JPH07240589A - Cooling structure for heat generator - Google Patents

Cooling structure for heat generator

Info

Publication number
JPH07240589A
JPH07240589A JP2949494A JP2949494A JPH07240589A JP H07240589 A JPH07240589 A JP H07240589A JP 2949494 A JP2949494 A JP 2949494A JP 2949494 A JP2949494 A JP 2949494A JP H07240589 A JPH07240589 A JP H07240589A
Authority
JP
Japan
Prior art keywords
cooling
heating element
air
cooling duct
partition plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2949494A
Other languages
Japanese (ja)
Inventor
Toshirou Shiroe
利郎 城江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2949494A priority Critical patent/JPH07240589A/en
Publication of JPH07240589A publication Critical patent/JPH07240589A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To uniformly and efficiently cool an object disposed in a cooling duct wherever it is located in the cooling duct. CONSTITUTION:A cooling structure includes a cooling duct 3 for passing cooled air, objects 5 to be cooled on one surface of the cooling duct, and a partition plate 6 for dividing the cooling duct into an air supply side as a pressure chamber 3a and an air discharge side as a cooling chamber 3b including the object. The partition plate has an outlet hole 6a for cooled air made in the corresponding position to each object and also is provided with an air shielding plate 6b near each object on the windward side.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、発熱体の冷却構造に関
する。冷却空気を通す冷却ダクトの一面に配設された発
熱体、例えば回路素子を強制冷却する場合、場所によっ
て冷却効果が異なる問題があり、場所に関係なく均一に
効率よく冷却することが要望されている。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating element cooling structure. In the case of forcibly cooling a heating element, such as a circuit element, arranged on one surface of a cooling duct through which cooling air is passed, there is a problem that the cooling effect differs depending on the location, and there is a demand for uniform and efficient cooling regardless of the location. There is.

【0002】[0002]

【従来の技術】図5の側断面図に示すように、従来の発
熱体の冷却構造は、冷却空気を通す冷却ダクト13と、こ
の冷却ダクト13の一面に配設したプリント基板ユニット
14に配列実装された発熱体15(頭部に放熱フィン付き放
熱器15a を固着した回路素子、例えば半導体装置を示
す)と、冷却ダクト13の両開口端のそれぞれに冷却空気
を送り込む送気ファン11と、その冷却空気を排出する排
気ファン12とで構成されている。冷却空気は下(送気
側)から上(排気側)へ吹き抜ける過程で発熱体15及び
その放熱器15a を順次に冷却し排出される。
2. Description of the Related Art As shown in the side cross-sectional view of FIG. 5, a conventional heating element cooling structure has a cooling duct 13 for passing cooling air and a printed circuit board unit arranged on one surface of the cooling duct 13.
A heating element 15 (a circuit element having a radiator 15a with radiation fins fixed to its head, for example, a semiconductor device) mounted in an array on 14 and an air supply fan for feeding cooling air to both open ends of the cooling duct 13. 11 and an exhaust fan 12 for discharging the cooling air. The cooling air is sequentially cooled and discharged from the heating element 15 and its radiator 15a in the process of blowing from the bottom (air supply side) to the top (exhaust side).

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うな上記冷却構造によれば、冷却空気は送気側から排気
側へ吹き抜ける過程で発熱体を通過冷却するごとに温度
が上昇するため、排気側に近くなるほど冷却効果が悪く
なるとか、冷却空気の一部は冷却ダクトの周囲を素通り
して直接、発熱体の冷却に寄与せずに排出されて無駄に
なるといった問題があった。
However, according to such a cooling structure as described above, the temperature of the cooling air rises every time the heating element is cooled while passing through the heating element in the process of blowing from the air feeding side to the exhaust side. There is a problem in that the cooling effect becomes worse as the temperature becomes closer to, and some of the cooling air passes directly around the cooling duct and is discharged directly without contributing to the cooling of the heating element and is wasted.

【0004】上記問題点に鑑み、本発明は冷却ダクト内
に配設された発熱体を冷却ダクト内の場所に関係なく均
一に効率よく冷却する発熱体の冷却構造を提供すること
を目的とする。
In view of the above problems, it is an object of the present invention to provide a heating element cooling structure for uniformly and efficiently cooling a heating element arranged in a cooling duct regardless of the location in the cooling duct. .

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に、本発明の発熱体の冷却構造においては、冷却空気を
通す冷却ダクトと、該冷却ダクトの一面に配設する発熱
体と、前記冷却ダクト内の風路を送気側と排気側とに分
割し一方の送気側を圧力室にし、他方の排気側を前記発
熱体を含んだ冷却室に区切る仕切り板とを備え、該仕切
り板は前記それぞれの発熱体に対応した位置に冷却空気
の噴出し口を開口し、かつそれぞれの発熱体の風上側直
近に遮風板を備え構成する。
In order to achieve the above object, in a heating element cooling structure of the present invention, a cooling duct for passing cooling air, a heating element disposed on one surface of the cooling duct, and The air duct in the cooling duct is divided into an air supply side and an exhaust side, one air supply side is used as a pressure chamber, and the other exhaust side is divided into a cooling chamber containing the heating element. The plate is configured to have a jet of cooling air opened at a position corresponding to each of the heating elements, and a wind shield plate provided in the vicinity of the windward side of each heating element.

【0006】[0006]

【作用】冷却ダクトは送気側を圧力室にし排気側を発熱
体を含んだ冷却室に区切る仕切り板を備え、仕切り板は
発熱体に対応した位置に冷却空気の噴出し口を開口する
ことにより、圧力室の冷却空気が仕切り板の噴出し口か
ら冷却室に噴き出し、その噴流は即座にそれぞれの発熱
体に直接、吹きつけるため、すべての発熱体を同じ条件
で冷却することができる。また、発熱体の風上側直近に
遮風板を備えることにより、仕切り板の噴出し口から冷
却室に噴き出した冷却空気は発熱体を冷却し温度が上が
るが、その温度の上がった冷却空気は後の遮風板に遮ら
れて遮風板の陰にある発熱体に曝されることなく排気さ
れるため、排気側に近い場所の発熱体でも実装場所に関
係なく均一に効率よく冷却することができる。
The cooling duct is provided with a partition plate that divides the air supply side into a pressure chamber and the exhaust side into a cooling chamber containing a heating element. The partition plate should have a jet of cooling air opened at a position corresponding to the heating element. By this, the cooling air of the pressure chambers is jetted from the jet port of the partition plate to the cooling chambers, and the jet flow immediately blows directly to the respective heating elements, so that all the heating elements can be cooled under the same conditions. Further, by providing a wind shield near the windward side of the heating element, the cooling air jetted into the cooling chamber from the jetting port of the partition plate cools the heating element and the temperature rises, but the cooling air whose temperature has risen is Since it is exhausted without being exposed to the heat generating element behind the wind shielding plate because it is shielded by the wind shielding plate later, even the heat generating element near the exhaust side can be cooled uniformly and efficiently regardless of the mounting location. You can

【0007】また、圧力室に送り込まれた冷却空気は、
仕切り板の噴出し口からのみ噴き出し、しかも噴き出し
た冷却空気は即座に発熱体に吹きつけるため、冷却ダク
トに送り込まれた冷却空気を無駄なく有効に利用するこ
とができる。
Further, the cooling air sent into the pressure chamber is
The cooling air blown out only from the blowout port of the partition plate is immediately blown to the heating element, so that the cooling air sent to the cooling duct can be effectively used without waste.

【0008】[0008]

【実施例】以下、図面に示した実施例に基づいて本発明
の要旨を詳細に説明する。図1は本発明の一実施例の側
断面図、図2は図1の要部拡大側断面図、図3は図1の
A−A矢視正面図、図4は図1のB−B矢視平面図であ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be described in detail below with reference to the embodiments shown in the drawings. 1 is a side sectional view of an embodiment of the present invention, FIG. 2 is an enlarged side sectional view of an essential part of FIG. 1, FIG. 3 is a front view taken along the line AA of FIG. 1, and FIG. 4 is a BB of FIG. FIG.

【0009】それぞれの図に示すように、発熱体の冷却
構造は、送気側と排気側のそれぞれに送気ファン1と排
気ファン2とを配設し冷却空気を矢印方向に通す冷却ダ
クト3と、この配設したプリント基板ユニット4に配列
実装された発熱体5(頭部に放熱フィン付き放熱器5aを
固着した回路素子、例えば半導体装置)と、冷却ダクト
3内の風路を風路方向に送気側と排気側とに分割し一方
の送気側を圧力室3aにし、他方の排気側を発熱体5を含
んだ冷却室3bに区切る仕切り板6とを備える。この仕切
り板6はそれぞれの発熱体5に対応した位置に冷却空気
の噴出し口6aを開口し、かつそれぞれの発熱体5の風上
側直近に冷却空気をガイドする遮風板6bを備える構成す
る。
As shown in each of the drawings, the cooling structure for the heating element is provided with an air supply fan 1 and an exhaust fan 2 on each of the air supply side and the exhaust side, and a cooling duct 3 for passing cooling air in the arrow direction. A heating element 5 (a circuit element having a radiator 5a with a radiation fin fixed to its head, for example, a semiconductor device) arranged and mounted on the printed circuit board unit 4 thus arranged; and an air passage in the cooling duct 3. A partition plate 6 is divided into an air supply side and an exhaust side in one direction, one air supply side being a pressure chamber 3a, and the other exhaust side being divided into a cooling chamber 3b containing a heating element 5. This partition plate 6 is provided with a cooling air ejection port 6a at a position corresponding to each heating element 5 and a wind shield plate 6b for guiding the cooling air to a position immediately upstream of each heating element 5. .

【0010】いま、送気ファン1と排気ファン2とを共
同運転し、冷却空気を冷却ダクト1内の圧力室3aに送り
込むと、仕切り板6の噴出し口6aから冷却空気が噴き出
す。その噴流は即座に発熱体5の放熱器5aに吹きつけら
れ、排気ファン2によって排出側に流れるが、その流れ
は図3に示すように、遮風板6bに遮られて両側に分かれ
温度の上がった冷却空気が再び、さらに排出側にある発
熱体5の放熱器5aに吹きつけられないようにする。
Now, when the air supply fan 1 and the exhaust fan 2 are operated together and the cooling air is sent to the pressure chamber 3a in the cooling duct 1, the cooling air is ejected from the ejection port 6a of the partition plate 6. The jet flow is immediately blown to the radiator 5a of the heating element 5 and flows to the discharge side by the exhaust fan 2, but the flow is blocked by the wind shield plate 6b and is divided into both sides as shown in FIG. The rising cooling air is prevented from being blown again to the radiator 5a of the heating element 5 on the discharge side.

【0011】そのため、すべての発熱体を同じ温度条件
で冷却することができる。そして、温度の上がった冷却
空気は遮風板に遮られて遮風板の陰にある発熱体に曝さ
れることなく排気されるため、排気側に近い場所の発熱
体でも実装場所に関係なく均一に効率よく冷却すること
ができる。
Therefore, all the heating elements can be cooled under the same temperature condition. Then, the cooling air whose temperature has risen is exhausted without being exposed to the heating element behind the windshield because it is blocked by the windshield, so even if the heating element near the exhaust side does not depend on the mounting location. It can be cooled uniformly and efficiently.

【0012】また、圧力室に送り込まれた冷却空気は、
仕切り板の噴出し口からのみ噴き出し、即座に発熱体に
吹きつけられて冷却作用するため、冷却ダクトに送り込
まれた冷却空気を無駄なく有効に利用することができ
る。
Further, the cooling air sent into the pressure chamber is
The cooling air sent out to the cooling duct can be effectively used without waste because it spouts only from the ejection port of the partition plate and is immediately blown to the heating element to perform a cooling action.

【0013】[0013]

【発明の効果】以上、詳述したように本発明によれば、
冷却ダクト内に配設された発熱体を冷却ダクト内の場所
に関係なく均一に効率よく冷却することができるといっ
た産業上極めて有用な効果を発揮する。
As described above in detail, according to the present invention,
A very useful effect in the industry can be achieved such that the heating element arranged in the cooling duct can be uniformly and efficiently cooled regardless of the place in the cooling duct.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の一実施例の側断面図FIG. 1 is a side sectional view of an embodiment of the present invention.

【図2】 図1の要部拡大側断面図FIG. 2 is an enlarged side sectional view of an essential part of FIG.

【図3】 図1のA−A矢視正面図FIG. 3 is a front view taken along the line AA of FIG.

【図4】 図1のB−B矢視平面図FIG. 4 is a plan view taken along the line BB of FIG.

【図5】 従来技術による側断面図FIG. 5 is a side sectional view according to the related art.

【符号の説明】[Explanation of symbols]

3 冷却ダクト 3a 圧力室 3b 冷却室 6 仕切り板 6a 噴出し口 6b 遮風板 3 Cooling duct 3a Pressure chamber 3b Cooling chamber 6 Partition plate 6a Jet port 6b Wind shield

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 冷却空気を通す冷却ダクト(3) と、 該冷却ダクト(3) の一面に配設する発熱体(5) と、 前記冷却ダクト(3) 内の風路を送気側と排気側とに分割
し一方の送気側を圧力室(3a)にし、他方の排気側を前記
発熱体(5) を含んだ冷却室(3b)に区切る仕切り板(6) と
を備え、 該仕切り板(6) は前記それぞれの発熱体(5) に対応した
位置に冷却空気の噴出し口(6a)を開口し、かつそれぞれ
の発熱体(5) の風上側直近に遮風板(6b)を備えてなるこ
とを特徴とする発熱体の冷却構造。
1. A cooling duct (3) for passing cooling air, a heating element (5) arranged on one surface of the cooling duct (3), and an air passage in the cooling duct (3) as an air supply side. A partition plate (6) which is divided into an exhaust side and one of the air supply sides is made into a pressure chamber (3a) and the other exhaust side is divided into a cooling chamber (3b) containing the heating element (5), The partition plate (6) has a jet of cooling air (6a) at a position corresponding to each heating element (5), and a wind shield plate (6b) near the windward side of each heating element (5). ) Is provided, the heating element cooling structure.
JP2949494A 1994-02-28 1994-02-28 Cooling structure for heat generator Withdrawn JPH07240589A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2949494A JPH07240589A (en) 1994-02-28 1994-02-28 Cooling structure for heat generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2949494A JPH07240589A (en) 1994-02-28 1994-02-28 Cooling structure for heat generator

Publications (1)

Publication Number Publication Date
JPH07240589A true JPH07240589A (en) 1995-09-12

Family

ID=12277628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2949494A Withdrawn JPH07240589A (en) 1994-02-28 1994-02-28 Cooling structure for heat generator

Country Status (1)

Country Link
JP (1) JPH07240589A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187964A (en) * 1997-09-09 1999-03-30 Nippon Telegr & Teleph Corp <Ntt> Electronic circuit package and mounting body thereof
JP2002208791A (en) * 2001-01-11 2002-07-26 Hitachi Ltd Cooling device of electronic circuit
JP2006120794A (en) * 2004-10-20 2006-05-11 Nec Corp Electronic apparatus
JP2007005685A (en) * 2005-06-27 2007-01-11 Fujitsu Ltd Package cooling method and device thereof
JP2010187811A (en) * 2009-02-17 2010-09-02 Hitachi Medical Corp X-ray ct apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187964A (en) * 1997-09-09 1999-03-30 Nippon Telegr & Teleph Corp <Ntt> Electronic circuit package and mounting body thereof
JP2002208791A (en) * 2001-01-11 2002-07-26 Hitachi Ltd Cooling device of electronic circuit
JP2006120794A (en) * 2004-10-20 2006-05-11 Nec Corp Electronic apparatus
JP2007005685A (en) * 2005-06-27 2007-01-11 Fujitsu Ltd Package cooling method and device thereof
JP4546335B2 (en) * 2005-06-27 2010-09-15 富士通株式会社 Package cooling device
JP2010187811A (en) * 2009-02-17 2010-09-02 Hitachi Medical Corp X-ray ct apparatus

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Legal Events

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Effective date: 20010508