JP3166056B2 - Processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing processing such as resist coating on an object to be processed such as a semiconductor wafer.

[0002]

2. Description of the Related Art Generally, in a semiconductor device manufacturing process, a photoresist is applied to a semiconductor wafer (hereinafter, referred to as a wafer) as an object to be processed, and a circuit pattern is reduced by using a photolithography technique to form a photoresist. A series of processes of transferring and developing this are performed.

In the above-mentioned resist coating process, a uniform resist film is formed on a wafer by dripping the resist from a resist supply nozzle onto a wafer which is horizontally rotated by a spin chuck provided in a processing chamber. I have. The thickness of the resist film is determined by the number of rotations of the spin chuck, the amount of the resist dropped, and the like. Therefore, in order to make the film thickness of the resist uniform, the accuracy of a reciprocating pump as a resist pressure feeding means provided in a resist supply system, that is, a pipeline connecting the resist supply nozzle and the resist tank is, of course, It is important to perform maintenance and inspection of devices such as filters and valves provided in pipes.

Further, in order to make the film thickness of the resist uniform, it is necessary to keep the temperature and humidity of clean air supplied into the processing chamber constant. Therefore, conventionally, a humidity sensor is provided in the processing chamber to detect the humidity in the processing chamber, and the humidity of the air supplied into the processing chamber is controlled based on the detection signal (Japanese Patent Laid-Open No. 2-57844). , JP-A-4
-134349, JP-A-4-309215).

[0005]

In the resist supply system, for example, if the filter is clogged, the supply amount of the resist becomes unstable. Therefore, it is necessary to periodically clean or replace the filter. However, in order to clean or replace the filter, the operation of the apparatus must be stopped once, which causes a problem that productivity is lowered and running cost is increased. In addition, by installing a sensor in the resist tank, it is possible to detect liquid shortage in the tank, but in the case of this liquid shortage, stop the processing, replenish the resist in the resist tank, and remove the air in the pipeline. Because it is necessary to extract
There are also problems that the number of parts for that purpose increases and much effort is required. Further, even if there is a discharge failure in the resist supply system for some reason, it cannot be detected, so that there is a problem that the processing yield is reduced by performing the processing as it is.

On the other hand, in the air supply system, since the sensor is simply disposed in the processing chamber, it malfunctions or deteriorates when exposed to disturbance such as air flowing in the processing chamber or an atmosphere of a solvent (organic agent) of the resist. In particular, since the humidity easily fluctuates, accurate control of the temperature and the humidity cannot be performed, and the thickness of the resist film cannot be made uniform.

In some cases, the processing chamber is opened due to, for example, washing of the cup. When there is no current plate, the supplied air and the air outside the processing chamber are detected in a mixed state, and feedback is applied. In this case, no matter how much the temperature and the humidity of the supplied air are controlled, they are mixed with the external air, resulting in excessive control. Therefore, even if the processing chamber is closed in this state, there is a problem that it takes time to return to a stable state because air in an over-controlled state remains in the air controller and the air duct.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a processing apparatus capable of appropriately controlling the supply of a processing liquid and improving throughput and yield. Is what you do.

[0009]

In order to achieve the above object, a first processing apparatus of the present invention comprises a processing liquid supply means for supplying a processing liquid to an object to be processed, a processing liquid supply means and a processing liquid supply means. assumes processing apparatus having a processing solution supply pipe which connects the source, a treatment liquid pumping means is interposed the processing solution supply pipe, distribution to the distribution of the processing liquid in the processing liquid pumping means suction pressure and discharging the processing liquid by setting the the detector
A pressure detecting means for detecting a pressure, on the basis of the detection signal from the pressure detecting means is characterized in that it comprises a control means for issuing a predetermined control signal (claim 1).

A second processing apparatus according to the present invention, like the first processing apparatus, includes a processing liquid supply means for supplying a processing liquid to the object to be processed, and a processing liquid supply means and a processing liquid supply source. And a processing liquid pressure supply means interposed in the processing liquid supply pipe, and a processing liquid suction side and a processing liquid discharge of the processing liquid pressure supply means. inhalation detector to thus treatment liquid which is disposed conduit in the side
A pressure detecting means for detecting a pressure and a discharge pressure, and a control means for issuing a predetermined control signal based on a detection signal from the pressure detecting means (claim 2).

Further, a third processing apparatus according to the present invention includes a processing chamber in which an object to be processed and processing liquid supply means for supplying a processing liquid to the object are disposed; And a processing liquid supply system for supplying a processing liquid to the processing liquid supply means, and a temperature for detecting the temperature and humidity in the processing chamber in the air supply system. A temperature / humidity air supply means for controlling the temperature and humidity of supply air based on a detection signal from the humidity detection means is provided, and the processing liquid supply system is provided with a pressure supply means for processing liquid flowing through the processing liquid supply system. A pressure detecting means for detecting the suction pressure and the discharge pressure is provided, and a control means for generating a predetermined control signal based on a detection signal from the pressure detecting means is provided. Item 3).

In the third processing apparatus, a rectifier is disposed at a position near the air supply port of the processing chamber, and at least one of the temperature / humidity detecting means is provided to contact the air flowing along the rectifier. It is preferable to dispose the means in the rectifier (claim 4).

Further, in the third processing apparatus, the pressure detecting means of the processing liquid supply system may be of any type as long as it detects the suction pressure and the discharge pressure of the pressure supply means of the processing liquid flowing in the processing liquid supply system. For example, the processing liquid supply means and the processing liquid supply
A detecting element disposed in a processing liquid distribution section of a processing liquid pumping means interposed in a processing liquid supply pipe connecting to a supply source .
Detecting means for detecting the suction pressure and the discharge pressure of the processing liquid
(Claim 5), or, depending on the detector which is disposed conduit in the treatment liquid inlet side and the treatment liquid discharge side of the processing liquid pumping means
Suction pressure and discharge pressure of the treatment liquid Te can be formed by the pressure detecting means for detecting (claim 6).

[0014]

According to the processing apparatus of the present invention based on the above technical means, the detecting element of the pressure detecting means is disposed in the processing liquid flowing portion of the processing liquid pressure feeding means provided in the processing liquid supply pipe,
By transmitting the detection signal from the pressure detection means to the control means, a predetermined control signal based on the detection signal, for example, an increase in the discharge pressure due to clogging of a filter provided in the processing liquid supply pipe line or a processing liquid It is possible to detect a decrease in suction pressure due to running out of the processing liquid in the tank. Therefore, it is possible to monitor the pressure value and the fluctuation of the pressure of the processing liquid in the processing liquid supply system, and it is possible to easily and accurately manage the processing liquid supply system.

[0015] A detecting element of the pressure detecting means is provided in the processing liquid suction side and the processing liquid discharging side of the processing liquid pressure feeding means, and a detection signal from the pressure detecting means is controlled by the control means. In the same manner as in the processing apparatus according to claim 1, a predetermined control signal based on the detection signal, for example, an increase in the discharge pressure due to clogging of a filter provided in the processing liquid supply pipe or processing. It is possible to detect a decrease in suction pressure due to running out of the processing liquid in the liquid tank (claim 2).

In the air supply system, temperature and humidity air supply means for controlling the temperature and humidity of supply air based on a detection signal from temperature and humidity detection means for detecting temperature and humidity in the processing chamber is provided. The liquid supply system is provided with pressure detection means for detecting the suction pressure and the discharge pressure of the pressure supply means for the processing liquid flowing in the processing liquid supply system, and a predetermined control is performed based on a detection signal from the pressure detection means. By arranging the control means for issuing a signal, it is possible to control the temperature and humidity of the clean air supplied into the processing chamber from the air supply system, and to change the pressure value and the pressure of the processing liquid in the processing liquid supply system. Can be monitored (claims 3 , 5, 6 ). Therefore, it is possible to easily manage both the air supply system and the processing liquid supply system.

In the processing apparatus according to the third aspect, a rectifier is disposed at a position near the air supply port of the processing chamber, and at least one of the temperature and humidity detecting means is brought into contact with air flowing along the rectifier. By arranging the detecting element in the rectifier , the rectifier can isolate the humidity detecting means from disturbance in the processing chamber and the atmosphere of the chemical solution, and accurately detect the humidity of the clean air supplied into the processing chamber ( Claim 4). Therefore, the temperature and humidity of the air supply system can be accurately controlled.

[0018]

Next, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, a case where the processing apparatus according to the present invention is applied to a semiconductor wafer processing system will be described.

As shown in FIG. 1, a processing system for a semiconductor wafer (hereinafter, referred to as a wafer) includes a loader unit 1 for loading / unloading a wafer W as an object to be processed, a brush cleaning device 2 for brush cleaning the wafer W, A jet water cleaning device 3 for cleaning the wafer W with high-pressure jet water, an adhesion processing device 4 for hydrophobizing the surface of the wafer W, a cooling processing device 5 for cooling the wafer W to a predetermined temperature, and coating a resist on the surface of the wafer W A resist coating apparatus 6 as a processing apparatus according to the present invention, which has a function of removing excess resist from the peripheral portion of the wafer by side rinsing, and heating the wafer W after resist coating to perform prebaking and postbaking. The processing apparatus 7 has a function of developing the exposed wafer W and rinsing the developed resist pattern surface. Thereby improving the working efficiency by assembling the like management device 8.

In the central portion of the processing system configured as described above, a wafer transfer path 9 is provided along the longitudinal direction, and each of the devices 2 to 8 is arranged on the wafer transfer path 9 with its front face facing. Wafer transfer mechanism 11 provided with wafer transfer arm 10 for transferring wafer W between apparatuses 2 to 8
Are provided movably along the wafer transfer path 9.
Then, for example, one unprocessed wafer W stored in a wafer cassette (not shown) of the loader unit 1 is taken out and transported, and sequentially cleaned, adhered, cooled,
After the resist is applied by the resist coating apparatus 6 according to the present invention, the wafer is subjected to a pre-baking process, a post-baking process after exposure by an exposure device (not shown), and the processed wafer W is loaded into a wafer cassette (not shown) of the loader unit 1. To be stored.

As shown in FIG. 2, the resist coating device 6 is provided in a processing chamber 20 having an air supply port 21 at an upper part thereof.
A spin chuck 22 for holding the wafer W so as to be rotatable in a horizontal direction, a processing cup 23 surrounding the spin chuck 22, and a resist supply nozzle 24 for supplying, for example, a resist as a processing liquid to the surface of the wafer W (processing liquid supply Means) and a side rinse liquid supply nozzle 25 for supplying a rinse liquid for removing the resist on the peripheral edge of the wafer W.

In this case, the spin chuck 22 is mounted on a drive shaft 27 of a motor 26 disposed below the processing chamber 20, and is connected to a vacuum device (not shown) to hold the wafer W by suction. Have been. An exhaust port 23a and a drain port 23b are provided at the bottom of the processing cup 23, and an exhaust pipe 28 and a drain pipe 29 are connected to the exhaust port 23a and the drain pipe 23b, respectively.

The resist supply nozzle 24 is configured to be horizontally movable on the spin chuck 22 by a moving mechanism (not shown), that is, movable to a resist dropping position and a standby position. Further, the resist supply nozzle 24 is connected to a resist tank 31 as a processing liquid supply source via a resist supply pipe 30 (processing liquid supply pipe). A reciprocating electric pump 32 is provided in the resist supply line 30 as a processing liquid pumping means for supplying (pressurizing) the resist to the resist supply nozzle 24 by suction and discharge operations. In the resist supply pipe line 30 on the discharge side of FIG.
A filter 33, an air-operated on-off valve 34, and a suck-back valve 35 are provided. The electric pump 3
Filter 3 in the resist supply line 30 on the discharge side of No. 2
A drain pipe 37 provided with a valve 36 interposed is provided in front of the drain pipe 3. The resist tank 31 is connected to a supply source 38 of an inert gas such as nitrogen (N2) for pressurizing the inside of the resist tank 31 at the start of the supply of the resist.

As shown in FIG. 3, the electric pump 32 includes a casing 40 and a pump portion 4 formed by a partition wall 41.
2 and a drive part 43, and a suction port 45 having check valves 44a and 44b in the pump part 42, respectively.
a and a discharge port 45b.
And the resist supply pipe line 30 is connected to the discharge port 45b. A diaphragm 47 mounted on the tip of a movable element 46 slidable through the partition wall 41 is provided in the pump portion 42 so as to be switchable between a suction side (suction operation) and a discharge side (discharge operation). The diaphragm 47 reciprocates with the reciprocal movement of the mover 46 connected to the drive shaft 48a of the motor disposed in the drive portion 43, for example, the stepping motor 48 via the ball screw mechanism 49, and the suction port 45a From the discharge port 45b to the resist supply nozzle 24 side.

In a portion of the pump portion 42 of the electric pump 32 which faces the diaphragm 47, a pressure detecting means for detecting a suction pressure at the time of suction of the resist passing through the pump portion 42 and a discharge pressure at the time of discharge, for example, A detection body 51 having a film portion made of fluororesin is provided. A signal detected by the detection body 51 is used as a pressure detection means, for example, a diffusion type semiconductor pressure sensor 50.
The suction pressure and the discharge pressure of the electric pump 32 are electrically detected by the piezoresistance effect of the semiconductor in the pressure sensor 50. Further, a signal detected by the pressure sensor 50 is transmitted to a central processing unit 52 (CPU) as a control means, and a control signal calculated and compared with predetermined information previously stored in the CPU 52 is fed back to the electric pump 32 or Alarm display and monitor display are provided.

As described above, by disposing the detector 51 of the pressure sensor 50 in the pump portion 42 of the electric pump 32, it is possible to monitor the suction / discharge operation of the electric pump 32 during the supply of the resist. That is, when the electric pump 32 operates normally, a pressure waveform as shown in FIG. 4A (discharge pressure: 0.2 kg / cm 2 is discharged at 1 cc / sec for about 2 to 3 sec. For example, when the filter 33 is clogged, the resist liquid is difficult to pass through. Therefore, as shown in FIG.
Since it becomes higher by an amount, it is possible to detect this and notify the replacement time of the filter 33 by an alarm display or a monitor display. When the resist in the resist tank 31 runs out of liquid, as shown in FIG. 4C, nitrogen gas is sucked in instead of the resist solution. Since this is reduced, it is possible to detect this and notify the liquid exchange by an alarm display or a monitor display. Based on the signal thus detected, the CPU 52
The control signal can be taken out from the control signal, and the drive of the electric pump 32 is automatically stopped by the control signal, the supply of the resist is stopped, and the filter 33 can be replaced or the resist can be supplied. Further, it is also possible to detect that the suction pressure has decreased and has reached a predetermined value such as “0”, thereby notifying the end of the resist supply step.

In the above embodiment, the case where the processing liquid supply means is formed by the electric pump 32 has been described, but a bellows pump may be used instead of the diaphragm type electric pump 32. Further, in the above-described embodiment, the case where the detection body 51 of the pressure sensor 50 is disposed on the pump portion 42 of the electric pump 32 has been described. However, such a structure is not necessarily required. 3, the suction port 45a of the electric pump 32
The detection body 51 of the pressure sensor 50 is disposed in the resist supply line 30 on the suction side connected to the suction port, and the pressure sensor 50 is detected in the resist supply line 30 on the discharge side connected to the discharge port 45b of the electric pump 32. By disposing the body 51, it is possible to detect clogging of the filter 33 and running out of liquid in the resist in the resist tank 31 in the same manner as described above.

On the other hand, a HEPA filter 60 is attached to the air supply port 21 of the processing chamber 20, and a temperature / humidity air supply device 62 (temperature / humidity air supply means) is connected via a duct 61. Air supply device 62
After the air adjusted to a predetermined temperature and humidity is cleaned by the HEPA filter 60, the air can be supplied into the processing chamber 20.

As shown in FIG. 5, the temperature / humidity air supply device 62 has an air outlet 64 connected to the processing chamber 20 via a duct 61 at an upper portion of a box-shaped case 63. On the other hand, an air inlet 66 having a pre-filter 65 is provided. In the case 63, the air inlet 66 and the air outlet 64 are connected by a passage 67.

In this case, the inhaled air is cooled to about 4 ° C. in the air supply port 21 side of the passage 67 and dehumidified (30 to 35 ° C.).
%) Is provided. This heat exchanger 70 connects a refrigerant supply side and a refrigerant discharge side of a heat exchange tube 72 wound in a meandering manner around a chamber 71 in which a passage 67 is slightly bulged, through a circulation line 73. In order from the refrigerant supply side to the refrigerant discharge side in the passage 73, the expansion valve 7
4. A structure in which a condenser 75 and a compressor 76 are provided.

The air passing through the heat exchanger 70 is passed through the passage 67 on the downstream side of the heat exchanger 70, that is, on the air outlet side at a predetermined temperature (about 23 ° C.) and a humidity (35 to 35 ° C.).
(36%). The heater 80 is configured to heat a pure water 82 contained in a tank 81 communicating with a passage 67 by a heater 83, and a switch 84 of the heater 83 operates the processing chamber 2.
A central processing unit 52A as a control unit that operates based on detection signals from a temperature sensor 91 (temperature detection unit) and a humidity sensor 92 (humidity detection unit) disposed in the vicinity of the air supply port 21 in the area 0. An ON / OFF operation can be performed by a control signal from the (CPU). In addition,
If the CPU 52A of the temperature / humidity air supply device 62 and the CPU 52 of the resist supply system are integrated into one, the control unit can be unified.

As shown in FIGS. 6 and 7, the humidity sensor 92 of the temperature sensor 91 and the humidity sensor 92 is disposed along the downflow air flow supplied from the air supply port 21. Rectifier 93 having a hollow rectangular cross section
Guide cylinder 9 communicating with an opening hole 95 provided in side wall 94 of
6, the humidity can be detected by contacting only the air flowing through the rectifier 93. Therefore, since the humidity sensor 92 is isolated from the atmosphere in the processing chamber 20, it is possible to prevent the humidity sensor 92 from malfunctioning and deteriorating due to a change in the atmosphere in the processing chamber 20, for example, a solvent (organic agent) of a resist. it can.

Further, due to trouble, maintenance, etc., H
Even when the EPA filter 60 is raised, the humidity sensor 92 always touches the air in the rectifier 93 without touching the outside air, so that when the next process is started, the downflow can be immediately set to the predetermined humidity. .

On the other hand, the temperature sensor 91 may be brought into contact with the airflow flowing in the rectifier 93, but since a large malfunction does not occur in temperature detection due to a change in the atmosphere in the processing chamber 20, the temperature sensor 91 is It may be arranged outside 93.

A fan 85 is provided downstream of the heater 80, and the air sucked from the air inlet 66 by the fan 85 is sent to the air outlet 64 through the passage 67. Further, the processing chamber 20 is
To be sent inside.

Next, an operation of applying a resist on the surface of the wafer W using the resist coating apparatus 6 configured as described above will be described.

First, after the adhesion process, when the wafer W cooled by the cooling processing device 5 is carried into the processing chamber 20 of the resist coating device 6 by the wafer transfer arm 10 of the wafer transfer mechanism 11, the spin chuck 22 is raised. Then, after receiving and holding the wafer W by suction, the wafer W is placed in the processing cup 23 by descending. next,
The resist supply nozzle 24 is moved from the standby position to above the wafer W by a moving mechanism (not shown).
Is driven, the resist in the resist tank 31 is dripped from the resist supply nozzle 24 to the surface of the wafer W through the resist supply line 30, diffuses to the surface of the wafer W rotated by the spin chuck 22, and A resist film is formed.

In the step of forming a resist film on the surface of the wafer W in this manner, if the filter 33 of the resist supply line 30 becomes clogged, as shown in FIG. Rises, the increase in the pressure is detected by the pressure detector 51 of the pressure sensor 50 and transmitted to the CPU 52, and the clogging of the filter 33 can be detected by the control signal issued from the CPU 52. You can know when to clean or replace. Further, when the resist in the resist tank 31 runs out of liquid, the suction pressure of the electric pump 32 decreases as shown in FIG. 4C. CPU 52 detects by body 51
And the control signal issued from the CPU 52 notifies the user that the resist has run out. At this time,
The filter 33 can be replaced by stopping the operation of the electric pump 32 according to a control signal from the CPU 52.

During the resist coating process, the air whose temperature and humidity has been adjusted by the temperature and humidity air supply device 62 is cleaned by the HEPA filter 60 and supplied into the processing chamber 20 in a downflow state. In this state, the temperature and humidity in the processing chamber 20 are detected by the temperature sensor 91 and the humidity sensor 92, and the control signal from the CPU 52A based on the detection signal activates the heater 83 of the heater 80 to set the predetermined temperature and humidity. Can always be supplied into the processing chamber 20.

In the above embodiment, the case where the processing apparatus of the present invention is applied to a resist coating apparatus has been described. However, the processing apparatus of the present invention can also be applied to an apparatus for supplying a processing liquid other than a resist to an object to be processed. The present invention can also be applied to a processing apparatus that needs to adjust the temperature and humidity of the air supplied to the apparatus. Further, in the above embodiment, the case where the object to be processed is a semiconductor wafer has been described. However, the object to be processed is not necessarily limited to a semiconductor wafer. For example, an object to be processed on an LCD substrate, a ceramic substrate, or the like may be used. Applicable.

If solid matter or air bubbles are mixed in the resist solution, irregularities are partially generated in the pressure waveform at the time of discharge and suction, and the mixing is detected by detecting this. Is also possible. Accordingly, the discharge operation can be stopped, and the discharge of the solids and bubbles to the wafer W can be prevented.

As the air cooling means of the temperature and humidity air supply device 62, an electronic cooling means such as a Peltier element may be used instead of a fluid such as a refrigerant. Further, as the heating means, a heating means such as oil, hot air, microwave, electromagnetic induction or the like may be used instead of the pure water 82.

[0043]

As described above, since the processing apparatus of the present invention is configured as described above, the following effects can be obtained.

1) According to the processing apparatus of the first and second aspects, after the suction of the processing liquid pressure feeding means in the processing liquid supply system and
Since the discharge pressure can be detected and controlled to monitor the pressure value and the fluctuation of the pressure of the processing liquid, the processing liquid supply system can be easily and accurately managed, thereby improving the throughput and the yield. be able to.

2) According to the processing apparatus of the third to sixth aspects, the temperature and humidity of the clean air supplied from the air supply system into the processing chamber can be controlled, and the processing liquid is fed under pressure in the processing liquid supply system . After the suction of the means and the discharge pressure are detected
Since the pressure value of the processing liquid and the fluctuation of the pressure can be monitored by controlling, the management of both the air supply system and the processing liquid supply system can be facilitated, and the throughput and the yield can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a resist coating and developing processing system incorporating a processing apparatus of the present invention.

FIG. 2 is a schematic configuration diagram of a processing apparatus of the present invention.

FIG. 3 is a cross-sectional view of the electric pump according to the present invention.

FIG. 4 is a timing chart showing the discharge and suction operations of the electric pump.

FIG. 5 is a sectional view of a temperature and humidity air adjusting device according to the present invention.

FIG. 6 is a cross-sectional view showing a mounting state of a temperature sensor and a humidity sensor according to the present invention.

FIG. 7 is a bottom view of a main part of FIG. 6;

[Explanation of symbols]

 W Semiconductor wafer (object to be processed) 24 Resist supply nozzle (treatment liquid supply means) 30 Resist supply pipe (treatment liquid supply pipe) 31 Resist tank (treatment liquid supply source) 32 Electric pump (treatment liquid pressure supply means) 33 Filter 42 Pump part 50 Pressure sensor (pressure detection means) 51 Detector 52, 52A CPU (control means) 62 Temperature / humidity air supply device (temperature / humidity air supply means) 91 Temperature sensor (temperature detection means) 92 Humidity sensor (humidity detection means) ) 93 rectifier

Continuation of the front page (56) References JP-A-3-21309 (JP, A) JP-A-2-1113 (JP, A) JP-A-64-8620 (JP, A) JP-A-3-4146 (JP) , A) JP-A-6-7689 (JP, A) JP-A-2-133472 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 G03F 7/16 502

Claims (6)

(57) [Claims] 1. A processing apparatus comprising: a processing liquid supply means for supplying a processing liquid to an object to be processed; and a processing liquid supply pipe connecting the processing liquid supply means and a processing liquid supply source. a treatment liquid pumping means is interposed in the supply pipe is disposed in the flow of the processing liquid in the processing liquid pumping means
A pressure detecting means for detecting the suction pressure and discharge pressure of the treatment liquid by that detector, and a control means for issuing a predetermined control signal based on the detection signal from the pressure detecting means, and wherein the process apparatus. 2. A processing apparatus comprising: a processing liquid supply unit for supplying a processing liquid to an object to be processed; and a processing liquid supply pipe connecting the processing liquid supply unit and a processing liquid supply source. a treatment liquid pumping means is interposed in the supply pipe, the suction pressure of the process liquid by detecting body which is disposed conduit in the treatment liquid inlet side and the treatment liquid discharge side of the processing liquid pumping means and
A processing apparatus comprising: pressure detection means for detecting a discharge pressure; and control means for issuing a predetermined control signal based on a detection signal from the pressure detection means. 3. A processing chamber in which an object to be processed and processing liquid supply means for supplying a processing liquid to the object to be processed are provided; an air supply system for supplying clean air into the processing chamber; A processing liquid supply system for supplying a processing liquid to the liquid supply means, wherein the supply air is supplied to the air supply system based on a detection signal from a temperature and humidity detection means for detecting the temperature and humidity in the processing chamber. Temperature / humidity air supply means for controlling the temperature and humidity of the processing liquid, and a pressure detection means for detecting the suction pressure and the discharge pressure of the pressure supply means for the processing liquid flowing through the processing liquid supply system in the processing liquid supply system. And a control means for issuing a predetermined control signal based on the detection signal from the pressure detection means. 4. A rectifier is disposed near the air supply port of the processing chamber, and at least one of the temperature and humidity detectors is disposed in the rectifier so as to come into contact with air flowing along the rectifier. The processing apparatus according to claim 3, wherein: (5) The processing liquid supply system includes processing liquid supply means and processing liquid.
A processing liquid supply pipe connecting the processing liquid supply source and the processing liquid supply
A processing liquid pressure feeding means interposed in the supply pipe, and the processing liquid pressure feeding means;
Of the processing liquid in the means
Pressure detecting means for detecting the suction pressure and the discharge pressure of the processing liquid
The processing apparatus according to claim 3, further comprising: 6. The processing liquid supply system includes processing liquid supply means and processing liquid.
A processing liquid supply pipe connecting the processing liquid supply source and the processing liquid supply
A processing liquid pressure feeding means interposed in the supply pipe, and the processing liquid pressure feeding means;
Means are disposed in the pipeline on the processing liquid suction side and the processing liquid discharge side.
The suction pressure and discharge pressure of the processing liquid
4. A pressure detecting means comprising:
The processing device according to the above.