JPH07336077A - Cooling structure of heating-element package - Google Patents
Cooling structure of heating-element packageInfo
- Publication number
- JPH07336077A JPH07336077A JP6131504A JP13150494A JPH07336077A JP H07336077 A JPH07336077 A JP H07336077A JP 6131504 A JP6131504 A JP 6131504A JP 13150494 A JP13150494 A JP 13150494A JP H07336077 A JPH07336077 A JP H07336077A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- refrigerant
- view
- package
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＬＳＩなどの発熱体パ
ッケージの冷却構造に関する。半導体チップなどの発熱
体を収容するパッケージは、半導体チップの集積度が高
くなるにしたがって発熱量が増加し、空冷だけでは十分
に冷却できなくなってきているため、その冷却効率を改
善することが要望されている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for a heating element package such as an LSI. A package containing a heating element such as a semiconductor chip increases in heat generation as the degree of integration of the semiconductor chip increases, and it has become impossible to sufficiently cool it by air cooling alone, so it is desirable to improve its cooling efficiency. Has been done.
【０００２】[0002]
【従来の技術】図10(a),(b) の側断面図及びその斜視平
面図に示すように、従来の発熱体パッケージは、セラミ
ックなどからなるパッケージ基体11の中央に穿設した凹
部11a内に半導体チップ10をダイボンディングにより固
着している。半導体チップ10の電極は、裏面に突出した
入出力端子ピン12に接続した凹部11a 内面の電極にボン
ディングワイヤ13により接続するとともに、凹部11a を
覆う封止板14を凹部11aの周縁に形成したメタライズ面
にろう付け接合している。2. Description of the Related Art As shown in the side sectional views of FIGS. 10 (a) and 10 (b) and its perspective plan view, a conventional heating element package has a recess 11a formed in the center of a package base 11 made of ceramic or the like. The semiconductor chip 10 is fixed inside by die bonding. The electrodes of the semiconductor chip 10 are connected to the electrodes on the inner surface of the recess 11a connected to the input / output terminal pins 12 protruding on the back surface by the bonding wires 13, and the sealing plate 14 covering the recess 11a is formed on the periphery of the recess 11a. The surface is brazed and joined.
【０００３】この発熱体パッケージは、図示しない送風
機からの空気流中に配置することにより空冷している。This heating element package is air-cooled by being placed in an air flow from a blower (not shown).
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな上記冷却構造によれば、半導体チップの集積度が高
くなるにしたがって発熱量が増加し、空冷だけでは十分
に冷却できないといった問題があった。However, according to the above cooling structure, there is a problem in that the amount of heat generated increases as the degree of integration of the semiconductor chips increases, and the air cooling alone cannot sufficiently cool the semiconductor chip.
【０００５】上記問題点に鑑み、本発明は発熱体パッケ
ージに冷媒の流路を付設することにより効率よく冷却で
きる発熱体パッケージの冷却構造を提供することを目的
とする。In view of the above problems, it is an object of the present invention to provide a cooling structure for a heating element package which can be efficiently cooled by providing a cooling medium passage in the heating element package.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明の発熱体パッケージの冷却構造においては、
半導体チップを固着したパッケージ基体と、該半導体チ
ップを囲包する形状に形成し互いに離隔した位置に備え
る冷媒出入口から冷媒を流通する空間を有するジャケッ
トとからなり、該ジャケットを前記パッケージ基体に接
合して前記半導体チップを封止するとともに、ジャケッ
トに冷媒を流通し冷却するように構成する。In order to achieve the above object, in the cooling structure of the heating element package of the present invention,
It is composed of a package base to which a semiconductor chip is fixed, and a jacket formed in a shape surrounding the semiconductor chip and having a space for allowing a coolant to flow from a coolant inlet / outlet provided at positions separated from each other. The jacket is joined to the package base. The semiconductor chip is sealed by the above, and a coolant is circulated through the jacket to cool it.
【０００７】あるいは、半導体チップを固着したパッケ
ージ基体と、該半導体チップを囲包する形状に形成し互
いに離隔した位置に冷媒出入口を備える封止板とからな
り、該封止板を前記パッケージ基体に接合して前記半導
体チップを封止するとともに冷媒を流通する空間を形成
し、半導体チップを冷媒中に浸漬し冷却するように構成
する。Alternatively, it comprises a package base to which a semiconductor chip is fixed, and a sealing plate which is formed in a shape to surround the semiconductor chip and has a coolant inlet and outlet at positions separated from each other. The semiconductor chip is bonded to seal the semiconductor chip, a space for circulating a coolant is formed, and the semiconductor chip is immersed in the coolant for cooling.
【０００８】[0008]
【作用】パッケージ基体に固着した半導体チップを囲包
し封止する従来の封止板の替わりに、冷媒出入口を備え
冷媒を流通する空間を有するジャケットで半導体チップ
を囲包し封止することにより、ジャケットの空間に冷媒
を流通し、パッケージ基体からジャケットに伝導される
熱を冷媒に吸収できるため、効率よく冷却することがで
きる。By replacing the conventional sealing plate that encloses and seals the semiconductor chip fixed to the package base, by enclosing and encapsulating the semiconductor chip with a jacket having a refrigerant inlet / outlet and a space through which the refrigerant flows. Since the refrigerant flows in the space of the jacket and the heat conducted from the package base to the jacket can be absorbed by the refrigerant, the cooling can be efficiently performed.
【０００９】あるいは、パッケージ基体に固着した半導
体チップを囲包し封止する従来の封止板の替わりに、冷
媒出入口を備える封止板で半導体チップを囲包し封止す
ることにより、半導体チップを内包した空間に冷媒を流
通し、半導体チップを冷媒中に浸漬することにより、半
導体チップの熱を冷媒に直接、吸収できるため、より効
率よく冷却することができる。Alternatively, instead of the conventional sealing plate that encloses and seals the semiconductor chip fixed to the package base, the semiconductor chip is enclosed and sealed by a sealing plate having a refrigerant inlet / outlet, thereby The heat of the semiconductor chip can be directly absorbed by the coolant by circulating the coolant in the space containing the and immersing the semiconductor chip in the coolant, so that the cooling can be performed more efficiently.
【００１０】[0010]
【実施例】以下、図面に示した実施例に基づいて本発明
の要旨を詳細に説明する。なお、全図をとおして同じ構
成要素には同一符号を付している。DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be described in detail below with reference to the embodiments shown in the drawings. The same components are denoted by the same reference symbols throughout the drawings.
【００１１】図１(a),(b) は、本発明の第１実施例の側
断面図及びその斜視平面図である。図１に示す発熱体パ
ッケージは、従来同様にセラミックなどからなるパッケ
ージ基体１の中央に穿設した四角形の凹部1a内に半導体
チップ10をダイボンディングにより固着し、半導体チッ
プ10の電極は、裏面に突設した入出力端子ピン２の電極
にボンディングワイヤ３により接続する。1 (a) and 1 (b) are a side sectional view and a perspective plan view of the first embodiment of the present invention. In the heating element package shown in FIG. 1, a semiconductor chip 10 is fixed by die bonding in a rectangular recess 1a formed in the center of a package base 1 made of ceramic or the like as in the conventional case, and the electrodes of the semiconductor chip 10 are provided on the back surface. Bonding wires 3 are connected to the electrodes of the protruding input / output terminal pins 2.
【００１２】凹部1aは、高熱伝導性の金属薄板でできた
封止板４で覆い、凹部1aの周縁に施したメタライズ接合
面にろう付けする。（以下の各実施例において、パッケ
ージ基体のろう付け面には予め、メタライズ加工が施し
てある）封止板４には、互いに離隔した位置、即ち対角
位置に冷媒出入口６（図は配管が接続し易いようにニッ
プルを突設している）を突設し、凹部1aの空間５内に冷
媒７を循環することにより半導体チップ10を冷媒７中に
曝す。The recess 1a is covered with a sealing plate 4 made of a thin metal plate having high thermal conductivity, and is brazed to the metallized joint surface formed on the periphery of the recess 1a. (In each of the following examples, the brazing surface of the package base has been metallized in advance.) The sealing plate 4 has a refrigerant inlet / outlet 6 (a pipe is shown in the figure) at a position separated from each other, that is, a diagonal position. The semiconductor chip 10 is exposed in the coolant 7 by projecting a nipple so as to facilitate connection and circulating the coolant 7 in the space 5 of the recess 1a.
【００１３】凹部1aの空間５を循環する冷媒７は、フロ
ン、液体窒素、弗化炭素、空気などを用いる。この発熱
体パッケージは、従来同様に図示しない送風機からの冷
却空気中に曝し空冷するが、半導体チップを冷媒中に浸
漬するため、接合部から封止板に伝導した熱の他に、冷
媒に半導体チップの発熱を直接、吸収できるため、冷却
効率を改善することができる。The refrigerant 7 circulating in the space 5 of the recess 1a is CFC, liquid nitrogen, carbon fluoride, air or the like. This heating element package is air-cooled by exposing it to cooling air from a blower (not shown) as in the conventional case, but since the semiconductor chip is immersed in the cooling medium, in addition to the heat conducted from the joint to the sealing plate, the cooling medium is used as a semiconductor. Since the heat generated by the chip can be directly absorbed, the cooling efficiency can be improved.
【００１４】図２(a),(b) は、第２実施例の側断面図及
びその斜視平面図で、第１実施例と同様に浸漬冷却の場
合である。図２の発熱体パッケージは、半導体チップ10
を固着する凹部1aをパッケージ基体１の反対側（入出力
端子ピン２の突出側）に穿設する。凹部1aは封止板４で
封止し凹部1aに冷媒７を流通する空間５を形成する。こ
の空間５と連通する貫通孔1a-1をパッケージ基体１に穿
設し、貫通孔1a-1の上側に冷媒出入口（ニップル）６を
備える点が異なる。FIGS. 2 (a) and 2 (b) are a side sectional view and a perspective plan view of the second embodiment, showing the case of immersion cooling as in the first embodiment. The heating element package of FIG.
A concave portion 1a for fixing is attached to the opposite side of the package substrate 1 (the protruding side of the input / output terminal pin 2). The recess 1a is sealed with a sealing plate 4 to form a space 5 through which the coolant 7 flows in the recess 1a. A different point is that a through hole 1a-1 communicating with the space 5 is formed in the package base 1, and a refrigerant inlet / outlet (nipple) 6 is provided above the through hole 1a-1.
【００１５】これにより、第１実施例の浸漬冷却の場合
と同様の作用、効果を奏する。図３(a),(b) は、第３実
施例の側断面図及びその斜視平面図である。図３の発熱
体パッケージは、半導体チップ10を固着した凹部1aを閉
じる封止板４を凹部1aの周縁にろう付け接合するが、さ
らにこの封止板４はその接合部の周りにパッケージ基体
１上面との間に冷媒７を流通する環状の空間８を形成す
るように絞り成形してあり、その空間８の対角位置に冷
媒出入口（ニップル）６を突設するとともに封止板４の
最外周縁をパッケージ基体１上面にろう付け接合する点
が異なる。なお、この場合の冷媒は半導体チップに直
接、接触しないため、電気的絶縁性のない水であっても
よい。As a result, the same action and effect as in the immersion cooling of the first embodiment are achieved. 3 (a) and 3 (b) are a side sectional view and a perspective plan view of the third embodiment. In the heating element package of FIG. 3, a sealing plate 4 that closes the recess 1a to which the semiconductor chip 10 is fixed is brazed and bonded to the peripheral edge of the recess 1a. It is draw-formed so as to form an annular space 8 through which the refrigerant 7 circulates with the upper surface. A refrigerant inlet / outlet (nipple) 6 is provided at a diagonal position of the space 8 and the sealing plate 4 The difference is that the outer peripheral edge is brazed to the upper surface of the package base 1. Since the coolant in this case does not come into direct contact with the semiconductor chip, it may be water without electrical insulation.
【００１６】これにより、冷媒はパッケージ基体との接
合部から封止板に伝導した熱の他に、パッケージ基体上
面に直接、接触して半導体チップからの伝導熱を吸収す
ることができるため、冷却効率を改善することができ
る。As a result, the coolant can directly contact the upper surface of the package base and absorb the conductive heat from the semiconductor chip in addition to the heat conducted to the sealing plate from the joint with the package base, so that the cooling can be performed. The efficiency can be improved.
【００１７】図４(a),(b) は、第４実施例の側断面図及
びその斜視平面図である。図４の発熱体パッケージは、
半導体チップ10を固着した凹部1aを閉じる封止板４を凹
部1aの周縁にろう付け接合するが、さらに封止板４との
間に冷媒７が流通する空間８を拡張するように絞り成形
した外壁板９をパッケージ基体１上面にろう付け接合す
る点が異なる。FIGS. 4A and 4B are a side sectional view and a perspective plan view of the fourth embodiment. The heating element package of FIG.
A sealing plate 4 for closing the recess 1a to which the semiconductor chip 10 is fixed is brazed and joined to the peripheral edge of the recess 1a, and is further drawn so as to expand the space 8 through which the coolant 7 flows between the sealing plate 4 and the sealing plate 4. The difference is that the outer wall plate 9 is brazed to the upper surface of the package base 1.
【００１８】これにより、拡張された空間を流通する冷
媒はパッケージ基体に直接、接触して半導体チップから
の伝導熱を吸収するとともに、パッケージ基体との接合
部から封止板及び外壁板に伝導した熱も冷媒に吸収する
ことができるため、さらに冷却効率を改善することがで
きる。As a result, the coolant flowing through the expanded space directly contacts the package base to absorb the conduction heat from the semiconductor chip, and also conducts from the joint with the package base to the sealing plate and the outer wall plate. Since the heat can also be absorbed by the refrigerant, the cooling efficiency can be further improved.
【００１９】図５(a),(b) は、第４実施例を変形した第
５実施例の側断面図及びその斜視平面図である。図５の
発熱体パッケージは、凹部1aを閉じる封止板４の中央面
を半導体チップ10の上面に接触するように絞り成形し、
その接触部10a に図示しないサーマルコンパウンドを塗
布介在して接触させる点が異なる。5 (a) and 5 (b) are a side sectional view and a perspective plan view of a modified fifth embodiment of the fourth embodiment. The heating element package of FIG. 5 is formed by drawing so that the central surface of the sealing plate 4 that closes the recess 1a is in contact with the upper surface of the semiconductor chip 10.
The difference is that a thermal compound (not shown) is applied to the contact portion 10a to intervene.
【００２０】これにより、封止板はパッケージ基体との
接合部からの熱伝導に加えてさらに半導体チップ上面と
の接触部からも熱伝導できるため、第４実施例より冷却
効率を改善することができる。As a result, the sealing plate can conduct heat not only from the joint with the package base but also from the contact with the upper surface of the semiconductor chip, so that the cooling efficiency can be improved as compared with the fourth embodiment. it can.
【００２１】図６(a),(b) は、第５実施例を変形した第
６実施例の側断面図及びその斜視平面図である。図６の
発熱体パッケージは、半導体チップ10上面と接触する封
止板４の中央面の周囲に撓み易くする波形の襞4a-1を絞
り成形した点が異なる。6 (a) and 6 (b) are a side sectional view and a perspective plan view of a sixth embodiment which is a modification of the fifth embodiment. The heating element package of FIG. 6 is different in that a corrugated fold 4a-1 that facilitates bending is drawn around the central surface of the sealing plate 4 that contacts the upper surface of the semiconductor chip 10.
【００２２】これにより、第５実施例と同様の作用によ
り冷却効率を改善できるとともに、波形の襞部分の可撓
性により熱膨張差などによる不要な応力が半導体チップ
との接触部分に生じるのを防止することができる。As a result, the cooling efficiency can be improved by the same action as that of the fifth embodiment, and unnecessary stress due to the difference in thermal expansion or the like is generated in the contact portion with the semiconductor chip due to the flexibility of the corrugated fold portion. Can be prevented.
【００２３】図７(a),(b) は、第７実施例の側断面図及
びその斜視平面図である。図７の発熱体パッケージは、
半導体チップ10を固着した凹部1aを、冷媒７が流通する
ジャケット41で封止した点が異なる。FIGS. 7A and 7B are a side sectional view and a perspective plan view of the seventh embodiment. The heating element package of FIG.
The difference is that the recess 1a to which the semiconductor chip 10 is fixed is sealed with a jacket 41 through which the coolant 7 flows.
【００２４】このジャケット41は、高熱伝導性の金属薄
板でなり、凹部1aを封じる第４実施例と同様の封止板41
a と対角位置に冷媒出入口（ニップル）６を突設した外
壁板41b とからなり、封止板41a と外壁板41b との間に
冷媒７が流通する空間41c を形成し重ね合わせ封着す
る。ジャケット41の外周縁は凹部1a周縁のメタリック接
合面にろう付けし凹部1aを気密に封止する。The jacket 41 is made of a thin metal plate having high thermal conductivity, and is the same as the sealing plate 41 for sealing the recess 1a in the fourth embodiment.
It is composed of a and an outer wall plate 41b having a refrigerant inlet / outlet (nipple) 6 projecting in a diagonal position, and a space 41c in which the refrigerant 7 flows is formed between the sealing plate 41a and the outer wall plate 41b to be superposed and sealed. . The outer peripheral edge of the jacket 41 is brazed to the metallic bonding surface of the peripheral edge of the recess 1a to hermetically seal the recess 1a.
【００２５】この第７実施例では、凹部を封じる封止板
を冷媒が循環するジャケット構造にすることで、構造が
簡単になりパッケージ基体との接合部からの伝導熱を冷
媒により吸収できるため、冷却効率を改善することがで
きる。In the seventh embodiment, since the sealing plate for sealing the concave portion has a jacket structure in which the refrigerant circulates, the structure is simplified and the conduction heat from the joint with the package base can be absorbed by the refrigerant. The cooling efficiency can be improved.
【００２６】図８(a),(b) は、第７実施例を変形した第
８実施例の側断面図及びその斜視平面図である。図８の
発熱体パッケージは、第７実施例と同様に構成するが、
さらに第５実施例を適用し、凹部1aを閉じるジャケット
41の封止板41a の中央面を半導体チップ10の上面に接触
するように絞り成形し、その接触部10a に図示しないサ
ーマルコンパウンドを塗布介在して接触させる点が異な
る。FIGS. 8A and 8B are a side sectional view and a perspective plan view of an eighth embodiment obtained by modifying the seventh embodiment. The heating element package of FIG. 8 has the same configuration as that of the seventh embodiment,
Furthermore, a jacket to which the fifth embodiment is applied to close the recess 1a.
The difference is that the central surface of the sealing plate 41a of 41 is formed by drawing so as to contact the upper surface of the semiconductor chip 10, and a thermal compound (not shown) is applied to the contact portion 10a so as to make contact.
【００２７】これにより、ジャケットを循環する冷媒
は、パッケージ基体との接合部からの伝導熱と半導体チ
ップ上面との接触部からの伝導熱とを吸収できるため、
冷却効率を改善することができる。As a result, the coolant circulating in the jacket can absorb the conduction heat from the joint with the package base and the conduction heat from the contact with the upper surface of the semiconductor chip.
The cooling efficiency can be improved.
【００２８】図９(a),(b) は、第８実施例を変形した第
９実施例の側断面図及びその斜視平面図である。図９の
発熱体パッケージは、第８実施例と同様に構成するが、
さらに第６実施例を適用し、半導体チップ10上面と接触
する封止板41a の中央面の周囲に撓み易くする波形の襞
41a-1 を絞り成形した点が異なる。9 (a) and 9 (b) are a side sectional view and a perspective plan view of a ninth embodiment which is a modification of the eighth embodiment. The heating element package of FIG. 9 has the same configuration as that of the eighth embodiment,
Further, by applying the sixth embodiment, the corrugated folds which facilitate the bending around the central surface of the sealing plate 41a which is in contact with the upper surface of the semiconductor chip 10 are provided.
The difference is that 41a-1 was drawn.
【００２９】これにより、第６実施例及び第８実施例と
同様の作用、効果を奏することができる。なお、上記説
明の各実施例は、パッケージ基体の凹部に半導体チップ
を１個に限らず複数個が配置する場合にも同様に適用す
ることができる。また、凹部に収容した半導体チップを
対象にするだけてなく、パッケージ基体の平坦な表面に
配置した半導体チップもそれらを囲包する形状の封止部
材をパッケージ基体に接合して封止し、上記各実施例の
如き冷媒の流通空間を形成することでも効率よく冷却で
きることは言うまでもない。また、発熱体は上記説明の
半導体チップに限らず他の発熱体（発熱素子）を収容し
たパッケージの冷却構造にも適用できることは言うまで
もない。As a result, the same operation and effect as those of the sixth and eighth embodiments can be obtained. The above-described embodiments can be similarly applied to the case where a plurality of semiconductor chips are arranged in the recess of the package base body. Further, not only the semiconductor chips housed in the recesses are targeted, but also the semiconductor chips arranged on the flat surface of the package base are sealed by bonding a sealing member having a shape surrounding them to the package base. It goes without saying that the cooling space can be efficiently cooled by forming the circulation space for the refrigerant as in each embodiment. Further, it goes without saying that the heating element is not limited to the semiconductor chip described above, and can be applied to a cooling structure of a package containing another heating element (heating element).
【００３０】[0030]
【発明の効果】以上、詳述したように本発明によれば、
パッケージ基体に固着した半導体チップなどの発熱体を
冷媒の流通空間を有するジャケットで封止するか、ある
いは発熱体を直接、冷媒の流通空間に曝す構造とするな
ど冷媒の流路を発熱体パッケージに付設することによ
り、冷却構造が簡略化されるとともに冷却効率を改善す
ることができるため、発熱体の集積度が高くなり発熱量
が増加した発熱体パッケージに適用し低コストで冷却効
率のよい発熱体パッケージを提供することができるとい
った産業上極めて有用な効果を発揮する。As described above in detail, according to the present invention,
For example, the heating element such as a semiconductor chip fixed to the package base is sealed with a jacket having a refrigerant circulation space, or the heating element is directly exposed to the refrigerant circulation space. By attaching it, the cooling structure can be simplified and the cooling efficiency can be improved, so it can be applied to a heating element package in which the degree of integration of heating elements is high and the amount of heat generated is increased. It has an extremely useful effect in the industry that a body package can be provided.
【図１】 本発明の第１実施例の側断面図及びその斜視
平面図FIG. 1 is a side sectional view and a perspective plan view of a first embodiment of the present invention.
【図２】 本発明の第２実施例の側断面図及びその斜視
平面図FIG. 2 is a side sectional view and a perspective plan view of a second embodiment of the present invention.
【図３】 本発明の第３実施例の側断面図及びその斜視
平面図FIG. 3 is a side sectional view and a perspective plan view of a third embodiment of the present invention.
【図４】 本発明の第４実施例の側断面図及びその斜視
平面図FIG. 4 is a side sectional view and a perspective plan view of a fourth embodiment of the present invention.
【図５】 本発明の第５実施例の側断面図及びその斜視
平面図FIG. 5 is a side sectional view and a perspective plan view of a fifth embodiment of the present invention.
【図６】 本発明の第６実施例の側断面図及びその斜視
平面図FIG. 6 is a side sectional view and a perspective plan view of a sixth embodiment of the present invention.
【図７】 本発明の第７実施例の側断面図及びその斜視
平面図FIG. 7 is a side sectional view and a perspective plan view of a seventh embodiment of the present invention.
【図８】 本発明の第８実施例の側断面図及びその斜視
平面図FIG. 8 is a side sectional view and a perspective plan view of an eighth embodiment of the present invention.
【図９】 本発明の第９実施例の側断面図及びその斜視
平面図FIG. 9 is a side sectional view and a perspective plan view of a ninth embodiment of the present invention.
【図10】 従来技術による側断面図及びその斜視平面図FIG. 10 is a side sectional view and a perspective plan view thereof according to the related art.
１ パッケージ基体 1a 凹部 ４ 封止板 ５ 空間 ６ 冷媒出入口 ７ 冷媒 10 半導体チップ（発熱体） 41 ジャケット 41c 空間 1 Package Base 1a Recess 4 Sealing Plate 5 Space 6 Refrigerant Port 7 Refrigerant 10 Semiconductor Chip (Heating Element) 41 Jacket 41c Space
Claims (2)
体(1) と、該半導体チップ(10)を囲包する形状に形成し
互いに離隔した位置に冷媒出入口(6) を備える封止板
(4) とからなり、 該封止板(4) を前記パッケージ基体(1) に接合して前記
半導体チップ(10)を封止するとともに冷媒(7) を流通す
る空間(5) を形成し、前記半導体チップ(10)を冷媒(7)
中に浸漬し冷却することを特徴とする発熱体パッケージ
の冷却構造。1. A sealing plate having a package base (1) to which a semiconductor chip (10) is fixed, and a coolant inlet / outlet (6) formed in a shape surrounding the semiconductor chip (10) and separated from each other.
(4), and the sealing plate (4) is bonded to the package base (1) to seal the semiconductor chip (10) and form a space (5) through which a refrigerant (7) flows. , The semiconductor chip (10) the refrigerant (7)
A cooling structure for a heating element package, which is characterized in that it is immersed in and cooled.
体(1) と、該半導体チップ(10)を囲包する形状に形成し
互いに離隔した位置に備える冷媒出入口(6)から冷媒(7)
を流通する空間(41c) を有するジャケット(41)とから
なり、 該ジャケット(41)を前記パッケージ基体(1) に接合して
前記半導体チップ(10)を封止するとともに、ジャケット
(41)に冷媒(7) を流通し冷却することを特徴とする発熱
体パッケージの冷却構造。2. A package base (1) to which a semiconductor chip (10) is fixed, and a coolant inlet / outlet (6) formed in a shape surrounding the semiconductor chip (10) and provided at positions separated from each other.
A jacket (41) having a space (41c) through which the semiconductor chip (10) is sealed by bonding the jacket (41) to the package base (1).
A cooling structure for a heating element package, characterized in that a refrigerant (7) is circulated in (41) for cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6131504A JPH07336077A (en) | 1994-06-14 | 1994-06-14 | Cooling structure of heating-element package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6131504A JPH07336077A (en) | 1994-06-14 | 1994-06-14 | Cooling structure of heating-element package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07336077A true JPH07336077A (en) | 1995-12-22 |
Family
ID=15059573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6131504A Withdrawn JPH07336077A (en) | 1994-06-14 | 1994-06-14 | Cooling structure of heating-element package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07336077A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100381431B1 (en) * | 1997-05-14 | 2003-04-23 | 인텔 코오퍼레이션 | Method and apparatus for cooling a semiconductor die |
| JP2004297069A (en) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | System and method for direct convective cooling of exposed integrated circuit die surface |
| JP2006339239A (en) * | 2005-05-31 | 2006-12-14 | Toyota Motor Corp | Semiconductor device |
| US8125781B2 (en) | 2004-11-11 | 2012-02-28 | Denso Corporation | Semiconductor device |
| WO2012091044A1 (en) * | 2010-12-27 | 2012-07-05 | 株式会社ザイキューブ | Semiconductor device/electronic component mounting structure |
-
1994
- 1994-06-14 JP JP6131504A patent/JPH07336077A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100381431B1 (en) * | 1997-05-14 | 2003-04-23 | 인텔 코오퍼레이션 | Method and apparatus for cooling a semiconductor die |
| JP2004297069A (en) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | System and method for direct convective cooling of exposed integrated circuit die surface |
| JP4657617B2 (en) * | 2003-03-27 | 2011-03-23 | エスティーマイクロエレクトロニクス，インコーポレイテッド | System and method for direct convection cooling of an exposed integrated circuit die surface |
| US8125781B2 (en) | 2004-11-11 | 2012-02-28 | Denso Corporation | Semiconductor device |
| US10079226B2 (en) | 2004-11-11 | 2018-09-18 | Denso Corporation | Semiconductor device |
| JP2006339239A (en) * | 2005-05-31 | 2006-12-14 | Toyota Motor Corp | Semiconductor device |
| JP4569766B2 (en) * | 2005-05-31 | 2010-10-27 | トヨタ自動車株式会社 | Semiconductor device |
| WO2012091044A1 (en) * | 2010-12-27 | 2012-07-05 | 株式会社ザイキューブ | Semiconductor device/electronic component mounting structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010904 |