JPH0728116B2 - Thick film hybrid integrated circuit - Google Patents
Thick film hybrid integrated circuitInfo
- Publication number
- JPH0728116B2 JPH0728116B2 JP3019436A JP1943691A JPH0728116B2 JP H0728116 B2 JPH0728116 B2 JP H0728116B2 JP 3019436 A JP3019436 A JP 3019436A JP 1943691 A JP1943691 A JP 1943691A JP H0728116 B2 JPH0728116 B2 JP H0728116B2
- Authority
- JP
- Japan
- Prior art keywords
- copper conductor
- thick film
- integrated circuit
- hybrid integrated
- film hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は厚膜混成集積回路に関す
るものである。FIELD OF THE INVENTION The present invention relates to thick film hybrid integrated circuits.
【０００２】[0002]
【従来の技術】近年、厚膜混成集積回路において、従来
の銀系導体を銅導体に置き換える試みがなされている。2. Description of the Related Art In recent years, attempts have been made to replace conventional silver-based conductors with copper conductors in thick-film hybrid integrated circuits.
【０００３】すなわち、銅導体は導体抵抗が低く、ライ
ンを細くすることが可能であり、かつ耐マイグレーショ
ン性に優れていることからライン間隔を狭くすることも
可能なため、厚膜混成集積回路の小型化に有利な導体材
料であることが上げられる。That is, since the copper conductor has a low conductor resistance and can make lines thin, and since it is excellent in migration resistance, it is also possible to make the line interval narrow, so that it can be used in a thick film hybrid integrated circuit. It can be said that the conductor material is advantageous for miniaturization.
【０００４】したがって、高周波回路への利用や高速デ
ジタル化への対応という点でも注目されている。Therefore, attention has been paid to its use in high-frequency circuits and high-speed digitalization.
【０００５】[0005]
【発明が解決しようとする課題】ところが、セラミック
基板上に印刷法で銅導体を形成する場合、９００℃の窒
素雰囲気中で焼成する方法がとられてきたが、性能の良
い厚膜抵抗や絶縁ガラス層が得られないという欠点があ
った。However, when forming a copper conductor on a ceramic substrate by a printing method, a method of firing in a nitrogen atmosphere at 900 ° C. has been used. There was a drawback that a glass layer could not be obtained.
【０００６】これに対し、パラジウム−銀導体において
は、信頼性の高い空気中焼成用酸化ルテニウム抵抗を利
用し、ルテニウム抵抗を空気中で焼成した後、銅導体ペ
ーストを印刷し、６００℃で焼成する方法が提案されて
きた。On the other hand, in the case of the palladium-silver conductor, a highly reliable ruthenium oxide resistor for firing in air is utilized. After ruthenium resistor is fired in air, a copper conductor paste is printed and fired at 600 ° C. A method of doing so has been proposed.
【０００７】しかし、本発明者らの研究の結果、６００
℃の低温では銅導体の焼結が不充分で、耐はんだ性およ
び、電極強度が弱く、高信頼性の厚膜混成集積回路が得
られない。However, as a result of the research conducted by the present inventors, 600
At a low temperature of ℃, sintering of the copper conductor is insufficient, solder resistance and electrode strength are weak, and a highly reliable thick film hybrid integrated circuit cannot be obtained.
【０００８】また焼結性を向上させるために、焼成温度
を高温にすれば抵抗体との接続部に接触異常が発生し、
第５図のように抵抗値が不安定になることが判明した。Further, if the firing temperature is raised to improve the sinterability, a contact abnormality occurs at the connection portion with the resistor,
It was found that the resistance value became unstable as shown in FIG.
【０００９】本発明は前記課題を解決し、高精度な厚膜
抵抗と高信頼性を有する銅導体による厚膜混成集積回路
基板を提供しようとするものである。The present invention is intended to solve the above problems and to provide a thick film hybrid integrated circuit board using a copper conductor having a highly accurate thick film resistance and high reliability.
【００１０】[0010]
【課題を解決するための手段】第４図は銅導体を用いた
厚膜混成集積回路の従来例を示し、１はＡ l2 Ｏ3 など
の絶縁セラミック基板、２は空気中焼成により得られた
酸化ルテニウム系厚膜抵抗体、３は６００℃の窒素雰囲
気中で焼成された銅導体、４は、５５０〜６００℃の窒
素雰囲気焼成の可能なガラスや樹脂系の保護コート、５
は部品、６は外部リード、７の半田により構成されてい
る。FIG. 4 shows a conventional example of a thick film hybrid integrated circuit using a copper conductor, 1 is an insulating ceramic substrate such as Al 2 O 3 and 2 is obtained by firing in air. Ruthenium oxide-based thick film resistor, 3 is a copper conductor fired in a nitrogen atmosphere at 600 ° C., 4 is a protective coat of glass or resin that can be fired in a nitrogen atmosphere at 550 to 600 ° C.
Is a component, 6 is an external lead, and 7 is a solder.
【００１１】本発明は、この銅導体を用いた厚膜混成集
積回路をさらに高性能、高精度、高信頼性に導くことを
目的としたものであるAn object of the present invention is to bring a thick film hybrid integrated circuit using this copper conductor to higher performance, higher accuracy and higher reliability.
【００１２】すなわち、本発明はまず、絶縁セラミック
基板に空気中８００℃〜９００℃で焼成可能な、銀系下
層導体ペースト、クロスガラスペースト、厚膜抵抗ペー
ストを順次印刷焼成した後、銅導体ペーストを用い、外
部リード端子取付ランドおよび部品取付ランドを印刷
し、６００℃を超え７００℃以下の窒素雰囲気中で焼成
を行い、That is, according to the present invention, first, a silver-based lower layer conductor paste, a cross glass paste and a thick film resistance paste, which can be fired in air at 800 ° C. to 900 ° C., are sequentially printed and fired, and then a copper conductor paste is used. By using, to print the external lead terminal mounting land and component mounting land, firing in a nitrogen atmosphere of over 600 ℃ 700 ℃,
【００１３】次いで、抵抗端子部を含む配線部に銅導体
ペーストを印刷し、５００℃以上６００℃未満の窒素雰
囲気中で焼成し、回路を形成する。その後、保護コート
を形成し、部品実装、外部リード端子接続を行い、厚膜
混成集積回路を構成するものである。Next, a copper conductor paste is printed on the wiring portion including the resistance terminal portion and fired in a nitrogen atmosphere at 500 ° C. or higher and lower than 600 ° C. to form a circuit. After that, a protective coat is formed, parts are mounted and external lead terminals are connected to form a thick film hybrid integrated circuit.
【００１４】[0014]
【作用】本発明の厚膜混成集積回路は、銅導体ペースト
を部品取付ランドおよび外部リード端子取付ランドに印
刷し、６００℃を超え７００℃以下の窒素雰囲気中で焼
成して、各ランドの接着強度を高め、次いで、抵抗部を
含む配線電極部に銅導体ペーストを印刷し、５００℃以
上６００℃未満の窒素雰囲気中で焼成することにより、
抵抗−銅導体界面に界面抵抗が発生せず、抵抗値精度や
Ｔ、Ｃ、Ｒで優れた特性を得ることができる。In the thick film hybrid integrated circuit of the present invention, the copper conductor paste is printed on the component mounting lands and the external lead terminal mounting lands, and the lands are bonded by firing in a nitrogen atmosphere exceeding 600 ° C. and 700 ° C. or less. By increasing the strength and then printing the copper conductor paste on the wiring electrode portion including the resistance portion and firing in a nitrogen atmosphere at 500 ° C. or higher and less than 600 ° C.,
Interface resistance does not occur at the resistance-copper conductor interface, and excellent characteristics in resistance value accuracy and T, C, and R can be obtained.
【００１５】[0015]
【実施例】以下、本発明を実施例に基づき詳細に説明す
る。第１図、および第２図は本発明の一実施例の一部拡
大断面図で、１１はアルミナ基板、１２は厚膜抵抗体、
１３は第１の銅導体層、１４は第２図の銅導体層で、厚
膜抵抗体１２を形成したアルミナ基板１１に外部リード
付端子用ランド及び部品取付用ランドを銅導体ペースト
で印刷し、６００℃を超え、７００℃以上の窒素雰囲気
中で焼成して第１の銅導体層１３を形成し、その後、さ
らに抵抗端子部を含む配線電極用銅導体ペーストを印刷
し、５００℃以上６００℃未満の窒素雰囲気中で焼成し
て、第２の銅導体層１４を設け、厚膜混成集積回路を構
成するものである。EXAMPLES The present invention will now be described in detail based on examples. 1 and 2 are partially enlarged sectional views of an embodiment of the present invention, in which 11 is an alumina substrate, 12 is a thick film resistor,
13 is the first copper conductor layer, 14 is the copper conductor layer of FIG. 2, and the external lead-attached terminal lands and component mounting lands are printed with copper conductor paste on the alumina substrate 11 on which the thick film resistor 12 is formed. , 600 ° C. and 700 ° C. or higher in a nitrogen atmosphere to form a first copper conductor layer 13, and then print a copper conductor paste for wiring electrodes including a resistance terminal portion at 500 ° C. or higher 600 ° C. The second copper conductor layer 14 is provided by firing in a nitrogen atmosphere of less than ° C to form a thick film hybrid integrated circuit.
【００１６】なお、第３図は、第１の銅導体層１３と第
２の銅導体層１４を２層構造としたもので、熱エージン
グ特性をより向上させたものである。また、１５は保護
コート層で、１６は部品、１７は外部リード端子、１８
は半田である。Incidentally, FIG. 3 shows a structure in which the first copper conductor layer 13 and the second copper conductor layer 14 have a two-layer structure, and the thermal aging characteristics are further improved. Further, 15 is a protective coat layer, 16 is a component, 17 is an external lead terminal, 18
Is solder.
【００１７】[0017]
【発明の効果】以上のように、本発明は第６図に示すご
とく、初期的に優れた接着強度が得られ、また第７図の
ように熱エージング後の接着強度にも向上が見られ、従
来の銅導体を用いた厚膜混成集積回路の弱点である接着
強度の問題も解決できた。As described above, according to the present invention, as shown in FIG. 6, excellent adhesive strength is initially obtained, and as shown in FIG. 7, the adhesive strength after heat aging is also improved. , The problem of adhesion strength, which is a weak point of the thick film hybrid integrated circuit using the conventional copper conductor, has been solved.
【図１、図２、図３】本発明の厚膜混成集積回路の実施
例の一部拡大断面図である。1, 2, and 3 are partially enlarged cross-sectional views of an embodiment of a thick film hybrid integrated circuit of the present invention.
【図４】従来の厚膜混成集積回路の一部拡大断面図であ
る。FIG. 4 is a partially enlarged sectional view of a conventional thick film hybrid integrated circuit.
【図５】抵抗値−焼成温度関係特性図である。FIG. 5 is a resistance value-firing temperature relationship characteristic diagram.
【図６】電極強度−焼成温度関係特性図である。FIG. 6 is a characteristic diagram of electrode strength-firing temperature relationship.
【図７】電極強度−熱エージング時間特性図である。FIG. 7 is an electrode strength-thermal aging time characteristic diagram.
１１：アルミナ基板 １２：厚膜抵抗体 １３：第
１の銅導体層 １４：第２の銅導体層 １５：保護コート層 １６：部
品 １７：外部リード端子 １８：半田11: Alumina substrate 12: Thick film resistor 13: First copper conductor layer 14: Second copper conductor layer 15: Protective coat layer 16: Component 17: External lead terminal 18: Solder
Claims (1)
部リード端子取付ランドに印刷し、６００℃を超え７０
０℃以下の窒素雰囲気中で焼成して第１の銅導体層を形
成し、その後さらに抵抗端子部を含む配線電極部に銅導
体ペーストを印刷し、５００℃以上６００℃未満の窒素
雰囲気中で焼成して第２の銅導体層を形成し、回路を構
成することを特徴とする厚膜混成集積回路。1. A copper conductor paste is printed on component mounting lands and external lead terminal mounting lands, and the temperature exceeds 600.degree.
The first copper conductor layer is formed by firing in a nitrogen atmosphere at 0 ° C. or lower, and then a copper conductor paste is printed on the wiring electrode portion including the resistance terminal portion, and in a nitrogen atmosphere at 500 ° C. or higher and lower than 600 ° C. A thick film hybrid integrated circuit, which is formed by firing to form a second copper conductor layer to form a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3019436A JPH0728116B2 (en) | 1991-01-18 | 1991-01-18 | Thick film hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3019436A JPH0728116B2 (en) | 1991-01-18 | 1991-01-18 | Thick film hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04236483A JPH04236483A (en) | 1992-08-25 |
| JPH0728116B2 true JPH0728116B2 (en) | 1995-03-29 |
Family
ID=11999239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3019436A Expired - Lifetime JPH0728116B2 (en) | 1991-01-18 | 1991-01-18 | Thick film hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728116B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624354A (en) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | Manufacture of thick film multi-layer substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61144657U (en) * | 1985-02-27 | 1986-09-06 |
-
1991
- 1991-01-18 JP JP3019436A patent/JPH0728116B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624354A (en) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | Manufacture of thick film multi-layer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04236483A (en) | 1992-08-25 |
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