JPH07288388A - Airtight housing - Google Patents

Abstract

PURPOSE:To provide an airtight housing provided with a cooling device which has good heat collecting and heat dissipating efficiency and enables effective use of a space inside an airtight housing. CONSTITUTION:An airtight housing 1 is formed of a cooling device 5 which is formed by connecting a heat pipe 3 wherein a radiation fin 4 is attached to an expansion tube part 2a formed in a copper or copper alloy plate 2 to a part or an entire of a wall surface. A wall surface itself of an airtight housing has cooling ability by constituting the airtight housing 1 in this way.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device comprising a hermetically sealed housing containing a heating element such as a power semiconductor element, particularly a copper plate having an expanded tube portion and a heat pipe to which a heat radiation fin is attached. The present invention relates to a hermetically-sealed case provided.

[0002]

2. Description of the Related Art Conventionally, a storage box (main conversion device) for electronic parts for controlling electric railway vehicles is housed in a housing provided with air holes, and wind is introduced from the air holes to cool the electronic parts inside the housing. However, since there is a problem that electronic components are contaminated by dust or the like, the housing has recently been shifted to a hermetically sealed state. In this case, it is necessary to attach a cooling device to suppress the temperature rise inside the housing due to the heat generation of the electronic parts and protect the electronic parts and the like.

The cooling device for the hermetically sealed housing is the actual open sho 58-20.
As disclosed in Japanese Patent No. 541, a heat pipe is penetrated into and out of a hermetically sealed casing, heat collecting fins are provided on a heat pipe inside the hermetically sealed casing, and a heat pipe is provided outside the hermetically sealed casing. Is provided with heat radiation fins, or without heat collecting fins, a heat pipe is directly adhered to the semiconductor (heating element) inside the closed casing to collect heat, and the heat is dissipated by the heat radiation fins outside the sealed casing. It is known to replace cold air with internal air by a fan.

Further, when a heat generating element is installed inside a hermetically sealed housing, if a heat collecting fin cannot be arranged, it is mounted as close as possible to the inner wall (side wall, ceiling, floor, etc.) of the housing or the housing. A cooling fin may be formed directly on the outer wall of the body, or black paint may be applied to increase the heat emissivity.

[0005]

A semiconductor element, a lead wire, a power source, etc. are arranged in a hermetically sealed case, and a heat collecting fin mounted on a heat pipe inside is relatively bulky, so that it is a space. Becomes cramped. Further, the structure as disclosed in the above publication requires a seal structure between the heat pipe and the side wall of the closed casing, and further uses a fan to cool the outside of the closed casing. If the air in the interior is replaced, dust may enter the interior and reduce the heat collection efficiency. And if the heating element is attached to the inner wall of the closed housing closely or the outer wall is directly formed with cooling fins, it is necessary to provide a certain space around it and arrange other members, or the closed housing. A plate material for the outer wall is required.

The present invention has been made to solve the above-mentioned problems, and has a hermetically sealed casing provided with a cooling device which has good heat collection and radiation efficiency and can effectively utilize the space in the hermetically sealed casing. Intended to provide the body.

[0007]

That is, in order to solve the above-mentioned problems, the present invention provides a hermetically sealed housing for dissipating a part or all of a wall surface to an expansion tube formed of a copper or copper alloy plate. It is characterized in that it is formed by a cooling device formed by connecting heat pipes to which fins are attached.

[0008]

When the hermetically sealed housing is used as the above means, the wall surface of the hermetically sealed housing 1 collects heat from the semiconductor element (heating element) or the like disposed inside, and the radiation fins 4 mounted on the heat pipe 3 are provided.
It will have a cooling capacity to radiate more heat. Closed enclosure 1
When installing the copper plate 2, the copper plate 2 should not be a hindrance to other members such as the ceiling portion and the side surface portion of the hermetically sealed housing 1, and may be attached to a convenient surface in consideration of the position where the radiation fins 4 can be easily arranged. I can. Since it is not necessary to provide heat collecting fins inside the closed casing 1, a space can be provided. If necessary, a fan may be installed in the closed casing 1 to agitate the inside thereof to further enhance the cooling efficiency.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall perspective view of a closed casing 1 of the present invention. A part or all of the wall surface of the closed casing 1 is a copper or copper alloy plate (hereinafter simply referred to as a copper plate) having a heat pipe 3 having a radiation fin 4 attached to one end thereof and an expansion tube portion 2a described later. And 2) are integrally formed with the cooling device 5. A heating element such as a semiconductor element or a power source is installed inside the closed casing 1.

FIG. 2 is a plan view of the cooling device 5, and FIG. 3 is a side view. The cooling device 5 has an expansion tube portion 2a in which two copper plates are superposed and joined to each other and a working fluid is circulated therein.
It is connected to the copper plate 2 in which the expansion tube portion 2a and the heat pipe 3 communicate with each other. The expansion tube portion 2a of the copper plate 2 is formed as follows. That is, as shown in FIG. 5 (A), one copper plate (a pilot hole P is bored in this copper plate) on which a contour pattern S to be the expansion tube portion 2a is printed in advance is joined to the other copper plate. In addition, a thin gap is formed in a portion of the contour pattern S, and the contour pattern is fixed by a bulging jig 6 and high pressure water is injected from the pilot hole P by bulging. The copper plate in the S portion is expanded to form the expansion tube portion 2a,
As shown in FIG. 5 (B), trimming processing is performed and cutting is performed.
As shown in (C), the expansion tube portion 2a is manufactured by brazing the base 7 with silver.

FIG. 4A is a sectional view taken along the line X--X in FIG. 2, in which one of the two copper plates is thickened.
(B) is a case where the two copper plates have the same thickness. As shown in these figures, the internal space of the expansion tube portion 2a serves as a flow path for the working medium (liquid).

A heat pipe 3 is brazed and connected to the end of the expansion tube portion 2a of the copper plate 2 instead of (or to) the base 7, and the inside of the heat pipe 3 and the copper plate 2 are connected.
A working medium that carries heat is vacuum-sealed inside the expansion tube portion 2a. In this case, the expansion tube portion 2a of the copper plate 2 serves as an evaporation portion (heat receiving portion) of the working medium, and the heat pipe 3 to which the radiation fins 4 are attached serves as a condensation portion (radiation portion) of the working medium. That is, as the working medium (working liquid), specifically, alcohol, fluorine-based gas, water, perfluorocarbon, etc. are enclosed, and the heat generated from the semiconductor element (heating element) etc. is It is transported from the expansion tube portion 2a of the copper plate 2 to the heat radiation fins 4 attached to the heat pipe 3 through the working fluid, and the sealed housing 1
The heat is exchanged with the outside air and is radiated.

Next, the heat pipe 3 or the heat radiation fin 4 is made of copper, copper alloy, aluminum alloy or the like having good thermal conductivity. The heat pipe 3 is located near the heat radiation fin 4 in a so-called corrugation. -It may be processed so that it can be flexibly bent and arranged at an arbitrary angle. If such corrugation is applied, the radiation fins 4 can be directed in the most appropriate direction according to the situation of the closed casing 1 to be installed, which is extremely convenient.

As described above, in the hermetically sealed housing 1 of the present invention, the heat pipe 3 to which the heat radiation fins 4 are attached is connected to the expansion tube portion 2a of the copper or copper alloy plate 2 by brazing or the like to be integrated. Since the cooling device 5 is the wall surface of the closed casing 1,
The wall surface of the closed casing itself has a cooling capability of collecting the heat from the semiconductor element (heating element) or the like disposed inside and radiating the heat from the radiation fins 4 attached to the heat pipe 3. When the closed casing 1 is installed, the copper plate 2 is
It can be mounted on a convenient surface in consideration of the position where the radiation fins 4 can be easily arranged without interfering with other members such as the ceiling portion and the side surface portion. Since it is not necessary to provide heat collecting fins inside the closed casing 1, a space can be provided. If necessary, a cooling fan can be installed in the closed casing 1 to agitate the inside to further enhance the cooling efficiency.

FIG. 6 is a plan view of a modification of the copper plate 2. As shown in this figure and the cooling device installed on the ceiling of the closed casing 1 in FIG. 1, the expansion tube portion 2a for enclosing the working fluid formed on the copper plate 2 is a semiconductor element or the like arranged inside the closed casing 1. Various shapes and capacities can be used depending on the amount of heat received from the heating element. That is, the heat receiving capacity and the heat radiating capacity can be increased while the capacity of the closed casing 1 itself is constant.

In the above description, in the hermetically sealed enclosure of the present invention, a part or the whole of the wall surface is formed by the cooling device 5, but the cooling device 5 is not used as a wall surface, but a conventional hermetically sealed structure. A portion of the copper or copper alloy plate 2 having the expansion tube portion 2a formed therein is disposed as a heat collecting plate inside a hermetically sealed housing made of a normal plate material such as a housing, and the heat pipe 3 and the radiation fins 4 are arranged. It is of course possible to use it as a cooling device in which the portion is arranged outside the hermetically sealed casing.

[0017]

Since the hermetically sealed housing of the present invention has the structure described in detail above, the hermetically sealed housing itself has a heat exchange capacity, and the cooling capacity can be improved. Further, it is possible to efficiently collect heat and dissipate heat to the outside of the closed casing without providing heat collecting fins inside the closed casing, and if the radiation fin is of a self-cooling type, the fan can be omitted. In addition, since the heat pipe is not inserted in this closed casing, a seal structure is not required in the heat pipe mounting portion. Furthermore, since heat collecting fins are not arranged in the closed casing, parts and leads are not provided inside. There is a space in arranging the lines.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a hermetically sealed housing of the present invention.

FIG. 2 is a plan view of the closed casing according to the present invention.

FIG. 3 is a side view of the hermetically sealed housing of the present invention.

4A is a cross-sectional view taken along the line XX in FIG. 2, in which one of the two copper plates is thickened, and FIG.
FIG. 6B is a diagram in the case where the two copper plates have the same thickness.

FIG. 5 is a production explanatory view in the case of forming an expansion tube portion on a copper plate used in the present invention, and FIG. 5 (A) is a diagram in which one copper plate is printed with a paint that chemically reacts with copper and overlapped to be expanded. FIG. 5 (B) is a perspective view showing a state in which water pressure is applied to the concave portion of the contour pattern portion that becomes the pipe portion, FIG. It is a perspective view showing the state where the mouthpiece is brazed to the expansion tube portion.

FIG. 6 is a plan view of a modified example of the copper plate.

[Explanation of symbols]

 1 Sealed case 2 Copper plate 2a Expansion tube part 3 Heat pipe 4 Radiating fin 5 Cooling device

Claims (1)

[Claims] 1. A hermetically sealed structure characterized in that part or all of the wall surface is formed by a cooling device formed by connecting a heat pipe with a radiation fin attached to an expansion tube formed of a copper or copper alloy plate. Case.