JPH0739234Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0739234Y2
JPH0739234Y2 JP1986032787U JP3278786U JPH0739234Y2 JP H0739234 Y2 JPH0739234 Y2 JP H0739234Y2 JP 1986032787 U JP1986032787 U JP 1986032787U JP 3278786 U JP3278786 U JP 3278786U JP H0739234 Y2 JPH0739234 Y2 JP H0739234Y2
Authority
JP
Japan
Prior art keywords
electrically insulating
hole
recess
insulating substrate
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986032787U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62145337U (US06277897-20010821-C00009.png
Inventor
英二 萩本
次郎 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1986032787U priority Critical patent/JPH0739234Y2/ja
Publication of JPS62145337U publication Critical patent/JPS62145337U/ja
Application granted granted Critical
Publication of JPH0739234Y2 publication Critical patent/JPH0739234Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Die Bonding (AREA)
JP1986032787U 1986-03-07 1986-03-07 半導体装置 Expired - Lifetime JPH0739234Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986032787U JPH0739234Y2 (ja) 1986-03-07 1986-03-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986032787U JPH0739234Y2 (ja) 1986-03-07 1986-03-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS62145337U JPS62145337U (US06277897-20010821-C00009.png) 1987-09-12
JPH0739234Y2 true JPH0739234Y2 (ja) 1995-09-06

Family

ID=30839797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986032787U Expired - Lifetime JPH0739234Y2 (ja) 1986-03-07 1986-03-07 半導体装置

Country Status (1)

Country Link
JP (1) JPH0739234Y2 (US06277897-20010821-C00009.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0746709B2 (ja) * 1986-08-11 1995-05-17 イビデン株式会社 電子部品搭載用基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5836500A (ja) * 1981-08-28 1983-03-03 マックス株式会社 製図ヘッドの符号化用ディスク取付装置
JPS6218084A (ja) * 1985-07-16 1987-01-27 新藤電子工業株式会社 半導体素子実装用プリント配線板の製造方法
JPS6239032A (ja) * 1985-08-14 1987-02-20 Matsushita Electric Works Ltd 電子素子用チツプキヤリア

Also Published As

Publication number Publication date
JPS62145337U (US06277897-20010821-C00009.png) 1987-09-12

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