JPS6314457Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to the improvement of chip-type multilayer capacitors that are directly attached to substrates such as printed wiring boards, and aims to reduce the directionality when attaching to the substrate. It is.

Most conventional chip-type multilayer capacitors have a rectangular parallelepiped shape as shown in FIG. In the figure, 1 is a laminate, and 2, 2 are external connection electrodes. When mounting this multilayer capacitor on, for example, a printed circuit board, the external connection electrodes 2, 2 are connected to the wiring electrodes 4, 4, 4, . They were to be brought into contact with each other and soldered. However, the wiring electrodes 4, 4, 4, . . . on the substrate 3 are configured as densely as possible because the substrate 3 must be made as small as possible. Therefore, the portion that becomes the electrode for attaching the multilayer capacitor is not determined, and may be located in the front-rear direction (arrow A) or in the left-right direction (arrow B) of the substrate 3. Nevertheless, conventional multilayer capacitors are formed in a rectangular parallelepiped shape and have directionality, so when mounting them on the substrate 3, the direction must be determined one by one. When using a machine, it had to be extremely difficult to control. Furthermore, even when these conventional multilayer capacitors are stacked and stored in a cylindrical magazine 5 as shown in FIG. However, it also had the disadvantage that the structure of the automatic machine was complicated.

The present invention has been made in view of the above points, and is intended to provide a chip-type multilayer capacitor with almost no directionality.

Embodiments of the present invention will be described below with reference to the drawings.
4 is a plan view of a capacitor sheet, FIG. 5 is a perspective view of a multilayer capacitor, and FIG. 6 is an exploded perspective view of FIG. 5.

11 is a dielectric sheet formed into a regular octagon, 1
Reference numeral 2 denotes a square capacitor electrode provided at the center of one plane of the sheet 11, and 13a and 13b are conductively connected to the capacitor electrode 12 and extend to a predetermined side of the dielectric sheet 11, respectively. The capacitor sheet 10 is formed by the dielectric sheet 11, the capacitor electrode 12, and the external electrodes 13a and 13b. In this case, the external extraction electrode 13
a and 13b may face either side of the dielectric sheet 11, but it is necessary that there be one empty side (the side to which no external lead-out electrode is provided) between both sides. must be granted. A chip type multilayer capacitor M as shown in FIG. 5 is constructed by stacking a plurality of such capacitor sheets 10, but the stacking of each capacitor sheet 10 can be better understood from the exploded view in FIG. I can do it. That is, the second capacitor sheet 10a is in contact with the first capacitor sheet 10a.
In the capacitor sheet 10b, the two external lead-out electrodes 13a' and 13b' are connected to the first capacitor sheet 10b.
The capacitor sheets 10c, 10d, . . . are stacked so as to face the external extraction electrodes 13a, 13b of a, and the third, fourth capacitor sheets 10c, 10d, . . . are stacked in the same way. 20 is a dummy sheet to which no electrodes are provided. In other words, each of the external lead-out electrodes of another capacitor sheet that comes into contact with the two diagonal sides of the two sides facing the two external lead-out electrodes of the capacitor sheet are positioned. Therefore, when all the capacitor sheets are stacked, external electrodes are led out on the four diagonal sides of the octagonal multilayer capacitor M, and the two sides are at the same potential. It becomes. In FIG. 5, 15a and 15b are external connection electrodes respectively attached to the lead-out portions of one of the external lead-out electrodes having the same potential, and 16a and 16b are respectively attached to the lead-out parts of the other lead-out electrode of the same potential. This is the provided external connection electrode.

The chip-type multilayer capacitor of the present invention constructed in this way can eliminate its front-back, left-right, and left-right directionality, and when installing it on a printed circuit board, as shown in FIG. Even if there are wiring electrodes 4, 4 for attachment in the arrow A) or in the left-right direction (arrow B), the attachment can be done in exactly the same way. In other words, the wiring electrode 4 in the direction of arrow A,
4, for example, the external connection electrode 15
a, 16a are conductively connected to them, and when there are wiring electrodes 4, 4 in the direction of arrow B, external connection electrodes 15b, 16b are conductively connected to them.

FIG. 8 shows another example of the shape of the capacitive sheet 10 used in the present invention, in which the area to which the capacitive electrodes 12 are provided is utilized to the maximum extent.

It should be noted that the above embodiments and drawings are merely means for embodying the present invention, and it goes without saying that the present invention is not limited to these. For example, the shape of the dielectric sheet may be not only an octagon but also a substantially regular even-numbered polygon.
Further, the shape and position of each electrode may be arbitrarily determined, and various design changes may be made without departing from the spirit of the present invention.

As described above, in the present invention, the outer shape of the chip-type multilayer capacitor is an octagon or more, which is almost a regular-even polygon, so the directionality is small, and it is extremely easy to attach it to the wiring electrodes of the board. It does not require complicated steps for positioning, and is particularly suitable for operation by an automatic machine or the like. In addition, since the present invention has a structure in which the directionality of the capacitor is almost eliminated, it is possible to easily handle it during manufacturing as well as when storing it in a cylindrical magazine, etc. It has many practical effects.

[Brief explanation of drawings]

Figure 1 is a perspective view of a conventional chip-type multilayer capacitor, Figure 2 is a plan view showing the capacitor attached to a board, Figure 3 is a partial perspective view of a cylindrical magazine that houses it, and Figure 4. 5 is a plan view showing an example of the shape of the capacitor sheet used in the present invention, FIG. 5 is a perspective view showing an example of the shape of the chip-type multilayer capacitor of the present invention, and FIG.
The figure is an exploded perspective view of FIG. 5, FIG. 7 is a plan view showing the state shown in FIG. 5 attached to a board, and FIG. It is a diagram. 10...Capacitance sheet, 11...Dielectric sheet, 12...Capacitance electrode, 13a, 13b...External extraction electrode, 15a, 15b, 16a, 16b
...External connection electrode.

Claims (1)

[Scope of utility model registration request] A dielectric sheet having a substantially even-numbered octagon or greater polygon, a capacitance electrode provided at the center of the dielectric sheet, and a capacitor connected to the capacitance electrode,
and a plurality of capacitance sheets, each having two external extraction electrodes extending over two adjacent sides of a selected side of the dielectric sheet, are stacked so that the external extraction electrodes of each abutting capacitance sheet are positioned on diagonal sides of each other, and an external connection electrode is provided at each end to which the external extraction electrodes are led out.