JPH0737305Y2 - Square chip type electronic component - Google Patents

Square chip type electronic component

Info

Publication number
JPH0737305Y2
JPH0737305Y2 JP1987089395U JP8939587U JPH0737305Y2 JP H0737305 Y2 JPH0737305 Y2 JP H0737305Y2 JP 1987089395 U JP1987089395 U JP 1987089395U JP 8939587 U JP8939587 U JP 8939587U JP H0737305 Y2 JPH0737305 Y2 JP H0737305Y2
Authority
JP
Japan
Prior art keywords
electronic component
electrodes
type electronic
square chip
chip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987089395U
Other languages
Japanese (ja)
Other versions
JPS63197327U (en
Inventor
定明 倉田
敬文 斎木
政信 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1987089395U priority Critical patent/JPH0737305Y2/en
Publication of JPS63197327U publication Critical patent/JPS63197327U/ja
Application granted granted Critical
Publication of JPH0737305Y2 publication Critical patent/JPH0737305Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【考案の詳細な説明】 [産業上の利用分野] この考案は、立方体形を呈する角チップ形電子部品に関
する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a rectangular chip-shaped electronic component having a cubic shape.

[従来の技術] 直方体を呈する角チップ形電子部品の代表的なものは積
層チップ形コンデンサである。このコンデンサは、第5
図で示すように、内部電極4を設けたセラミックシート
を複数枚積層し、これら内部電極4を、電子部品1の両
端面に設けた外部電極2、3に交互に接続したものであ
る。
[Prior Art] A typical chip-type electronic component having a rectangular parallelepiped shape is a multilayer chip-type capacitor. This capacitor is the fifth
As shown in the figure, a plurality of ceramic sheets provided with internal electrodes 4 are laminated, and these internal electrodes 4 are alternately connected to external electrodes 2 and 3 provided on both end surfaces of the electronic component 1.

[考案が解決しようとする問題点] 従来使用されている上記の角チップ形電子部品は、次の
理由から、雑然と収納されたいわゆるばら詰めのホッパ
ーから自動電子部品搭載装置を用いて円筒チップ形電子
部品と共に回路基板に搭載することが事実上できなかっ
た。
[Problems to be Solved by the Invention] The above-mentioned square chip-shaped electronic components that have been conventionally used are cylindrical chips from a so-called loosely packed hopper that is cluttered and stored using an automatic electronic component mounting device for the following reasons. It was practically impossible to mount it on the circuit board together with the electronic parts.

即ち、上記角チップ形電子部品をパイプ状のシュートb
を通して搬送する際、第6図で示すように、電子部品が
シュートbの中で傾いた状態で停止し、詰まってしまう
ことが多い。
That is, the square chip-shaped electronic component is replaced with a pipe-shaped chute b.
When it is conveyed through, as shown in FIG. 6, electronic parts often stop in a state of being tilted in the chute b and become jammed.

さらに、角チップ形電子部品がシュートaをうまく通っ
て回路基板aの上に供給できたとしても、同電子部品は
回路基板aの上で様々な方向を向く。最も理想的なの
は、第5図で示すように、接続しようとする電極c、d
の上にわたって横たわるように供給されることであり、
この状態では、両端面に設けた電極2、4を基板a上の
電極c、dに各々半田付けすることができる。しかし、
実際には第7図や第8図のような状態で搭載されること
があり、この状態では電極2、3を半田付けすることが
できない。
Further, even if the rectangular chip-shaped electronic component can pass through the chute a and be supplied onto the circuit board a, the electronic component faces various directions on the circuit board a. The most ideal is, as shown in FIG. 5, the electrodes c and d to be connected.
Is to be laid on top of,
In this state, the electrodes 2 and 4 provided on both end surfaces can be soldered to the electrodes c and d on the substrate a, respectively. But,
Actually, it may be mounted in a state as shown in FIGS. 7 and 8, and in this state, the electrodes 2 and 3 cannot be soldered.

この考案は、上記従来の問題点を解決することを目的と
する。
The present invention aims to solve the above-mentioned conventional problems.

[問題を解決するための手段] 即ち、この考案による角チップ形電子部品は、電子部品
11を立方体とし、その何れもが互いに各々別の隣接する
3面にわたって各々の電極12、13を形成したものであ
る。
[Means for Solving the Problem] That is, the square chip electronic component according to the present invention is an electronic component.
11 is a cube, and each has electrodes 12 and 13 formed on three adjacent and different surfaces.

[作用] この電子部品11は立方体であるため、第3図で示すよう
に、パイプ状のシュートbの中でどの様に傾いても、そ
のシュートbの径方向の寸法に大きな変動が無い。従っ
て、シュートbの中で電子部品が停止しにくい。
[Operation] Since this electronic component 11 is a cube, as shown in FIG. 3, no matter how it is tilted in the pipe-shaped chute b, the radial dimension of the chute b does not greatly change. Therefore, it is difficult for the electronic component to stop in the chute b.

また、電子部品11は立方体であって、かつその互いに隣
接する3面にわたって各々の電極12、13が設けられてい
るため、第4図で示すように、どの様な方向で回路基板
a上に載せられても、必ず各々の電極12、13が基板a上
の電極c、dの上にあって、同電極c、dの表面に対し
て垂直な面にある。これにより、双方の電極12、13を回
路基板aの各々の電極c、dに半田付けすることが可能
となる さらに、立方体の電子部品11の他方の電極12、13が形成
されていない各々別の3面にわたって各々の電極12、13
が形成されているので、電極c、dの幅が電子部品11に
対して多少広い場合でも、電極12、13が短絡することが
ない。
Further, since the electronic component 11 is a cube, and the electrodes 12 and 13 are provided on the three surfaces adjacent to each other, as shown in FIG. Even if they are placed, the electrodes 12 and 13 are always on the electrodes c and d on the substrate a, and are on the plane perpendicular to the surfaces of the electrodes c and d. This makes it possible to solder both electrodes 12, 13 to the respective electrodes c, d of the circuit board a. Further, the other electrodes 12, 13 of the cubic electronic component 11 are not formed respectively. Of the electrodes 12, 13 over the three surfaces of
Therefore, even if the width of the electrodes c and d is slightly wider than that of the electronic component 11, the electrodes 12 and 13 are not short-circuited.

[実施例] 次に、第1図〜第4図を参照しながら、この考案の実施
例について説明する。
[Embodiment] Next, an embodiment of the present invention will be described with reference to FIGS.

図示の実施例では、電子部品11として角形積層コンデン
サが示されている。即ち、第2図で示すように、図示の
電子部品11は内部電極14、15を有する誘電体セラミック
シート16を積層し、立方体形に形成されている。上記内
部電極14、15は電子部品11の隣接する2つの側面21、22
及び23、24に導出され、これら各面に形成された外部電
極12、13に各々接続されている。
In the illustrated embodiment, a rectangular monolithic capacitor is shown as the electronic component 11. That is, as shown in FIG. 2, the illustrated electronic component 11 is formed in a cubic shape by laminating dielectric ceramic sheets 16 having internal electrodes 14 and 15. The internal electrodes 14 and 15 are provided on two adjacent side surfaces 21 and 22 of the electronic component 11.
And 23, 24, and are connected to the external electrodes 12, 13 formed on these surfaces, respectively.

上記外部電極12、13は、電子部品11の側面21、22と23、
24の他、各々上面25と下面26に形成されている。即ち、
外部電極12が側面21、22と上面25にわたって、外部電極
13が側面23、24と下面26にわたって形成されている。換
言すると、電子部品11の頂角18を一つの角とする3つの
面21、22、25に一方の外部電極12が設けられ、上記頂角
18と対向する頂角19を一つの角とする3つの面23、24、
25に他方の外部電極13が設けられている。もちろん外部
電極12と13とは、電子部品11の各面上で他方の電極と互
いに仕切られ、絶縁されている。
The external electrodes 12 and 13 are side surfaces 21, 22 and 23 of the electronic component 11,
Besides 24, they are formed on the upper surface 25 and the lower surface 26, respectively. That is,
When the external electrode 12 extends over the side surfaces 21, 22 and the upper surface 25,
13 is formed over the side surfaces 23, 24 and the lower surface 26. In other words, one of the external electrodes 12 is provided on the three surfaces 21, 22, 25 having the apex angle 18 of the electronic component 11 as one corner,
Three faces 23, 24 with one apex angle 19 facing 18
The other external electrode 13 is provided at 25. Of course, the external electrodes 12 and 13 are separated from each other on each surface of the electronic component 11 and insulated from each other.

この電子部品11は、ばら詰めのホッパーから自動電子部
品搭載装置、いわゆるマルチマウンターを使用して第4
図で示すように回路基板aに搭載し、その電極c、dに
半田付けする。この場合、電極12と13が仕切られた部分
に半田レジスト等を塗布しておくとよい。
This electronic component 11 can be installed from a loosely packed hopper to an automatic electronic component mounting device, a so-called multi-mounter, by which a fourth
As shown in the figure, it is mounted on a circuit board a and soldered to its electrodes c and d. In this case, it is advisable to apply a solder resist or the like to the part where the electrodes 12 and 13 are partitioned.

なお、第1図〜第4図においては、説明の便宜上、電子
部品11の稜線や角が直角となるような形状が示されてい
るが、実際にはシュートbを通りやすくするため、電子
部品11の稜線や角に或る程度丸みをもたせるのが望まし
い。
1 to 4, for the sake of convenience of description, a shape in which the ridges and corners of the electronic component 11 are right angles is shown. It is desirable that the ridges and corners of 11 have some roundness.

[考案の効果] 以上説明した通り、この考案の角チップ形電子部品は、
パイプ状のシュートbで停滞しにくく、しかも配線基板
a上にどの様な姿勢で載せられてもその一対の電極12、
13を回路基板a上に対向して配置された電極c、dに半
田付けすることができる。従って、ばら詰めのホッパー
から自動電子部品搭載装置を使用して円筒チップ形電子
部品と同時に、回路基板aへの搭載が可能となる。
[Effect of the Invention] As described above, the square chip electronic component of the present invention is
The pipe-shaped chute b is less likely to stagnate, and the pair of electrodes 12, which is placed on the wiring board a in any posture,
13 can be soldered to the electrodes c and d which are arranged to face each other on the circuit board a. Therefore, it becomes possible to mount the electronic components on the circuit board a at the same time as the cylindrical chip type electronic components by using the automatic electronic component mounting device from the hoppers packed in bulk.

【図面の簡単な説明】[Brief description of drawings]

第1図はこの考案の実施例を示す角チップ形電子部品の
斜視図、第2図は同電子部品の一部断面斜視図、第3図
は同電子部品のシュート内での状態を示す断面図、第4
図は同電子部品の配線基板への搭載状態を示す斜視図、
第5図は角チップ形電子部品の従来例を示す配線基板へ
の搭載状態の一部断面斜視図、第6図は同電子部品のシ
ュート内での状態を示す断面図、第7図と第8図は同電
子部品の配線基板への搭載状態を示す斜視図である。 11……電子部品、12、13……電極、21〜24……電子部品
の側面、25……電子部品の上面、25……電子部品の下面
1 is a perspective view of a rectangular chip type electronic component showing an embodiment of the present invention, FIG. 2 is a partial sectional perspective view of the electronic component, and FIG. 3 is a sectional view showing a state of the electronic component in a chute. Figure, 4th
The figure is a perspective view showing the mounting state of the electronic component on the wiring board,
FIG. 5 is a partial cross-sectional perspective view showing a state in which a square chip electronic component is mounted on a wiring board showing a conventional example, and FIG. 6 is a cross-sectional view showing a state of the electronic component in a chute, FIGS. FIG. 8 is a perspective view showing a mounting state of the electronic component on a wiring board. 11 …… electronic parts, 12, 13 …… electrodes, 21-24 …… side surfaces of electronic parts, 25 …… top surface of electronic parts, 25 …… bottom surface of electronic parts

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】一対の電極を有する角チップ形電子部品に
おいて、該電子部品(11)を立方体とし、各々別の互い
に隣接する3面にわたって各々の電極(12)、(13)を
形成したことを特徴とする角チップ形電子部品。
1. A rectangular chip-type electronic component having a pair of electrodes, wherein the electronic component (11) is a cube, and the electrodes (12), (13) are formed over three mutually adjacent surfaces. Square chip type electronic parts characterized by.
JP1987089395U 1987-06-10 1987-06-10 Square chip type electronic component Expired - Lifetime JPH0737305Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987089395U JPH0737305Y2 (en) 1987-06-10 1987-06-10 Square chip type electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987089395U JPH0737305Y2 (en) 1987-06-10 1987-06-10 Square chip type electronic component

Publications (2)

Publication Number Publication Date
JPS63197327U JPS63197327U (en) 1988-12-19
JPH0737305Y2 true JPH0737305Y2 (en) 1995-08-23

Family

ID=30948348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987089395U Expired - Lifetime JPH0737305Y2 (en) 1987-06-10 1987-06-10 Square chip type electronic component

Country Status (1)

Country Link
JP (1) JPH0737305Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968918A (en) * 1982-10-13 1984-04-19 日立コンデンサ株式会社 Chip type electronic part

Also Published As

Publication number Publication date
JPS63197327U (en) 1988-12-19

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