JP2022019235A - Plating fixture - Google Patents

Abstract

To provide a plating fixture that neither lowers production efficiency, nor bringing a side face and one surface of a peripheral edge part of a plated substrate into contact with an electric plating liquid, and can carry out electric plating on only the one surface.SOLUTION: A plating fixture 11 comprises: an unplated surface-side fixation plate 13 which fixes the side of an unplated side 1b of a substrate 1 to be plated; a counter plate 2 which faces an end part; seal members which are provided between the end part of the substrate and the counter plate and between the non-plating surface-side fixation plate outside the substrate to be plated and a plated surface-side fixation plate; and fixing means 7, the plated substrate, the plated surface-side fixation plate, the seal member 3 provided therebetween, the unplated surface-side fixation plate and the counter plate outside the plated substrate, and the seal member 4 provided therebetween forming a sealed space. The seal members 3, 4 have gaps inside, and the gaps make uniform pressure applied to the seal members 3, 4 to enhance the sealability of the sealed space.SELECTED DRAWING: Figure 4

Description

The present invention relates to a plating jig used in a wet surface treatment apparatus such as electroplating and etching.

In electroplating, plating may be performed on only one side (one side) of the substrate to be plated. Since the electroplating solution is a strong acid, if it is not desired to immerse the non-plated surface of the substrate to be plated in the electroplating solution, it is necessary to separate the surface that is not desired to be immersed in the electroplating solution from the electroplating solution.

Methods for separating a part of the substrate to be plated from the electroplating solution include attaching an acid-resistant tape, applying an acid-resistant chemical, and covering with a resin or stainless steel jig.

In the above-mentioned attachment of the acid-resistant tape, the attachment step and the peeling step can be performed in a short time, but it is not suitable for covering the end face of the substrate to be plated. This is because the acid-resistant tape cannot sufficiently follow the shape at the boundary between the main surface and the side surface of the substrate to be plated, and may form a gap through which the plating solution can penetrate.

Even in the coating of the acid-resistant chemical, the coating step and the peeling step can be performed in a short time, but it is not suitable for coating the end face of the substrate to be plated. This is because, at the boundary portion where the main surface and the side surface of the end surface of the substrate to be plated are in contact with each other, non-uniformity of wettability due to the shape may occur, and poor wetting of the acid-resistant agent may occur.

On the other hand, the covering with the resin or stainless steel jig can perform the mounting step and the removing step in a short time, and is also suitable for covering the end face of the substrate to be plated. because,
By devising the structure of the jig, the end face of the substrate to be plated is not touched, and several places in the vicinity thereof are shielded to avoid the influence of sudden changes in the shape of the substrate on the end face. This is because it is possible to isolate the entire one side of the surface from the plating solution.

For example, in Patent Documents 1 and 2, in the process of electroplating a plate-shaped member such as a silicon wafer, one side and the end face of the substrate to be plated are separated from the electroplating liquid by a sealing member with a resin or stainless steel jig. The technology is disclosed.

However, since these jigs use a disk-shaped silicon wafer, it is difficult for the pressure applied to the component holding the silicon wafer having a circular window to be uniform, and the sealing property deteriorates, resulting in an electroplating solution. Isolation from is likely to be incomplete.

On the other hand, even in a rectangular substrate, the pressure applied to the component holding the rectangular substrate having the rectangular window is unlikely to be equal in the vicinity of the corner of the rectangular window and the portion away from the corner.
Therefore, it is difficult to immerse only the surface to be plated in the electroplating solution without immersing the end face of the rectangular substrate and one side that is not plated in the electroplating solution.

Regarding such a technique, Patent Document 3 discloses a surface treatment apparatus for electroplating only the surface to be plated without immersing the end portion of a rectangular substrate and one unplated surface in an electroplating solution. However, in the surface treatment apparatus of Patent Document 3, it is necessary to replace the electroplating liquid every time one substrate is electroplated, and the production efficiency is poor.

Japanese Unexamined Patent Publication No. 2006-16651 Japanese Patent No. 5576848 Japanese Patent Application No. 2017-537035

In view of the above circumstances, the present invention does not reduce the production efficiency, does not allow the side surface and one surface of the peripheral edge of the substrate to be plated to come into contact with the electroplating solution, and electrically supplies only the other surface of the substrate. An object of the present invention is to provide a plating jig capable of performing plating.

As a means for solving the above problems, the invention according to claim 1 of the present invention does not perform electroplating on the non-plated surface and the side surface of the peripheral end portion of the substrate to be plated, but electroplats only the surface to be plated. It is a plating jig that performs
A non-plated surface side fixing plate that faces the non-plated surface side of the substrate to be plated and fixes the substrate to be plated,
A fixing plate on the surface to be plated and a fixing plate on the surface to be plated to fix the peripheral end of the substrate to be plated on the surface to be plated.
Detachable seal member A provided between the peripheral end of the substrate to be plated on the side to be plated and the fixing plate on the surface to be plated, and
Detachable seal member B provided between the non-plated surface side fixing plate and the plated surface side fixing plate outside the substrate to be plated, and
It is equipped with a fixing means for fixing the substrate to be plated by pressing the fixing plate on the surface to be plated against the fixing plate on the non-plated surface side.
A sealed space is formed by the substrate to be plated, the fixing plate on the non-plated surface side, the fixing plate on the surface to be plated, the sealing member A, and the sealing member B.
The sealing members A and B are rubber packings having a rectangular, elliptical, or circular cross-sectional shape.
The rubber packing is a plating jig characterized by having a void inside or having a recess or a notch in a cross-sectional shape.

The invention according to claim 2 is the plating jig according to claim 1, wherein the fixing means is a fixing means using a rotary latch, a screw, or a clip.

The plating jig of the present invention has a non-plated surface side fixing plate that faces the non-plated surface side of the substrate to be plated and fixes the substrate to be plated, and a cover that fixes the peripheral end portion of the substrate to be plated on the surface side to be plated. Between the plating surface side fixing plate, the peripheral end of the plating surface side and the plating surface side fixing plate, and the non-plating surface side fixing plate and the plating surface side fixing plate outside the plating surface side Between each, a seal member that can be attached and detached and has an internal gap, and a fixing means for fixing the plated substrate by pressing the plated surface side fixing plate against the non-plated surface side fixing plate are provided. .. Therefore, the peripheral end of the substrate to be plated, the fixing plate on the surface to be plated, the sealing member provided between them, and the fixing plate on the non-plated surface side and the surface to be plated outside the substrate to be plated. A closed space can be formed by the side fixing plate and the sealing member provided between them. Since the non-plated surface of the substrate to be plated and the side surface of the peripheral edge can be arranged in the closed space, the substrate to be plated can be mounted on the plating jig of the present invention and electroplated. , Electroplating can be performed only on the surface to be plated. Therefore, electroplating is performed only on one surface of the substrate to be plated without immersing the non-plated surface and the side surface of the peripheral edge of the substrate to be plated in the electroplating solution without reducing the productivity. It will be possible to do.

The front schematic view which shows an example of the plating jig of this invention. The schematic diagram which illustrates the state which attached the substrate to be plated to the plating jig of FIG. FIG. 2 is a schematic perspective view. FIG. 3 is a schematic cross-sectional view taken along the line AA'of FIG. FIG. 3 is a schematic cross-sectional view taken along the line BB'in FIG. The front schematic diagram which illustrates the fixed plate on the side to be plated of the substrate to be plated of the plating jig of this invention. The front schematic diagram which illustrates the non-plated surface side fixing plate of the substrate to be plated of the plating jig of this invention. The cross-sectional schematic diagram illustrating the seal member 3 of the plating jig of this invention. FIG. 6 is a schematic cross-sectional view illustrating the sealing member 4 of the plating jig of the present invention. FIG. 6 is a schematic cross-sectional view illustrating the sealing member 3 in which a part of the plating jig of the present invention is recessed. FIG. 6 is a schematic cross-sectional view illustrating the sealing member 4 in which a part of the plating jig of the present invention is recessed.

Hereinafter, embodiments of the plating jig of the present invention will be described with reference to the drawings. In addition, in order to omit duplicate explanations, the same reference numerals are given to the components exhibiting the same or similar functions in the figure.
Further, the dimensions of each part shown in the description are examples, and can be appropriately changed depending on various conditions such as the purpose of use and the type of measurement sample.

The plating jig of the present invention will be described.

The plating jig of the present invention is a plating jig in which the non-plated surface and the side surface of the peripheral end portion of the substrate to be plated are not electroplated, and only the surface to be plated is electroplated. Hereinafter, the plating jig 11 of the present invention will be described with reference to FIGS. 1 to 11.

FIG. 1 is an explanatory diagram illustrating the plating jig 11 of the present invention. The plating jig 11 includes a non-plated surface side fixing plate 13 (see FIG. 4) that faces and fixes the non-plated surface 1b side of the substrate 1 to be plated, and a peripheral end portion of the substrate 1 to be plated 1a side to the surface to be plated 1a. It is provided with a fixing plate 12 on the surface to be plated (see FIG. 5) for fixing the plating. The substrate 1 to be plated is arranged and fixed in the recess 10a (see FIG. 1) formed in the support 10 (see FIGS. 2 to 5), and is formed by the non-plated surface side fixing plate 13 and the plated surface side fixing plate 12. By being sandwiched, the non-plated surface 1b (the surface not plated) and the side surface 1c of the peripheral edge of the substrate 1 to be plated are arranged in a closed space that is not immersed in the plating solution, so that the non-plated surface 1b is not plated. The surface 1b and the side surface 1c are not electroplated (see FIGS. 3 to 5).

The recess 10a is one form of the fixing means of the substrate 1 to be plated, and does not need to be limited to this. Any means may be used as long as it can fix the substrate 1 to be plated facing the non-plated surface side of the substrate 1 to be plated. The recess 10a may be, for example, a recess formed by counterbore processing. Further, instead of the recess 10a, the substrate may be arranged and fixed at a fixed position by three or more fixing pins, or may be another means.

Further, a more specific configuration of the plating jig 11 of the present invention includes a bus bar 9 which is an electrode connected to a plating power supply, a fixing portion 8 extending from the bus bar 9 and fixing a support 10, a bus bar 9 and the following. The power supply line 6 for electrically connecting the power supply unit 5 described in the above, the power supply unit 5 for connecting the power supply line 6 and the substrate to be plated, and the fixing plate 12 on the plated surface side are pressed against the fixing plate 13 on the non-plated surface side. The main component of the non-plated surface side fixing plate 13 and the support 10 that supports the substrate 1 to be plated by the recess 10a, which is the main component of the fixing means 7 and the non-plated surface side fixing plate 13. And
Along the facing plate 2 having an opening 15 on which the surface 1a to be plated of the substrate 1 to be plated can be plated, the peripheral edge portion of the substrate 1 to be plated, and the inner edge portion of the opening 15 of the facing plate 2. The sealing member 3 which is in close contact with both of them and is provided so as to be sealable, and the seal member 4 which is in close contact with the support 10 and the facing plate 2 and is provided so as to be sealable on the outside of the seal member 3. Is equipped with.

Therefore, the unplated one side (non-plated surface 1b) of the substrate 1 to be plated and the side surface 1c of the peripheral end portion are the facing plate 2, the substrate 1 to be plated, the support 10, the seal member 3, and the seal member 3. It is arranged in the space sealed by the sealing member 4. As a result, the non-plated surface 1b of the substrate 1 to be plated and the side surface 1c of the peripheral end portion are not immersed in the electroplating solution and are not electroplated, but the substrate 1 to be plated is to be plated. The surface 1a can be electroplated.

FIG. 2 is a view in which the substrate 1 to be plated is attached to the plating jig 11, and the substrate 1 to be plated is attached between the facing plate 2 and the support 10. The surface to be plated 1a (see FIGS. 4 and 5) of the substrate 1 to be plated is placed on the facing plate 2 of the plating jig 11 so that it can be immersed in the electroplating liquid except for a part sealed by the sealing member 3. It is exposed by the formed opening 15.

FIG. 3 is a perspective view of FIG. 2 in which the substrate 1 to be plated is attached to the plating jig 11. The sealing member 3 is arranged between the exposed portion of the surface to be plated 1a of the substrate 1 to be plated and the outer periphery of the substrate 1 to be plated, or inside the peripheral edge portion 1c of the substrate 1 to be plated (FIG. 4, FIG. See FIG. 5). The sealing member 4 is arranged between the outer periphery (peripheral end portion) of the facing plate 2 and the outer periphery (peripheral end portion) of the substrate 1 to be plated (see FIGS. 4 and 5). The feeding portion 5 is arranged between the sealing member 3 and the sealing member 4, and is located inside the outer periphery of the substrate 1 to be plated, that is, inside the peripheral end portion. The feeder line 6 plays a role of electrically connecting the feeder 5 and the bus bar 9 to supply power from the power source to the feeder 5, but the feeder 5 and the fixed portion 8 are connected to each other. May be good. In that case, the fixing portion 8 needs to be made of a highly conductive material such as copper. The fixing portion 8 fixes the bus bar and the support 10.

FIG. 4 is a cross-sectional view of the plating jig 11 in the AA'cutting line of FIG. The substrate 1 to be plated is sandwiched between the facing plate 2 and the support 10.
The facing plate 2 is a main component of the plating surface side fixing plate 12. The surface-side fixing plate 12 to be plated includes a facing plate 2 and sealing members 3 and 4 arranged in recesses 2a and 2b formed in the facing plate 2, respectively.
Further, the support 10 is a main component of the non-plated surface side fixing plate 13. The non-plated surface side fixing plate 13 may be composed of only the support 10, or may be configured to include the sealing member 4.
The sealing member 3 seals between the substrate 1 to be plated and the facing plate 2. The sealing member 4 seals between the facing plate 2 and the support 10. The electroplating liquid invades the space 14 covered with the substrate 1 to be plated, the sealing member 3, the facing plate 2, the sealing member 4, the support 10, and the recess 10a of the support 10 for fixing the substrate 1 to be plated. Therefore, the non-plated surface 1b and the side surface 1c of the peripheral end portion of the substrate 1 to be plated are not immersed in the plating solution, and only the surface to be plated 1a can be immersed in the electroplating solution to perform electroplating. Although the recess 10a and the non-plated surface 1b are in contact with each other, the gaps are emphasized in FIGS. 4 and 5.

FIG. 5 is a cross-sectional view of the plating jig 11 in the BB'cutting line of FIG. The feeding unit 5 is electrically connected to the feeding line 6 and the surface to be plated 1a of the substrate 1 to be plated, and supplies power to the surface to be plated 1a. The number of feeding units 5 is not particularly limited.

FIG. 6 is an explanatory view showing a surface of the plate to be plated on the side to be plated 12 in contact with the substrate to be plated. The case where the seal member 3 and the seal member 4 are installed on the facing plate 2 is illustrated, and the feeding portion 5 is installed through the facing plate 2.

FIG. 7 is an explanatory view showing a surface of the non-plated surface side fixing plate 13 of the substrate to be plated, which is in contact with the substrate 1 to be plated. The non-plated surface side fixing plate 13 of the substrate to be plated is fixed to the bus bar 9 through the fixing portion 8. The non-plated surface side fixing plate 13 of the substrate to be plated is provided with a recess 10a for fixing the substrate 1 to be plated. Instead of installing the recess 10a, the substrate to be plated may be fixed with a positioning pin or the like. A fixing means 7 is installed on the non-plated surface side fixing plate 13 of the substrate to be plated. As described above, the number of the fixing means 7 is not particularly limited, and any means may be used as long as it can fix the substrate to be plated. For example, as the fixing means 7, a rotary latch, a clip, a screw, a rotary fastener, or the like may be used. Further, as described above, the seal member 4 may be fixed to the non-plated surface side fixing plate 13 of the substrate to be plated.

FIG. 8 is a cross-sectional view of the seal member 3. As the sealing member 3, a rubber packing having a gap 3a inside can be mentioned as an example. The sealing function is improved by the gap 3a. Examples of the cross-sectional shape of the seal member 3 include a rectangle 3A, an ellipse 3B, and a circle 3C.

When the facing plate 2 is pressed against the substrate 1 to be plated (see, for example, FIG. 4), the gap 3a absorbs a part of the pressure, resulting in an imbalance in pressure applied between the facing plate 2 and the substrate 1 to be plated. The imbalance of pressure applied between the sealing member 3 and the sealing member 4 is improved. It is desirable that the seal rubber 3 is fixed to the recess 2a of the facing plate 2.

FIG. 9 is a cross-sectional view of the seal member 4. As the sealing member 4, a rubber packing having a gap 4a inside can be mentioned as an example. The sealing function is improved by the gap 4a. Examples of the cross-sectional shape of the seal member 4 include a rectangle 4A, an ellipse 4B, and a circle 4C.

When the facing plate 2 is pressed against the support 10 (see, for example, FIG. 4), the gap 4a absorbs a part of the pressure, and the pressure imbalance between the facing plate 2 and the support 10 and the sealing member. The imbalance of pressure applied between 3 and the sealing member 4 is improved. The seal member 4 is preferably fixed to the recess 2b of the facing plate 2, but may be fixed to the support 10.

The fixing means 7 (see FIGS. 1 to 4) uniformly applies pressure to the facing plate 2 and the substrate 1 to be plated, and the facing plate 2 and the support 10, and has a sealing function of the sealing member 3 and the sealing member 4. To demonstrate. The number of fixing means 7 is not particularly limited.

The function of the fixing means 7 is to uniformly apply pressure to the facing plate 2 and the substrate 1 to be plated, and the facing plate 2 and the support 10 to exert the sealing function of the sealing member 3 and the sealing member 4. Therefore, it is not necessary to limit the means as long as it can exert the same function. For example, as the fixing means 7, a rotary latch, a clip, a screw, a rotary fastener, or the like may be used.

FIG. 10 is a cross-sectional view of the seal member 3. When the sealing member 3 is made of a highly elastic material such as rubber packing, the void 3a formed inside the sealing member 3 absorbs a part of the pressure to improve the sealing function. On the other hand, by installing a dent or a notch in the cross section of the seal member 3 instead of the gap 3a, the dent in the cross section of the seal member 3 can absorb a part of the pressure to improve the sealing function. Examples of the non-point symmetric shape of the cross section of the seal member 3 include a cross-sectional shape 3D in which a part of a rectangle is recessed, a cross-sectional shape 3E in which a part of an elliptical shape is recessed, and a cross-sectional shape 3F in which a part of a circle is recessed. .. Further, the shape of the above-mentioned recess or notch is not particularly limited.

FIG. 11 is a cross-sectional view of the seal member 4. When the sealing member 4 is made of a highly elastic material such as rubber packing, the void 4a formed inside the sealing member 4 absorbs a part of the pressure to improve the sealing function. On the other hand, by installing a dent or a notch in the cross section of the seal member 4 instead of the gap 4a, it is possible to improve the sealing function by absorbing a part of the pressure such as the dent in the cross section of the seal member 4. Examples of the non-point symmetric shape of the cross section of the seal member 4 include a cross-sectional shape 4D in which a part of a rectangle is recessed, a cross-sectional shape 4E in which a part of an elliptical shape is recessed, and a cross-sectional shape 4F in which a part of a circle is recessed. .. Further, the shape of the above-mentioned recess or notch is not particularly limited.

As described above, the plating jig 11 of the present invention has been described with reference to FIGS. 1 to 11, and the plating jig 11 of the present invention faces the non-plated surface 1b side of the substrate 1 to be plated and has the substrate 1 to be plated. The non-plated surface side fixing plate 13 (see FIGS. 3 and 4) to be fixed and the plated surface side fixing plate 12 (see FIGS. 3 and 5) for fixing the peripheral end portion of the substrate 1 to be plated on the side to be plated 1a. ) And. Further, between the peripheral end portion of the substrate 1 to be plated on the side to be plated 1a and the facing plate 2 (see FIG. 4), and between the non-plated surface side fixing plate 13 outside the substrate 1 to be plated and the facing plate 2. By pressing the removable sealing members 3 and 4 and the facing plate 2 against the support 10 of the non-plated surface side fixing plate 13, the substrate 1 to be plated is placed between the support 10 and the facing plate 2. It is provided with a fixing means 7 for sandwiching and fixing the plating.

As shown in FIG. 4, the peripheral end portion of the substrate 1 to be plated on the surface to be plated 1a side, the facing plate 2 which is the main component of the fixing plate on the surface to be plated, and the sealing member provided between them. 3, the support 10 which is the main component of the non-plated surface side fixing plate 13 outside the substrate 1 to be plated, the facing plate 2 of the fixing plate on the plated surface side, and the sealing member provided between them. A closed space is formed by 4. In this closed space, the non-plated surface 1b of the substrate 1 to be plated and the side surface 1c of the peripheral end portion are arranged. Therefore, when performing electroplating, they are not immersed in the electroplating solution.

Further, as described with reference to FIG. 11, the sealing function is improved by forming a dent or a notch portion easily crushed by pressure in the cross-sectional shape of the seal member 3 and the seal member 4. Due to this improvement in the sealing function, the non-plated surface (non-plated surface 1b) of the substrate 1 to be plated and the side surface 1c of the peripheral end portion are not immersed in the electroplating solution, and the sealing members 3 and 4 of the surface to be plated 1a are in close contact with each other. It can be electroplated by immersing it in an electroplating solution except for the part where it is plated.

The plating jig 11 can be used as an etching jig and a developing jig by removing the bus bar 9, the fixing portion 8, and the lead wire 6. Further, the feeding portion 5 may be removed, the hole of the facing plate 2 through which the feeding portion 5 penetrates may be closed, and the etching jig or the developing jig may be used.

1 Substrate to be plated 1a Surface to be plated 1b Non-plated surface 1c Side surface of peripheral edge 2 Opposing plates 2a, 2b, 10a Recesses 3, 4 Sealing members 3a, 4a Voids 3A, 4A Cross-sectional shape of a sealing member with a hollow rectangular cross section 3B, 4B Cross-section shape of the seal member with a hollow oval cross section 3C, 4C Cross-section shape of the seal member with a hollow circular cross section 3D, 4D Cross-section shape of the seal member with a partially recessed rectangular cross section 3E, 4E Partially recessed oval cross section Cross-sectional shape of the seal member 3F, 4F Cross-sectional shape of the seal member with a circular cross section that is partially recessed 5 Feeding part 6 Feeding line 7 Fixing means 8 Fixing part 9 Bus bar 10 Support 11 Plating jig 12 (of the substrate to be plated) Fixed plate on the surface to be plated 13 Fixed plate on the non-plated surface side (of the substrate to be plated 14) Space 15 (formed in the facing plate 2) where the electroplating liquid does not immerse

Claims (2)

It is a plating jig that does not electroplating the non-plated surface and the side surface of the peripheral edge of the substrate to be plated, but electroplats only the surface to be plated.
A non-plated surface side fixing plate that faces the non-plated surface side of the substrate to be plated and fixes the substrate to be plated,
A fixing plate on the surface to be plated and a fixing plate on the surface to be plated to fix the peripheral end of the substrate to be plated on the surface to be plated.
Detachable seal member A provided between the peripheral end of the substrate to be plated on the side to be plated and the fixing plate on the surface to be plated, and
Detachable seal member B provided between the non-plated surface side fixing plate and the plated surface side fixing plate outside the substrate to be plated, and
It is equipped with a fixing means for fixing the substrate to be plated by pressing the fixing plate on the surface to be plated against the fixing plate on the non-plated surface side.
A sealed space is formed by the substrate to be plated, the fixing plate on the non-plated surface side, the fixing plate on the surface to be plated, the sealing member A, and the sealing member B.
The sealing members A and B are rubber packings having a rectangular, elliptical, or circular cross-sectional shape.
A plating jig characterized in that the rubber packing has a gap inside, or has a recess or a notch in a cross-sectional shape. The plating jig according to claim 1, wherein the fixing means is a fixing means using a rotary latch, a screw, or a clip.

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