JPH07249719A - Electronic apparatus - Google Patents

Abstract

PURPOSE:To obtain an insulating structure exhibiting high insulation without sacrifice of compactness when an insulator is interposed between a terminal plate for mounting a heating electronic component and a heat plate while exhibiting sufficient heat dissipation effect and allowing assemblage with high productivity. CONSTITUTION:The electronic apparatus comprises a terminal plate 6b for mounting a heating electronic element 4, and an insulator 8 sandwiched by the terminal plate 6b and a heat plate 9 wherein a rising wall 8a is formed integrally with the insulator 8 on the periphery.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating structure for electronic devices such as solid state relays.

[0002]

2. Description of the Related Art In a solid-state relay, ceramics (alumina, etc.) are placed between a heat dissipation plate and an electric circuit section such as a triac or thyristor which is a heat-generating electronic element.
An insulating structure with an insulator made of is interposed.

[0003]

In the above insulating structure, it is necessary to increase the insulation distance as the voltage of the power supply used increases. For example, (a) the thickness of the insulator is increased.

(B) The outer shape of the insulator is enlarged, and the circuit portion is concentrated near the center thereof.

(C) An insulator made of the same material or a different material is attached to the insulator to form an insulation barrier.

Means such as the above are appropriately selected or combined and used.

However, the above-mentioned various conventional means have the following drawbacks. That is, according to the above means (a) for increasing the thickness of the insulator, the thermal resistance of the insulator increases and a sufficient heat dissipation effect cannot be obtained.

The above means (b) for enlarging the outer shape of the insulator
According to this, downsizing is hindered and it becomes difficult to meet market needs.

According to the above-mentioned means (c) for forming an insulating barrier by bonding, the assembling cost is high and the reliability of bonded boundary insulation is required.

The present invention has been made paying attention to such a point, and exhibits a high insulating property when an insulator is interposed between a terminal for mounting a heat-generating electronic element and a heat radiating plate. However, the main purpose is to obtain an insulating structure that can achieve a sufficient heat dissipation effect without compromising the compactness, and that can be assembled with high productivity. Another purpose is to make it possible to increase the durability of the circuit portion.

[0011]

In order to achieve the above object, the present invention has the following constitution. That is, the first aspect of the present invention is an electronic device configured such that a heat-generating electronic element is mounted on a terminal plate and an insulator is interposed between the terminal plate and the heat dissipation plate. It is characterized in that the rising wall is integrally formed with the.

Further, the second invention is characterized in that, in the first invention, the space surrounded by the rising wall is filled with a resin material.

The third invention is characterized in that the electronic device according to the first invention or the second invention is a solid state relay.

[0014]

According to the structure of the first aspect of the invention, the height and wall thickness of the rising wall integrally formed on the peripheral portion of the insulator are appropriately set, so that the size of the outer shape of the insulator is not required to be changed so much. Insulation distance can be secured. Further, at this time, the formation of the rising wall does not increase the thermal resistance from the insulator to the heat dissipation plate.

Further, according to the structure of the second aspect of the invention, the recessed space surrounded by the rising wall can be a filling space for the potting resin, and by filling this recessed space with a small amount of resin, the element and The circuit part can be protected.

Further, according to the structure of the third invention, there can be obtained a solid state relay which exhibits the operation of the first invention or the second invention.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A solid state relay of the present invention will be described with reference to FIGS.

The solid state relay includes a circuit board 1,
From the pair of output terminal members 2 and 3 forming the output terminals P ₁ and P ₂ , the heat-generating electronic element 4 (triac THY), the pair of terminals 5 and 6 connected to the heat-generating electronic element 4, the gate terminal 7, and the ceramic. Insulating body 8, heat dissipation plate 9 made of a metal plate, a case body 10 made of resin for mounting these parts, and a locking claw 10 on the top of the case body 10.
It is composed of a cover case (not shown) and the like connected via a and 10b.

The heating electronic element 4 is mounted and connected to a terminal plate 6b which is integral with the terminal 6, and the other terminal 5 is connected to the upper surface of the element and a gate terminal 7 is provided upright.
The terminal plate 6b itself is fixedly mounted on the heat dissipation plate 9 via the insulator 8, and the element unit unit shown in FIG. 6 is preassembled and then assembled to the case body 10 from below.

The heat radiating plate 9 is fitted and mounted in the lower opening of the case body 10, and a pair of caulking pins 11 projecting from the lower surface of the case body 10 are inserted into the through holes 12 of the heat radiating plate 9 for thermal caulking. The element unit is assembled and fixed to the case body 10. The heat dissipation plate 9 is provided with a mounting hole 14 that overlaps with the mounting holes 13 of the pair of mounting legs 10c protruding from the case body 10. The heat generated by the heat-generating electronic element 4 is generated by the terminal plate 6b and the insulator 8. , And via the heat dissipation plate 9 to the electric device equipped with this solid state relay.

The output terminal members 2 and 3 are positioned and fitted from above in a pair of recesses 15 formed in the peripheral wall of the case body 10, and one output terminal member 2 is provided with a terminal pin 6a protruding from the terminal plate 6b. To the slits 16 and 17 formed in the output terminal members 2 and 3,
Terminal pins 5a and 6a provided upright from the terminals 5 and 6 are respectively inserted and electrically connected.

The circuit board 1 is fitted and mounted in the upper opening of the case body 10, and the three terminal holes 5 of the terminal 5 are inserted into the three through holes 18, 19, 20 formed in the circuit board 1.
b, the terminal pin 6a of the terminal 6 and the gate terminal 7 are respectively inserted and soldered to each terminal 5,
6, 7 are conductively connected to predetermined portions of the circuit on the substrate.

The characteristic features of the present invention will be described below.

The insulator 8 is integrally formed of a ceramic material in a shallow rectangular box shape, and a series of rising walls 8a integrally provided on all four sides of the insulator 8 dissipate heat from the circuit portion including the heat-generating electronic element 4 and heat radiation. The insulation distance to the plate 9 is increased. An insulating resin material 21 such as silicon is filled (potted) in the recessed space surrounded by the rising wall 8a to protect the heat-generating electronic element 4 and its circuit portion.

By setting the height and thickness of the rising wall 8a according to the voltage of the power source used, the insulator 8
It is possible to form a barrier with a desired insulation distance without increasing the outer shape of the barrier. Further, resin filling into the recessed space surrounded by the rising wall 8a is optional. When the resin material 21 is not filled, the rising wall 8a does not necessarily have to be formed on the entire circumference, and it is possible to form the rising wall 8a only on the peripheral portion in the direction requiring a large insulation distance.

[0026]

According to the first invention, the following effects can be expected.

(1) Since the rising wall is simply formed to have a proper size in the peripheral portion of the insulator, it is possible to easily cope with the target heat-generating electronic element and usage conditions without increasing the outer shape of the insulator. This is effective for making the device compact and increasing the mounting flexibility.

(2) Since the formation of the rising wall does not increase the heat resistance of heat transfer to the heat dissipation plate,
The heat dissipation effect does not deteriorate as seen in the means for increasing the insulation distance by increasing the thickness of the insulator, and the desired heat dissipation effect can be maintained.

(3) Since the rising wall for forming the insulation barrier is formed integrally with the insulator, it is superior in assembling workability and can reduce the production cost as compared with the means for forming the insulation barrier by bonding the insulators. effective. Further, according to the second aspect of the present invention, by further filling the resin material into the recessed space surrounded by the rising wall in the first aspect of the present invention, the element can be protected and durability and reliability can be improved. In addition to being effective for improvement, it is possible to save the resin material as compared with the case where the entire case is filled with the resin material, and it is also effective in reducing the auxiliary material cost.

According to the third aspect of the present invention, it is possible to obtain the solid-state relay excellent in insulating property with a simple structure, in which the effects of the first and second aspects are exhibited.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a main part

FIG. 2 is a plan view of the assembled state.

FIG. 3 is a plan view with a circuit board removed.

FIG. 4 is a sectional view taken along line aa in FIG.

5 is a sectional view taken along line bb in FIG.

FIG. 6 is a perspective view of an element unit.

[Explanation of symbols]

 4 Heat generating electronic element 6b Terminal plate 8 Insulator 8a Standing wall 9 Heat dissipation plate 21 Resin material

Claims (3)

[Claims] 1. An electronic device configured such that a heat-generating electronic element is mounted on a terminal plate and an insulator is interposed between the terminal plate and the heat radiating plate, and a rising wall is provided around a periphery of the insulator. An electronic device characterized by being integrally formed. 2. The electronic device according to claim 1, wherein a space surrounded by the rising wall is filled with a resin material. 3. A solid state relay as claimed in claim 1.
Alternatively, the electronic device according to claim 2.