JPH07326565A - Processing device - Google Patents

Abstract

PURPOSE:To manage appropriately supply of processing liquid to enhance throughput and a manufacturing yield. CONSTITUTION:A resist supply nozzle 24 supplying resist being processing liquid to a semiconductor wafer W is connected with a resist tank 31 via a resist supply pipe path 30. A detector 51 of a pressure sensor 50 is arranged in a pump part 42 of an electric-powered pump 32 provided in the resist supply pipe path 30, and a detection signal derived from the pressure sensor 50 is transmitted to a CPU 52. Thus, it is possible to detect pressure variations such as a clogged filter 33 provided in the resist supply pipe path 30 and liquid runout of resist in the resist tank 31.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing processing such as resist coating on an object to be processed such as a semiconductor wafer.

[0002]

2. Description of the Related Art Generally, in a semiconductor device manufacturing process, a photoresist is applied to a semiconductor wafer (hereinafter referred to as a wafer) as an object to be processed, and a circuit pattern is reduced by using a photolithography technique to form the photoresist. A series of processes for transferring and developing this is performed.

In the resist coating process, a uniform resist film is formed on the wafer by dropping the resist from a resist supply nozzle onto the wafer which is horizontally rotated by a spin chuck provided in the processing chamber. There is. The film thickness of the resist film is determined by the rotation speed of the spin chuck, the amount of resist dropped, and the like. Therefore, in order to make the film thickness of the resist uniform, the accuracy of the reciprocating pump as the resist pressure-feeding means provided in the conduit for connecting the resist supply system, that is, the resist supply nozzle and the resist tank is, of course, It is important to maintain and inspect equipment such as filters and valves installed in pipelines.

Further, in order to make the film thickness of the resist uniform, it is necessary to keep the temperature and humidity of the clean air supplied into the processing chamber constant. Therefore, conventionally, a humidity sensor is arranged in the processing chamber to detect the humidity in the processing chamber, and the humidity of the air supplied into the processing chamber is controlled based on the detection signal (Japanese Patent Laid-Open No. 2-57844). , JP-A-4
-134349 and Japanese Patent Laid-Open No. 4-309215).

[0005]

By the way, in the resist supply system, if the filter is clogged, for example, the supply amount of the resist becomes unstable. Therefore, it is necessary to regularly clean or replace the filter. However, in order to clean or replace the filter, it is necessary to stop the operation of the device once, which causes a decrease in productivity and an increase in running cost. Also, by installing a sensor in the resist tank, it is possible to detect liquid shortage in the tank, but in the case of this liquid shortage, the process is stopped, the resist is replenished in the resist tank, and the air in the pipeline is removed. Because it needs to be removed
There is also a problem that the number of parts for that purpose increases and much labor is required. Further, there is a problem in that even if there is a discharge failure in the resist supply system for some reason, it cannot be detected, and the product yield is reduced by performing the processing as it is.

On the other hand, in the air supply system, since the sensor is simply arranged in the processing chamber, it is exposed to the disturbance of the air flowing in the processing chamber or the atmosphere of the solvent (organic agent) of the resist to malfunction or deteriorate. In particular, since the humidity easily fluctuates, there is a problem that the temperature and humidity cannot be accurately controlled, and the film thickness of the resist film cannot be made uniform.

Further, the processing chamber may be opened by cleaning the cup or the like, and in the state where there is no straightening plate, the supplied air and the air outside the processing chamber are detected in a mixed state, and feedback is applied. In this case, no matter how much the temperature and humidity of the supplied air are controlled, the air will be mixed with the external air, resulting in excessive control. Therefore, even if the processing chamber is closed in this state, there is a problem that it takes time to return to the stable state because the air in the excessively controlled state remains inside the air controller and the blower duct.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a processing apparatus capable of appropriately controlling the supply of a processing liquid and improving the throughput and the yield. To do.

[0009]

In order to achieve the above object, a first processing apparatus of the present invention is a processing liquid supply means for supplying a processing liquid to an object to be processed, the processing liquid supply means and the processing liquid supply. Assuming a processing apparatus having a processing liquid supply pipeline connecting with a source, the processing liquid pressure feeding means interposed in the processing liquid supply pipeline and the processing liquid circulating portion in the processing liquid pressure feeding means are detected. It is characterized by comprising a pressure detecting means for disposing a body and a control means for issuing a predetermined control signal based on a detection signal from the pressure detecting means (claim 1).

The second processing apparatus of the present invention, like the first processing apparatus, has a processing liquid supply means for supplying the processing liquid to the object to be processed, the processing liquid supply means and the processing liquid supply source. Based on the premise of a processing apparatus having a processing liquid supply line connecting with the processing liquid supply line, the processing liquid pressure feeding means interposed in the processing liquid supply line and the processing liquid suction side or the processing liquid discharge of the processing liquid pressure feeding means. It is characterized by comprising a pressure detecting means for arranging a detecting body in the side pipe and a control means for issuing a predetermined control signal based on a detection signal from the pressure detecting means (claim) Item 2).

A third processing apparatus of the present invention is a processing chamber in which an object to be processed and processing liquid supply means for supplying a processing liquid to the object to be processed are provided, and clean air is provided in the processing chamber. Assuming a processing apparatus including an air supply system for supplying the processing liquid and a processing liquid supply system for supplying the processing liquid to the processing liquid supply means, the air supply system is provided with a temperature for detecting the temperature and humidity in the processing chamber. A temperature / humidity air supply means for controlling the temperature and humidity of the supply air based on the detection signal from the humidity detection means is provided, and the pressure of the processing liquid flowing in the processing liquid supply system is detected in the processing liquid supply system. And a control means for issuing a predetermined control signal based on a detection signal from the pressure detecting means (claim 3).

In the above-mentioned third processing apparatus, a rectifying body is arranged in the vicinity of the air supply port of the processing chamber, and at least the humidity detecting means of the temperature and humidity detecting means is brought into contact with the air flowing along the rectifying body. It is preferable to provide the means (Claim 4).

In the third processing apparatus, the pressure detecting means of the processing liquid supply system may be any one as long as it detects the pressure of the processing liquid flowing in the processing liquid supply system, for example, the processing liquid supply. The pressure is detected in the processing liquid pressure-feeding means provided in the pipeline with a detection body disposed in the processing liquid flow section, or in the processing liquid pressure-feeding means's processing liquid suction side or processing liquid discharge side pipeline. It can be formed by the pressure detecting means for disposing the body.

[0014]

According to the processing apparatus of the present invention by the above-mentioned technical means, the detection body of the pressure detection means is arranged in the processing liquid flow section of the processing liquid pressure feeding means provided in the processing liquid supply pipe line.
By transmitting the detection signal from the pressure detection means to the control means, a predetermined control signal based on the detection signal, for example, an increase in discharge pressure or treatment liquid due to clogging of a filter interposed in the treatment liquid supply pipeline, It is possible to detect a decrease in suction pressure due to a lack of the processing liquid in the tank. Therefore, the pressure value of the processing liquid in the processing liquid supply system and the fluctuation of the pressure can be monitored, and the management of the processing liquid supply system can be performed easily and accurately (claim 1).

Further, the detection body of the pressure detection means is arranged in the processing liquid suction side or the processing liquid discharge side of the processing liquid pressure feed means, and the detection signal from the pressure detection means is transmitted to the control means. Accordingly, similar to the processing apparatus according to claim 1, a predetermined control signal based on the detection signal, for example, an increase in discharge pressure due to clogging of a filter provided in the processing liquid supply conduit or an increase in the processing liquid tank It is possible to detect a decrease in suction pressure due to the processing liquid running out (claim 2).

Further, the air supply system is provided with temperature / humidity air supply means for controlling the temperature and humidity of the supply air on the basis of the detection signal from the temperature / humidity detection means for detecting the temperature and humidity in the processing chamber. The liquid supply system is provided with a pressure detection means for detecting the pressure of the processing liquid flowing in the processing liquid supply system, and a control means for issuing a predetermined control signal based on the detection signal from the pressure detection means. With the provision, the temperature and humidity of the clean air supplied from the air supply system into the processing chamber can be controlled, and the pressure value and pressure fluctuation of the processing liquid in the processing liquid supply system can be monitored ( Claim 3). Therefore, management of both the air supply system and the processing liquid supply system can be facilitated.

In the processing apparatus according to the third aspect of the present invention, a rectifying body is arranged in the vicinity of the air supply port of the processing chamber, and at least the humidity of the temperature and humidity detecting means is brought into contact with the air flowing along the rectifying body. By disposing the detector, the rectifying body isolates the humidity detecting means from the disturbance in the processing chamber and the chemical liquid atmosphere, and the humidity of the clean air supplied into the processing chamber can be accurately detected. ). Therefore, the temperature and humidity of the air supply system can be accurately controlled.

[0018]

Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In this embodiment, a case where the processing apparatus according to the present invention is applied to a semiconductor wafer processing system will be described.

As shown in FIG. 1, a semiconductor wafer (hereinafter referred to as a wafer) processing system includes a loader unit 1 for loading and unloading a wafer W as an object to be processed, a brush cleaning device 2 for cleaning the wafer W with a brush, A jet water cleaning device 3 for cleaning the wafer W with high-pressure jet water, an adhesion processing device 4 for hydrophobizing the surface of the wafer W, a cooling processing device 5 for cooling the wafer W to a predetermined temperature, and a resist coating on the surface of the wafer W. And a resist coating apparatus 6 which is a processing apparatus of the present invention having a function of removing excess resist on the peripheral edge of the wafer by side rinse processing, heating for performing pre-baking and post-baking by heating the wafer W after resist coating. Processing device 7, development having a function of developing the exposed wafer W and rinsing the resist pattern forming surface after development Thereby improving the working efficiency by assembling the like management device 8.

A wafer transfer path 9 is provided along the longitudinal direction in the central portion of the processing system configured as described above, and the devices 2 to 8 are arranged on the wafer transfer path 9 with their front faces facing each other. Wafer transfer mechanism 11 including a wafer transfer arm 10 for transferring the wafer W to and from each of the devices 2 to 8.
Are provided movably along the wafer transfer path 9.
Then, for example, one unprocessed wafer W stored in a wafer cassette (not shown) of the loader unit 1 is taken out and conveyed, and is sequentially cleaned, adhered, and cooled.
After applying a resist by the resist applying device 6 according to the present invention, pre-baking and exposure by an exposing device (not shown) are followed by development processing and post-baking, and the processed wafer W is placed in a wafer cassette (not shown) of the loader unit 1. Transport to and store.

As shown in FIG. 2, the resist coating apparatus 6 has a processing chamber 20 having an air supply port 21 at its upper portion.
A spin chuck 22 that rotatably holds the wafer W in a horizontal direction, a processing cup 23 that surrounds the spin chuck 22, a resist as a processing liquid is supplied to the surface of the wafer W, for example, a resist supply nozzle 24 that drops the processing liquid (processing liquid supply). Means) and a side rinse liquid supply nozzle 25 for supplying a rinse liquid for removing the resist on the periphery of the wafer W.

In this case, the spin chuck 22 is mounted on a drive shaft 27 of a motor 26 arranged below the processing chamber 20 and is connected to a vacuum device (not shown) so as to adsorb and hold the wafer W. Has been done. Further, an exhaust port 23a and a drain port 23b are provided at the bottom of the processing cup 23, and an exhaust pipe 28 and a drain pipe 29 are connected to them, respectively.

The resist supply nozzle 24 is configured to be horizontally movable on the spin chuck 22, that is, movable to the resist dropping position and the standby position by a moving mechanism (not shown). Further, the resist supply nozzle 24 is connected to a resist tank 31 as a processing liquid supply source via a resist supply pipe 30 (processing liquid supply pipe). A reciprocating electric pump 32 is interposed in the resist supply conduit 30 as a processing liquid pressure-feeding means for supplying (pressure-feeding) the resist to the resist supply nozzle 24 by suction and discharge operations, and the electric pump 32. In the resist supply pipeline 30 on the discharge side of, in order toward the resist supply nozzle 24,
A filter 33, an air-operated opening / closing valve 34, and a suck back valve 35 are provided. The electric pump 3
Filter 3 in resist supply line 30 on the discharge side of 2
A drain pipe 37 having a valve 36 interposed therein is branched in front of 3. Further, the resist tank 31 is connected to a supply source 38 of an inert gas such as nitrogen (N2) for pressurizing the inside of the resist tank 31 when starting the supply of the resist.

In the electric pump 32, as shown in FIG.
2 and a drive portion 43 are partitioned, and a suction port 45 having check valves 44a and 44b in the pump portion 42, respectively.
a and a discharge port 45b are provided, and these suction ports 45a
And the resist supply pipeline 30 are connected to the discharge port 45b. Further, in the pump portion 42, a diaphragm 47 that is mounted on the tip of a movable element 46 that is slidable through the partition wall 41 is disposed so as to be switchable between a suction side (suction operation) and a discharge side (discharge operation). The diaphragm 47 reciprocates along with the reciprocal movement of the mover 46 connected to the drive shaft 48a of the motor provided in the drive portion 43, for example, the stepping motor 48 via the ball screw mechanism 49, and the suction port 45a. The resist is sucked into the pump portion 42 and discharged from the discharge port 45b to the resist supply nozzle 24 side.

Further, at a portion of the pump portion 42 of the electric pump 32 facing the diaphragm 47, pressure detecting means for detecting a suction pressure at the time of sucking the resist passing through the pump portion 42 and a discharge pressure at the time of discharging the resist, for example, A detector 51 having a film portion made of fluororesin is provided. The signal detected by the detector 51 serves as pressure detecting means, for example, a diffusion semiconductor type pressure sensor 50.
And the suction pressure and the discharge pressure of the electric pump 32 are electrically detected by the piezoresistive effect of the semiconductor in the pressure sensor 50. Further, the signal detected by the pressure sensor 50 is transmitted to a central processing unit 52 (CPU) as a control means, and a control signal calculated by comparison with predetermined information stored in advance in the CPU 52 is fed back to the electric pump 32. It is designed to display alarms and monitors.

By disposing the detection body 51 of the pressure sensor 50 in the pump portion 42 of the electric pump 32 as described above, the suction / discharge operation of the electric pump 32 at the time of supplying the resist can be monitored. That is, when the electric pump 32 operates normally, a pressure waveform (discharging pressure: 0.2 Kg / cm ² is discharged at 1 cc / sec for about ² to 3 seconds, as shown in FIG. Inhalation is performed for about 10 seconds). However, when the filter 33 is clogged, for example, the resist solution becomes difficult to pass through. Therefore, as shown in FIG. H
Since it becomes higher, it is possible to inform the user of the replacement time of the filter 33 by detecting this and displaying an alarm or a monitor. Further, when the liquid in the resist tank 31 runs out of liquid, as shown in FIG. 4C, since the nitrogen gas is sucked in instead of the resist liquid, the suction pressure is L minutes from the normal state. Since it decreases, it is possible to notify of the liquid exchange by detecting this and displaying an alarm or monitor. Based on the signal thus detected, the CPU 52
A control signal can be extracted from the control signal, and the control signal can automatically stop the driving of the electric pump 32, stop the supply of the resist, and replace the filter 33 or replenish the resist. It is also possible to detect the end of the resist supply step by detecting that the suction pressure has dropped and reached a predetermined value such as "0".

In the above embodiment, the case where the processing liquid supply means is formed by the electric pump 32 has been described, but a bellows pump may be used instead of the diaphragm type electric pump 32. Further, in the above embodiment, the case where the detection body 51 of the pressure sensor 50 is arranged in the pump portion 42 of the electric pump 32 has been described, but it is not always necessary to have such a structure, and for example, FIGS. 3, the suction port 45a of the electric pump 32 is shown by an imaginary line.
The detection body 51 of the pressure sensor 50 is arranged in the resist supply pipeline 30 on the suction side connected to the pressure sensor 50 and the detection sensor 51 is detected in the resist supply pipeline 30 on the discharge side connected to the discharge port 45b of the electric pump 32. By disposing the body 51, it is possible to detect clogging of the filter 33, running out of the liquid of the resist in the resist tank 31, and the like, as described above.

On the other hand, a HEPA filter 60 is attached to the air supply port 21 of the processing chamber 20, and a temperature / humidity air supply device 62 (temperature / humidity air supply means) is connected via a duct 61. Air supply device 62
It is configured such that the air whose temperature and humidity are adjusted to a predetermined temperature can be cleaned by the HEPA filter 60 and then supplied into the processing chamber 20.

As shown in FIG. 5, the temperature / humidity air supply device 62 is provided with an air outlet 64 which is connected to the processing chamber 20 via the duct 61 on the upper part of a box-shaped case 63, and the lower side of the case 63. An air inlet 66 having a pre-filter 65 is provided on one side, and the air inlet 66 and the air outlet 64 are connected by a passage 67 in the case 63.

In this case, on the air supply port 21 side of the passage 67, the sucked air is cooled to about 4 ° C. and dehumidified (30 to 35).
%) Is provided. This heat exchanger 70 connects a refrigerant supply side and a refrigerant discharge side of a heat exchange pipe 72, which is wound in a meandering manner around a chamber 71 slightly bulging in a passage 67, with a circulation pipe line 73, The expansion valve 7 is provided in order from the refrigerant supply side to the refrigerant discharge side of the passage 73.
4, the condenser 75 and the compressor 76 are provided.

In the passage 67 on the downstream side of the heat exchanger 70 thus constructed, that is, on the air outlet side, the air that has passed through the heat exchanger 70 has a predetermined temperature (about 23 ° C.) and humidity (35-35).
A heater 80 for adjusting the temperature to 36%) is provided. The heater 80 is configured so that the pure water 82 contained in the tank 81 communicating with the passage 67 is heated by the heater 83, and the switch 84 of the heater 83 is operated by the switch 84 of the heater 83.
A central processing unit 52A as a control means that operates based on detection signals from a temperature sensor 91 (temperature detecting means) and a humidity sensor 92 (humidity detecting means) arranged in the vicinity of the air supply port 21 in the 0. It can be turned on and off by a control signal from the (CPU). In addition,
If the CPU 52A of the temperature / humidity air supply device 62 and the CPU 52 of the resist supply system are unified, the control section can be unified.

Of the temperature sensor 91 and the humidity sensor 92, as shown in FIGS. 6 and 7, the humidity sensor 92 is disposed along the downflow air flow supplied from the air supply port 21, for example. , Rectifier 93 having a hollow rectangular cross section
Guide tube 9 communicating with the opening hole 95 provided in the side wall 94 of the
6 is inserted into the rectifying body 93 so that the humidity can be detected by contacting only the air flowing in the rectifying body 93. Therefore, since the humidity sensor 92 is isolated from the atmosphere in the processing chamber 20, it is possible to prevent the humidity sensor 92 from malfunctioning and deteriorating due to the change in the atmosphere in the processing chamber 20, for example, the solvent (organic agent) of the resist. it can.

Further, due to trouble, maintenance, etc., H
Even when the EPA filter 60 is raised, the humidity sensor 92 is constantly in contact with the air in the rectifying body 93 without touching the outside air, so that the downflow can be immediately set to a predetermined humidity when the process is started next time. .

On the other hand, the temperature sensor 91 may also be brought into contact with the air flow flowing in the rectifying body 93, but since the temperature detection 91 does not cause a large malfunction due to a change in the atmosphere in the processing chamber 20, the temperature sensor 91 is used as the rectifying body. It may be arranged outside 93.

A fan 85 is provided on the downstream side of the heater 80, and the air sucked from the air suction port 66 by the fan 85 is sent to the air sending port 64 via the passage 67. Further, through the duct 61, the processing chamber 20
It is supposed to be sent inside.

Next, the operation of applying the resist on the surface of the wafer W using the resist applying apparatus 6 configured as described above will be described.

First, after the adhesion processing, the wafer W cooled by the cooling processing apparatus 5 is carried into the processing chamber 20 of the resist coating apparatus 6 by the wafer carrying arm 10 of the wafer carrying mechanism 11, and the spin chuck 22 moves up. Then, the wafer W is received, sucked and held, and then lowered to dispose the wafer W in the processing cup 23. next,
The resist supply nozzle 24 is moved above the wafer W from the standby position by a moving mechanism (not shown), and the electric pump 32 is moved.
Is driven, the resist in the resist tank 31 is dripped onto the surface of the wafer W from the resist supply nozzle 24 through the resist supply line 30, diffused onto the surface of the wafer W rotated by the spin chuck 22, and is transferred onto the surface of the wafer W. A resist film is formed.

In the process of forming the resist film on the surface of the wafer W in this way, if the filter 33 of the resist supply conduit 30 is clogged, the discharge pressure of the electric pump 32 as shown in FIG. 4B. Is increased, the increase in the pressure is detected by the pressure detection body 51 of the pressure sensor 50 and transmitted to the CPU 52, and the clogging of the filter 33 can be detected by the control signal issued from the CPU 52. Know when to clean or replace. Further, when the resist in the resist tank 31 runs out of liquid, the suction pressure of the electric pump 32 decreases as shown in FIG. 4C, and therefore the decrease in pressure is detected by the pressure sensor 50. CPU 52 detected by body 51
Then, the control signal issued from the CPU 52 can be sent to notify the liquid out of the resist. At this time,
The filter 33 can be replaced by stopping the operation of the electric pump 32 according to a control signal from the CPU 52.

During the resist coating process, the air whose temperature and humidity has been adjusted by the temperature and humidity air supply device 62 is purified by the HEPA filter 60 and supplied in a downflow state. In this state, the temperature sensor 91 and the humidity sensor 92 detect the temperature and humidity in the processing chamber 20, and the control signal from the CPU 52A based on the detection signal operates the heater 83 of the heater 80 to operate at a predetermined temperature and humidity. The air can be constantly supplied into the processing chamber 20.

In the above embodiment, the case where the processing apparatus of the present invention is applied to the resist coating apparatus has been described, but it can also be applied to an apparatus that supplies a processing liquid other than resist to the object to be processed, and the processing chamber. It can also be applied to a processing device in which it is necessary to adjust the temperature and humidity of the air supplied to the. Further, in the above embodiment, the case where the object to be processed is a semiconductor wafer has been described, but the object to be processed is not necessarily limited to the semiconductor wafer, and for example, an object to be processed may be an LCD substrate, a ceramic substrate or the like. It is applicable.

Further, if solid matter or air bubbles are mixed in the resist liquid, unevenness is partially generated in the pressure waveform at the time of discharging and inhaling. Therefore, by detecting this, the above mixing can be detected. Will also be possible. As a result, the discharge operation can be stopped and the discharge of the solid matter or bubbles onto the wafer W can be prevented in advance.

Further, as the air cooling means of the temperature / humidity air supply device 62, an electronic cooling means such as a Peltier element may be used instead of the fluid such as the refrigerant. Further, as the heating means, instead of the pure water 82, a heating means such as oil, hot air, microwave, electromagnetic induction may be used.

[0043]

As described above, since the processing apparatus of the present invention is constructed as described above, the following effects can be obtained.

1) According to the processing apparatus of the first and second aspects, since the pressure value and the fluctuation of the pressure of the processing liquid in the processing liquid supply system can be monitored, the management of the processing liquid supply system is easy and accurate. Therefore, the throughput and the yield can be improved.

2) According to the processing apparatus of the third aspect, the temperature and humidity of the clean air supplied from the air supply system into the processing chamber can be controlled, and the pressure value of the processing liquid in the processing liquid supply system can be controlled. Since it is possible to monitor fluctuations in pressure and pressure, it is possible to facilitate management of both the air supply system and the treatment liquid supply system, and improve throughput and yield.

[Brief description of drawings]

FIG. 1 is a perspective view of a resist coating / developing processing system incorporating a processing apparatus of the present invention.

FIG. 2 is a schematic configuration diagram of a processing apparatus of the present invention.

FIG. 3 is a sectional view of an electric pump according to the present invention.

FIG. 4 is a timing chart showing discharge and suction operations of the electric pump.

FIG. 5 is a cross-sectional view of the temperature / humidity air conditioner according to the present invention.

FIG. 6 is a cross-sectional view showing a mounting state of a temperature sensor and a humidity sensor according to the present invention.

FIG. 7 is a bottom view of the main part of FIG.

[Explanation of symbols]

 W Semiconductor Wafer (Processing Object) 24 Resist Supply Nozzle (Process Liquid Supply Means) 30 Resist Supply Pipeline (Process Liquid Supply Pipeline) 31 Resist Tank (Process Liquid Supply Source) 32 Electric Pump (Process Liquid Pressure Sending Means) 33 Filter 42 pump part 50 pressure sensor (pressure detection means) 51 detection body 52, 52A CPU (control means) 62 temperature and humidity air supply device (temperature and humidity air supply means) 91 temperature sensor (temperature detection means) 92 humidity sensor (humidity detection means) ) 93 Rectifier

Claims (4)

[Claims] 1. A processing apparatus comprising: a processing liquid supply means for supplying a processing liquid to an object to be processed; and a processing liquid supply pipeline connecting the processing liquid supply means and a processing liquid supply source. Based on the detection signal from the processing liquid pressure feeding means provided in the supply pipeline, the pressure detecting means for arranging the detection body in the processing liquid flow portion of the processing liquid pressure feeding means, and the detection signal from the pressure detection means. And a control means for issuing a control signal. 2. A processing apparatus comprising: a processing solution supply means for supplying a processing solution to an object to be processed; and a processing solution supply pipeline connecting the processing solution supply means and the processing solution supply source. From the pressure detecting means, the processing liquid pressure-feeding means interposed in the supply pipeline, the pressure detecting means for arranging the detection body in the processing liquid suction-side or processing liquid discharge-side pipeline of the processing liquid pressure-feeding means, and the pressure detecting means. And a control unit that issues a predetermined control signal based on the detection signal of. 3. A processing chamber in which an object to be processed and a processing liquid supply means for supplying a processing liquid to the object to be processed are installed, an air supply system for supplying clean air into the processing chamber, and the above-mentioned processing. A processing apparatus comprising a processing liquid supply system for supplying a processing liquid to a liquid supply means, wherein air is supplied to the air supply system based on a detection signal from a temperature / humidity detection means for detecting temperature and humidity in the processing chamber. A temperature / humidity air supply means for controlling the temperature and humidity of the processing liquid is arranged, and a pressure detection means for detecting the pressure of the processing liquid flowing in the processing liquid supply system is arranged in the processing liquid supply system. A processing device, comprising: a control means for emitting a predetermined control signal based on a detection signal from the detection means. 4. A rectifying body is provided near the air supply port of the processing chamber, and at least a humidity detecting means of the temperature and humidity detecting means is provided so as to come into contact with air flowing along the rectifying body. The processing device according to claim 3, wherein