JPH07279387A - Floor heating structural body and construction method thereof - Google Patents

Abstract

PURPOSE:To fit floor heating to an existing floor surface by fitting a heating section beneath a floor material via a heat conduction relaxing layer, and arranging a soaking board and a heat insulating layer beneath it. CONSTITUTION:A heat-resistant floor surface 20 is formed between floor joists 13, 13 where floor heating is to be applied so that the lower face of a floor material 21 is exposed. A heating section 40 is fitted beneath the floor material 21 via a heat conduction relaxing layer 30, and a soaking board 50 made of a heat conducting material is fitted beneath the heating section 40 via the heat conduction relaxing layer 30 to face the lower face of the floor material 21. The lower face of the soaking board 50 is covered with a heat insulating layer 60 to construct floor heating by utilizing the existing floor material 21 as it is. The heat generated from the heating section 40 is diffused and transmitted by the soaking board 50, dispersed on the lower face of the floor material 21 by the heat conduction relaxing layer 30, and gradually transmitted to the floor material 21. Execution can be conducted without changing the daily life on the floor surface during reconstruction, and the reconstruction work can be conducted without modifying the floor joist structure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floor heating structure in a building having a wooden floor covering structure and a method for constructing the floor heating structure.

[0002]

2. Description of the Related Art A conventional floor heating structure of this type is one in which a plate material is spread and laid on a joist horizontally laid under the floor to form a base surface referred to as a base plate surface. A heat-insulating layer is provided, and a heating section is provided on the heat-insulating layer, in which a hot water pipe is laid in a meandering shape of an electric heater wire, and the floor surface for floor heating is formed on the upper surface of the heating section in a multi-layered structure. A floor material for floor heating that does not deform or shrink due to temperature rise, such as cork tile material or plywood material, is used for the surface, and in some cases, a minute gap between the floor surface and the hot water pipe, that is, the heating portion. Is formed so that the heat radiated from the heating portion is not locally concentrated on the floor surface. The heating part is often formed by continuously connecting panel plates in which heating elements such as hot water pipes and heater wires are previously arranged in a U shape or an S shape, and the heating part formed in this manner is used outdoors. A hot water heat source device, such as a gas or oil combustion device, a solar water heater, or the like provided in the above is connected with a circulation pump, or an electric current supply device is connected.

[0003]

In such a conventional floor heating structure, since the heating portion is provided between the base surface and the floor surface, the construction work is complicated and the construction period becomes long. ,
In addition, there is a problem that the construction cost becomes high, and when a failure occurs in the heating portion, there is a problem that the repair work becomes troublesome because it cannot be repaired unless the floor surface is peeled off. Furthermore, the above-mentioned conventional structure has the following problems when the existing floor covering structure is converted into a floor heating structure. First, in the existing floor covering structure, the floor material is directly spread on the joists to form the floor surface.Therefore, when this floor surface is used as the base surface, the new floor surface rises higher than the sill. In addition to the problem that the door cannot be opened and closed, the strength of the floor material of the existing floor surface is often not sufficient to mount the heating part and the new floor surface. Therefore, in the past, when modifying an existing floor covering structure to a floor heating structure, the floor surface of the existing floor covering structure was removed and repaired to lower the joists, and then the new joists were installed on the base. There was no choice but to adopt a method of forming a surface and successively superposing a heating part and a new floor on the base surface. However, with such a floor heating modification method, it is extremely troublesome to remove and store the furniture and equipment in the room where floor heating is to be performed, and to restore it after the construction, and the floor structure of the room is dismantled before being fundamentally rebuilt. Therefore, there is a problem that the enforcement period is long, the renovation cost is extremely high, and there is also an inconvenience that the room cannot be used during the construction period. Therefore, the conventional floor heating structure has a problem that it is extremely difficult to adopt it for modifying an existing building.

[0004]

The floor heating structure of the present invention comprises:
As shown in FIG. 1, a heat-resistant floor material 21 spread and laid on the joists 13 forms a floor surface 20 to be heated, and the bottom surface of the floor material 21 is located between the predetermined joists 13. The heating unit 40 is attached via the heat conduction relaxation layer 30, and the lower surface of the heating unit 40 is superposed with a heat equalizing plate 50 made of a material having good heat conductivity so as to be spread between the joists 13. The lower surface of the heat equalizing plate 50 is covered with a heat insulating layer 60, and if desired, the lower surface of the heat insulating layer 60 is supported by a supporting means such as a supporting plate 70. The floor material 21 is made of a material that is neither deformed nor cracked by heating.
To this end, the floor material 21 itself may have heat resistance, or a general wood material having poor heat resistance may be heat-treated. As a method of this heat treatment, permeability and distortion prevention are used. Apply an effective waterproofing agent. Further, in the method of the present invention, the heating unit 40 is attached from below to the lower surface of the floor material 21 between the predetermined joists 13 in the joist structure. First, the floor material 2 that forms the floor surface 20 on the joists 13
1 is deployed and laid. This floor surface 20 is usually preformed by an existing floor material 21, and therefore the method of the present invention is usually carried out as a repair work on an existing wooden floor covering structure. In the method of the present invention, firstly joist 1
Preliminary step of removing the heat insulating material covering the lower surface of the floor material 21 between 3 and a waterproofing agent that is permeable to the floor material 21 with the exposed lower surface and has an effect of preventing distortion, that is, having a permeability to the wooden building material. After permeation, a waterproof coating that prevents distortion due to moisture and temperature of the wooden building material, for example, a step of applying a brand name Newseal stain, which is a penetrating protective waterproofing agent sold by Nippon Special Coating Co., Ltd., and this step After that, a step of attaching the heating portion 40 to the lower surface of the floor material between the joists 13 via a paperboard having a thickness of, for example, about 2 mm, and the lower surface of the heating portion 40 between the joists are made of a material having good thermal conductivity. There is a step of attaching the heat equalizing plate 50 and a step of forming a heat insulating layer 60 by superposing a heat insulating material on the lower surface of the heat equalizing plate 50. In the above process, the preliminary process of removing the heat insulating material between the joists is not necessary when newly constructing the floor heating structure, and in this case, a floor material suitable for floor heating such as plywood or cork tile material is used from the beginning. Since it is used, it is sufficient to apply a waterproofing agent having permeability. That is, in this case, the effect of preventing distortion is not particularly required. The heating unit is often a panel having a built-in hot water pipe that has been conventionally used, but the present invention is not limited to this. For example, a seed wire for an electric heater may be arranged in a straight line, a meandering line, or a striped pattern. May be. When a hot water pipe or a seed wire is used, the soaking plate 50 may be used as a panel substrate and the hot water pipe or the seed wire may be directly fixed to the soaking plate 50. Something is desirable. In the method of the present invention, when the permeation protection waterproofing agent is applied to the lower surface of an existing flooring material, the method according to claim 8 is adopted since the waterproofing agent contains a volatile solvent. Things are desirable. In this method, first, the heating section 40 is fixed to the upper surface of the heat equalizing plate 50, and a liquid absorbing fiber layer such as paperboard or nonwoven fabric as the heat conduction moderating layer 30 is layered on the upper surface of the heat equalizing plate 50 to form an adhesive. Polymerize and fix. In this manner, after being combined with the panel body P in which the liquid absorbent fiber layer and the heating portion and the heat equalizing plate are stacked, the penetrating protective waterproof agent having an adhesive property on the upper surface of the liquid absorbent fiber layer when undried For example, while applying the new seal stain (trade name) as shown in FIG. 5, while the liquid absorbing fiber layer is impregnated with the waterproof agent coating layer 22 ', that is, the waterproof agent is While not drying, the panel body P is carried under the floor, and the waterproof agent coating layer 22 'is provided.
To the underside of the flooring. By doing so, the panel body P is adhered to the lower surface of the floor material due to the adhesiveness of the waterproof agent coating layer 22 ', so that the permeation protection waterproof agent is applied to the floor material 21 without filling the underfloor with the solvent. You can do it. After the panel body P is mounted in this manner, the heat equalizing plate is used as a supporting plate and fixed to the floor material 21 with screws or nails, and then a heat insulating material is attached to the lower surface of the panel body P with an adhesive or the like. To wear.

[0005]

[Operation] In the floor heating structure of the present invention, the heating portion 40 is attached in a suspended manner on the lower surface of the floor material thus supported by the joists. In this structure, the heat generated from the heating unit 40 is diffused and transmitted by the heat equalizing plate 50, is also dispersed by the heat conduction relaxation layer 30 to the lower surface of the floor material, and is gradually transmitted to the floor material 21. In this floor heating structure, since the joists 13 and the base plate are not provided below the heating part, the heating part 40 can be attached as described in claims 4, 7 and 8, and therefore, in the section of the effect of the invention. There are benefits as stated.

[0006]

1 is a longitudinal sectional view showing the structure of a floor heating structure of the present invention. In the figure, 10 is a joist structure, 20 is a floor surface, 30 is a heat conduction relaxation layer, 40 is a heating portion, and 50 is soaking. A plate, 60 indicates a heat insulating layer.

The joist structure 10 has a plurality of large pulls 12 which are horizontally laid in parallel on a support leg 11 which stands upright on the ground, and a large number of which are mounted and fixed on the large pulls 12 so as to be orthogonal to the large pulls. The joists 13 and the joists 13 have a skeleton that supports the floor surface 20.

The floor surface 20 is formed by laying a large number of floor materials 20 on the joist 13 in parallel, and carpets or tatami mats may be superposed on the floor surface. As the floor material 21, wood flooring material, decorative plywood,
There are materials with poor heat resistance, such as solid wood boards, that is, materials that are distorted or cracked when heated, and materials with good heat resistance, such as cork tile materials and plywood. In this case, it is necessary to select a material with good heat resistance, and in this case as well, it is desirable to apply a waterproof coating on the lower surface of the floor material. On the contrary, when the structure of the present invention is refurbished by using the existing floor surface, the floor material 21 is often a material having poor heat resistance. The heat resistance may be improved by applying a waterproofing agent having an anti-strain effect, for example, a penetrating protective waterproofing agent Neusealstein (trade name) sold by Nippon Special Coating Co., Ltd. Since this New Seal Stin is a waterproof material that penetrates deeply into the material, fills the internal cavity, and hardens to prevent deformation and cracking of the material, it is applied to the bottom surface of the floor material 21. If the coating layer 22 is formed as shown in FIG. 2 by applying it, this waterproofing agent penetrates into the floor material 21 as shown by the dotted line and the floor material 2
The heat resistance of 1 is improved.

The heat conduction moderating layer 30 gradually transfers the heat from the heating section 40 and the heat equalizing plate 50 to the floor material 21, and thereby to the portion of the floor surface 20 facing the hot water pipe or the seed wire. Floor surface 2 to prevent intensive heat transfer
It is possible to reduce the temperature unevenness of 0. Such a heat conduction relaxation layer 30 may be a minute void formed between the heating portion 40 and the floor material 21, but in the embodiment, it has a thickness of 2 m.
A fiber layer of paperboard or non-woven fabric of about m is used. An appropriate number of through holes 31 may be formed in the heat conduction moderating layer 30 made of this fiber layer as shown in FIG. 3, and thus the voids in the through holes can be used as the heat conduction moderating space. Thus, by using a perforated plate having a large number of through holes as such a fiber layer, the total space area can be increased while maintaining the strength.

The heating section 40 may be one using a hot water pipe 41 as shown in FIG. 2, or as shown in FIG.
The electric heating element 42 may be, for example, a nichrome wire or a seed wire. When the hot water pipe 41 is used, it is connected to a hot water heat source device and a circulation pump, which are not shown, and when the electric heating element 42 is used, it is connected to a current supply device which is not shown. , The same as the conventional one. The heating unit 40
In addition to arranging one hot water pipe 41, electric heating element 42, etc. in a straight line as in the embodiment, it may be arranged in a stripe pattern or a meandering pattern. 50 is used as a substrate and is preliminarily piped or wired to form a panel. When the panel is formed in this way, as shown in FIG. 6, a heat insulating layer 60 having a concave groove 62 is made of a hard heat insulating material 61, and the heat equalizing plate 50 and the hot water pipe 41 of the heating unit 40 are coupled to the heat insulating layer 60. The panel body P thus combined is fixed, and after the panel body P is fixed to the floor member 21, the concave groove 51 portion of the soaking plate 50 in which the heating portion 40 is fitted is accommodated in the concave groove 62 of the heat insulating layer 60 from below. Once installed, the work is extremely easy.

The soaking plate 50 is made of a material having good heat conductivity, for example, a plate material made of aluminum,
In the embodiment, a concave groove 51 opening toward the bottom surface of the floor material is formed in the center of the plate material having a width accommodated between the joists 3 and 13. The recessed groove 51 accommodates the hot water pipe 41 and the heater wire 42 of the heating section 40, and the plate surfaces 52, 52 of the heat equalizing plate 50 are formed so as to be in close contact with the heat conduction moderating layer 30. The soaking plate 50 is preferably made of a material that radiates far infrared rays by heating. As such a plate material, there is an aluminum alloy material Super Ray (trade name) sold by Sky Aluminum Co., Ltd. . The heat equalizing plate 50 is thermally connected to the heating unit 40, and the heat conduction moderating layer 3 is also provided.
Therefore, it is desirable that the heat insulating layer 60 has an aluminum foil 63 formed on the upper surface thereof, as shown in FIG. Will get better.

In the structure of the present invention, a hot water pipe or an electric heating means such as a nichrome wire or a seed wire is usually used as the heating means of the heating section 40. As the electric heating means, a surface heating type heater is used. Since there is also a soaking plate 5
It may be polymerized to 0. When this surface-heating type heater is used, since the heater has a sheet-shaped or plate-shaped planar shape, it can be directly bonded to the heat conduction relaxation layer 30 in a planar manner. Therefore, when such a surface-heating type heater is used, the heat equalizing plate 50 only serves as a supporting means, and may be omitted in some cases. That is, in this case, the heating unit 40 has the heat insulating layer 60,
In particular, it is directly supported by the hard insulating layer 60.

The heat insulating layer 60 is usually made of a hard heat insulating material, but in some cases a soft heat insulating material may be used, or a two-layer structure using a hard heat insulating material and a soft heat insulating material. You can make it.

Next, a method for constructing the structure of the present invention will be described. This method comprises a step of forming a heat resistant floor surface 20 between joists 13 and 13 for floor heating so that the lower surface of the floor material 21 is exposed, and a heat treatment is applied to the lower surface of the floor material 21 following this step. Heating unit 40 through the conduction relaxation layer 30
The step of mounting and the soaking plate 50 made of a material having good thermal conductivity on the lower surface of the heating section 40, and the soaking plate 50 faces the lower surface of the floor material via the heat conduction moderating layer 30. As described above, there is a step of stacking and a step of covering the lower surface of the heat equalizing plate 50 with a heat insulating layer 60 after this step.

In the step of forming the heat resistant floor surface 20, the floor material 21 of the floor surface 20 is made of a material having heat resistance,
For example, in the case of a cork tile material, this material may be used, for example, when the floor surface 20 is an existing one and the floor material 21 has poor heat resistance such as the wood flooring material or the floor material 21. In order to improve the heat resistance and water resistance of the floor material, the permeation protection waterproofing agent is applied to the lower surface of the floor material 21 as described in claim 4, and the coating layer 22 changes the floor material 21. It is necessary to prevent distortion and cracks and impart waterproofness. Furthermore, when the floor surface 20 is an existing one and the heat insulating material is overlaid on the lower surface of the floor material, it is necessary to expose the lower surface of the floor material and a preliminary step for removing the existing heat insulating material is required.

The heat conduction relaxation layer 30 is, for example, a soaking plate 5
0 may be formed by providing a heat insulating ridge 53 as shown by a chain line in FIG. 4 to form a gap between the heat equalizing plate 50 and the lower surface of the floor material 21, but in FIGS. In the embodiment shown, the plate thickness is 2 m
A m-thick board is used, and if desired, a through hole 31 as shown in FIG. 3 may be formed in this board. The heat conduction relaxation layer 30 is preferably formed by using a fiber layer such as paperboard or nonwoven fabric, and a felt material can be used as such a material. As described above, the heating unit 40 is configured to heat the lower surface of the floor material 21 with the hot water pipe 41, the electric heater wire 42, and the like. Therefore, while the hot water pipe 41 and the like are brought into contact with the bottom of the paperboard, piping, Although it may be fixed to the floor member 21 with a wiring hook, this makes the piping or wiring work troublesome. Therefore, as described in claims 7 and 8, the soaking plate 50 is used as a substrate. A hot water pipe, a heater wire, etc. are preliminarily piped and wired to the panel body P as shown in FIGS.
It is convenient to attach the panel body P to the floor material by fixing the heat equalizing plate 50 to the lower surface of the floor material 21 with wood screws, nails, staples or the like. In this case, therefore, the heat conduction relaxation layer 3 is formed on the uppermost layer of the panel body P.
If the fiber layer of 0 is provided, the work of attaching the panel body P becomes easier.

When the panel body P is used as described above, the liquid absorbing property of the fiber layer 30 is utilized to make use of the fiber layer 30.
If the permeation protection waterproofing agent is applied to the underside of the floor, a coating layer 22 'as shown in FIG. 5 can be formed on the outside without applying in a narrow space under the floor. At the time of work, it is possible to reduce unpleasant odors and air pollution generated by the evaporation of the solvent. Since the coating layer 22 'of the panel body P is tacky while the solvent is not dried, the coating layer 22' is adhered to the lower surface of the floor material 21 to temporarily fix the panel body P. There is also an advantage that the panel body P can be attached and fixed to the floor material 21 by nailing or the like in this state.

After attaching the heat equalizing plate 50 to the floor material 21 as described above, the heat insulating layer 60 as shown in FIG. 2 is superposed on the lower surface of the heat equalizing plate 50 with an adhesive or the like. Since the structure of the present invention is provided in the space under the floor, the heat insulating layer 60 can be formed to be much thicker than the conventional one, and the heat insulating effect is excellent. Thus, a means for supporting the thick heat insulating layer 60, such as joist 1
It is desirable to provide a support plate 70 which is fixed and laterally fixed by nailing or an adhesive between the lower surfaces of the electrodes 3 and 13. By doing so, it is possible to effectively prevent the heat insulating layer 60 from falling due to its own weight.

[0019]

EFFECTS OF THE INVENTION The floor heating structure according to the present invention thus has the floor material 2
Since it is provided on the lower surface of No. 1, a wider space can be used as compared with the conventional one, so that the heating section 40 and the heat insulating layer 60 can be made large, and a base surface for supporting the heating section from below is unnecessary. The effect is that the construction work is simple and the cost can be reduced. Further, according to the method of the present invention, since the floor heating structure can be manufactured by using the existing floor material 21, the floor surface 20 can be used even during the remodeling. It has the effect of being able to perform renovation without changing daily life on the floor, and because renovation work can be done without modifying the joist structure, the time required for renovation can be shortened and compared to conventional renovation work. And the cost can be reduced significantly. In particular, according to the method of claim 8, it is not necessary to handle the volatile protective waterproofing agent having strong volatility in a narrow space under the floor, so that there is an effect that workability and safety are extremely good.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a heating structure of the present invention.

FIG. 2 is an exploded view of the same.

FIG. 3 is a perspective view showing an implementation of a heat conduction relaxation layer of the heating structure.

FIG. 4 is a perspective view of the heat equalizing plate.

FIG. 5 is a perspective view of the panel body.

FIG. 6 is an exploded view showing another embodiment of the heating structure.

[Explanation of symbols]

 10 joist structure 13 joist 20 floor surface 21 floor material 22 coating layer 30 heat conduction relaxation layer 40 heating part 41 hot water pipe 42 heater wire 50 soaking plate 51 concave groove 60 heat insulating layer 62 concave groove 70 support plate P panel body

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location // E04B 5/48 C

Claims (9)

[Claims] 1. A heat-resistant floor surface placed between joists, a heating portion attached to the lower surface of the floor material forming the floor surface via a heat conduction relaxation layer, and a heavy attachment to the lower surface of the heating portion. As well as
A floor characterized by comprising a heat equalizing plate which is developed in parallel with the lower surface of the floor material and is made of a material having good thermal conductivity, and a heat insulating layer which covers and closes the lower surface of the heat equalizing plate. Heating structure. 2. The floor heating structure according to claim 1, wherein the heat conduction relaxation layer according to claim 1 is a fiber layer such as paperboard. 3. The floor heating structure according to claim 1, wherein the soaking plate according to claim 1 has a characteristic of radiating far infrared rays toward a lower surface of the floor material when heated. 4. A step of applying a permeable protective waterproofing agent which is permeable and has an effect of preventing distortion of the floor material to the lower surface of the floor material whose lower surface is exposed in the floor joists selected for floor heating,
After applying the waterproofing agent, a step of installing a heating portion on the lower surface of the floor material via a heat conduction relaxation layer, and a soaking plate made of a material having good thermal conductivity on the lower surface of the heating portion is used as the lower surface of the floor material. A step of fixing the heat equalizing plate to the lower surface of the floor material while stacking in parallel,
A method for constructing a floor heating structure, comprising the step of polymerizing and forming a heat insulating layer on the lower surface of the soaking plate. 5. The heat conduction relaxation layer according to claim 4 is a fiber layer of paperboard or the like, and the fiber layer is applied due to the adhesiveness of the permeable protective waterproofing agent applied to the lower surface of the flooring material in an undried state. The floor heating structure construction method according to claim 4, wherein the floor heating structure is adhered to the bottom surface of the layer. 6. The method according to claim 4, wherein when an existing heat insulating material is overlaid on the lower surface of the floor material, this heat insulating material is removed as a preliminary step before the step of applying the permeation protection waterproofing agent. The method for constructing a floor heating structure according to claim 4. 7. The heating unit according to claim 4 is previously arranged on a heat equalizing plate to form a panel body using the heat equalizing plate as a substrate, and the panel body is attached to the heat conduction moderating layer. The method for constructing a floor heating structure according to claim 4, wherein the floor heating structure is fixed to the lower surface of the floor material through the interposition. 8. A heat conduction relaxation layer on the bottom surface of the flooring material, the bottom surface of which is exposed between the joists selected for floor heating, a heating portion arranged on the bottom surface of the heat conduction relaxation layer, and further the heating portion. Floor heating provided by stacking a heat equalizing plate with good thermal conductivity, which is superposed on the lower surface of the heat spreader and developed in parallel with the lower surface of the floor material, and a heat insulating layer superposed on the lower surface of the heat equalizing plate. In the method for constructing a structure, a liquid absorbing fiber layer is used as the heat conduction moderating layer, and the liquid absorbing fiber layer is bonded and fixed to the upper surface of a heat equalizing plate provided with a heating unit in advance to form a heat equalizing plate. A step of forming a panel body as a substrate, a step of applying a permeation protection waterproofing agent to the liquid absorbing fiber layer of the panel body in advance to form a coating layer, and a step of forming the coating layer in an undried state. The panel body is adhered to the lower surface of the floor material using adhesiveness, and the heat equalizing plate is fixed to the lower surface of the floor material to secure the panel body. A method for constructing a floor heating structure, comprising the step of mounting. 9. The method according to claim 8, wherein when an existing heat insulating material is layered on the bottom surface of the floor material, the work of removing the heat insulating material before mounting the panel body is included as a preliminary step. For building a floor heating structure for a building.