JPH07326687A - Package for electronic device - Google Patents

Abstract

PURPOSE:To obtain a package for electronic device in which the adverse influence of scattered splashes, solder balls, or a flux on an electronic device is prevented when a cap is airtightly joined to a base by welding or soldering. CONSTITUTION:A cap 2 is deeply put in a base 1 so that no splash, solder ball, nor flux can adhere to an electronic device 3 even when splashes, solder balls, or flux 10 are scattered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for fitting a base of an electronic device package and a cap.

[0002]

2. Description of the Related Art Conventionally, in the case of seam welding, a lid 5 is placed on the Kovar ring 4 as shown in FIG.
While tracing, the power was applied and welding was performed to join the lid and Kovar ring. Further, in the case of soldering, as shown in FIG. 4, the limited metal portion (metallized) 6 of the ceramic base and the cap 2 were joined by soldering.

[0003]

SUMMARY OF THE INVENTION In the prior art methods,
In case of seam welding, as shown in Fig. 3, Kovar ring 4
When the lid 5 and the lid 5 are electrically welded by the seam welding electrode roller 10, the splash 8 is scattered between the Kovar ring 4 and the lid 5, and the splash 8 adheres to the electronic device 3 in the package to cause a problem. Also in the case of soldering, as shown in FIG.
However, there is a problem that the solder balls and the flux 9 adhere to the electronic device 3 in the package to cause a problem.

[0004]

In order to solve the problem, the base 1 and the cap 2 are deeply fitted to each other so that even if the splash 9, the solder balls and the flux 10 are scattered, the structure is not attached to the electronic device 3. I solved all the problems easily.

[0005]

【Example】

(Embodiment in case of seam welding) FIG. 1 shows a sectional view of the embodiment. Inside the box-shaped base 1 having an opening upward,
Fit the box-shaped cap 2 having an opening on the lower side,
The seam welding electrode roller 10 is moved halfway around the two opposing edges of the outside edge of the opening of the base, and is welded and hermetically sealed. In this way, cap 2 and base 1
Since the fitting portion has a narrow gap and is long, even if the splash 8 occurs at the welded portion, there is no place to pop out, so that no defect occurs in the electronic component device 3.

(Embodiment for Soldering) FIG. 2 shows a sectional view of the embodiment. A box-shaped cap 2 having an opening on the lower side is fitted to the inside of a box-shaped base 1 having an opening upward, and soldering is performed all around the inside of the opening of the base 1 and the cap 2. And airtightly seal. In this way, the fitting portion between the cap 2 and the base 1 has a narrow gap and is long, so that even if the solder balls or the flux 9 scatters at the soldering point, there is no place where the solder ball or the flux 9 spatters, so that the electronic device 3 does not have a problem. .

In the drawings shown in the embodiments, terminals are omitted and not shown. Kovar or the like is used as an example of the material of the cap 2 or the base 1, and nickel is generally used as an example of plating. Further, as the "electronic device" of the present invention, an integrated circuit, a piezoelectric vibrator, a piezoelectric oscillator,
There are SAW devices and the like. Although the box-shaped (square) cap and base are described in the drawings of the embodiments, a base and a cap having a circular opening may be used.

[0008]

According to the present invention, when airtight bonding between the cap and the base is performed by seam welding or soldering, splash, solder balls or flux scattering generated during bonding does not adversely affect the electronic device. Therefore, the non-defective rate of the product was significantly improved and the cost was reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of hermetic sealing by seam welding according to the present invention.

FIG. 2 is a sectional view showing an embodiment of hermetic sealing by soldering according to the present invention.

FIG. 3 is a cross-sectional view showing an example of airtight sealing by seam welding according to the related art.

FIG. 4 is a cross-sectional view showing an example of hermetic sealing by soldering according to a conventional technique.

[Explanation of symbols]

 1 Base 2 Cap 3 Electronic device

Claims (1)

[Claims] 1. In an electronic device package, a cap having an opening is inserted by fitting along the inside of a base having the opening, and a hermetic seal is provided between the opening of the base and the cap. A package for electronic devices characterized by stopping.