JPH07321377A - Luminous device and its manufacture - Google Patents

Abstract

PURPOSE:To provide a construction aiming at being common for lead frames while preventing the defective connection of bonding wires of a luminous device. CONSTITUTION:In a luminous device sealed with a transmissive resin so as to cover a luminous element 6 equipped with the luminous element 6 mounted on a lead 5a and a bonding wire 7 connecting the luminous element 6 to another lead 5b, a recessed portion 3 surrounding the luminous element 6 is provided, thereby forming a resin coupling portion 2 for fixing the leads. Also, in a manufacturing method for a luminous device 1 sealing with a light-transmissive resin so as to cover a luminous element 6 equipped with the luminous element 6 mounted on a lead 5a and a bonding wire 7 connecting the luminous element 6 to other lead 5b, a recessed portion surrounding the luminous element 6 is provided and the luminous element 6 is bonded to other lead 5b after forming a resin coupling portion 2 for fixing the lead 5a to other lead 5b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed light emitting device and a manufacturing method thereof, and more particularly to a structure for fixing leads of the light emitting device and a manufacturing method thereof.

[0002]

2. Description of the Related Art A conventional light emitting device 10 shown in FIG. 8 will be described in a manufacturing process. The lead frame shown in FIG. 9 capable of manufacturing a plurality of light emitting devices in series is formed by punching out a metal plate made of Fe or the like. The lead frame includes a first connecting portion 11, a second connecting portion 12, a third connecting portion 13, and
Leads 14a and 14b connected to the first connecting portion 11 and intersecting the second connecting portion 12 and the third connecting portion 13, and a lead 14a.
A reflection portion 15 having a substantially conical shape is formed at the tip end of the, and a lead terminal 16 is formed at the tip end of the lead 14b. 1 and 2 after plating the reflecting portion 15 of the lead frame shown in FIG. 9 and the lead terminal 16 and their vicinity with a metal such as Ag.
As shown in FIG. 1, the light emitting element 17 is mounted on the reflecting portion 15, and the electrode portion (not shown) of the light emitting element 17 and the lead terminal 1 are provided.
6 from the light emitting element 17 to the wire bonder capillary 1
At 9, a metal wire 18 such as Au is electrically connected.

Then, a resin sealing portion 20 is formed of a translucent resin so as to cover the reflecting portion 15 including the bonding wire and the lead terminal 16, and then the first connecting portion 11 and the second connecting portion 11 are formed.
The individual light emitting device 10 is manufactured by cutting the connecting portion 12 and the third connecting portion 13.

[0004]

However, when the conventional light emitting device 10 is manufactured, it is attempted to connect the wire 18 from the lead terminal 16 to the light emitting element 17 by the capillary 19 of the wire bonder as shown in FIG. When the capillary 19 applies an impact force to the lead terminal 16, the lead 1
4b vibrates.

By the way, the lead frame used for the light emitting device 10 is formed with the second connecting portion 12 for preventing the vibration of the lead 14b. However, in order to avoid the resin sealing of the light emitting device 10, the lead terminal 16 is formed. It was not possible to form it at a position close to, and the length of the lead 14b became long, and it was not possible to completely prevent vibration during wire bonding.

Therefore, due to the vibration of the lead terminal 14b,
Capillary 19 has shaken, and capillary 1
There is a problem in that the pressure contact of the lead wire 16 to the lead terminal 16 is insufficient, and a connection failure of the wire 18 to the lead terminal 16 occurs. Further, when manufacturing the light emitting device 10 having a relatively large diameter, the reflecting portion 15 had to be made large in order to increase the amount of reflected light of the light emitting device 10.

Therefore, it is necessary to prepare a lead frame for each diameter size so that the enlarged reflecting portion 15 does not protrude from the resin sealing portion 20, and not only a component is required for each diameter size, but also There is a problem in that the manufacturing process needs to be changed significantly according to the diameter of the light emitting device, and the manufacturing process becomes complicated. SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting device having a structure in which a lead frame is used in common while preventing defective connection of bonding wires of the light emitting device, and a method for manufacturing the same.

[0008]

In order to solve the conventional problems, the invention described in claim 1 of the present application is a light emitting device, and a light emitting element mounted on one lead, and the light emitting element A light emitting device comprising a bonding wire connecting the other lead and sealing the light emitting element with a translucent resin, having a recess surrounding the light emitting element and fixing the one and the other leads It is characterized in that it is provided with a resin connecting portion.

On the other hand, the invention described in claim 2 of the present application is
A method for manufacturing a light emitting device, comprising a light emitting element mounted on one lead and a bonding wire connecting the light emitting element and the other lead, and sealing with a translucent resin so as to cover the light emitting element. In the method for manufacturing a light emitting device described above, after forming a resin connecting portion that has a recess surrounding the light emitting element and fixes between the one and the other leads, bonding between the light emitting element and the other lead is performed. It has a feature.

[0010]

In the light emitting device, since the resin connecting portion for fixing the leads is provided, it is possible to reduce the length of the leads vibrated during wire bonding. Further, since the resin connecting portion for fixing the leads to each other is provided with the concave portion surrounding the light emitting element, the light quantity can be adjusted by the diameter of the concave portion.

In the method for manufacturing a light emitting device, after forming a resin connecting portion for fixing one lead and the other lead,
By bonding between the light emitting element and the other lead, it is possible to reduce the blurring of the lead during bonding.

[0012]

In the light emitting device of the present invention, since the leads having the recesses surrounding the light emitting element are fixed by the resin connecting portion, the length of the vibrated leads is reduced, and the capillaries at the time of manufacturing the light emitting device are reduced. Vibration of the reed can be prevented. Therefore, due to the blurring of the capillary,
It is possible to prevent insufficient pressure contact force to the lead terminal of the capillary.
This has an effect that it is possible to prevent defective connection of the wire connecting the light emitting element and the lead terminal to the lead terminal.

By providing a recess at a position corresponding to the light emitting element of the resin connecting portion for fixing the leads, light from the light emitting element does not leak to the lead side, and a light emitting device using the same light emitting element is provided. In addition to increasing the amount of reflected light, it is possible to further increase the amount of reflected light of the light emitting device when a resin having a high reflectance is used as the resin for fixing the leads to each other.

Further, since the resin connecting portion for fixing the leads is provided with the concave portion surrounding the light emitting element, the light quantity of the light emitting device can be adjusted by the diameter size of the concave portion, and the resin sealing portion of the light emitting device having a different diameter can be adjusted. The lead frame required for manufacturing can be standardized. Therefore, every time the diameter size is changed in the manufacturing process, it is not necessary to significantly switch the manufacturing apparatus according to the lead frame, and the manufacturing process can be simplified.

Furthermore, by forming the resin connecting portion for fixing the leads before mounting the light emitting element on the lead, the vicinity of the lead terminal of the lead and the resin connecting portion can be plated with metal at the same time. This has the effect that the amount of reflected light of a light emitting device using a light emitting element can be further increased. On the other hand, in the method for manufacturing a light emitting device, by forming a resin connecting portion for fixing one lead and the other lead and then bonding the light emitting element and the other lead, the blurring of the lead at the time of bonding is reduced. Therefore, it is possible to prevent a decrease in the pressure contact force of the capillary to the lead terminal, and it is possible to prevent the defective connection of the wire to the lead terminal and to make the connection in a short time.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a side view of an embodiment of a light emitting device of the present invention, which will be described below according to a manufacturing process. The lead frame used for the light emitting device 1 is made of Fe by the conventional method.
Is formed by punching out a metal plate made of, and has a lead 5a on which a light emitting element is mounted and a lead 5b having a lead terminal 4 at the tip.

After the lead frame is molded, as shown in FIGS. 2 and 3, a resin connecting portion 2 for commonly fixing the leads 5a and 5b so that a recess 3 is formed at the end of the lead 5a. Are formed by a known molding method.
Note that FIG. 3 shows a state in which FIG. 2 showing the manufacturing process of the light emitting device is viewed from the side. Then, the ends of the two leads 5a and 5b and the resin connecting portion 2 are plated with Ag so that the luminous efficiency of the light emitting device 1 is improved. Next, after mounting the light emitting element 6 on the bottom of the recess 3 formed in the resin connecting portion 2 and the tip of the lead 5a by a die bonder, as shown in FIG. 4, an electrode (not shown) of the light emitting element 6 is formed. ) And lead 5b
The lead terminal 4 at the tip of is connected by a bonding wire 7 with a wire bonder.

After that, the lead including the bonding wire 7 and the resin connecting portion 2 are formed into a resin sealing portion 8 with a light-transmitting resin to manufacture the light emitting device 1 shown in FIG. Next, FIG.
Shows a side view of a light emitting device according to another embodiment of the present invention, showing a light emitting device having three leads. A lead frame used in a light emitting device 1 having a lead 5a, on which a light emitting element is mounted, and a lead 5b, 5c having a lead terminal 4 at a tip thereof, which is obtained by punching out a metal plate made of Fe as in the above-described embodiment. Is molded.

Then, the three leads 5 of the lead frame
After the ends of a, 5b, and 5c are plated with Ag, as shown in FIGS. 6 and 7, two light emitting elements 6 that emit light of different colors are mounted on the tips of the leads 5a with a die bonder. To do. Note that FIG. 7 shows a state in which FIG. 6 showing the manufacturing process of the light emitting device is viewed from the side. Further, the resin connecting portion 2 for fixing the leads 5a and the leads 5b and 5c is formed by molding with white resin having high reflectance so that the recess 3 is formed at the end of the lead 5a. Next, the electrodes (not shown) of each light emitting element and the leads 5b and 5c
The lead terminal 4 of is connected with a wire bonder.

Thereafter, the leads including the bonding wires and the resin connecting portion 2 are formed into a resin sealing portion 8 with a light-transmitting resin to manufacture the light emitting device 1 shown in FIG. In the light emitting device 1 of the present embodiment, instead of forming the resin connecting portion 2 by molding, the resin connecting portion 2 formed in advance may be inserted and fixed in the lead frame. In that case, the resin connecting portion 2 can be easily attached to the lead frame,
Without significantly changing the manufacturing process of the conventional light emitting device,
The resin connecting portion 2 can be formed.

If the resin connecting portion 2 is formed before mounting the light emitting element 6 on the lead, both ends of the resin connecting portion 2 and the connecting portion 11 of the lead frame can be fixed at the same time. As a result, vibration or bending of the leads of the lead frame due to conveyance of the lead frame during manufacturing of the light emitting device 1 is less likely to occur, and mounting errors of the light emitting element 6 and wire bonding defects do not occur, and the manufacturing of the light emitting device 1 is prevented. It is possible to prevent the occurrence of defects.

Further, in the lead frame used in the light emitting device 1, one of the leads 5 on which the light emitting element 6 is mounted is mounted.
Since a is formed to be shorter than the other leads 5b and 5c having the lead terminals to which the bonding wire is directly connected, even if the light emitting element 6 is mounted on the lead 5a, the light emitting element 6
The height of the lead terminals 4 of the leads 5b and 5c becomes higher than the height of the electrode portion of. Accordingly, when wire bonding the light emitting element 6 and the lead terminal 4 to each other, if the light emitting element 6 side which is relatively low is used for the first bonding, the rising of the bonding wire can be used to perform the bonding to the higher lead terminal 4. Therefore, not only the height of the wire top can be reduced, the light emitting device 1 can be downsized, but also the resin sealing of the light emitting device 1 by the resin having the light transmitting property without being affected by the bonding wire. The shape of the portion 8 can be made to have a good optical characteristic.

Further, in the conventional light emitting device in which the lead is provided with the recess, since the diameter of the recess becomes large in proportion to the diameter of the light emitting device, the size of the lead for each diameter of the light emitting device, particularly the lead. Although the lead frames having different distances are used, in the light emitting device 1 of the present invention in which the recess 3 is formed in the resin connecting portion 2, if the diameter of the recess 3 is increased, the same light emitting element 6 is used. The amount of reflected light of the light emitting device 1 can be increased, and the amount of reflected light of the light emitting device 1 can be adjusted by the diameter dimension of the concave portion 3, and even if a lead frame having the same inter-lead distance is used. By adjusting the diameter of the recessed portion 3, the amount of reflected light can be obtained according to the diameter of the light emitting device 1, and the lead frame used in the light emitting device 1 can be shared. Therefore, there is an effect that it becomes easy to manufacture light emitting devices having various kinds of diameters and manage parts in the manufacturing process.

The present invention is based on the shapes, materials, and
It is not limited to the contents such as the procedure.

[Brief description of drawings]

FIG. 1 is a side view showing a light emitting device of an embodiment of the present invention.

FIG. 2 is a perspective view showing a part of a manufacturing process of a light emitting device according to an embodiment of the invention.

FIG. 3 is a perspective view showing a part of a manufacturing process of a light emitting device according to an embodiment of the present invention.

FIG. 4 is a side view showing a part of a manufacturing process of a light emitting device according to an embodiment of the present invention.

FIG. 5 is a side view showing a light emitting device of another embodiment of the present invention.

FIG. 6 is a perspective view showing a part of a manufacturing process of a light emitting device of another embodiment of the present invention.

FIG. 7 is a side view showing a part of a manufacturing process of a light emitting device of another embodiment of the present invention.

FIG. 8 is a side view showing a conventional light emitting device.

FIG. 9 is a plan view showing a lead frame used in a conventional light emitting device.

FIG. 10 is a perspective view illustrating a part of the manufacturing process of the conventional light emitting device.

FIG. 11 is a perspective view illustrating a part of the manufacturing process of the conventional light emitting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ...- Light emitting device 2 ... Resin connection part 3 ... Recessed part 4 ... Lead terminal 5a ... Lead 5b ... Lead 5c ... Lead 6 ... Light-emitting element 7 ... Bonding wire 8 ... Resin sealing part 10 ... Light emitting device 11 ... First connection part 12 ... Second connection part 13 ... Third connection part 14a ... Lead 14b ... Lead 15 ... Reflecting part 16 ... Lead terminal 17 ... Light emitting element 18 ... Bonding wire 19 ... Capillary 20 ... Resin sealing part

Claims (2)

[Claims] 1. A light emitting element mounted on one of the leads,
A light emitting device comprising the light emitting element and a bonding wire connecting the other lead, wherein the light emitting device is sealed with a translucent resin so as to cover the light emitting element. A light-emitting device comprising a resin connecting portion for fixing the leads. 2. A light emitting device mounted on one of the leads,
A method of manufacturing a light-emitting device, comprising: the light-emitting element and a bonding wire connecting the other lead, the light-emitting element being sealed with a translucent resin so as to cover the light-emitting element. And a resin connecting portion for fixing the other lead between the light emitting element and the other lead, and then bonding between the light emitting element and the other lead.