JPH07321148A - Mounting method and structure for semiconductor device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device mounting structure and a method, wherein a semiconductor device can be mounted on a circuit board high in productivity and reliability with conductive adhesive agent. CONSTITUTION:A thermoplastic conductive agent film is formed on a support board and then transferred onto the projecting contact points 4 of a semiconductor device 3 as kept in a plastic state by heating. Keeping conductive adhesive agent 8 transferred to the projecting contact points 4 in a plastic state, the projecting contact points 4 are brought into contact with the connecting electrodes 7 of a circuit board 6, and then conductive adhesive agent 8 is cured. Therefore, as thermoplastic conductive adhesive agent is quickly cured by cooling, a semiconductor device mounting process can be improved in productivity. A heating temperature required in a mounting operation is comparatively low, so that thermal stress caused by a difference in thermal expansion coefficient between a semiconductor device and a circuit board is very small, and a semiconductor module composed of them is enhanced in reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting method and a semiconductor device mounting body, and more particularly to improvement of a technique for mounting a semiconductor device face down with a conductive adhesive.

[0002]

2. Description of the Related Art Conventionally, as a method of mounting a semiconductor device on a circuit board by face down, a protruding contact made of a soldering alloy is previously formed on an electrode pad of the semiconductor device by a plating technique, and this protruding contact is used. The method of soldering to the connection electrode of the circuit board has been used, but in recent years, a method of connecting the semiconductor device to the circuit board using a conductive adhesive is being used.

As a method of mounting a semiconductor device using such a conductive adhesive, for example, US Pat. No. 4,661,192 is used.
As disclosed in the publication, there is a technique for simply connecting a semiconductor device to a circuit board by face down using a conductive adhesive. Hereinafter, a conventional mounting technique of a semiconductor device will be described with reference to the drawings.

FIG. 3 is a diagram showing a part of the mounting process of the semiconductor device, showing the process of transferring the conductive adhesive to the protruding contacts of the semiconductor device. Further, FIG. 4 is a cross-sectional view of a main part of a semiconductor device package formed by the above-described process.

In FIGS. 3 and 4, 9 is a semiconductor device, 10 is a terminal electrode formed on a predetermined portion of the semiconductor device 9, 11 is a protruding contact formed on the terminal electrode 10,
Reference numeral 12 is a coating film formed by applying a conductive epoxy resin, 13 is a supporting substrate, 14 is a circuit board, 15 is a connecting electrode on the circuit board 14, and 16 is a conductive epoxy resin transferred to the protruding contact 10. It is a transfer part.

The outline of a conventional semiconductor device mounting method using the above-described conductive adhesive and its mounting body will be described below.

First, a conductive epoxy resin coating film 10 is formed on a support base 13, and the semiconductor device 9 is connected to the protruding contact 1 from above the support base 13 as shown in FIG.
1 is lowered and the two are brought into contact with each other.
Then, the tip of the protruding contact 11 of the semiconductor device 9 is brought into contact with the coating film 12 of the conductive epoxy resin formed on the support base 13 to transfer the conductive epoxy resin to the protruding contact 11.

After that, the semiconductor device 9 in which the transfer portion 16 of the conductive epoxy resin is attached on the protruding contact 11 is aligned with the connection electrode 15 on the circuit board 14 and stacked, and then the conductive epoxy resin is cured. As a result, as shown in FIG. 4, a mounting body of the semiconductor device 9 using the conductive epoxy resin is obtained.

[0009]

However, in the mounting method of the semiconductor device and the mounting body thereof as described above,
Since a conductive epoxy resin is used as a conductive adhesive,
There is a problem that the time required to cure the conductive epoxy resin after the semiconductor device 9 is loaded on the circuit board 14 is long, and the productivity of the package of the semiconductor device 9 is low. That is, in general, 150 is required to cure the conductive epoxy resin.
This is because heat of about ° C and time of 1 hour or more are required.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device mounting method and a semiconductor device capable of easily mounting the semiconductor device on a circuit board with high productivity. It is to provide the implementation body of.

[0011]

In order to achieve the above object, the means for solving the problems of the present invention is to use a thermoplastic conductive adhesive as a resin constituting the conductive adhesive.

[0012] Specifically, the means taken by the invention of claim 1 is a thermoplastic method as a semiconductor device mounting method for mounting a semiconductor device having a protruding contact face down on a circuit board using a conductive adhesive. Forming a coating film of a conductive adhesive on the supporting substrate; and heating the conductive adhesive on the supporting substrate to keep it in a plastic state while making the protruding contacts of the semiconductor device conductive on the supporting substrate. Of the semiconductor device by contacting the coating film of the conductive adhesive to transfer the thermoplastic conductive adhesive to the protruding contact and maintaining the transfer portion of the conductive adhesive formed in the above process in the plastic state. Provided are a step of bringing the protruding contact into contact with the connecting electrode of the circuit board, and a step of cooling the conductive adhesive with the protruding contact of the semiconductor device in contact with the connecting electrode of the circuit board to bond the two. It is a method.

The means taken by the invention of claim 2 is defined by claim 1.
In the invention, the step of transferring the conductive adhesive to the protruding contact of the semiconductor device is a method of heating the semiconductor device to a temperature equal to or higher than a temperature at which the conductive adhesive becomes in a plastic state.

The means taken by the invention of claim 3 is the method of claim 1.
Alternatively, in the second aspect of the present invention, the step of bringing the protruding contact of the semiconductor device into contact with the connection electrode of the circuit board is a method of heating the semiconductor device to a temperature equal to or higher than a temperature at which the conductive adhesive is in a plastic state.

The means taken by the invention of claim 4 is defined by claim 1.
Alternatively, in the second aspect of the invention, the step of bringing the protruding contact of the semiconductor device into contact with the connection electrode of the circuit board is a method of heating the circuit board to a temperature at which the conductive adhesive is in a plastic state or higher.

According to the invention of claim 5, in the invention of claim 1, 2, 3 or 4, the conductive adhesive contains at least a thermoplastic resin and a conductive filler.

According to the invention of claim 6, in the invention of claim 1, 2, 3, 4 or 5, the protruding contact of the semiconductor device has a two-step protruding shape.

The means of the invention as set forth in claim 7 is intended for a semiconductor device mounting body in which a semiconductor device having protruding contacts is mounted on a circuit board. A protruding contact made of a conductive material is provided on the terminal electrode of the semiconductor device, and a connection electrode made of a conductive material is provided at a predetermined portion of the circuit board, and the protruding contact of the semiconductor device is made of a thermoplastic conductive material. It is configured to be fixed to the connection electrode of the circuit board with an adhesive.

The means taken by the invention of claim 8 is the method of claim 7.
In the invention, the protruding contact of the semiconductor device has a two-step protruding shape.

The means taken by the invention of claim 9 is defined by claim 7.
Alternatively, in the eighth invention, the conductive adhesive is configured to include at least a thermoplastic resin and a conductive filler.

[0021]

According to the first aspect of the present invention, the protruding contact of the semiconductor device and the connection electrode of the circuit board are fixed to each other through the conductive adhesive transferred to the protruding contact of the semiconductor device. . At that time, since the conductive adhesive is made of a thermoplastic resin, the conductive adhesive is hardened by simply cooling and the both are bonded. Therefore, unlike a thermosetting resin, it does not take a long time to cure due to a reaction, and the time required for the process is shortened. Moreover, in order to maintain the thermoplastic resin in the plastic state, it is not necessary to maintain the temperature as high as when the thermosetting resin is cured, so that the thermal expansion caused by the difference in the coefficient of thermal expansion between the semiconductor device and the circuit board The stress is also extremely small, and the reliability of the mounted semiconductor device is improved.

According to the second aspect of the present invention, when the conductive adhesive is transferred to the protruding contact of the semiconductor device, the protruding contact is heated to a temperature at which the semiconductor device is in a plastic state or higher, so that the protruding contact has a thermoplastic conductive adhesive. The temperature is maintained at a temperature at which the agent can be transferred, and transfer is smoothly performed.

According to the invention of claim 3 or 4, when the protruding contact of the semiconductor device and the connection electrode of the circuit board are brought into contact with each other, the semiconductor device or the circuit board is heated to a temperature not lower than the thermoplastic temperature, so that the thermoplastic conductive material The adhesive agent is maintained in a plastic state, and the adhesive agent also adheres to the connection electrode side. At that time, it is possible to perform heating by using a tool for adsorbing the semiconductor device or a support member for the circuit board, and the structure of the device is simplified.

According to the invention of claim 5, the function of the conductive adhesive is easily ensured by the thermoplastic resin and the conductive filler.

According to the sixth aspect of the invention, since the protruding contact has the two-step protruding shape, the cooling of the thermoplastic conductive adhesive is completed in a shorter time.

According to the invention of claim 7, in the semiconductor device mounted face down, the semiconductor device is mounted on the circuit board by the thermoplastic conductive adhesive, so that the time required for the mounting process of the semiconductor device is shortened. As a result, productivity is improved and cost is reduced. Further, since the heating temperature in the mounting process is lowered, the thermal stress caused by the difference in thermal expansion coefficient between the semiconductor device and the circuit board is suppressed to a very small level, and the reliability is improved.

In the inventions of claims 8 and 9, the same actions as those of the inventions of claims 6 and 5 can be obtained.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device mounting process according to an embodiment of the present invention and a semiconductor device mounting body obtained as a result will be described below with reference to the drawings.

FIGS. 1A to 1C are process drawings for explaining a method of mounting a semiconductor device according to an embodiment, and FIG. 2 is a cross-sectional view of a main part of a semiconductor device package manufactured by the mounting method of FIG. Is.

In FIGS. 1 and 2, 1 is a coating film of a thermoplastic conductive adhesive in a plastic state, 2 is a heated support base, 3 is a semiconductor device, and 4 is formed on a terminal electrode of the semiconductor device. The protruding contact 5 is a heating / sucking tool for heating and sucking the semiconductor device 3, 6 is a circuit board, 7 is a connecting electrode on the circuit board 6, and 8 is a transfer portion of a thermoplastic conductive adhesive. Is. Here, the thermoplastic conductive adhesive 1 is a thermoplastic resin such as a polyester resin containing a conductive filler such as Ag.

A method of mounting the semiconductor device configured as described above and a mounting body thereof will be described below with reference to the drawings.

First, as shown in FIG. 1A, a coating film 1 made of a plasticized thermoplastic conductive adhesive is formed on a supporting substrate 2. At this time, the support substrate 2 is heated to a temperature equal to or higher than the temperature at which the thermoplastic conductive adhesive becomes in a plastic state.

Then, as shown in FIG. 1 (b), while the semiconductor device 3 having the protruding contact 4 is adsorbed by the heating / adsorption tool 5, the protruding contact 4 is in a plastic state with the conductive adhesive coating film 1 Contact. At that time, the semiconductor device 3 is heated by the heating / adsorption tool 2 to a temperature equal to or higher than the temperature at which the conductive adhesive is in a plastic state. After that, when the semiconductor device 3 is pulled up by the heating / suction tool 5, a part of the thermoplastic conductive adhesive is transferred onto the protruding contact 4,
The transfer portion 8 is formed.

Next, as shown in FIG. 1 (c), heating and
The semiconductor device 3 is lowered while sucking the semiconductor device 3 with the suction tool 5, and the protruding contact 4 having the transfer portion 8 of the conductive adhesive formed on the tip is aligned with the connection electrode 7 on the circuit board 6. And contact them. At this time, since the conductive adhesive transfer portion 8 is heated and in a plastic state, the conductive adhesive adheres to the surface of the connection electrode 7.

After that, when the heating / suction tool 5 is separated from the semiconductor device 3, the transfer portion 8 of the thermoplastic conductive adhesive is cooled and hardened, and as shown in FIG. And the connection electrode 7 of the circuit board 6 are adhered to each other by the transfer portion 8 of the thermoplastic conductive adhesive. That is, a semiconductor device package is obtained.

In the above-described embodiment, since the semiconductor device and the circuit board are bonded by using the thermoplastic conductive adhesive that has been plasticized in advance, the conductive adhesive is short when the semiconductor device is mounted on the circuit board. Can be cured in time. Therefore, the productivity of the package of the semiconductor device using the conductive adhesive is improved and the cost is reduced.

Since the semiconductor device is mounted on the circuit board by using the conductive adhesive as described above, the thermal stress caused by the difference in the thermal expansion coefficient between the semiconductor device and the circuit board can be suppressed to an extremely small level. It is possible to obtain a highly reliable semiconductor device package.

In this embodiment, when the semiconductor device 3 is mounted on the circuit board 6, the semiconductor device 3 is heated by the heating / suction tool 5, but the semiconductor device 3 is heated by the suction tool. Instead, it may be adsorbed only. In that case, the circuit board 6 may be heated, and it is also possible to heat the thermoplastic conductive adhesive by other heating means such as irradiation with infrared rays.

Further, in the above-mentioned embodiment, as the thermoplastic conductive adhesive, a polyester resin containing a conductive filler such as Ag is used, but the conductive adhesive of the present invention is not limited to this embodiment. However, any material may be used as long as it has thermoplasticity and conductivity.

Further, in the above-mentioned embodiment, the protruding contact 4 has a simple cylindrical shape. However, if the protruding contact 4 has a two-step shape, the transfer portion 8 of the conductive adhesive can be cooled more quickly. The curing time can be shortened.

[0041]

As described above, according to the method of mounting a semiconductor device of the present invention, in order to bond the semiconductor device and the circuit board by using the thermoplastic conductive adhesive which is maintained in the plastic state in advance, The conductive adhesive can be cured in a short time when the semiconductor device is mounted on the circuit board, and thus the productivity of the semiconductor device mounting body using the conductive adhesive can be improved.

Further, the package of the semiconductor device of the present invention is
Since a thermoplastic conductive adhesive is used to bond the semiconductor device and the circuit board, there is almost no effect of thermal stress caused by the difference in thermal expansion coefficient between the semiconductor device and the circuit board, and highly reliable mounting of the semiconductor device is achieved. You can get the body.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a state of a semiconductor device or the like in a mounting process of a semiconductor device according to an embodiment.

FIG. 2 is a partial cross-sectional view of a mounted body of a semiconductor device in an example.

FIG. 3 is a partial cross-sectional view showing a state when a conductive adhesive is transferred to a protruding contact of a semiconductor device in a conventional semiconductor device mounting method.

FIG. 4 is a partial cross-sectional view of a mounting body obtained by a conventional semiconductor device mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 coating 2 support base 3 semiconductor device 4 protruding contact 5 heating / adsorption tool 6 circuit board 7 connection electrode 8 transfer part 9 semiconductor device 10 terminal electrode 11 protruding contact 12 coating 13 support base 14 circuit board 15 connection electrode 16 transfer part

Claims (9)

[Claims] 1. A method of mounting a semiconductor device having a protruding contact on a circuit board face down using a conductive adhesive, wherein a coating film of a thermoplastic conductive adhesive is formed on a supporting substrate. And the conductive adhesive on the supporting substrate is heated and kept in a plastic state while the protruding contact of the semiconductor device is brought into contact with the coating film of the conductive adhesive on the supporting substrate to form a protruding contact. A step of transferring a conductive adhesive to the step of contacting the protruding contact of the semiconductor device with the connection electrode of the circuit board while maintaining the transfer part of the conductive adhesive formed in the step in a plastic state, And a step of cooling the conductive adhesive in a state where the protruding contacts of the semiconductor device are in contact with the connection electrodes of the circuit board and adhering the two together. 2. The method for mounting a semiconductor device according to claim 1, wherein in the step of transferring the conductive adhesive to the protruding contact of the semiconductor device, the semiconductor device is heated to a temperature equal to or higher than a temperature at which the conductive adhesive is in a plastic state. A method for mounting a semiconductor device, comprising: 3. The method for mounting a semiconductor device according to claim 1, wherein in the step of bringing the protruding contact of the semiconductor device into contact with the connection electrode of the circuit board, the semiconductor device is heated to a temperature at which the conductive adhesive is in a plastic state. A method for mounting a semiconductor device, comprising heating to the above temperature. 4. The method for mounting a semiconductor device according to claim 1, wherein in the step of bringing the protruding contact of the semiconductor device into contact with the connection electrode of the circuit board, the temperature of the circuit board is equal to or higher than a temperature at which the conductive adhesive is in a plastic state. A method for mounting a semiconductor device, which comprises heating the semiconductor device to the temperature of. 5. The method for mounting a semiconductor device according to claim 1, 2, 3 or 4, wherein the conductive adhesive contains at least a thermoplastic resin and a conductive filler. Method. 6. The method of mounting a semiconductor device according to claim 1, 2, 3, 4 or 5, wherein the protruding contact of the semiconductor device has a two-step protruding shape. 7. A semiconductor device mounting body in which a semiconductor device is mounted on a circuit board, wherein a protruding contact made of a conductive material is formed on a terminal electrode of the semiconductor device, and formed on a predetermined portion of the circuit board. And a connection electrode made of a conductive material, wherein the protruding contact of the semiconductor device is fixed to the connection electrode of the circuit board with a thermoplastic conductive adhesive. 8. The semiconductor device mounting body according to claim 7, wherein the protruding contact of the semiconductor device has a two-step protruding shape. 9. The semiconductor device package according to claim 7, wherein the conductive adhesive contains at least a thermoplastic resin and a conductive filler.