JP3258274B2 - Heat sink cooling structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink cooling structure applied to an induction heating rice cooker and the like.

[0002]

2. Description of the Related Art Conventionally, in an induction heating type rice cooker or the like, a heat sink having a plurality of fins is provided to cool electronic components mounted on a substrate, for example, an IGBT or the like so as not to lose heat. By providing a fan or forming an air flow path between the substrate and the substrate holder, a forced air flow in the heat sink is generated to improve the cooling capacity.

[0003]

However, since the air flow path is formed by the substrate and the substrate holder, a portion where air is stagnant is formed around the flow path, which may hinder the improvement of the cooling capacity. Further, since each fin of the heat sink must be disposed in the air flow path, dimensional restrictions are large and a sufficient amount of heat radiation may not be secured in some cases.

Accordingly, an object of the present invention is to provide a heat sink cooling structure which enables effective cooling of electronic components by effectively utilizing a limited space.

[0005]

According to the present invention, as a means for solving the above problems, a heat sink provided on a substrate is formed by the substrate and a substrate holder for holding the substrate, and extends vertically. In the heat sink cooling structure located in the middle of the air flow path, an inner opening is formed in the partition wall of the substrate holder, and an outer opening is formed in one of the side walls, and a blower fan is arranged to cover the inner opening. On the other hand, by projecting a part of the fins of the heat sink from the outer opening, the blower fan is driven to generate a vertical air flow in the air flow path, and through the outer opening. Thus, a part of the air sent from the blower fan can flow out of the air flow path.

It is preferable that a through-hole for guiding a part of the air flow in the air flow path to the electronic component on the substrate side is formed in the heat sink.

[0007]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a front sectional view of an induction heating rice cooker to which the heat sink cooling structure according to the present embodiment is applied. This induction heating type rice cooker generally includes a rice cooker main body 1 and a lid 2. Air holes 3 (the rear side is not shown) are formed in the front and rear lower surfaces of the rice cooker main body 1 in the width direction, respectively. In addition, as shown in FIG. 2, a protective frame 4 is provided inside the rice cooker main body 1, and an inner container 5 is housed therein so as to be able to be taken out. A substrate holder 6 is provided in front of the protection frame 4. The substrate holder 6
This is for holding the substrate 7 and the liquid crystal panel 8.

As shown in FIGS. 2 and 3, the substrate holder 6 has a partition wall 9 arranged vertically in the front space of the rice cooker main body 1, and a panel holding portion provided at an upper end thereof at an angle. 10, a side wall 11 extending rearward from both side edges of the partition wall 9, and a substantially U-shaped guide wall 1 provided on the front surface of the partition wall 9
2 is provided. When the substrate 7 is held, an air flow path is formed by the substrate 7, the side wall 11, and the partition wall 9. As shown in FIG. 1, the partition wall 9 has an inner opening 13 formed from the center to the guide wall 12, and an outer opening 14 formed laterally from the guide wall 12. A blower fan 15 is attached to the partition wall 9 inside the guide wall 12. Reference numeral 16 denotes an insertion portion into which a driver or the like is inserted for power adjustment or the like.

Various electronic components such as an IGBT, a DB 17a (diode bridge: rectifier circuit), and a power adjustment volume 17b are mounted on the substrate 7 held by the substrate holder 6. Further, a heat sink 18 is fixed to the substrate 7 in order to prevent these electronic components from being thermally damaged. The heat sink 18 is made of aluminum, and has a plurality of fins 19 projecting at predetermined intervals as shown in FIG.
Etc.). The protrusion of each fin 19 is longer at a portion corresponding to the outer opening 14 than at a portion corresponding to the inner opening 13.
Therefore, when the substrate 7 is held by the substrate holder 6, the fins 19 project forward through the outer opening 14. Further, a through hole 20 is formed in the heat sink 18 so that air from the blower fan 15 is directly blown to the electronic component (DB 17a) on the substrate.

Next, a cooling state of the electronic component using the heat sink cooling structure will be described.

When the rice cooking is started, the electronic components on the substrate 7, especially the IGBT and the DB 17a, generate heat when energized.
Then, the outside air is taken in through the air holes 3 by rotating the blower fan 15. This outside air passes through the heat sink 18 through the inner opening 13 of the substrate holder 6, absorbs the heat transmitted from the DB 17a to the heat sink 18, and flows up and down the air flow path.
And is discharged from a rear side air hole (not shown) through the lower side and the side.

Further, an air flow is generated in the vertical direction also on the side of the guide wall 12 due to the upstream and downstream in the air flow path. As a result, an air flow is generated from the air flow passage through the outer opening 14, and the heat sink 18 is cooled. In the outer opening 14, the fins 19 of the heat sink 18 are formed longer than other parts and have a large surface area, so that sufficient cooling is possible.

Further, a through hole 20 is formed in the heat sink 18 as shown in FIG. 4, and air from the blower fan 15 is guided to the electronic component (DB 17a), and is passed through the escape hole 7a provided in the substrate 7 to the rear. The electronic component (DB 17a) can be sufficiently cooled.

[0015]

As is apparent from the above description, according to the heat sink cooling structure of the present invention, an opening is formed in the substrate holder so that some fins of the heat sink can protrude from the air flow path to the outside. Therefore, an air flow can be formed in a region where the air has not flowed conventionally. Also,
By projecting the fin through the opening, its surface area can be increased. As a result, the heat radiation capability of the heat sink can be increased, and the electronic components mounted on the substrate can be sufficiently cooled.

In particular, a through hole is formed in the heat sink so that air can be directly blown to the electronic component.
The electronic components can be further cooled sufficiently.

[Brief description of the drawings]

FIG. 1 is a front sectional view of an induction heating rice cooker according to the present embodiment.

FIG. 2 is a partial side sectional view of FIG.

FIG. 3 is a partial plan sectional view of FIG. 1;

FIG. 4 is an enlarged sectional view showing the heat sink of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 3 ... Air hole 6 ... Board holder 7 ... Board 9 ... Partition wall 10 ... Panel holding part 11 ... Side wall 12 ... Guide wall 13 ... Inside opening 14 ... Outside opening 15 ... Blow fan 17a ... DB (diode bridge) 17b ... Power adjustment volume 18 Heat sink 19 Fins 20 Through holes

Claims (2)

(57) [Claims] 1. A heat sink cooling structure, wherein a heat sink provided on a substrate is formed by the substrate and a substrate holder for holding the substrate, and is located in the middle of a vertically extending air flow path. An inner opening is formed in the partition wall, and an outer opening is formed in one of the side walls, and a blower fan is disposed so as to cover the inner opening, and a part of the fins of the heat sink protrudes from the outer opening. By driving the blower fan, a vertical airflow is generated in the air flow passage, and a part of the air sent from the blower fan from the middle of the air flow passage through the outer opening. A heat sink cooling structure characterized in that the part can be discharged. 2. The heat sink cooling according to claim 1, wherein a through hole for guiding a part of the air flow in the air flow path to the electronic component on the substrate side is formed in the heat sink. Construction.