JPH07243028A - Thin substrate and metal mold for molding thin substrate - Google Patents

Abstract

PURPOSE:To provide a thin substrate and metal mold for molding the thin substrate capable of preventing generation of flashes at outside edges and permitting smooth and sure execution of vapor deposition of metal in post-stages. CONSTITUTION:A resin is supplied into the cavity C for the thin substrate in a closed state of the molds and thereafter, the second mold body 21 is moved in a mold closing direction relative to the first mold body 20 having an inclined part 20a corresponding to a chamfered part 30a, by which the resin in the cavity C is compression molded.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-walled substrate in which one surface of a thin-walled substrate main body is a metal deposition surface and a thin-walled substrate molding die.

[0002]

2. Description of the Related Art Conventionally, as a molding die for molding a disk-shaped information recording body such as an optical disk substrate with resin, as shown in FIG. 4, a disk-shaped fixed mirror plate 1 is a fixed support member 2. The inner peripheral holder 3 and the sprue bush 4 are attached to the central portion of the fixed mirror surface plate 1, and the outer peripheral holder attached to the inner peripheral holder 3 and the outer edge portion of the fixed mirror surface plate 1. 5, a donut disc-shaped stamper (information recording plate) 6 is detachably attached to the fixed mirror plate 1, and a movable support member 7 is provided so as to face the fixed support member 2 so that the movable support member 7 can move toward and away from the fixed support member 2. A movable mirror plate 8 is provided at the center of the movable support member 7 so as to be movable in the mold opening / closing direction, while a gate cut pin 9 is slidably fitted in the center part of the movable mirror plate 8 in the mold opening / closing direction. Moreover, those internal to the projecting rod 10 of the gate cut pin 9 is slidably provided in the mold closing direction is known. In this molding die, the molten resin is passed through the inside of the sprue bush 4 and the sprue bush 4, the inner peripheral holder 3, the stamper 6, in the state where the support members 2 and 7 are closed. After supplying into the cavity C composed of the outer peripheral holder 5, the movable mirror surface plate 8, the gate cut pin 9 and the projecting rod 10, the gate cut pin 9 is brought closer to the sprue bush 4 side and the resin in the cavity C is manufactured as a product. And the resin of the other sprue portion is cut and separated, and the movable mirror surface plate 8 is brought close to the stamper 6 side to compression-mold the resin in the cavity C of the product portion. Then, after the resin in the cavity C is solidified by cooling, the space between the support members 2 and 7 is opened, and the resin in the cavity C is attached to the movable mirror plate 8, the gate cut pin 9, and the protruding rod 10. In this state, the resin is removed from the stamper 6 side, and then the resin of the sprue portion is projected by the projecting rod 10 to release the resin, and the product is taken out from the movable mirror surface plate 8.

[0003]

By the way, the movable mirror surface plate 8 is inserted into and removed from the outer peripheral holder 5 due to the mold closing and the mold opening. However, it is difficult to transfer heat from the fixed mirror surface plate 1 to the outer peripheral holder 5. As a result, there is a risk of galling between the movable mirror surface plate 8 and the outer peripheral holder 5. For this reason, in the past, as shown in FIG.
As shown in, a predetermined clearance is set in advance between the movable mirror surface plate 8 and the outer peripheral holder 5.
However, as described above, the movable mirror plate 8 and the outer peripheral holder 5 are
If a predetermined clearance is set between and, a burr may occur on the outer edge of the mirror surface of the molded product. Also,
Metal is vapor-deposited on this mirror surface in a later step. However, if the finish of the outer edge portion of the mirror surface is poor, there is a problem that the vapor deposition is not performed smoothly and the vapor deposition strength of the outer edge portion of the mirror surface is not sufficiently secured. is there.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to prevent burrs from being generated at the outer edge portion and to perform metal vapor deposition smoothly and surely in a subsequent process. It is to provide a thin substrate and a mold for molding the thin substrate that can be formed.

[0005]

To achieve the above object, the first aspect of the present invention provides a thin-walled substrate in which one surface of a thin-walled substrate body is a metal-deposited surface. A chamfered portion or a stepped portion is formed on the outer edge portion of. Further, according to claim 2 of the present invention, one surface of the thin-walled substrate body is a metal deposition surface, and a thin-walled substrate in which a chamfered portion or a step portion is formed at an outer edge portion of the metal deposition surface is formed. In a thin substrate molding die, a cavity for the thin substrate is formed between a pair of mold plates,
Further, the first template defines the chamfered portion or the stepped portion and the flat portion of the metal vapor deposition surface, and the second template defines the other surface and the outer peripheral surface of the thin-walled substrate body. It is what you make. Further, according to claim 3 of the present invention, one surface of a thin-walled substrate main body is a metal vapor deposition surface, and a thin-walled substrate in which a chamfered portion or a step portion is formed at an outer edge portion of the metal vapor deposition surface is formed. In the mold for thin-wall substrate molding,
A cavity for the thin substrate is formed between a pair of mold plates, and a mold plate forming the metal vapor deposition surface forms a first mold body that forms the chamfered portion or the step portion, and the first mold body. The second mold body is provided inside the body so as to be movable in the mold opening / closing direction and forms a flat portion of the metal vapor deposition surface.

[0006]

In the thin-walled substrate according to the first aspect of the present invention, a chamfered portion or a step formed on the outer edge of the metal deposition surface of the thin-walled substrate body causes burrs on the outer edge of the metal deposition surface. To prevent this, a smooth metal vapor deposition surface is formed to surely perform metal vapor deposition. According to a second aspect of the present invention, there is provided a mold for forming a thin substrate, comprising: a first template plate that defines a chamfered portion or a step portion of a thin substrate body and a flat portion of a metal deposition surface; The other surface (information recording surface) of the plate-like substrate body and the second template plate that defines the outer peripheral surface are closed to form a cavity, and the mating surface (parting line) between the template plates is defined as above. It is located between the chamfered portion or the stepped portion of the substrate body and the outer peripheral surface to prevent molding defects such as burrs. Further, in claim 3 of the present invention, after the resin is supplied into the cavity for the thin substrate in the mold closed state,
The second mold body is moved in the mold closing direction with respect to the first mold body to compression-mold the resin in the cavity.

[0007]

Embodiments of the present invention will be described below with reference to FIGS. In these figures, the same components as those of the above-described conventional example shown in FIGS. 4 and 5 are designated by the same reference numerals and the description thereof will be omitted.

FIG. 1 shows a first embodiment of the present invention.
In this figure, reference numeral 20 is a first mold body attached to the central portion of the movable support member, and the first mold body 20 is formed on one surface (metal vapor deposition surface) of the thin substrate body 30. The inclined surface 20a for forming the outer edge portion (chamfered portion) 30a is provided. Then, inside the first mold body 20, the second mold body 21 that forms the flat portion 30b of the metal vapor deposition surface is formed.
Is attached to the first mold body 20 so as to be movable in the mold opening / closing direction.

When the thin-walled substrate molding die having the above-mentioned structure is used to mold the thin-walled substrate with resin, molten resin is supplied into the cavity C in the mold closed state, and then, as in the prior art, the gate is used. The cutting pin cuts and separates the product part and other sprue parts. Subsequently, the second mold body 21 is moved in the mold closing direction (to the stamper 6 side) with respect to the first mold body 20, and the resin in the cavity C of the product portion is compression molded (see FIG. 1). Further, the cavity C
After the resin inside is solidified by cooling, the mold is opened, and the product adhering to the movable side and the solidified resin of the sprue part are released from the movable side and taken out. In this case, at the time of resin molding, the outer peripheral holder 5 attached to the fixed mirror plate and the first mold body 20 are firmly adhered by a sufficient mold clamping force, and
Since the first mold body 20 and the second mold body 21 are installed on the same movable side, they can be maintained in substantially the same temperature state, and between the first mold body 20 and the second mold body 21. Since it suffices to set a clearance such that they can slide with respect to each other, burrs do not occur on the outer edge of the obtained product. In the product (thin substrate) molded in this way, since the chamfered portion 30a is formed on the outer edge of the metal vapor deposition surface, it is possible to ensure a good finished state of the metal vapor deposition surface. In the metal deposition process, which is a process,
The metal vapor deposition surface can be smoothly subjected to vapor deposition processing,
The vapor deposition strength of the outer edge portion of the metal vapor deposition surface does not decrease as compared with the other flat portion 30b.

Further, instead of the chamfered portion 30a of the first embodiment, as shown in FIG. 2, the flat portion 30 of the metal deposition surface is formed.
A stepped portion 30c formed of a combination of a vertical surface orthogonal to b and an inclined surface continuous with this vertical surface, or a stepped stepped portion 30d as shown in FIG. 3 may be formed.

[0011]

As described above, according to the first aspect of the present invention.
Is a thin-walled substrate in which one surface of the thin-walled substrate body is a metal deposition surface, a chamfered portion or a step portion is formed at the outer edge of the metal deposition surface. By the step portion, it is possible to prevent burrs from being generated at the outer edge portion of the metal vapor deposition surface, and it is possible to form a smooth metal vapor deposition surface in the subsequent step and reliably perform metal vapor deposition. Further, according to claim 2 of the present invention, one surface of the thin-walled substrate body is a metal deposition surface, and a thin-walled substrate in which a chamfered portion or a step portion is formed at an outer edge portion of the metal deposition surface is formed. In a mold for molding a thin substrate, a cavity for the thin substrate is formed between a pair of mold plates, and the first mold plate defines the chamfered portion or the stepped portion and the flat portion of the metal vapor deposition surface. With the second
Since the template of (1) defines the other surface and the outer peripheral surface of the thin-walled substrate body, a first template defining a chamfered portion or a step and a flat portion of the metal vapor deposition surface, A cavity is formed by closing the other surface (information recording surface) of the thin-walled substrate main body and the second template defining the outer peripheral surface to form a mating surface (parting line) between the two template plates. By positioning it between the chamfered portion or the stepped portion of the substrate body and the outer peripheral surface, molding defects such as burrs can be reliably prevented, and a product of good quality can be smoothly molded. Further, according to claim 3 of the present invention, one surface of a thin-walled substrate main body is a metal vapor deposition surface, and a thin-walled substrate in which a chamfered portion or a step portion is formed at an outer edge portion of the metal vapor deposition surface is formed. In a mold for molding a thin substrate, a first mold in which a cavity for the thin substrate is formed between a pair of mold plates, and a mold plate forming the metal vapor deposition surface forms the chamfered portion or the stepped portion. Since the mold body is composed of a body and a second mold body that is movably provided inside the first mold body in the mold opening / closing direction and forms a flat portion of the metal deposition surface, In this state, after supplying the resin into the cavity for the thin substrate, the second mold body is moved in the mold closing direction with respect to the first mold body to compression-mold the resin in the cavity. , Keep the clearance between the second molds to a minimum. And it is can be smoothly molded thin substrate never burrs occurs in the outer edge portion of the metallized surface.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a third embodiment of the present invention.

FIG. 4 is a cross-sectional view of a thin substrate molding die.

FIG. 5 is a cross-sectional view of a main part of a conventional mold for molding a thin substrate.

[Explanation of symbols]

 C cavity 1 fixed mirror plate 6 stamper (information recording plate) 8 movable mirror plate 20 first mold body 20a inclined surface 21 second mold body 30 substrate body 30a chamfered portion 30b flat portion 30c, 30d stepped portion

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Claims (3)

[Claims] 1. A thin-walled substrate in which one surface of a thin-walled substrate body is a metal deposition surface, and a chamfered portion or a step portion is formed at an outer edge portion of the metal deposition surface. substrate. 2. A thin-walled substrate forming gold for molding a thin-walled substrate in which one surface of a thin-walled substrate main body is a metal vapor deposition surface, and a chamfered portion or a step portion is formed at an outer edge portion of the metal vapor deposition surface. In the mold, a cavity for the thin substrate is formed between a pair of mold plates, and the first mold plate defines the chamfered portion or the step portion and the flat portion of the metal deposition surface, and The mold plate for forming a thin-walled substrate body defines the other surface and the outer peripheral surface of the thin-walled substrate body. 3. A thin-walled substrate forming metal for molding a thin-walled substrate in which one surface of a thin-walled substrate main body is a metal vapor deposition surface, and a chamfered portion or a step portion is formed at an outer edge portion of the metal vapor deposition surface. In the mold, a cavity for the thin substrate is formed between a pair of mold plates, and a mold plate forming the metal vapor deposition surface forms the chamfered portion or the stepped portion.
And a second mold body movably provided inside the first mold body in the mold opening / closing direction and forming a flat portion of the metal deposition surface. Mold for thin-walled substrate molding.