JPH07254582A - 半導体ウェーハ粒子除去装置 - Google Patents

半導体ウェーハ粒子除去装置

Info

Publication number
JPH07254582A
JPH07254582A JP26773894A JP26773894A JPH07254582A JP H07254582 A JPH07254582 A JP H07254582A JP 26773894 A JP26773894 A JP 26773894A JP 26773894 A JP26773894 A JP 26773894A JP H07254582 A JPH07254582 A JP H07254582A
Authority
JP
Japan
Prior art keywords
roller
wafer
semiconductor wafer
flat
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26773894A
Other languages
English (en)
Japanese (ja)
Inventor
Mark A Mcguire
エイ．マクガイヤー マーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH07254582A publication Critical patent/JPH07254582A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P72/0406—
    • H10P76/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP26773894A 1993-10-29 1994-10-31 半導体ウェーハ粒子除去装置 Pending JPH07254582A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US144944 1993-10-29
US08/144,944 US5475892A (en) 1993-10-29 1993-10-29 Semiconductor wafer particle extractor

Publications (1)

Publication Number Publication Date
JPH07254582A true JPH07254582A (ja) 1995-10-03

Family

ID=22510861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26773894A Pending JPH07254582A (ja) 1993-10-29 1994-10-31 半導体ウェーハ粒子除去装置

Country Status (5)

Country Link
US (1) US5475892A (enExample)
EP (1) EP0651438A1 (enExample)
JP (1) JPH07254582A (enExample)
KR (1) KR950012575A (enExample)
TW (1) TW280935B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244220B2 (ja) * 1996-08-06 2002-01-07 信越半導体株式会社 平板状物の乾燥方法および乾燥装置
DE19644779C2 (de) * 1996-10-28 2001-06-28 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten, insbesondere auch von Halbleiterwafern
US5883374A (en) * 1997-03-27 1999-03-16 Advanced Micro Devices, Inc. Scanning system for identifying wafers in semiconductor process tool chambers
US6918864B1 (en) * 1999-06-01 2005-07-19 Applied Materials, Inc. Roller that avoids substrate slippage
US20060000494A1 (en) * 2004-06-30 2006-01-05 Lam Research Corporation Self-draining edge wheel system and method
TWI858644B (zh) * 2023-04-07 2024-10-11 奇勗科技股份有限公司 一種晶圓的濕式處理設備及用於其的晶圓載台

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3004276A (en) * 1958-11-03 1961-10-17 Carl C Hoffman Apparatus for quickly cleaning folded filter element of dry type air filters
US3005223A (en) * 1959-07-07 1961-10-24 William W Taylor Phonograph record vacuum cleaner
US3150401A (en) * 1963-01-31 1964-09-29 William W Taylor Phonograph record cleaner
NL130001C (enExample) * 1963-07-24
US3479222A (en) * 1966-06-22 1969-11-18 Disc Pack Corp Apparatus for and method of cleaning memory discs
US3765051A (en) * 1971-11-12 1973-10-16 A Nu Inc Apparatus for cleaning filter elements or the like
EP0145749B1 (en) * 1983-05-23 1988-03-16 Asq Boats, Inc. Universal flat orienter for semiconductor wafers
US4662811A (en) * 1983-07-25 1987-05-05 Hayden Thomas J Method and apparatus for orienting semiconductor wafers
JPS61178187U (enExample) * 1985-04-26 1986-11-06
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
JPH05259264A (ja) * 1992-03-11 1993-10-08 Fujitsu Ltd 半導体ウェーハ整列装置

Also Published As

Publication number Publication date
US5475892A (en) 1995-12-19
TW280935B (enExample) 1996-07-11
EP0651438A1 (en) 1995-05-03
KR950012575A (ko) 1995-05-16

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