JPH07297563A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPH07297563A JPH07297563A JP6091297A JP9129794A JPH07297563A JP H07297563 A JPH07297563 A JP H07297563A JP 6091297 A JP6091297 A JP 6091297A JP 9129794 A JP9129794 A JP 9129794A JP H07297563 A JPH07297563 A JP H07297563A
- Authority
- JP
- Japan
- Prior art keywords
- case
- metal film
- lid
- opening edge
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ケース内に素子を収納
した電子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component containing a device in a case.
【０００２】[0002]
【従来の技術】図４は従来例の電子部品を示している。2. Description of the Related Art FIG. 4 shows a conventional electronic component.
【０００３】１はセラミック製のケースで、このケース
１内には高周波部品等の素子２が接着剤３で貼付けられ
ることにより実装されている。この素子２はアルミワイ
ヤ４により外部電極５に電気的に接続されている。また
ケース１の開口縁上のリング状のシール用金属膜６に
は、コバールリング７がろう付けされており、金属製の
蓋８が溶接などにより気密的に接合されている。Reference numeral 1 denotes a ceramic case, in which an element 2 such as a high frequency component is mounted by being attached with an adhesive 3 in the case 1. This element 2 is electrically connected to an external electrode 5 by an aluminum wire 4. A Kovar ring 7 is brazed to the ring-shaped sealing metal film 6 on the opening edge of the case 1, and a metallic lid 8 is hermetically joined by welding or the like.
【０００４】[0004]
【発明が解決しようとする課題】上記構成においては、
パッケージ化するために、コバールリング７が必要とな
る。しかしながらコバールリング７は高価で、しかも蓋
８と接合するためには溶接が必要となり、さらに高価と
なってしまう。In the above configuration,
The Kovar ring 7 is required for packaging. However, the Kovar ring 7 is expensive, and welding is required to join it to the lid 8, which further increases the cost.
【０００５】そこで本発明は、コバールリングを用いた
溶接による接合方法を使用せずにパッケージ化すること
を目的とするものである。Therefore, an object of the present invention is to package without using a joining method by welding using a Kovar ring.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に、本発明は前記ケースの開口縁上に第１の金属膜を設
け、この第１の金属膜上に導電性接着剤を介して前記蓋
を接着するとともに、前記ケースの外周面には、前記ケ
ースの開口縁に臨む溝を形成したものである。In order to achieve this object, the present invention provides a first metal film on the opening edge of the case, and a conductive adhesive is provided on the first metal film. The lid is adhered, and a groove facing the opening edge of the case is formed on the outer peripheral surface of the case.
【０００７】[0007]
【作用】上記構成とすればケースの開口縁に設けた第１
の金属膜上に蓋を安価な半田等の導電性接着剤により接
着できるので、コストダウンが図りやすく、しかも蓋の
押圧により押広げられた余剰の導電性接着剤は溝内に流
入することとなるので、この余剰の導電性接着剤が不用
意に外部電極部に流下して短絡等を引き起こすことがな
いものとなる。With the above structure, the first member provided on the opening edge of the case
Since the lid can be adhered to the metal film of with a conductive adhesive such as inexpensive solder, it is easy to reduce the cost, and the surplus conductive adhesive spread by pressing the lid flows into the groove. Therefore, this excess conductive adhesive will not accidentally flow down to the external electrode portion to cause a short circuit or the like.
【０００８】[0008]
【実施例】以下、図を用いて本発明の実施例を説明す
る。図１は本発明の一実施例の電子部品の左側半分を断
面した正面図、図２はその平面図、図３は蓋とケースを
分離した正面図であるが、従来例の図４と同一部分には
同一番号を付している。Embodiments of the present invention will be described below with reference to the drawings. 1 is a front view in which a left half of an electronic component according to an embodiment of the present invention is cross-sectioned, FIG. 2 is a plan view thereof, and FIG. 3 is a front view in which a lid and a case are separated, but which is the same as FIG. 4 of a conventional example. The parts are given the same numbers.
【０００９】図１、図２、図３において、９は半田付が
行える金属製の蓋で、その下面全面には、シール材とし
て２６０℃以上の融点の半田１０が膜状に設けられてい
る。１はアルミナで形成された多層基板１ａ、枠体１
ｂ，１ｃを積層して形成した正方形または長方形のケー
スで、その内部にはＫHz帯からＭHz帯までの高周波部品
等の素子２が接着剤３により実装されている。そしてこ
の状態で素子２と外部電極５はボンディングワイヤ４を
介して接続されている。なお外部電極５はケース１の四
面に全て引き出されている。またケース１の開口縁上面
にはリング状の金属膜６が設けられている。さらにケー
ス１の各コーナ部には、円弧状の溝１ｄが設けられ、こ
の溝１ｄはケース１の上・下端にまで達している。さら
に各溝１ｄにも金属膜６ａがあり、これは金属膜６と接
続されている。上記蓋９は半田１０を介してケース１の
開口縁の金属膜６上に接着され、パッケージ化およびシ
ールド化が図られている。この時前記金属膜６，６ａは
タングステン、ニッケル、金を順にメッキすることによ
り形成したものであり、最上層の金が半田の滑動を促進
する結果蓋９をケース１に押付けた時に押広げられる余
剰の半田１０は金属膜６，６ａを伝わって溝１ｄ内へと
流下することとなる。このためこの余剰半田１０による
外部電極５の短絡等を防止できる。In FIGS. 1, 2, and 3, reference numeral 9 denotes a metal lid which can be soldered, and a solder 10 having a melting point of 260 ° C. or higher is provided in a film form on the entire lower surface thereof as a sealing material. . 1 is a multilayer substrate 1a made of alumina, a frame 1
A square or rectangular case is formed by stacking b and 1c, and an element 2 such as a high-frequency component in the KHz band to the MHz band is mounted therein by an adhesive 3. In this state, the element 2 and the external electrode 5 are connected via the bonding wire 4. The external electrodes 5 are all drawn out to the four sides of the case 1. A ring-shaped metal film 6 is provided on the upper surface of the opening edge of the case 1. Further, each corner of the case 1 is provided with an arcuate groove 1d, which reaches the upper and lower ends of the case 1. Further, each groove 1d also has a metal film 6a, which is connected to the metal film 6. The lid 9 is bonded onto the metal film 6 on the opening edge of the case 1 via the solder 10 to achieve packaging and shielding. At this time, the metal films 6 and 6a are formed by plating tungsten, nickel, and gold in order, and the uppermost gold promotes the sliding of the solder, so that it is spread when the lid 9 is pressed against the case 1. The surplus solder 10 will flow down into the groove 1d along the metal films 6 and 6a. Therefore, it is possible to prevent a short circuit or the like of the external electrode 5 due to the excess solder 10.
【００１０】[0010]
【発明の効果】以上のように本発明はケースの開口縁上
に第１の金属膜を設け、この第１の金属膜上に導電性接
着剤を介して前記蓋を接着するとともに、前記ケースの
外周面には、前記ケースの開口縁に臨む溝を形成したも
のである。As described above, according to the present invention, the first metal film is provided on the opening edge of the case, and the lid is bonded onto the first metal film via the conductive adhesive, and the case is formed. A groove facing the opening edge of the case is formed on the outer peripheral surface of the.
【００１１】そして上記構成とすればケースの開口縁に
設けた第１の金属膜上に蓋を安価な半田等の導電性接着
剤により接着できるので、コストダウンが図りやすく、
しかも蓋の押圧により押広げられた余剰の導電性接着剤
は溝内に流入することとなるので、この余剰の導電性接
着剤が不用意に外部電極部に流下して短絡等を引き起こ
すことがないものとなる。With the above arrangement, the lid can be adhered to the first metal film provided on the opening edge of the case with a conductive adhesive such as inexpensive solder, which facilitates cost reduction.
Moreover, since the surplus conductive adhesive spread by pressing the lid flows into the groove, the surplus conductive adhesive may inadvertently flow down to the external electrode portion to cause a short circuit or the like. There will be nothing.
【図１】本発明の一実施例の電子部品の左側半分を断面
した正面図FIG. 1 is a front view in which a left half of an electronic component according to an embodiment of the present invention is sectioned.
【図２】図１の平面図FIG. 2 is a plan view of FIG.
【図３】本発明の一実施例の蓋とケースを分離した正面
図FIG. 3 is a front view in which a lid and a case according to an embodiment of the present invention are separated.
【図４】従来例の左側半分を断面した正面図FIG. 4 is a front view in which the left half of the conventional example is sectioned.
１ ケース １ｄ 溝 ２ 素子 ５ 外部電極 ９ 蓋 １０ 半田 1 case 1d groove 2 element 5 external electrode 9 lid 10 solder
Claims (3)
に収納された素子と、この素子に電気的に接続されると
ともに前記ケース外に引出された外部電極と、前記ケー
スの上面開口部に装着された蓋とを備え、前記ケースの
開口縁上に第１の金属膜を設け、この第１の金属膜上に
導電性接着剤を介して前記蓋を接着するとともに、前記
ケースの外周面には、前記ケースの開口縁に臨む溝を形
成した電子部品。1. A case having an open top surface, an element housed in the case, an external electrode electrically connected to the element and drawn out of the case, and an opening on an upper surface of the case. A lid attached thereto, a first metal film is provided on an opening edge of the case, and the lid is adhered to the first metal film via a conductive adhesive, and an outer peripheral surface of the case Is an electronic component having a groove facing the opening edge of the case.
るとともに、この第２の金属膜と第１の金属膜とを導電
性接着剤を介して接着した請求項１に記載の電子部品。2. The second metal film is provided on the case-side surface of the lid, and the second metal film and the first metal film are adhered to each other via a conductive adhesive. Electronic components.
コーナ部に溝を形成した請求項１、または請求項２に記
載の電子部品。3. The electronic component according to claim 1, wherein the case has a square shape or a rectangular shape, and a groove is formed in each corner portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6091297A JPH07297563A (en) | 1994-04-28 | 1994-04-28 | Electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6091297A JPH07297563A (en) | 1994-04-28 | 1994-04-28 | Electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07297563A true JPH07297563A (en) | 1995-11-10 |
Family
ID=14022544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6091297A Pending JPH07297563A (en) | 1994-04-28 | 1994-04-28 | Electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07297563A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000228451A (en) * | 1999-02-05 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Electronic component |
| WO2008012885A1 (en) * | 2006-07-26 | 2008-01-31 | Panasonic Corporation | Circuit board and portable electronic apparatus |
| WO2008012873A1 (en) * | 2006-07-25 | 2008-01-31 | Panasonic Corporation | Circuit board and portable electronic apparatus |
-
1994
- 1994-04-28 JP JP6091297A patent/JPH07297563A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000228451A (en) * | 1999-02-05 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Electronic component |
| WO2008012873A1 (en) * | 2006-07-25 | 2008-01-31 | Panasonic Corporation | Circuit board and portable electronic apparatus |
| US8134840B2 (en) | 2006-07-25 | 2012-03-13 | Panasonic Corporation | Circuit board and mobile electronic apparatus |
| WO2008012885A1 (en) * | 2006-07-26 | 2008-01-31 | Panasonic Corporation | Circuit board and portable electronic apparatus |
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