JPH07249631A - はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法 - Google Patents

はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法

Info

Publication number
JPH07249631A
JPH07249631A JP7003679A JP367995A JPH07249631A JP H07249631 A JPH07249631 A JP H07249631A JP 7003679 A JP7003679 A JP 7003679A JP 367995 A JP367995 A JP 367995A JP H07249631 A JPH07249631 A JP H07249631A
Authority
JP
Japan
Prior art keywords
solder
solder ball
forming member
recess
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7003679A
Other languages
English (en)
Japanese (ja)
Inventor
Masayuki Ochiai
正行 落合
Yasuo Yamagishi
康男 山岸
Hidefumi Ueda
秀文 植田
Nobuo Kamehara
伸男 亀原
Rikuro Sono
陸郎 薗
Ichiro Yamaguchi
一郎 山口
Kazuhiko Mitobe
一彦 水戸部
Koki Otake
幸喜 大竹
Junichi Kasai
純一 河西
Masataka Mizukoshi
正孝 水越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7003679A priority Critical patent/JPH07249631A/ja
Priority to TW84105223A priority patent/TW273638B/zh
Publication of JPH07249631A publication Critical patent/JPH07249631A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP7003679A 1994-01-20 1995-01-13 はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法 Pending JPH07249631A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP7003679A JPH07249631A (ja) 1994-01-20 1995-01-13 はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法
TW84105223A TW273638B (enrdf_load_stackoverflow) 1994-01-20 1995-05-24

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6-4751 1994-01-20
JP475194 1994-01-20
JP7003679A JPH07249631A (ja) 1994-01-20 1995-01-13 はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPH07249631A true JPH07249631A (ja) 1995-09-26

Family

ID=26337314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7003679A Pending JPH07249631A (ja) 1994-01-20 1995-01-13 はんだバンプ及びはんだボールの製造方法及び半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JPH07249631A (enrdf_load_stackoverflow)
TW (1) TW273638B (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH104127A (ja) * 1996-04-16 1998-01-06 Ngk Spark Plug Co Ltd 半田バンプを有する基板の製造方法
WO1999009590A1 (fr) * 1997-08-19 1999-02-25 Hitachi, Ltd. Procede de formation d'electrodes de points de soudure et procede de fabrication de dispositifs a semiconducteur
JP2000517104A (ja) * 1996-08-27 2000-12-19 パック テック―パッケージング テクノロジーズ ゲーエムベーハー 選択的はんだ付けのためのプロセス
KR20030070342A (ko) * 2002-02-25 2003-08-30 최록일 반도체 소자의 솔더볼 형성장치 및 그 탑재방법
US6653219B2 (en) 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
DE102004041026A1 (de) * 2004-08-25 2005-11-03 Infineon Technologies Ag Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe
JP2008187211A (ja) * 1996-08-27 2008-08-14 Nippon Steel Materials Co Ltd 低融点金属のバンプを備えた半導体装置及びフリップチップボンディング方法
JPWO2015052780A1 (ja) * 2013-10-08 2017-03-09 リンテック株式会社 電子部品実装体の製造方法
JPWO2021131897A1 (enrdf_load_stackoverflow) * 2019-12-27 2021-07-01
WO2021131905A1 (ja) * 2019-12-27 2021-07-01 昭和電工マテリアルズ株式会社 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105489511B (zh) * 2015-11-30 2019-01-25 苏州瑞而美光电科技有限公司 标径bga封装金属焊球的制备方法及模具

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH104127A (ja) * 1996-04-16 1998-01-06 Ngk Spark Plug Co Ltd 半田バンプを有する基板の製造方法
JP2000517104A (ja) * 1996-08-27 2000-12-19 パック テック―パッケージング テクノロジーズ ゲーエムベーハー 選択的はんだ付けのためのプロセス
JP2008187211A (ja) * 1996-08-27 2008-08-14 Nippon Steel Materials Co Ltd 低融点金属のバンプを備えた半導体装置及びフリップチップボンディング方法
WO1999009590A1 (fr) * 1997-08-19 1999-02-25 Hitachi, Ltd. Procede de formation d'electrodes de points de soudure et procede de fabrication de dispositifs a semiconducteur
US6335271B1 (en) 1997-08-19 2002-01-01 Hitachi, Ltd. Method of forming semiconductor device bump electrodes
US6653219B2 (en) 2000-01-13 2003-11-25 Hitachi, Ltd. Method of manufacturing bump electrodes and a method of manufacturing a semiconductor device
KR20030070342A (ko) * 2002-02-25 2003-08-30 최록일 반도체 소자의 솔더볼 형성장치 및 그 탑재방법
DE102004041026A1 (de) * 2004-08-25 2005-11-03 Infineon Technologies Ag Verfahren zur Herstellung eines oder mehrerer Kontakthügel auf einer Substratscheibe
JPWO2015052780A1 (ja) * 2013-10-08 2017-03-09 リンテック株式会社 電子部品実装体の製造方法
JPWO2021131897A1 (enrdf_load_stackoverflow) * 2019-12-27 2021-07-01
WO2021131905A1 (ja) * 2019-12-27 2021-07-01 昭和電工マテリアルズ株式会社 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法
WO2021131897A1 (ja) * 2019-12-27 2021-07-01 昭和電工マテリアルズ株式会社 はんだバンプ形成用部材、はんだバンプ形成用部材の製造方法、及びはんだバンプ付き電極基板の製造方法
JPWO2021131905A1 (enrdf_load_stackoverflow) * 2019-12-27 2021-07-01
CN115053330A (zh) * 2019-12-27 2022-09-13 昭和电工材料株式会社 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法
CN115152007A (zh) * 2019-12-27 2022-10-04 昭和电工材料株式会社 焊料凸块形成用部件、焊料凸块形成用部件的制造方法及带焊料凸块的电极基板的制造方法
US20230042727A1 (en) * 2019-12-27 2023-02-09 Showa Denko Materials Co., Ltd. Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump
US12246398B2 (en) 2019-12-27 2025-03-11 Resonac Corporation Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump

Also Published As

Publication number Publication date
TW273638B (enrdf_load_stackoverflow) 1996-04-01

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