equipment in the clean room and discharging a used chemical liquid are arranged. If these process devices are placed in a clean room, dust will be generated by their operation, so they should be placed in a chamber under the floor of the clean room as much as possible, and necessary chemicals and gases should be sent to manufacturing equipment in the clean room by piping. . As a result, it is possible to effectively use the floor of the clean room (minimize the equipment installation area on the floor of the clean room), utilize the space under the floor, and reduce dust generation in the clean room.

[Problems to be solved by the invention]

However, in the case of the conventional clean room structure, the air that has been downflowed into the underfloor chamber collides with the process device provided in the underfloor chamber, so that an unbalanced air flow may occur in the underfloor chamber.

Or, by self-heating of each of the process equipment,
The down-flowed air may be adversely affected, and an unbalanced air flow may be generated in the underfloor chamber. When these unbalanced airflows became strong, there was a case where the downflow in the upper room through the grating floor was adversely affected.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an underfloor double structure for a clean room that eliminates uneven airflow and makes the air flow in the room uniform.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention supplies air in the ceiling room of a clean room into a clean room through a high-performance filter, sucks air in the clean room to an underfloor chamber through a grating floor, and air in the underfloor chamber. In a clean room where air is sucked and exhausted and supplied again to the ceiling chamber, the underfloor chamber is divided into two layers by a perforated plate, and air in the upper chamber is sucked and exhausted and supplied to the ceiling chamber. A device such as a pump is arranged in the lower chamber and the air in the lower chamber is sucked and exhausted to remove heat and dust generated by the device and supplied to the ceiling chamber for use. And

[Action]

According to the present invention, the underfloor chamber of a clean room is divided into two layers by a perforated plate. Then, the air in the upper chamber is sucked and discharged toward the high-performance filter, and a device such as a pump is arranged in the lower chamber. As a result, the air downflowed into the upper chamber will not be adversely affected,
The air flow in the room can be made uniform. Further, the heat generated from equipment such as a pump in the lower chamber is sucked and removed.

〔Example〕

Hereinafter, a preferred embodiment of an underfloor two-layer structure of a clean room according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view of an underfloor two-layer structure of a clean room according to the present invention.

The ceiling room 12 of the clean room 10 is provided with a ventilation port 14 on the right side surface, and the circulating air is supplied to the ceiling room 12 through the ventilation port 14. In addition, the ceiling room 12 has multiple HEPA (high performance)
The filters 16 and 16 are arranged, and the air in the ceiling chamber 12 is HEPA.
It is sent to room 20 through the filters 16, 16.

On the other hand, a plurality of pillars 26, 26 ... Are erected on the foundation floor 27, and the pillars 26, 26 ..
Is laid and an underfloor chamber is formed. The underfloor chamber is divided into two by a punching board 28 to form an upper layer chamber 24 and a lower layer chamber 29. A large number of ventilation holes are formed in the grating 22, and the aperture ratio of the ventilation holes can be adjusted by sliding the shutter 23 with respect to the back surface of the grating 22, and also in the punching board 28. A large number of vent holes are formed.

The air in the room 20 passes through the grating 22 and the shutter 23 and is sucked into the upper layer chamber 24 under the floor, and most of the air is sucked into the suction port 30. Further, the air that is not sucked into the suction port 30 is sucked into the lower chamber 29 through the punching board 28 and is sucked into the suction port 36. In the lower layer chamber 29, a cylinder box 32, a vacuum pump 34, etc. are appropriately arranged. The intake ports 30 and 36 are intake ducts 38
Is connected to the air conditioner 40 together with the outside air introduction duct 42 via the air conditioner 40, and the conditioned air mixed by the air conditioner 40 is supplied again to the ceiling chamber 12 via the air supply duct 46 by the blower 44 for use. .

Next, the operation of the underfloor two-layer structure of the clean room configured as described above will be described.

First, clean air is blown into the room through a plurality of HEPA filters 16, 16 ... Installed in the ceiling room 12. The air becomes a downdraft and is sucked into the underfloor grating 22.
It is sucked into the upper chamber 24.

Next, most of the air sucked into the upper chamber 24 is sucked into the suction port 30. Further, since the upper chamber 24 is not provided with a process device, the upper chamber 24
The air that has been downflowed to does not collide with the process equipment. Therefore, no unbalanced air flow is generated.

Next, the air that has not been sucked into the intake port 30 passes through the punching board 28 and is sucked into the lower layer chamber 29.
Inspired by 36. The air taken in by the intake port 36 is supplied again to the ceiling chamber 12 through the intake duct 38, the air conditioner 40, the blower 44, etc., and used.

On the other hand, when the process device disposed in the lower layer chamber 29 is operated, the air in the lower layer chamber 29 is warmed by the self-heating of the process device or receives dust, but the punching board 28 is provided, In addition, since the gas is sucked and exhausted, the upper chamber 24 is not adversely affected. Therefore, no unbalanced air flow is generated in the upper chamber 24, and the air flow in the room 20 can be made uniform.

The punching board 28 functions as a ventilation resistance (in other words, a current plate) that partitions the upper and lower parts. The presence of the punching board 28 restricts the air flow between the upper chamber 24 and the lower chamber 29, and there is no obstacle in the upper chamber 24 as shown in FIG. Exhaust is performed, and as a result, downflow can be made uniform near the floor of the clean room. As shown in FIG. 2, in the lower chamber 29, the exhaust flow is complicatedly disturbed by the action of an obstacle such as a pump and heat generation. However, since this disturbance is blocked by the punching board 28, the upper return chamber 24 is It does not affect. There is a possibility that the upward flow due to the heat generated by the pump, etc. will flow back from the punching board 28 to the upper layer.
The amount is sufficiently small as compared with the conventional underfloor chamber without the punching board 28 and can be ignored. That is, in the present invention, the shielding effect of the punching board 28 and the backflow to the upper layer by sucking and exhausting the chamber 29 of the lower layer are reduced.

The opening ratio of the ventilation hole of the grating 22 is set to the intake port 30,
The air downflow in the room 20 may be adjusted as appropriate by increasing the shutter 23 as it moves away from 36.

〔The invention's effect〕

As described above, according to the underfloor two-layer structure of the clean room according to the present invention, the underfloor chamber is divided into two-layer chambers by the perforated plate, and the air in the upper-layer chamber is sucked and supplied to the ceiling chamber for use. However, since a device such as a pump is arranged in the lower chamber, the flow of the air in the upper chamber is not adversely affected and the unbalanced air flow is not generated. Therefore, the air flow in the room can be made uniform. Further, since the air in the lower chamber is sucked and exhausted, it is possible to remove heat and dust from the devices in the lower chamber.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a clean room having a two-layer underfloor structure of a clean room according to the present invention, and FIG. 2 is a partial cross-sectional view showing a flow of air flow of the two-layer underfloor structure of a clean room according to the present invention. . 10 …… Clean room, 12 …… Ceiling room, 16 …… HEPA filter, 20 …… Room, 22 …… Grating, 24 …… Upper chamber, 28 …… Punching board, 29 …… Lower chamber, 30 …… Intake port , 32 …… cylinder box, 34 …… vacuum pump, 36 …… intake port, 38 …… intake duct.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuichi Takeuchi 1-1-14 Uchikanda, Chiyoda-ku, Tokyo Inside Hirtitsu Plant Construction Co., Ltd. (56) Reference JP-A-1-281352 (JP, A)

Claims (1)

[Claims] 1. The air in the ceiling room of a clean room is supplied into the clean room via a high performance filter, the air in the clean room is sucked into the underfloor chamber via the grating floor, and the air in the underfloor chamber is sucked and exhausted again. In a clean room used by supplying to the ceiling room, the underfloor chamber is divided into two layers by a perforated plate,
The air in the upper chamber is sucked and exhausted and supplied to the ceiling chamber for use, and the lower chamber is equipped with a device such as a pump and the air in the lower chamber is sucked and exhausted to generate heat and dust by the device. A double-layer structure under the floor of a clean room, which is used after being removed and supplied to the ceiling room.