JPH07278803A - Vacuum vapor deposition device - Google Patents

Abstract

PURPOSE:To provide such a winding-type vacuum vapor deposition device that variation of characteristics in the width direction of a substrate is decreased and excellent quality and production yield can be obtd. CONSTITUTION:This device is equipped with a mechanism to carry a polymer substrate, a vapor source, and a mechanism to scan electron beams 6 in the vacuum chamber. A thin film is continuously formed on a polymer substrate by scanning electron beams 6 while changes in the indident angle of electron beams to the vapor source are suppressed to within 5 degrees and by heating the vapor source.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum vapor deposition apparatus for continuously forming a thin film on a polymer substrate.

[0002]

2. Description of the Related Art In recent years, the application range of thin films has been expanding due to the demand of the times such as resource saving and miniaturization.

Particularly in digital recording, high density recording is required due to an increase in signal amount, and a metal thin film tape magnetically anisotropic by oblique vapor deposition or the like has attracted attention.

A conventional vapor deposition apparatus will be described below.
FIG. 5 shows the structure of a conventional vacuum vapor deposition apparatus. In FIG. 5, 1 is a polymer substrate, 2 is a refractory container, 3 is an evaporation material, 4 is a rotary support, 5 is an electron gun, 6 is an electron beam,
Reference numeral 7 is a vapor flow, and 8 is a mask.

The operation of the vacuum vapor deposition apparatus configured as described above will be described below. First, the vaporized material 3 is heated by the accelerated electron beam 6 to generate a vapor flow 7. This vapor partially adheres to the moving substrate 1 which is blocked by the mask 8 which limits the incident angle to the substrate 1 which is often used in the manufacture of magnetic tape. Further, in order to improve the uniformity of the thin film adhered to the polymer substrate 1, the refractory container 2 has substantially the same width as the polymer substrate 1, and the electron beam 6 is used for the electric field and the magnetic field to evaporate the evaporation material in the refractory container. Scan the top. FIG. 6 is a top view of the trajectory of the scanning electron beam.

[0006]

However, in the above conventional structure, since the incident angle of the vapor flow in the substrate width direction differs depending on the location (width direction) of the substrate, the magnetic characteristics in the substrate transport direction and the substrate width direction. There is a problem in that the relationship of magnetic characteristics differs depending on the location (width direction) of the substrate, and the balance of reproduction output varies depending on the location of the substrate. (In the known helical scan VTR, the electromagnetic conversion characteristics are different for each head depending on the track angle and the azimuth angle of the head.) The present invention solves the above-mentioned conventional problems, and a stable yield of quality in the width direction is obtained. It is an object to provide a good winding vacuum deposition apparatus.

[0007]

In order to achieve this object, a vacuum vapor deposition apparatus of the present invention comprises a mechanism for conveying a polymer substrate, an evaporation source, and a mechanism for scanning an electron beam in a vacuum chamber. The incident angle of the electron beam on the source is 5 in the width direction.
The evaporation source is heated while scanning the electron beam so that the temperature is within the range to continuously form a thin film on the polymer substrate.

[0008]

With this configuration, the incident angle (width direction) of the vapor flow on the substrate becomes substantially constant, the electromagnetic conversion characteristics become substantially constant in the width direction of the substrate, and a vapor deposition apparatus with a good yield can be obtained.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows the structure of a vacuum vapor deposition apparatus according to the first embodiment of the present invention. In FIG. 1, 1 is a polymer substrate, 2 is a refractory container, 3 is an evaporation material, 4 is a rotary support,
5 is an electron gun, 6 is an electron beam, 7 is a vapor flow, and 8 is a mask. FIG. 2 is a top view of the trajectory of the scanning electron beam.

The operation of the vacuum vapor deposition apparatus constructed as above will be described. First, the electron beam 6 emitted from the electron gun 5 and accelerated accelerates the vaporized material 3 to generate a vapor flow 7. This vapor adheres to the substrate 1 which moves along the rotary support 4 and is blocked by the mask 8 which limits the angle of incidence on the substrate 1 which is often used in the manufacture of magnetic tape. The electron beam 6 scans the evaporation material 3 by deflection using a known electric field or magnetic field. At this time, the incident angle θ of the electron beam on the evaporation material when viewed from the upper surface is determined by the distance between the electron gun and the evaporation source and the scanning width of the electron beam.

In the experiment, a vapor-deposited magnetic tape suitable for high-density recording was manufactured by changing the distance between the electron gun and the evaporation source and the scanning width of the electron beam, and a modified 8 mm VTR was used to vary the electromagnetic conversion characteristics in the substrate width direction. I checked. Experimental condition and variation 0.5
The yield in the width direction when dB is shown in (Table 1).

[0013]

[Table 1]

As is clear from Table 1, the electromagnetic conversion characteristics in the width direction can be obtained by appropriately selecting the distance between the electron gun and the evaporation source and the scanning width of the electron beam so that the difference in beam incident angle is within 5 degrees. An excellent effect can be obtained in terms of yield.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a configuration diagram of a vacuum vapor deposition device showing a second embodiment of the present invention. In FIG. 3, FIG.
The configuration is different from that of (1) in that a second deflection mechanism 9 for controlling the trajectory of the electron beam is provided. The second deflection mechanism is also appropriately selected from the known methods using an electric field and a magnetic field.
FIG. 4 is a top view of the trajectory of the scanning electron beam.

The operation of the vacuum vapor deposition apparatus constructed as above will be described. First, the electron beam 6 emitted from the electron gun 5 and heated heats the evaporation material 3 to generate a vapor flow 7. This vapor adheres to the substrate 1 which moves along the rotary support 4 and is blocked by the mask 8 which limits the angle of incidence on the substrate 1 which is often used in the production of electromagnetic tape. The electron beam 6 scans the evaporation material 3 by deflection using a known electric field or magnetic field. At this time, the second deflecting mechanism 9 appropriately controls the incident angle of the electron beam to the evaporation material when viewed from the upper surface.

A comparison between the vacuum vapor deposition apparatus according to this embodiment and the conventional vacuum vapor deposition apparatus was made by making a trial vapor deposition magnetic tape suitable for high density recording. The distance between the electron gun and the evaporation source was 1500 mm, and the scanning width of the electron beam was 500 mm. The results are shown in (Table 2).

[0018]

[Table 2]

As is clear from Table 2, when the electron beam is scanned, the deflection is appropriately performed to make the incident angle to the evaporation source constant, which is excellent in the yield of the electromagnetic conversion characteristics in the width direction. The effect is obtained. Further, the distance between the electron gun and the evaporation source can be reduced, and the device can be downsized.

[0020]

As described above, according to the present invention, a mechanism for conveying a polymer substrate, an evaporation source, and a mechanism for scanning an electron beam are provided in a vacuum chamber, and the evaporation source is heated while scanning the electron beam. In a vacuum vapor deposition apparatus for continuously forming a thin film on a polymer substrate, by changing the incident angle of an electron beam to an evaporation source within 5 degrees in the width direction, an excellent vacuum in terms of yield of electromagnetic conversion characteristics in the width direction is obtained. It is possible to realize a vapor deposition device.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a vacuum vapor deposition device according to a first embodiment of the present invention.

FIG. 2 is a top view of the trajectory of the electron beam of the vacuum vapor deposition device in the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a vacuum vapor deposition device according to a second embodiment of the present invention.

FIG. 4 is a top view of the trajectory of an electron beam in a vacuum vapor deposition device according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram of a conventional vacuum vapor deposition device.

FIG. 6 is a top view of the trajectory of an electron beam in a conventional vacuum vapor deposition device.

[Explanation of symbols]

 1 Polymer Substrate 2 Refractory Container 3 Evaporation Material 4 Rotation Support 5 Electron Gun 6 Electron Beam 7 Vapor Flow 8 Mask 9 Second Deflection Mechanism

Claims (1)

[Claims] 1. A mechanism for conveying a polymer substrate into a vacuum chamber,
In a vacuum vapor deposition apparatus having an evaporation source and a mechanism for scanning an electron beam, heating the evaporation source while scanning the electron beam to continuously form a thin film on the polymer substrate, the incident angle of the electron beam on the evaporation source changes. A vacuum vapor deposition apparatus characterized in that the width is within 5 degrees.