JPH07252685A - Plating method for metallic sheet and jig for plating - Google Patents

Abstract

PURPOSE:To efficiently execute prescribed plating only on one surface of metallic sheet by subjecting the one surface of the metallic sheet to electroplating in a plating liquid in the state of masking its non-plating surface by attracting and holding this surface with jigs. CONSTITUTION:Two sheets of the metallic sheets 2 are fitted into the body 3 of the jigs 1 for plating consisting of an electrolysis resistant synthetic resin and are then fixed by mounting cap members 22 at the jigs. Next, a vacuum pump, etc., are connected to a suction device 10 of the jig body 3 to evacuate the inside of grooves 4, 5 and recessed parts 6 for vacuum suction formed on the surfaces of the jig body 3, by which the metallic sheets 2, 2 are vacuum sucked to both surfaces of the jig body 3 and the non-plating surfaces of the metallic sheets 2, 2 are masked by the jig body 3. Two sheets of the metallic sheets 2, 2 fixed by the plating jigs 1 are immersed in this state into the plating liquid and electrodes 15 disposed at the jig body 3 are energized by lead wires 17 inserted from a terminal 18 through a hole 16 formed at the jig body 3, by which the outer side faces of the metallic sheets 2, are electroplated. One surface of two sheets of the metallic sheets is easily masked and held at one time and the other surface is simultaneously subjected to the plating treatment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for plating a metal plate and a jig for plating, and more specifically, a plating method for performing a predetermined plating treatment on only one surface of the metal plate, and a plating used for the method. For jigs.

[0002]

2. Description of the Related Art Conventionally, when copper plating is applied only to one surface of a metal plate, for example, a stainless steel plate, taping is applied to the other surface which is not plated, or a brazing material is applied to the other surface. After masking, electrolytic plating or electroless plating is performed. After the plating process is completed, the masked tape or the like is removed.

[0003]

However, the method of plating one surface of a metal plate as described above has the following problems. That is, it takes time for masking the other surface of the metal plate which is not plated and time for removing the masking after the plating treatment, resulting in poor workability and high cost. It is difficult to plate only the necessary parts. A terminal effect occurs in which the plated layer on the plated end face becomes thick. There is a problem such as.

The present invention has been made to solve the above-mentioned problems, and its object is to improve the workability and reduce the cost, and a metal plate plating method and a plating jig. To provide.

[0005]

The method for plating a metal plate according to the present invention as a means for achieving the above object is a metal plate, wherein the other surface of the metal plate is adsorbed and held on the whole other surface. Is held by a jig for masking, and the metal plate is plated while being attracted and held by the jig. Further, according to another method of plating a metal plate of the present invention, the other surfaces of the two metal plates are sucked and held by a jig, and the two metal plates are simultaneously plated while being sucked and held by the jig. It is designed to be applied. Further, in another plating method of the present invention, a masking member for masking the peripheral portion of the one surface of the metal plate held by the jig is held by the jig to perform the plating treatment.

Further, the jig for plating a metal plate of the present invention is
The metal plate is formed in substantially the same shape, and the other surface of the metal plate is suction-held by vacuum suction to mask the entire other surface. Further, another jig for plating a metal plate of the present invention has a structure in which grooves for vacuuming are formed on both surfaces of the jig so that the other surfaces of the two metal plates are sucked at the same time. Further, another plating jig of the present invention is configured such that a masking member for masking the peripheral portion of one surface of the metal plate is vacuum-adsorbed to the peripheral portion of the jig. Furthermore, the jig for plating a metal plate of the present invention is provided with an electrode that contacts the metal plate and a hook member that suspends the jig.

[0007]

According to the method for plating a metal plate of the present invention, the metal plate is held by a jig that holds the other surface of the metal plate by suction and masks the other surface, and is held by the jig. By plating the metal plate as it is, the other surface of the metal plate is adsorbed and held on the jig before the plating process and the plating process is performed, and then the metal plate is removed from the jig. Predetermined plating can be performed only on. Further, in the case where the respective other surfaces of the two metal plates are sucked and held by the jig, the two metal plates can be plated at the same time, and one surface of the metal plates held by the jig When the masking member for masking the peripheral edge of the metal plate is held by the jig to perform the plating treatment, the plating can be performed except for the peripheral edge of one surface of the metal plate.

Further, the jig for plating a metal plate of the present invention is
The metal plate is formed in substantially the same shape, and the other surface of the metal plate is suction-held by vacuum suction and the entire other surface is masked. Therefore, the metal plate is suction-held and plated by the plating jig. After the treatment, by removing the metal plate, it is possible to perform predetermined plating only on one surface of the metal plate. Further, in another jig for plating a metal plate according to the present invention, since grooves for vacuuming are formed on both surfaces of the jig and the other surfaces of the two metal plates are adsorbed at the same time, the two metal plates are attached. It is possible to perform plating on each one side at the same time. Furthermore, another plating jig of the present invention vacuum-adsorbs a masking member for masking the peripheral portion of the one surface of the metal plate to the peripheral portion of the jig.
Plating can be performed on one surface of the metal plate except the peripheral portion. Furthermore, since another plating jig of the present invention is provided with the electrodes and the hook members, it can perform electrolytic plating and can easily hang the jig.

As described above, according to the metal plate plating method and the plating jig of the present invention, the other surface of the metal plate which is not plated is sucked and held by the jig and the whole other surface is masked. In addition, it is possible to perform a predetermined plating on only one surface of the metal plate with good workability, and it is possible to achieve cost reduction.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG.
1 shows an embodiment of a metal plate plating method and a plating jig of the present invention, FIG. 1 is a side sectional view of the jig, FIG. 2 is a front view of the jig,
3 is a process diagram, FIG. 4 is an explanatory diagram of mounting a metal plate on a jig,
FIG. 5 is an illustration of the metal plate after plating.

The metal plate plating method of the present embodiment is a method for plating one surface of a metal plate. In brief, two metal plates 2 and 2 are held by a plating jig 1. As it is, the metal plates 2 and 2 are configured to be plated on one surface. Further, the plating jig 1 is formed in the same shape as the two metal plates 2 and 2 and holds the other surfaces (the surfaces not plated) of the two metal plates 2 and 2 by vacuum suction. The other surface of the metal plate 2 is masked. Here, a square stainless plate was used as the metal plate 2.

First, the plating jig 1 will be described.
The plating jig 1 is, for example, a rectangular jig made of an electrolytic resistant synthetic resin such as an epoxy resin, and has a rectangular metal plate mounting portion 1a for mounting a metal plate 2 to be plated. ing. A dummy holding portion 3a is provided on the periphery of the flat plate-shaped jig body 3, and two vacuum suction grooves 4 and 5 and a vacuum suction concave portion 6 are provided on both surfaces of the jig body 3. The vacuum suction grooves 4 and 5 and the vacuum suction recess 6 that are formed
Are communicated with the communication grooves 7 and 8, and the dummy holding portion 3a
Grooves 9 for vacuum suction are formed on both surfaces of the suction suction channel 1 formed inside the jig body 3 in the grooves 4, 5, 9 for vacuum suction.
The suction holes 11 and 12 communicating with 0 are open. Here, the suction hole 11 is a hole for sucking / sucking a lid member 22 described later, and the suction hole 12 is a hole for sucking / sucking the metal plate 2.

An electrode 15 is provided in the center of the jig body 3 of the plating jig 1, and a lead wire 17 is provided in the electrode 15 through a hole 16 formed in the jig body 3. The lead wire 17 is connected to the electrode connection terminal 18 attached to the jig body 3, and a hook member 19 for hanging is integrally formed on the top of the electrode connection terminal 18.

Further, the jig body 3 has a dummy holding portion 3
A seal ring 20 which is a rubber packing material is provided at the boundary with a to ensure vacuum suction, and a seal ring 21 is similarly provided at the peripheral edge of the dummy holding portion 3a. A dummy lid member 22 is suction-held on the dummy holding portion 3a of the plating jig 1, and the lid member 2 is held.
2 is formed with a flange portion 22a protruding inward,
A seal ring 24 is fitted on the flange portion 22a, and the seal ring 24 is configured to seal the peripheral edge of the metal plate 2. That is, the seal ring 24 presses the peripheral edge of the front surface of the metal plate 2, and the back surface of the metal plate 2 is held by the seal ring 20 so that the metal plate 2 is fixed from the front and back sides to prevent contact with the plating solution. is doing. Further, the lid member 22 is formed with a convex portion 26 for alignment.

Next, with reference to FIGS. 3 to 5, a method for plating one surface (one surface) of a metal plate 2 such as a stainless plate with copper using the above-described plating jig 1 will be described. First, as shown in FIG. 3, the plating jig 1 is attached to the metal plates 2 and 2.
Adsorb and hold.

Here, in the plating jig 1, after the metal plate 2 is fitted on one surface of the jig body 3, the lid member 22 is mounted, and as shown in FIG. Placed on
After the metal plate 2 is fitted on the other surface of the jig body 3 and the lid member 22 is attached, a vacuum pump or the like is connected to the suction passage 10 to suck the internal air, and the vacuum suction grooves 4, 5 and The vacuum suction concave portion 6 is set to a vacuum state to suck the metal plates 2 and 2 on both sides of the jig body 3 by vacuum, and the vacuum suction groove 9 is set to a vacuum state to set the lid members 22 to the dummy of the jig body 3. As shown in FIG. 1, the metal plates 2 and 2 are held on the jig 1 for plating by vacuum suction by vacuum suction to the holding portion 3a, and the other surfaces of the metal plates 2 and 2 are fixed to the jig main body 3 as shown in FIG. Masked by. After vacuum suction, the suction passage 10 of the plating jig 1 is closed with a cock or the like. by the way,
The vacuum degree at the time of suction of the metal plate 2 has a thickness of 0.5 mm,
In the case of a stainless plate having a size of 350 mm × 350 mm, the pressure is set to −600 mmHg (−80 KPa) or more, and after 30 minutes of suction of the metal plate set, −300 mmHg (−40 K).
Pa) or more is preferable.

Thereafter, the plating jig 1 is attached to the hook member 1 while the metal plates 2 and 2 are held on the plating jig 1.
As shown in FIG. 3, by suspending from a predetermined supporting member at 9, the dirt is removed by electrolytic degreasing, and after washing with water, the surface is activated by pickling to wash with water and then the nickel base. Plating. After washing with water, copper plating is performed. After further washing with water, an antioxidant treatment is performed. Here, since the other surfaces of the metal plates 2 and 2 are masked by the plating jig 1, the plating is not applied in the next step, and the peripheral edges of the one surface of the metal plates 2 and 2 are the lid members 22 and 22. Since it is covered with the flange portion 22a and the seal ring 24, it also acts so that plating is not applied in the next step.

As described above, one surface of the metal plate 2 that has been plated is copper-plated at the hatched portion in FIG. 5, and the peripheral portion is not plated. It is possible to prevent the problem that the plating on the peripheral portion is peeled off to form plating powder and adversely affect.

After the plating process is completed, the plating jig 1
Is taken out of the plating tank, and the suction path 1 of the plating jig 1 is removed.
Since the air flows into the vacuum suction grooves 4 and 5, the vacuum suction recess 6 and the vacuum suction groove 9 through the suction passage 10 by opening the cock etc. of 0, the lid members 22 and 22 can be removed to remove the metal. The plates 2 and 2 can be removed from the jig body 3.

Next, in order to confirm the operation and effect of the present invention, when the plating jig of this embodiment is used (hereinafter referred to as the method of this embodiment), the conventional insulating material taping and brazing material When the masking method by coating is used (hereinafter referred to as the conventional method), only one surface of each stainless steel plate is copper-plated, and the workability is compared. When the conventional method is used, the masking process is performed. so,
While it took four hours for two workers to mask 100 stainless steel plates, when the method of this embodiment was used, it took only 25 minutes for one worker to complete the work time. Was reduced to 1/20. This is because in the case of the conventional method, the surface of the stainless steel plate that is not plated is degreased with an organic solvent, masked by taping, and the tape is peeled off after the plating process is completed. Then, the adhesive paste of the tape adheres stubbornly, and a removal treatment with an organic solvent is required to remove the adhesive paste.

In addition, when the rate of defective plating was also examined, defective products were found to occur in 50% or more in the case of the conventional method. On the other hand, in the case of the method of this embodiment,
No defective products were found. This is because in the case of the conventional method, when masking by taping, air enters between the stainless plate and the tape and rises like a groove, and the peeling phenomenon of the tape occurs in the plating process, and the raised portion This is due to the fact that copper plating adheres to and defective products are generated.

From the above results, it was confirmed that the method of this embodiment can improve the workability and reduce the defective plating rate as compared with the conventional method. Therefore, in the case of this embodiment, accurate plating can be performed on only one surface of the stainless steel plate by a simple operation.

It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within the scope of the present invention. By the way, in the present embodiment, the description has been given of the plating method of plating the metal plate with copper.
The same can be applied to plating other than copper plating, such as zinc plating, cadmium plating, and precious metal plating. In addition, in the above-described embodiment, the plating process is described in the case of electrolytic plating,
It is obvious that electroless plating can be similarly performed by using the jig of this embodiment.

Further, in the above-mentioned embodiment, the plating jig is configured to simultaneously suck and hold two metal plates, but this improves productivity as compared with the case of holding one metal plate. Obviously, however, it goes without saying that the structure may be such that one metal plate is held. Further, the shape of the plating jig is not limited to a quadrangle, but the shape of the metal plate to be plated, such as a circle or an ellipse,
It may be formed into a polygonal shape such as a triangle or any other shape that fits the shape. Furthermore, in the above-described embodiment, the configuration using the lid member has been described, but the lid member may not be used. Further, in the above-mentioned embodiment, the vacuum suction grooves are formed so as to circulate, but this has the advantage that uniform vacuum suction can be performed, but a plurality of concave portions are scattered regularly and irregularly. Can also be formed.

[0025]

As is apparent from the above description, according to the metal plate plating method of the present invention, the metal plate is used as a jig for holding the other surface of the metal plate by suction and masking the entire other surface. Since the metal plate is subjected to the plating treatment while being held by suction and held by the jig, the other surface of the metal plate is sucked and held by the jig before the plating treatment and the metal treatment is performed. By removing the plate from the jig, it is possible to perform a predetermined plating on only one surface of the metal plate.

According to another plating method of the present invention,
Since the other surfaces of the two metal plates are sucked and held by the jig, there is an effect that the two metal plates can be simultaneously plated. Furthermore, according to another plating method of the present invention, a masking member for masking the peripheral portion of the one surface of the metal plate held by the jig is held by the jig to perform the plating treatment. It is possible to perform plating except for the peripheral portion of one surface, and it is possible to prevent the plating of the peripheral portion from being peeled off in a pressing process or the like, and having an adverse effect.

According to the metal plate plating jig of the present invention,
The metal plate is formed in substantially the same shape, and the other surface of the metal plate is suction-held by vacuum suction and the entire other surface is masked. Therefore, the metal plate is suction-held and plated by the plating jig. By removing the metal plate after the treatment, it is possible to perform a predetermined plating on only one surface of the metal plate.

According to another jig for plating a metal plate of the present invention, grooves for vacuuming are formed on both surfaces of the jig.
Since the other surfaces of the metal plates are adsorbed at the same time, it is possible to perform plating on each of the two metal plates at the same time. Further, according to another plating jig of the present invention, since a masking member for masking the peripheral portion of the one surface of the metal plate is vacuum-adsorbed to the peripheral portion of the jig, plating is performed on the one surface of the metal plate excluding the peripheral portion. It is possible to prevent the plating of the peripheral portion from peeling off in the pressing step and the like, and to prevent an adverse effect. Furthermore, according to another plating jig of the present invention, since the electrode and the hook member are provided, there is an effect that electrolytic plating can be performed and the jig can be easily suspended.

Thus, according to the metal plate plating method and the plating jig of the present invention, the other surface of the metal plate which is not plated is suction-held by the jig and the entire other surface is masked. There is an effect that predetermined plating can be performed only on one surface of the metal plate with good workability and cost can be reduced.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of a plating jig of the present invention.

FIG. 2 is a front view of a plating jig.

FIG. 3 is a process diagram of a plating method.

FIG. 4 is an explanatory diagram of a mounting process of a metal plate on a plating jig.

FIG. 5 is an explanatory diagram of a metal plate after plating.

[Explanation of symbols]

1 ... Plating jig, 2 ... Metal plate, 3 ... Jig body, 4, 5 ... Vacuum suction groove, 6 ... Vacuum suction recess, 9 ... Vacuum suction Groove, 10 ... Suction path, 1
1, 12 ... Suction hole, 15 ... Electrode, 19 ... Hook member, 22 ... Lid member, 20, 21, 24 ...
Seal ring

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Niimi 7-13 Minatomachi, Chofu City, Shimonoseki City, Yamaguchi Prefecture Shimonoseki Plating Co., Ltd.

Claims (7)

[Claims] 1. A plating method in which one surface of a metal plate is plated, wherein the other surface of the metal plate is attracted and held, and the metal plate is held by a jig that masks the other surface, A plating method for a metal plate, which is characterized in that a metal plate is plated while being adsorbed and held by a jig. 2. The method according to claim 1, wherein each of the other surfaces of the two metal plates is adsorbed and held by a jig, and the two metal plates are simultaneously plated while being adsorbed and held by the jig. Metal plate plating method. 3. The method for plating a metal plate according to claim 1, wherein a masking member for masking the peripheral portion of the one surface of the metal plate attracted and held by the jig is held by the jig. 4. A plating jig used when plating one surface of a metal plate, the jig having a substantially same shape as the metal plate, and the other surface of the metal plate being sucked by vacuum suction. A jig for plating a metal plate, comprising a masking portion that holds and masks the entire other surface. 5. The jig for plating a metal plate according to claim 4, wherein grooves for vacuuming are formed on both surfaces of the jig, and the other surfaces of the two metal plates are adsorbed at the same time. 6. The jig for plating a metal plate according to claim 4, wherein a masking member for masking the peripheral portion of the one surface of the metal plate is held by vacuum suction on the peripheral portion of the jig. 7. The jig is provided with an electrode that contacts the metal plate and a hook member that suspends the jig.
A jig for plating a metal plate according to any one of 1 to 6.