JPH07279387A - Floor heating structural body and construction method thereof - Google Patents

Floor heating structural body and construction method thereof

Info

Publication number
JPH07279387A
JPH07279387A JP6110599A JP11059994A JPH07279387A JP H07279387 A JPH07279387 A JP H07279387A JP 6110599 A JP6110599 A JP 6110599A JP 11059994 A JP11059994 A JP 11059994A JP H07279387 A JPH07279387 A JP H07279387A
Authority
JP
Japan
Prior art keywords
floor
heat
heating
layer
floor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6110599A
Other languages
Japanese (ja)
Inventor
Teruo Okano
照夫 岡野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON BEROO KK
Original Assignee
NIPPON BEROO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON BEROO KK filed Critical NIPPON BEROO KK
Priority to JP6110599A priority Critical patent/JPH07279387A/en
Publication of JPH07279387A publication Critical patent/JPH07279387A/en
Pending legal-status Critical Current

Links

Landscapes

  • Floor Finish (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Central Heating Systems (AREA)
  • Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)

Abstract

PURPOSE:To fit floor heating to an existing floor surface by fitting a heating section beneath a floor material via a heat conduction relaxing layer, and arranging a soaking board and a heat insulating layer beneath it. CONSTITUTION:A heat-resistant floor surface 20 is formed between floor joists 13, 13 where floor heating is to be applied so that the lower face of a floor material 21 is exposed. A heating section 40 is fitted beneath the floor material 21 via a heat conduction relaxing layer 30, and a soaking board 50 made of a heat conducting material is fitted beneath the heating section 40 via the heat conduction relaxing layer 30 to face the lower face of the floor material 21. The lower face of the soaking board 50 is covered with a heat insulating layer 60 to construct floor heating by utilizing the existing floor material 21 as it is. The heat generated from the heating section 40 is diffused and transmitted by the soaking board 50, dispersed on the lower face of the floor material 21 by the heat conduction relaxing layer 30, and gradually transmitted to the floor material 21. Execution can be conducted without changing the daily life on the floor surface during reconstruction, and the reconstruction work can be conducted without modifying the floor joist structure.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は木造の床張り構造を有す
る建造物における床暖房構造体及びその構築方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a floor heating structure in a building having a wooden floor covering structure and a method for constructing the floor heating structure.

【0002】[0002]

【従来の技術】従来の此種床暖房構造体は、床下に水平
方向へ架設された根太上に板材を展開敷設して下地板面
と称される基面を形成し、この基面上に断熱層を設ける
と共に該断熱層上に温水パイプを電熱ヒーター線等を蛇
行状に敷設した加熱部を設け、更にこの加熱部の上面に
床暖房用の床面を重層形成した構成で、上記床面には温
度上昇によって変形や収縮等を生じない床暖房用の床
材、例えばコルクタイル材や合板材等が使用されてお
り、又場合によっては床面と温水パイプ即ち加熱部間に
微小空隙が形成されていて、これによって加熱部から放
熱される熱が床面に局部的に集中しない様に配慮されて
いる。上記加熱部は、予め温水パイプやヒーター線等の
発熱体をU状やS状に配設したパネル板を連続結合して
形成する場合が多く、この様にして形成された加熱部に
は屋外に設けられた温水熱源機、例えばガスや石油の燃
焼装置や太陽熱温水器等が循環ポンプと共に接続された
り、或は又電流供給用機器が接続される。
2. Description of the Related Art A conventional floor heating structure of this type is one in which a plate material is spread and laid on a joist horizontally laid under the floor to form a base surface referred to as a base plate surface. A heat-insulating layer is provided, and a heating section is provided on the heat-insulating layer, in which a hot water pipe is laid in a meandering shape of an electric heater wire, and the floor surface for floor heating is formed on the upper surface of the heating section in a multi-layered structure. A floor material for floor heating that does not deform or shrink due to temperature rise, such as cork tile material or plywood material, is used for the surface, and in some cases, a minute gap between the floor surface and the hot water pipe, that is, the heating portion. Is formed so that the heat radiated from the heating portion is not locally concentrated on the floor surface. The heating part is often formed by continuously connecting panel plates in which heating elements such as hot water pipes and heater wires are previously arranged in a U shape or an S shape, and the heating part formed in this manner is used outdoors. A hot water heat source device, such as a gas or oil combustion device, a solar water heater, or the like provided in the above is connected with a circulation pump, or an electric current supply device is connected.

【0003】[0003]

【発明が解決しようとする課題】この様な従来の床暖房
構造体は、基面と床面との間に加熱部を設けているた
め、施工手間が煩多であると共に施工期間も長くなり、
且つ又施工費用も高くなると云う問題がある他加熱部に
故障が発生すると、床面を剥離しないと修理出来ないた
め修理作業が面倒になると云う問題がある。更に又上記
従来の構造体は、既存の床張り構造を床暖房構造に改変
する場合において下記問題が発生する。まず、既存の床
張り構造は、根太上に床材を直接展張して床面を形成し
たものであるから、この床面をその儘基面として利用す
ると、新しい床面が敷居より高く上昇して扉の開閉が不
能になると云う問題が生じる他、既存床面の床材の強度
が加熱部と新しい床面とを載乗するに充分でない事が多
いと云う問題がある。このため従来においては、既存の
床張り構造を床暖房構造体に改変するに際しては、既存
の床張り構造の床面を撤去して、根太を低くする改修を
行った後にこの新しい根太上に基面を作り、該基面上に
加熱部と新しい床面を逐次重合すると云う工法を採らざ
るを得なかった。しかしながらこの様な床暖房改変工法
では、床暖房を施工する部屋の家具、備品を撤去保管す
る手間や、施工後に復帰させる手間が極めて煩わしい
他、部屋の床構造を解体してから根本的に改築するた
め、施行期間が長く、且つ改築費用が著しく高額になる
と云う問題があり、且つ又施工期間中は当該部屋を使用
出来ないと云う不便もある。このため従来の床暖房構造
体は、既存建造物の改変には採用が著しく困難であると
云う問題がある。
In such a conventional floor heating structure, since the heating portion is provided between the base surface and the floor surface, the construction work is complicated and the construction period becomes long. ,
In addition, there is a problem that the construction cost becomes high, and when a failure occurs in the heating portion, there is a problem that the repair work becomes troublesome because it cannot be repaired unless the floor surface is peeled off. Furthermore, the above-mentioned conventional structure has the following problems when the existing floor covering structure is converted into a floor heating structure. First, in the existing floor covering structure, the floor material is directly spread on the joists to form the floor surface.Therefore, when this floor surface is used as the base surface, the new floor surface rises higher than the sill. In addition to the problem that the door cannot be opened and closed, the strength of the floor material of the existing floor surface is often not sufficient to mount the heating part and the new floor surface. Therefore, in the past, when modifying an existing floor covering structure to a floor heating structure, the floor surface of the existing floor covering structure was removed and repaired to lower the joists, and then the new joists were installed on the base. There was no choice but to adopt a method of forming a surface and successively superposing a heating part and a new floor on the base surface. However, with such a floor heating modification method, it is extremely troublesome to remove and store the furniture and equipment in the room where floor heating is to be performed, and to restore it after the construction, and the floor structure of the room is dismantled before being fundamentally rebuilt. Therefore, there is a problem that the enforcement period is long, the renovation cost is extremely high, and there is also an inconvenience that the room cannot be used during the construction period. Therefore, the conventional floor heating structure has a problem that it is extremely difficult to adopt it for modifying an existing building.

【0004】[0004]

【課題を解決するための手段】本発明床暖房構造体は、
図1に示す如く根太13の上に展開敷設された耐熱性を
有する床材21で被加熱用床面20を形成すると共にこ
の床材21の下面に所定の根太13の間に位置する様に
熱伝導緩和層30を介して加熱部40を取付け、更に該
加熱部40の下面には熱伝導性の良い材料で作られた均
熱板50を上記根太13間において展開する様に重着
し、又上記均熱板50の下面は断熱層60で被覆し、所
望によりこの断熱層60の下面を支持板70等の支承手
段で支承した構成である。上記床材21は加熱により変
歪したり、ひび割れする事がない材料で作られており、
このためには床材21自体の特性が耐熱性を有している
か、又は耐熱性の悪い一般木質材に耐熱処理をするかす
れば良く、この耐熱処理の方法としては、浸透性で変歪
防止効果のある防水剤を塗付すれば良い。そして又本発
明方法では、上記加熱部40は根太構造の内、所定の根
太13間において床材21の下面に下方から取付けられ
る。まず、根太13の上には床面20を形成する床材2
1が展開敷設される。この床面20は既存の床材21に
より予め形成されているのが通常であり、従って本発明
方法は既存の木造床張り構造に改修工事として実施され
るのが通常である。本発明方法においては、まず根太1
3間において床材21の下面を覆う断熱材を取除く予備
工程と、下面を露出した床材21に浸透性で変歪防止効
果のある防水剤、即ち木質建材に対して浸透性を有する
と共に浸透後には木質建材の湿気や温度に起因する変歪
を防止する防水塗料、例えば日本特殊塗料株式会社の販
売する浸透性保護防水剤である商品名ニューシールステ
インを塗付する工程と、この工程後に根太13間におけ
る床材下面に熱伝導緩和層30例えば厚さ2mm程度の
板紙を介して加熱部40を取付ける工程と、上記根太間
における加熱部40の下面に熱伝導の良い材料で作られ
た均熱板50を取付ける工程と、更にこの均熱板50の
下面に断熱材を重合して断熱層60を形成する工程とを
有している。上記工程中、根太間にある断熱材を取除く
予備工程は、床暖房構造体を新築する場合には必要ない
し、又この場合には当初より床暖房に適する床材例えば
合板やコルクタイル材を用いているから、浸透性のある
防水剤を塗付すれば良い。即ち、この場合には変歪防止
効果は特に必要とされるものではない。上記加熱部は従
来使用されている温水パイプ内蔵のパネルを用いる事が
多いが、これに限定されるものではなく、例えば電気ヒ
ーター用のシード線を直状や蛇行状又は縞目状に配線し
てもよい。而して温水パイプやシード線を用いる場合に
は、均熱板50をパネル基板として、これに直接温水パ
イプやシード線を固定すれば良く、又この均熱板50と
しては遠赤外線放射作用のあるものが望ましい。本発明
方法において、上記浸透性保護防水剤を既存の床材下面
に塗付する場合には、この防水剤が揮発性溶剤を含有し
ているところから、請求項8に記載される方法を採る事
が望ましい。この方法ではまず均熱板50の上面に加熱
部40を固定すると共に、この均熱板50の上面に熱伝
導緩和層30としての板紙や不織布等の吸液性繊維層を
重層して接着剤等で重合固定する。この様にして吸液繊
維層と加熱部及び均熱板とを積重したパネル体Pに組合
わせた後に、上記吸液姓繊維層の上面に未乾燥時に粘着
性を有する浸透性保護防水剤例えば前記ニューシールス
テイン(商品名)を図5のように塗付し、この防水剤の
塗付層22′が吸液性繊維層に含浸されて液状を保持し
ている間、即ち防水剤が乾燥しない間において上記パネ
ル体Pを床下に搬入すると共にその防水剤塗付層22′
を床材下面に接着する。この様にすると、パネル体Pは
防水剤塗付層22′の粘着性で床材下面に接着されるか
ら、床下に溶剤が充満する事なく、床材21に浸透性保
護防水剤を塗付する事が出来る。この様にしてパネル体
Pを取付けた後には、その均熱板を支板としてこれを螺
子や釘等で床材21に固定し、次いで断熱材を接着剤等
でパネル体Pの下面に重着する。
The floor heating structure of the present invention comprises:
As shown in FIG. 1, a heat-resistant floor material 21 spread and laid on the joists 13 forms a floor surface 20 to be heated, and the bottom surface of the floor material 21 is located between the predetermined joists 13. The heating unit 40 is attached via the heat conduction relaxation layer 30, and the lower surface of the heating unit 40 is superposed with a heat equalizing plate 50 made of a material having good heat conductivity so as to be spread between the joists 13. The lower surface of the heat equalizing plate 50 is covered with a heat insulating layer 60, and if desired, the lower surface of the heat insulating layer 60 is supported by a supporting means such as a supporting plate 70. The floor material 21 is made of a material that is neither deformed nor cracked by heating.
To this end, the floor material 21 itself may have heat resistance, or a general wood material having poor heat resistance may be heat-treated. As a method of this heat treatment, permeability and distortion prevention are used. Apply an effective waterproofing agent. Further, in the method of the present invention, the heating unit 40 is attached from below to the lower surface of the floor material 21 between the predetermined joists 13 in the joist structure. First, the floor material 2 that forms the floor surface 20 on the joists 13
1 is deployed and laid. This floor surface 20 is usually preformed by an existing floor material 21, and therefore the method of the present invention is usually carried out as a repair work on an existing wooden floor covering structure. In the method of the present invention, firstly joist 1
Preliminary step of removing the heat insulating material covering the lower surface of the floor material 21 between 3 and a waterproofing agent that is permeable to the floor material 21 with the exposed lower surface and has an effect of preventing distortion, that is, having a permeability to the wooden building material. After permeation, a waterproof coating that prevents distortion due to moisture and temperature of the wooden building material, for example, a step of applying a brand name Newseal stain, which is a penetrating protective waterproofing agent sold by Nippon Special Coating Co., Ltd., and this step After that, a step of attaching the heating portion 40 to the lower surface of the floor material between the joists 13 via a paperboard having a thickness of, for example, about 2 mm, and the lower surface of the heating portion 40 between the joists are made of a material having good thermal conductivity. There is a step of attaching the heat equalizing plate 50 and a step of forming a heat insulating layer 60 by superposing a heat insulating material on the lower surface of the heat equalizing plate 50. In the above process, the preliminary process of removing the heat insulating material between the joists is not necessary when newly constructing the floor heating structure, and in this case, a floor material suitable for floor heating such as plywood or cork tile material is used from the beginning. Since it is used, it is sufficient to apply a waterproofing agent having permeability. That is, in this case, the effect of preventing distortion is not particularly required. The heating unit is often a panel having a built-in hot water pipe that has been conventionally used, but the present invention is not limited to this. For example, a seed wire for an electric heater may be arranged in a straight line, a meandering line, or a striped pattern. May be. When a hot water pipe or a seed wire is used, the soaking plate 50 may be used as a panel substrate and the hot water pipe or the seed wire may be directly fixed to the soaking plate 50. Something is desirable. In the method of the present invention, when the permeation protection waterproofing agent is applied to the lower surface of an existing flooring material, the method according to claim 8 is adopted since the waterproofing agent contains a volatile solvent. Things are desirable. In this method, first, the heating section 40 is fixed to the upper surface of the heat equalizing plate 50, and a liquid absorbing fiber layer such as paperboard or nonwoven fabric as the heat conduction moderating layer 30 is layered on the upper surface of the heat equalizing plate 50 to form an adhesive. Polymerize and fix. In this manner, after being combined with the panel body P in which the liquid absorbent fiber layer and the heating portion and the heat equalizing plate are stacked, the penetrating protective waterproof agent having an adhesive property on the upper surface of the liquid absorbent fiber layer when undried For example, while applying the new seal stain (trade name) as shown in FIG. 5, while the liquid absorbing fiber layer is impregnated with the waterproof agent coating layer 22 ', that is, the waterproof agent is While not drying, the panel body P is carried under the floor, and the waterproof agent coating layer 22 'is provided.
To the underside of the flooring. By doing so, the panel body P is adhered to the lower surface of the floor material due to the adhesiveness of the waterproof agent coating layer 22 ', so that the permeation protection waterproof agent is applied to the floor material 21 without filling the underfloor with the solvent. You can do it. After the panel body P is mounted in this manner, the heat equalizing plate is used as a supporting plate and fixed to the floor material 21 with screws or nails, and then a heat insulating material is attached to the lower surface of the panel body P with an adhesive or the like. To wear.

【0005】[0005]

【作 用】本発明床暖房構造体は、この様に根太に支
承されている床材の下面に加熱部40を吊下状に取付け
たものである。本構造体では加熱部40から発生する熱
は均熱板50によって拡散伝達されると共に熱伝導緩和
層30によっても床材下面に分散され、且つ徐々に床材
21に伝達される。この床暖房構造体では、加熱部の下
方に根太13や下地板がないから、加熱部40の取付け
は請求項4,7,8記載の如く行う事が出来、このため
発明の効果の欄に記載したような利益がある。
[Operation] In the floor heating structure of the present invention, the heating portion 40 is attached in a suspended manner on the lower surface of the floor material thus supported by the joists. In this structure, the heat generated from the heating unit 40 is diffused and transmitted by the heat equalizing plate 50, is also dispersed by the heat conduction relaxation layer 30 to the lower surface of the floor material, and is gradually transmitted to the floor material 21. In this floor heating structure, since the joists 13 and the base plate are not provided below the heating part, the heating part 40 can be attached as described in claims 4, 7 and 8, and therefore, in the section of the effect of the invention. There are benefits as stated.

【0006】[0006]

【実施例】図1は本発明床暖房構造体の構成を示す縦断
面図で、図中10は根太構造,20は床面,30は熱伝
導緩和層,40は加熱部,50は均熱板,60は断熱層
を示す。
1 is a longitudinal sectional view showing the structure of a floor heating structure of the present invention. In the figure, 10 is a joist structure, 20 is a floor surface, 30 is a heat conduction relaxation layer, 40 is a heating portion, and 50 is soaking. A plate, 60 indicates a heat insulating layer.

【0007】上記根太構造10は、地上に直立する支脚
11上に平行状に横架された複数の大引き12と、この
大引き12上に大引きと直交する様に載架固定された多
数の根太13とを有しており、この根太構造によって床
面20を支承する骨格が構成される。
The joist structure 10 has a plurality of large pulls 12 which are horizontally laid in parallel on a support leg 11 which stands upright on the ground, and a large number of which are mounted and fixed on the large pulls 12 so as to be orthogonal to the large pulls. The joists 13 and the joists 13 have a skeleton that supports the floor surface 20.

【0008】上記床面20は、多数の床材20を上記根
太13上に平行状に展開敷設して形成されており、この
床面上にはカーペットや畳が重合される場合もある。上
記床材21としては、木質フローリング材,化粧合板,
ムク板等耐熱性の悪い材料、即ち加熱される事によって
変歪が生じたり、ひび割れしたりする材料と、コルクタ
イル材,合板等耐熱性の良い材料とがあり、本発明構造
体を新築する場合には耐熱性の良い材料を選ぶ事が必要
であり、この場合にも床材下面に防水塗料を塗る事が望
ましい。これに反し、本発明構造体を既設の床面を用い
て改修する場合には、床材21が耐熱性の悪い材料であ
る事も多いから、この場合には床材21に浸透性で変歪
防止効果のある防水剤、例えば日本特殊塗料株式会社の
販売に係る浸透性保護防水剤ニューシールスティン(商
品名)を塗付して耐熱性を改良すれば良い。このニュー
シールスティンは素材内部に深く浸透して内部空洞部を
充填すると共に硬化して素材の変歪やひび割れを阻止す
る特性がある防水用途料であるから、これを床材21の
下面に塗付して図2の如く塗付層22を形成すれば、こ
の防水剤が床材21内に点線で示す如く浸透して床材2
1の耐熱性を改良する。
The floor surface 20 is formed by laying a large number of floor materials 20 on the joist 13 in parallel, and carpets or tatami mats may be superposed on the floor surface. As the floor material 21, wood flooring material, decorative plywood,
There are materials with poor heat resistance, such as solid wood boards, that is, materials that are distorted or cracked when heated, and materials with good heat resistance, such as cork tile materials and plywood. In this case, it is necessary to select a material with good heat resistance, and in this case as well, it is desirable to apply a waterproof coating on the lower surface of the floor material. On the contrary, when the structure of the present invention is refurbished by using the existing floor surface, the floor material 21 is often a material having poor heat resistance. The heat resistance may be improved by applying a waterproofing agent having an anti-strain effect, for example, a penetrating protective waterproofing agent Neusealstein (trade name) sold by Nippon Special Coating Co., Ltd. Since this New Seal Stin is a waterproof material that penetrates deeply into the material, fills the internal cavity, and hardens to prevent deformation and cracking of the material, it is applied to the bottom surface of the floor material 21. If the coating layer 22 is formed as shown in FIG. 2 by applying it, this waterproofing agent penetrates into the floor material 21 as shown by the dotted line and the floor material 2
The heat resistance of 1 is improved.

【0009】上記熱伝導緩和層30は、加熱部40及び
均熱板50からの熱を徐々に床材21へ伝達するもの
で、これにより床面20の温水パイプやシード線と対向
する部分へ集中的に熱が伝達される事を防止して床面2
0の温度ムラを緩和する事が出来る。この様な熱伝導緩
和層30としては、加熱部40と床材21との間に形成
された微小空隙であっても良いが、実施例では厚さ2m
m程度の板紙や不織布等の繊維層を用いている。この繊
維層で作られた熱伝導緩和層30には図3に示す如く透
孔31を適数形成しても良く、かくすれば透孔部分の空
隙を熱伝導緩和空間として用いる事が出来る。而してこ
の様な繊維層として多数の透孔を形成した多孔板を用い
れば強度を保持しつつ空間総面積を大きくする事が出来
る。
The heat conduction moderating layer 30 gradually transfers the heat from the heating section 40 and the heat equalizing plate 50 to the floor material 21, and thereby to the portion of the floor surface 20 facing the hot water pipe or the seed wire. Floor surface 2 to prevent intensive heat transfer
It is possible to reduce the temperature unevenness of 0. Such a heat conduction relaxation layer 30 may be a minute void formed between the heating portion 40 and the floor material 21, but in the embodiment, it has a thickness of 2 m.
A fiber layer of paperboard or non-woven fabric of about m is used. An appropriate number of through holes 31 may be formed in the heat conduction moderating layer 30 made of this fiber layer as shown in FIG. 3, and thus the voids in the through holes can be used as the heat conduction moderating space. Thus, by using a perforated plate having a large number of through holes as such a fiber layer, the total space area can be increased while maintaining the strength.

【0010】上記加熱部40は、図2に示す如く温水パ
イプ41を用いたものでも良く、また図4に示す如く、
電気的発熱体42例えばニクロム線やシード線であって
も良い。而して温水パイプ41を用いた場合には、図示
しない温水熱源機と循環ポンプ等に接続され、又電気的
発熱体42を用いた場合には、図示しない電流供給用機
器に接続される事、従来と同様である。上記加熱部40
は、温水パイプ41や電気的発熱体42等を実施例の如
く直線状に1本配置する他、縞目状や蛇行状に配設して
構成される事もあるから、通常は均熱板50を基板とし
て予め配管又は配線されており、これによってパネル化
されている。この様にパネル化する場合、図6に示す如
く、硬質断熱材61で凹溝62を有する断熱層60を作
り、この断熱層60に均熱板50と加熱部40の温水パ
イプ41とを結合させたパネル体Pを組合せ、パネル体
Pを床材21に固定した後に加熱部40を嵌入した均熱
板50の凹溝51部分を断熱層60の凹溝62に収容す
る様にして下方から取付ければ作業が極めて容易であ
る。
The heating section 40 may be one using a hot water pipe 41 as shown in FIG. 2, or as shown in FIG.
The electric heating element 42 may be, for example, a nichrome wire or a seed wire. When the hot water pipe 41 is used, it is connected to a hot water heat source device and a circulation pump, which are not shown, and when the electric heating element 42 is used, it is connected to a current supply device which is not shown. , The same as the conventional one. The heating unit 40
In addition to arranging one hot water pipe 41, electric heating element 42, etc. in a straight line as in the embodiment, it may be arranged in a stripe pattern or a meandering pattern. 50 is used as a substrate and is preliminarily piped or wired to form a panel. When the panel is formed in this way, as shown in FIG. 6, a heat insulating layer 60 having a concave groove 62 is made of a hard heat insulating material 61, and the heat equalizing plate 50 and the hot water pipe 41 of the heating unit 40 are coupled to the heat insulating layer 60. The panel body P thus combined is fixed, and after the panel body P is fixed to the floor member 21, the concave groove 51 portion of the soaking plate 50 in which the heating portion 40 is fitted is accommodated in the concave groove 62 of the heat insulating layer 60 from below. Once installed, the work is extremely easy.

【0011】上記均熱板50は、熱伝導の良い材料、例
えばアルミニュームを材料とした板材で作られており、
実施例では根太3,13間に収容される幅の板材中央に
床材下面に向けて開口する凹溝51を形成してある。こ
の凹溝51には上記加熱部40の温水パイプ41やヒー
ター線42を収容し、均熱板50の板面52,52が熱
伝導緩和層30に密接出来る様に作ってある。上記均熱
板50は、加熱によって遠赤外線を放射する様な材料で
作るのが望ましく、この様な板材としては、スカイアル
ミニウム株式会社の販売に係るアルミニューム合金材ス
ーパーレイ(商品名)がある。上記均熱板50は、加熱
部40と熱学的に接続すると共に、上記熱伝導緩和層3
0と熱学的に密接していれば良く、従って図6の如く断
熱層60はその上面にアルミニューム箔63を形成する
事が望ましくこの場合には伝熱、断熱の双方において熱
学的効果が良くなる。
The soaking plate 50 is made of a material having good heat conductivity, for example, a plate material made of aluminum,
In the embodiment, a concave groove 51 opening toward the bottom surface of the floor material is formed in the center of the plate material having a width accommodated between the joists 3 and 13. The recessed groove 51 accommodates the hot water pipe 41 and the heater wire 42 of the heating section 40, and the plate surfaces 52, 52 of the heat equalizing plate 50 are formed so as to be in close contact with the heat conduction moderating layer 30. The soaking plate 50 is preferably made of a material that radiates far infrared rays by heating. As such a plate material, there is an aluminum alloy material Super Ray (trade name) sold by Sky Aluminum Co., Ltd. . The heat equalizing plate 50 is thermally connected to the heating unit 40, and the heat conduction moderating layer 3 is also provided.
Therefore, it is desirable that the heat insulating layer 60 has an aluminum foil 63 formed on the upper surface thereof, as shown in FIG. Will get better.

【0012】本発明構造体は、加熱部40の発熱手段と
して、温水パイプや電気的発熱手段、例えばニクロム線
やシード線を用いるのが通常であるが、電気発熱手段と
しては、面発熱型ヒーターもあるから、これを均熱板5
0に重合しても良い。而してこの面発熱型ヒーターを用
いる場合には、このヒーターがシート状や板状の平面形
状である事からして、直接的に熱伝導緩和層30に平面
的に接合させる事が出来る。従ってこの様な面発熱型ヒ
ーターを用いる場合には均熱板50は単に支承手段とし
ての役割しかない事になるから、場合によっては省除し
ても良い。即ちこの場合には加熱部40は断熱層60、
特に硬質断熱層60により直接的に支承される事にな
る。
In the structure of the present invention, a hot water pipe or an electric heating means such as a nichrome wire or a seed wire is usually used as the heating means of the heating section 40. As the electric heating means, a surface heating type heater is used. Since there is also a soaking plate 5
It may be polymerized to 0. When this surface-heating type heater is used, since the heater has a sheet-shaped or plate-shaped planar shape, it can be directly bonded to the heat conduction relaxation layer 30 in a planar manner. Therefore, when such a surface-heating type heater is used, the heat equalizing plate 50 only serves as a supporting means, and may be omitted in some cases. That is, in this case, the heating unit 40 has the heat insulating layer 60,
In particular, it is directly supported by the hard insulating layer 60.

【0013】上記断熱層60は、通常硬質断熱材を材料
として作られるが、場合によっては軟質断熱材を用いて
も良く、或は又硬質断熱材と軟質断熱材とを用いた2層
構造に作っても良い。
The heat insulating layer 60 is usually made of a hard heat insulating material, but in some cases a soft heat insulating material may be used, or a two-layer structure using a hard heat insulating material and a soft heat insulating material. You can make it.

【0014】続いて、上記の本発明構造体の構築方法に
ついて説明する。この方法は床暖房をしようとする根太
13,13間に耐熱性床面20をその床材21の下面が
露出する様にして形成する工程と、この工程につづいて
床材21の下面に熱伝導緩和層30を介して加熱部40
を取付ける工程と、上記加熱部40の下面に熱伝導性の
良い材料で作られた均熱板50を、該均熱板50が上記
床材下面に上記熱伝導緩和層30を介して対向する様に
重着する工程と、この工程後に上記均熱板50の下面を
断熱層60で被覆する工程とを有している。
Next, a method for constructing the structure of the present invention will be described. This method comprises a step of forming a heat resistant floor surface 20 between joists 13 and 13 for floor heating so that the lower surface of the floor material 21 is exposed, and a heat treatment is applied to the lower surface of the floor material 21 following this step. Heating unit 40 through the conduction relaxation layer 30
The step of mounting and the soaking plate 50 made of a material having good thermal conductivity on the lower surface of the heating section 40, and the soaking plate 50 faces the lower surface of the floor material via the heat conduction moderating layer 30. As described above, there is a step of stacking and a step of covering the lower surface of the heat equalizing plate 50 with a heat insulating layer 60 after this step.

【0015】上記耐熱性床面20を形成する工程は、こ
の床面20の床材21が材質的に耐熱性を有する材料、
例えばコルクタイル材の場合には、この儘使用しても良
いが、例えば床面20が既設のもので、床材21が前記
木質フローリング材等の耐熱性が悪いものである時や床
材21の耐熱性、耐水性を向上せしめるためには、請求
項4に記載するように床材21の下面に前記浸透性保護
防水剤を塗付して、この塗付層22により床材21の変
歪やひび割れを防止すると共に防水性を付与する必要が
ある。更に又上記床面20が既設のもので、床材下面に
断熱材が重層されている場合には、床材下面を露出する
ベく、既存の断熱材を取除く予備工程が必要となる。
In the step of forming the heat resistant floor surface 20, the floor material 21 of the floor surface 20 is made of a material having heat resistance,
For example, in the case of a cork tile material, this material may be used, for example, when the floor surface 20 is an existing one and the floor material 21 has poor heat resistance such as the wood flooring material or the floor material 21. In order to improve the heat resistance and water resistance of the floor material, the permeation protection waterproofing agent is applied to the lower surface of the floor material 21 as described in claim 4, and the coating layer 22 changes the floor material 21. It is necessary to prevent distortion and cracks and impart waterproofness. Furthermore, when the floor surface 20 is an existing one and the heat insulating material is overlaid on the lower surface of the floor material, it is necessary to expose the lower surface of the floor material and a preliminary step for removing the existing heat insulating material is required.

【0016】上記熱伝導緩和層30は、例えば均熱板5
0の上に図4に鎖線で示す如き断熱性の突条53を設け
て、均熱板50と床材21の下面間に空隙を形成して作
っても良いが、図1,図2に示す実施例では板厚が2m
m程度の板紙を使用しており、この板紙には所望により
図3に示す如き透孔31を形成しても良い。上記熱伝導
緩和層30は、板紙や不織布等の繊維層を用いて形成す
るのが望ましくこの様なものとしてフェルト材を用いる
事も出来る。上記加熱部40は前述の如く、温水パイプ
41や電気ヒーター線42等で床材21の下面を加熱す
る構成であるから、温水パイプ41等を板紙の下に当接
させつつ、これを配管、配線用フックで床材21に固定
しても良いが、この様にすると配管又は配線作業が面倒
であるから、請求項7,8に記載されている様に、均熱
板50を基板としてこれに予め温水パイプやヒーター線
等を配管、配線して、図5,図6に示す如くパネル体P
を作っておき、このパネル体Pを、その均熱板50を木
螺子や釘又はホッチキス等により床材21の下面に固定
する事によって床材に取付ける方法が便利である。而し
てこの場合には、パネル体Pの最上層に熱伝導緩和層3
0としての繊維層を設けておけば、パネル体Pの取付け
作業が更に容易となる。
The heat conduction relaxation layer 30 is, for example, a soaking plate 5
0 may be formed by providing a heat insulating ridge 53 as shown by a chain line in FIG. 4 to form a gap between the heat equalizing plate 50 and the lower surface of the floor material 21, but in FIGS. In the embodiment shown, the plate thickness is 2 m
A m-thick board is used, and if desired, a through hole 31 as shown in FIG. 3 may be formed in this board. The heat conduction relaxation layer 30 is preferably formed by using a fiber layer such as paperboard or nonwoven fabric, and a felt material can be used as such a material. As described above, the heating unit 40 is configured to heat the lower surface of the floor material 21 with the hot water pipe 41, the electric heater wire 42, and the like. Therefore, while the hot water pipe 41 and the like are brought into contact with the bottom of the paperboard, piping, Although it may be fixed to the floor member 21 with a wiring hook, this makes the piping or wiring work troublesome. Therefore, as described in claims 7 and 8, the soaking plate 50 is used as a substrate. A hot water pipe, a heater wire, etc. are preliminarily piped and wired to the panel body P as shown in FIGS.
It is convenient to attach the panel body P to the floor material by fixing the heat equalizing plate 50 to the lower surface of the floor material 21 with wood screws, nails, staples or the like. In this case, therefore, the heat conduction relaxation layer 3 is formed on the uppermost layer of the panel body P.
If the fiber layer of 0 is provided, the work of attaching the panel body P becomes easier.

【0017】この様にパネル体Pを用いる場合におい
て、この繊維層30の吸液性を利用し、この繊維層30
に前記浸透性保護防水剤を塗付すれば、床下の狭い空間
で塗付作業する事なく外部において図5に示すような塗
付層22′を形成出来るから、作業が容易であると共
に、床下作業時において、溶剤の揮発により発生する異
臭や空気の汚染を少なくする事が出来る。而してこのパ
ネル体Pの塗付層22′は、溶剤が乾燥しない間は粘着
性があるから、この塗付層22′を床材21の下面に接
着してパネル体Pを仮止めし、この儘の状態でパネル体
Pを床材21に釘止めする等して取付け固定する事が出
来ると云う利点もある。
When the panel body P is used as described above, the liquid absorbing property of the fiber layer 30 is utilized to make use of the fiber layer 30.
If the permeation protection waterproofing agent is applied to the underside of the floor, a coating layer 22 'as shown in FIG. 5 can be formed on the outside without applying in a narrow space under the floor. At the time of work, it is possible to reduce unpleasant odors and air pollution generated by the evaporation of the solvent. Since the coating layer 22 'of the panel body P is tacky while the solvent is not dried, the coating layer 22' is adhered to the lower surface of the floor material 21 to temporarily fix the panel body P. There is also an advantage that the panel body P can be attached and fixed to the floor material 21 by nailing or the like in this state.

【0018】以上の如く均熱板50を床材21に取付け
た後に、図2に示す如き断熱層60を均熱板50の下面
に接着剤等で重着する。本発明構造体は、床下の空間に
設けるものであるから、断熱層60は従来に比較して格
段と厚く形成する事が出来、断熱効果が良好である。而
してこの厚い断熱層60を支持する手段、例えば根太1
3,13の下面間に釘止や接着剤等で固定横架される支
持板70を設ける事が望ましく、この様にすれば、断熱
層60の自重による落下を有効に防止する事が出来る。
After attaching the heat equalizing plate 50 to the floor material 21 as described above, the heat insulating layer 60 as shown in FIG. 2 is superposed on the lower surface of the heat equalizing plate 50 with an adhesive or the like. Since the structure of the present invention is provided in the space under the floor, the heat insulating layer 60 can be formed to be much thicker than the conventional one, and the heat insulating effect is excellent. Thus, a means for supporting the thick heat insulating layer 60, such as joist 1
It is desirable to provide a support plate 70 which is fixed and laterally fixed by nailing or an adhesive between the lower surfaces of the electrodes 3 and 13. By doing so, it is possible to effectively prevent the heat insulating layer 60 from falling due to its own weight.

【0019】[0019]

【発明の効果】本発明床暖房構造体は、この様に床材2
1の下面に設けるものであるから、従来に比較して広い
空間を使用出来、従って加熱部40や断熱層60を大き
くする事が出来ると共に、加熱部を下から支承する基面
が不要なため、施工手間が簡単で且つ費用も低減出来る
と云う効果がある。そして又本発明方法は、既設の床材
21をその儘利用して床暖房構造体を作る事が出来るか
ら、改築が容易である他、改築中においても床面20を
その儘利用出来るから、床面上における日常生活を変え
る事なく改築が出来ると云う効果があり、且つ又根太構
造に手を加える事なく改築工事が出来るから、改築に要
する時間を短縮出来ると共に従来の改築工事に比鮫して
費用を格段と安価にする事が出来る。特に請求項8の方
法によれば、揮発性の強い浸透性保護防水剤を床下の狭
い空間で取扱う必要がないから、作業性及び安全性が極
めて良いと云う効果がある。
EFFECTS OF THE INVENTION The floor heating structure according to the present invention thus has the floor material 2
Since it is provided on the lower surface of No. 1, a wider space can be used as compared with the conventional one, so that the heating section 40 and the heat insulating layer 60 can be made large, and a base surface for supporting the heating section from below is unnecessary. The effect is that the construction work is simple and the cost can be reduced. Further, according to the method of the present invention, since the floor heating structure can be manufactured by using the existing floor material 21, the floor surface 20 can be used even during the remodeling. It has the effect of being able to perform renovation without changing daily life on the floor, and because renovation work can be done without modifying the joist structure, the time required for renovation can be shortened and compared to conventional renovation work. And the cost can be reduced significantly. In particular, according to the method of claim 8, it is not necessary to handle the volatile protective waterproofing agent having strong volatility in a narrow space under the floor, so that there is an effect that workability and safety are extremely good.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明暖房構造体の縦断面図である。FIG. 1 is a vertical sectional view of a heating structure of the present invention.

【図2】同分解図である。FIG. 2 is an exploded view of the same.

【図3】同暖房構造体の熱伝導緩和層の実施を示す斜視
図である。
FIG. 3 is a perspective view showing an implementation of a heat conduction relaxation layer of the heating structure.

【図4】同均熱板の斜視図である。FIG. 4 is a perspective view of the heat equalizing plate.

【図5】同パネル体の斜視図である。FIG. 5 is a perspective view of the panel body.

【図6】同暖房構造体の他の実施例を示す分解図であ
る。
FIG. 6 is an exploded view showing another embodiment of the heating structure.

【符号の説明】[Explanation of symbols]

10 根太構造 13 根太 20 床面 21 床材 22 塗付層 30 熱伝導緩和層 40 加熱部 41 温水パイプ 42 ヒーター線 50 均熱板 51 凹溝 60 断熱層 62 凹溝 70 支持板 P パネル体 10 joist structure 13 joist 20 floor surface 21 floor material 22 coating layer 30 heat conduction relaxation layer 40 heating part 41 hot water pipe 42 heater wire 50 soaking plate 51 concave groove 60 heat insulating layer 62 concave groove 70 support plate P panel body

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 // E04B 5/48 C ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location // E04B 5/48 C

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 根太間に載架された耐熱性床面と、この
床面を作る床材の下面に熱伝導緩和層を介して取付けら
れた加熱部と、この加熱部の下面に重着されると共に、
床材下面と平行状に展開し、且つ熱伝導性の良い材料で
作られた均熱板と、該均熱板の下面を覆閉する断熱層と
を有して成る事を特徴とした床暖房構造体。
1. A heat-resistant floor surface placed between joists, a heating portion attached to the lower surface of the floor material forming the floor surface via a heat conduction relaxation layer, and a heavy attachment to the lower surface of the heating portion. As well as
A floor characterized by comprising a heat equalizing plate which is developed in parallel with the lower surface of the floor material and is made of a material having good thermal conductivity, and a heat insulating layer which covers and closes the lower surface of the heat equalizing plate. Heating structure.
【請求項2】 請求項1の熱伝導緩和層が板紙等の繊維
層である事を特徴とした請求項1記載の床暖房構造体。
2. The floor heating structure according to claim 1, wherein the heat conduction relaxation layer according to claim 1 is a fiber layer such as paperboard.
【請求項3】 請求項1の均熱板が加熱された時におい
て床材下面に向け遠赤外線を放射する特性を有している
事を特徴とした請求項1記載の床暖房構造体。
3. The floor heating structure according to claim 1, wherein the soaking plate according to claim 1 has a characteristic of radiating far infrared rays toward a lower surface of the floor material when heated.
【請求項4】 床暖房をするべく選定された根太間にお
いて下面を露出した床材下面に浸透性で床材の変歪を防
止する効果のある浸透性保護防水剤を塗付する工程と、
この防水剤塗付後に熱伝導緩和層を介して加熱部を床材
下面に設置する工程と、該加熱部の下面に熱伝導性の良
い材料で作られた均熱板を上記床材下面と平行状に重着
すると共に、この均熱板を床材下面に固定する工程と、
上記均熱版の下面に断熱層を重合形成する工程とを有す
る事を特徴とした床暖房構造体の構築方法。
4. A step of applying a permeable protective waterproofing agent which is permeable and has an effect of preventing distortion of the floor material to the lower surface of the floor material whose lower surface is exposed in the floor joists selected for floor heating,
After applying the waterproofing agent, a step of installing a heating portion on the lower surface of the floor material via a heat conduction relaxation layer, and a soaking plate made of a material having good thermal conductivity on the lower surface of the heating portion is used as the lower surface of the floor material. A step of fixing the heat equalizing plate to the lower surface of the floor material while stacking in parallel,
A method for constructing a floor heating structure, comprising the step of polymerizing and forming a heat insulating layer on the lower surface of the soaking plate.
【請求項5】 請求項4における熱伝導緩和層が板紙等
の繊維層であり、この繊維層が床材下面に塗付された浸
透性保護防水剤の未乾状態時における粘着性により該塗
付層下面に接着される事を特徴とした請求項4記載の床
暖房構造体の構築方法。
5. The heat conduction relaxation layer according to claim 4 is a fiber layer of paperboard or the like, and the fiber layer is applied due to the adhesiveness of the permeable protective waterproofing agent applied to the lower surface of the flooring material in an undried state. The floor heating structure construction method according to claim 4, wherein the floor heating structure is adhered to the bottom surface of the layer.
【請求項6】 請求項4における床材下面に既存の断熱
材が重層されている時、この断熱材を浸透性保護防水剤
の塗付工程以前に取除く作業を予備工程として有する事
を特徴とした請求項4記載の床暖房構造体の構築方法。
6. The method according to claim 4, wherein when an existing heat insulating material is overlaid on the lower surface of the floor material, this heat insulating material is removed as a preliminary step before the step of applying the permeation protection waterproofing agent. The method for constructing a floor heating structure according to claim 4.
【請求項7】 請求項4の加熱部を予め均熱板上に配設
して、均熱板を基板としたパネル体を作り、このパネル
体をその均熱板を上記熱伝導緩和層を介して床材下面に
固定する様にした事を特徴とする請求項4記載の床暖房
構造体の構築方法。
7. The heating unit according to claim 4 is previously arranged on a heat equalizing plate to form a panel body using the heat equalizing plate as a substrate, and the panel body is attached to the heat conduction moderating layer. The method for constructing a floor heating structure according to claim 4, wherein the floor heating structure is fixed to the lower surface of the floor material through the interposition.
【請求項8】 床暖房をするべく選定された根太間にお
いて下面を露出した床材の下面に熱伝導緩和層と、この
熱伝導緩和層の下面に配置された加熱部と、更に該加熱
部の下面に重着すると共に床材下面と平行状に展開せし
められた熱伝導性の良い均熱板と、この均熱板の下面に
重合せしめられた断熱層とを積重して設ける床暖房構造
体の構築方法において、上記熱伝導緩和層として吸液性
繊維層を用い、この吸液性繊維層を、予め加熱部を設け
た均熱板の上面に接着固定して、均熱板を基板としたパ
ネル体を作る工程と、このパネル体の吸液性繊維層に予
め浸透性保護防水剤を塗付して塗付層を形成する工程
と、この塗付層の未乾状態時にその粘着性を用いてパネ
ル体を床材下面に接着すると共に上記均熱板を床材下面
に固定してパネル体を取付ける工程とを有する事を特徴
とする床暖房構造体の構築方法。
8. A heat conduction relaxation layer on the bottom surface of the flooring material, the bottom surface of which is exposed between the joists selected for floor heating, a heating portion arranged on the bottom surface of the heat conduction relaxation layer, and further the heating portion. Floor heating provided by stacking a heat equalizing plate with good thermal conductivity, which is superposed on the lower surface of the heat spreader and developed in parallel with the lower surface of the floor material, and a heat insulating layer superposed on the lower surface of the heat equalizing plate. In the method for constructing a structure, a liquid absorbing fiber layer is used as the heat conduction moderating layer, and the liquid absorbing fiber layer is bonded and fixed to the upper surface of a heat equalizing plate provided with a heating unit in advance to form a heat equalizing plate. A step of forming a panel body as a substrate, a step of applying a permeation protection waterproofing agent to the liquid absorbing fiber layer of the panel body in advance to form a coating layer, and a step of forming the coating layer in an undried state. The panel body is adhered to the lower surface of the floor material using adhesiveness, and the heat equalizing plate is fixed to the lower surface of the floor material to secure the panel body. A method for constructing a floor heating structure, comprising the step of mounting.
【請求項9】 請求項8における床材下面に既存の断熱
材が重層されている時、この断熱材をパネル体取付以前
に取除く作業を予備工程として有する事を特徴とした請
求項8記載の床暖房構造体の構築方法。
9. The method according to claim 8, wherein when an existing heat insulating material is layered on the bottom surface of the floor material, the work of removing the heat insulating material before mounting the panel body is included as a preliminary step. For building a floor heating structure for a building.
JP6110599A 1994-04-14 1994-04-14 Floor heating structural body and construction method thereof Pending JPH07279387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6110599A JPH07279387A (en) 1994-04-14 1994-04-14 Floor heating structural body and construction method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6110599A JPH07279387A (en) 1994-04-14 1994-04-14 Floor heating structural body and construction method thereof

Publications (1)

Publication Number Publication Date
JPH07279387A true JPH07279387A (en) 1995-10-27

Family

ID=14539942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6110599A Pending JPH07279387A (en) 1994-04-14 1994-04-14 Floor heating structural body and construction method thereof

Country Status (1)

Country Link
JP (1) JPH07279387A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116271A (en) * 1999-10-18 2001-04-27 Tokyo Gas Co Ltd Method for laying planar heater for floor heating and floor heating system
JP2007139400A (en) * 2005-11-19 2007-06-07 Misato Kk Method for installing floor heating device in house
CN102297468A (en) * 2011-09-28 2011-12-28 天津好为节能环保科技发展有限公司 Floor heating device with solar heat pump
CN102297466A (en) * 2011-09-28 2011-12-28 天津好为节能环保科技发展有限公司 floor heating terminal
CN103206062A (en) * 2013-04-18 2013-07-17 成军 Radiant heating construction method for floor comprising modular composite heat-insulation plates
CN103528111A (en) * 2012-07-02 2014-01-22 江苏德威木业有限公司 Integrated water heating floor block and heat conducting component thereof
CN105115019A (en) * 2015-09-14 2015-12-02 张家港市科兴炭纤维制品有限公司 Floor heating structural body and laying method thereof
CN105442803A (en) * 2015-12-28 2016-03-30 卡尔玛地板(苏州)有限公司 Floor and manufacturing method thereof
CN110206272A (en) * 2019-06-24 2019-09-06 南通大学 A kind of construction method of control floor heating protective layer cracking

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001116271A (en) * 1999-10-18 2001-04-27 Tokyo Gas Co Ltd Method for laying planar heater for floor heating and floor heating system
JP2007139400A (en) * 2005-11-19 2007-06-07 Misato Kk Method for installing floor heating device in house
CN102297468A (en) * 2011-09-28 2011-12-28 天津好为节能环保科技发展有限公司 Floor heating device with solar heat pump
CN102297466A (en) * 2011-09-28 2011-12-28 天津好为节能环保科技发展有限公司 floor heating terminal
CN103528111A (en) * 2012-07-02 2014-01-22 江苏德威木业有限公司 Integrated water heating floor block and heat conducting component thereof
CN103528111B (en) * 2012-07-02 2016-01-20 江苏德威木业有限公司 Integrated water heating floor block and heat conduction member thereof
CN103206062A (en) * 2013-04-18 2013-07-17 成军 Radiant heating construction method for floor comprising modular composite heat-insulation plates
CN103206062B (en) * 2013-04-18 2015-03-11 江苏博尔国际建设有限公司 Radiant heating construction method for floor comprising modular composite heat-insulation plates
CN105115019A (en) * 2015-09-14 2015-12-02 张家港市科兴炭纤维制品有限公司 Floor heating structural body and laying method thereof
CN105442803A (en) * 2015-12-28 2016-03-30 卡尔玛地板(苏州)有限公司 Floor and manufacturing method thereof
CN110206272A (en) * 2019-06-24 2019-09-06 南通大学 A kind of construction method of control floor heating protective layer cracking

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