JP3994235B2 - Cooling structure of control device - Google Patents

Cooling structure of control device Download PDF

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Publication number
JP3994235B2
JP3994235B2 JP27356897A JP27356897A JP3994235B2 JP 3994235 B2 JP3994235 B2 JP 3994235B2 JP 27356897 A JP27356897 A JP 27356897A JP 27356897 A JP27356897 A JP 27356897A JP 3994235 B2 JP3994235 B2 JP 3994235B2
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Japan
Prior art keywords
heat
generating component
heat sink
cooling
heat generating
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JP27356897A
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Japanese (ja)
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JPH1197872A (en
Inventor
信行 並木
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、ファンを使用する制御装置の冷却構造に関するものである。
【0002】
【従来の技術】
従来の制御装置の冷却構造は、図2に示すようになっている。
図において, 1は制御装置、2は制御装置の枠体を構成するヒートシンクで、ヒートシンク本体2aと、このヒートシンク本体2aの一方側に形成した発熱部品接触面2bと、他方側に設けた冷却フィン2cとで構成している。2dは前記ヒートシンク本体2aの発熱部品接触面2bに突出させて設けた突出片である。3は装置外枠で、カバーで構成している。この装置外枠3と前記ヒートシンク本体2aとで通風ダクト4を構成している。5は前記通風ダクト4の一方端において、前記ヒートシンク2に取り付けられた冷却ファンで、冷却風を前記通風ダクト内に送り込んでいる。6は通風ダクトの吸込口で、7は排出口である。8はプリント基板で、前記ヒートシンク2の発熱部品接触面2bと空隙を介して対向するように前記ヒートシンク2に取り付けられている。9は第1の発熱部品で、前記プリント基板8の上面に取り付けられ、上面を前記ヒートシンク2の発熱部品接触面2bに密着させている。10は第2の発熱部品で、前記プリント基板8の上面の反冷却ファン側に取り付けるとともに、前記ヒートシンク2の突出片2dに密着させている。
このような構成において、前記第1の発熱部品と第2の発熱部品の冷却は、つぎのように行なわれる。
まず、前記第1の発熱部品9の熱は、前記第1の発熱部品9と接触している発熱部品接触面2bからヒートシンク本体2aに伝えられ、第2の発熱部品10の熱は、前記第2の発熱部品10と接触している前記突出片2dからヒートシンク本体2aに伝えられる。
つぎに、前記ヒートシンク本体2aに伝えられた熱は、前記冷却フィン2cに伝わり、複数の冷却フィン2cの表面から、大気中に放熱される。この際、通風ダクト4内には、冷却ファン5によって、冷却風が矢印で示すように流れているので、冷却フィン2cの表面と大気との接触量が増加し、冷却フィン2cの表面からの放熱が良好に行われる。
【0003】
【発明が解決しようとする課題】
しかしながら、このような従来の制御装置の冷却構造においては、第2の発熱部品とヒートシンクの突出片が密着していないと、第2の発熱部品の熱がヒートシンクに伝わらず冷却性が悪くなるので、第2の発熱部品のプリント基板上での位置決め、および前記突出片との平行度を精度よく出す必要があり、しかも、前記第2の発熱部品は通常複数個あるので、制御装置の組立が非常に面倒であるという問題があった。
そこで、本発明は、組立が簡単で、冷却性がよい制御装置の冷却構造を提供することを目的とするものである。
【0004】
【課題を解決するための手段】
上記課題を解決するために、本発明は、装置枠体と、前記装置枠体と装置外枠との間に設けた通風ダクトと、前記通風ダクトの端部に設けた冷却ファンと、前記装置枠体に取り付けられ、ヒートシンク本体の一方側に発熱部品接触面を形成するとともに、他方側に前記通風ダクト内に突出する冷却フィンを設けたヒートシンクと、前記ヒートシンクの発熱部品接触面と空隙を介して対向するように、前記装置枠体に取り付けられたプリント基板と、前記プリント基板上に取り付けられ、上面を前記ヒートシンクの発熱部品接触面に密着させた第1の発熱部品と、前記プリント基板の上面の反冷却ファン側に取り付けた第2の発熱部品とを有する制御装置の冷却構造において、前記ヒートシンク本体の、前記第2発熱部品と対向する部分に、前記冷却ファン側と前記発熱部品接触面側を連通する通風穴を設け、前記通風穴の冷却ファン側の周囲に、前記第2発熱部品に向かって延びる傾斜したガイドを設けるようにしたものである。
このため、ヒートシンクの冷却フィン間を流れた風は、通風ダクトのカバとヒートシンクの貫通穴と壁によりプリント基板に搭載された発熱部品に流れて発熱部品の冷却効率が向上する。
【0005】
【発明の実施の形態】
以下、本発明の実施例を図に基づいて説明する。
図1は、本発明の実施例を示す制御装置の側断面図である。なお、図2と同一符号は、同一または相当する部材を示し、説明を省略する。
本発明の制御装置の冷却構造が従来技術と異なる点は、通風ダクト4内における冷却風の流れの方向を変え、プリント基板8上の第2発熱部品10を冷却風に直接当てて冷却するようにした点である。
そのため、本発明では、ヒートシンク本体2aの、前記第2発熱部品10と対向する部分に、前記冷却フィン2c側と前記発熱部品接触面2b側を連通する通風穴11を設けるとともに、前記通風穴11の冷却ファン5側の周囲に、前記第2発熱部品10に向かって延びる傾斜したガイド12を設けるようにしている。
また、前記装置外枠3を延長し、反冷却ファン5側に、冷却風の排出を防ぎ、かつ、冷却風を案内するための仕切部3aを設けるようにしている。
この場合、排出口13は、ヒートシンク本体2aとプリント基板8との間に形成される。
このような構成において、前記第1の発熱部品9と第2の発熱部品10の冷却は、つぎのように行われる。
[第1の発熱部品の冷却]
まず、前記第1の発熱部品9の熱は、前記第1の発熱部品9と接触している発熱部品接触面2bからヒートシンク本体2aに伝えられる。つぎに、前記ヒートシンク本体2aに伝えられた熱は、前記冷却フィン2cに伝わり、複数の冷却フィン2cの表面から、大気中に放熱される。この際、通風ダクト4内には、冷却ファン5によって、冷却風が矢印で示すように流れているので、冷却フィン2cの表面と大気との接触量が増加し、冷却フィン2cの表面からの放熱が良好に行われる。
[第2の発熱部品の冷却]
冷却ファン5で発生した冷却風は、ヒートシンク2から熱を奪った後、前記仕切部3aに当たり方向転換するとともに、前記通風穴11を通ってヒートシンク本体2aの反冷却フィン側に方向を変えて流れていく。ヒートシンク本体2aの反冷却フィン2c側に流れていった冷却風は、前記ガイド12によって第2の発熱部品10へ向かうように誘導され、第2の発熱部品10から熱を奪って、排出口13から制御装置外に流れ出ていく。この場合、第2の発熱部品10は冷却風によって直接冷却するので、ヒートシンク2に密着させる必要はなく、そのため、プリント基板8上への取り付けにあたっては、取り付け精度を厳しくする必要がない。
【0006】
【発明の効果】
以上述べたように、本発明によれば、冷却ファンで発生させた冷却風の流れを変えることにより、第2発熱部品を冷却風で直接冷却することができるので、従来のように、第2の発熱部品のプリント基板上での位置決め、および前記突出片との平行度を精度よく出す必要がなくなる。したがって、制御装置の組立がきわめて簡単で、かつ、制御装置の冷却性を大きく向上することができる。
【図面の簡単な説明】
【図1】 本発明の実施例を示す制御装置の側断面図である。
【図2】 従来技術を示す制御装置の側断面図である。
【符号の説明】
1 制御装置、
2 ヒートシンク、
2a ヒートシンク本体、
2b 発熱部品接触面、
2c 冷却フィン、
2d 突出片、
3 装置外枠、
3a 仕切部、
4 通風ダクト、
5 冷却ファン、
6 吸込口、
7 排出口、
8 プリント基板、
9 第1の発熱部品、
10 第2の発熱部品、
11 通風穴、
12 ガイド、
13 排出口
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling structure for a control device using a fan.
[0002]
[Prior art]
The cooling structure of the conventional control device is as shown in FIG.
In the figure, 1 is a control device, 2 is a heat sink constituting the frame of the control device, a heat sink body 2a, a heat generating component contact surface 2b formed on one side of the heat sink body 2a, and a cooling fin provided on the other side. 2c. Reference numeral 2d denotes a protruding piece provided to protrude from the heat generating component contact surface 2b of the heat sink body 2a. Reference numeral 3 denotes an outer frame of the apparatus, which is constituted by a cover. The device outer frame 3 and the heat sink main body 2a constitute a ventilation duct 4. Reference numeral 5 denotes a cooling fan attached to the heat sink 2 at one end of the ventilation duct 4 and sends cooling air into the ventilation duct. 6 is a suction port of the ventilation duct, and 7 is a discharge port. Reference numeral 8 denotes a printed circuit board, which is attached to the heat sink 2 so as to face the heat-generating component contact surface 2b of the heat sink 2 via a gap. Reference numeral 9 denotes a first heat generating component which is attached to the upper surface of the printed circuit board 8 and has its upper surface in close contact with the heat generating component contact surface 2 b of the heat sink 2. A second heat generating component 10 is attached to the anti-cooling fan side of the upper surface of the printed circuit board 8 and is in close contact with the protruding piece 2d of the heat sink 2.
In such a configuration, the cooling of the first heat generating component and the second heat generating component is performed as follows.
First, the heat of the first heat generating component 9 is transmitted to the heat sink body 2a from the heat generating component contact surface 2b in contact with the first heat generating component 9, and the heat of the second heat generating component 10 is transferred to the first heat generating component 9. 2 is transmitted to the heat sink body 2a from the protruding piece 2d that is in contact with the second heat generating component 10.
Next, the heat transmitted to the heat sink body 2a is transmitted to the cooling fins 2c and is radiated from the surfaces of the plurality of cooling fins 2c to the atmosphere. At this time, since the cooling air flows in the ventilation duct 4 as indicated by arrows by the cooling fan 5, the amount of contact between the surface of the cooling fin 2c and the atmosphere increases, and the air flows from the surface of the cooling fin 2c. Heat dissipation is performed well.
[0003]
[Problems to be solved by the invention]
However, in the conventional cooling structure of the control device, if the second heat generating component and the protruding piece of the heat sink are not in close contact with each other, the heat of the second heat generating component is not transmitted to the heat sink and the cooling performance is deteriorated. In addition, it is necessary to accurately position the second heat generating component on the printed circuit board and to provide parallelism with the protruding piece, and there are usually a plurality of the second heat generating components. There was a problem that it was very troublesome.
Therefore, an object of the present invention is to provide a cooling structure for a control device that is easy to assemble and has good cooling performance.
[0004]
[Means for Solving the Problems]
In order to solve the above problems, the present invention provides an apparatus frame, a ventilation duct provided between the apparatus frame and the apparatus outer frame, a cooling fan provided at an end of the ventilation duct, and the apparatus. A heat sink attached to the frame and having a heat generating component contact surface on one side of the heat sink body and a cooling fin protruding into the ventilation duct on the other side, and a heat generating component contact surface of the heat sink and a gap A printed circuit board attached to the apparatus frame, a first heat generating component attached on the printed circuit board and having an upper surface closely attached to a heat generating component contact surface of the heat sink, and the printed circuit board In the cooling structure of the control device having the second heat generating component attached to the anti-cooling fan side of the upper surface, the front portion of the heat sink body facing the second heat generating component Ventilation hole communicating the heat generating component contact surface side and the cooling fan side provided around the cooling fan side of the ventilation hole, is obtained by so providing the inclined guide extending toward the second heat generating part.
For this reason, the air flowing between the cooling fins of the heat sink flows into the heat generating component mounted on the printed circuit board through the cover of the ventilation duct, the through hole and the wall of the heat sink, and the cooling efficiency of the heat generating component is improved.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a side sectional view of a control device showing an embodiment of the present invention. 2 denote the same or corresponding members, and a description thereof will be omitted.
The cooling structure of the control device of the present invention is different from the prior art in that the direction of the cooling air flow in the ventilation duct 4 is changed and the second heat generating component 10 on the printed circuit board 8 is directly applied to the cooling air to cool it. This is the point.
Therefore, in the present invention, a ventilation hole 11 that communicates the cooling fin 2c side and the heating component contact surface 2b side is provided in a portion of the heat sink body 2a that faces the second heating component 10, and the ventilation hole 11 is provided. An inclined guide 12 extending toward the second heat generating component 10 is provided around the cooling fan 5 side.
Further, the apparatus outer frame 3 is extended, and a partition portion 3a for preventing cooling air from being discharged and guiding the cooling air is provided on the anti-cooling fan 5 side.
In this case, the discharge port 13 is formed between the heat sink body 2a and the printed board 8.
In such a configuration, the cooling of the first heat generating component 9 and the second heat generating component 10 is performed as follows.
[Cooling of first heat-generating component]
First, the heat of the first heat generating component 9 is transmitted from the heat generating component contact surface 2b in contact with the first heat generating component 9 to the heat sink body 2a. Next, the heat transmitted to the heat sink body 2a is transmitted to the cooling fins 2c and is radiated from the surfaces of the plurality of cooling fins 2c to the atmosphere. At this time, since the cooling air flows in the ventilation duct 4 as indicated by arrows by the cooling fan 5, the amount of contact between the surface of the cooling fin 2c and the atmosphere increases, and the air flows from the surface of the cooling fin 2c. Heat dissipation is performed well.
[Cooling of second heat generating component]
The cooling air generated by the cooling fan 5 takes heat from the heat sink 2 and then strikes the partition portion 3a and changes its direction and flows through the ventilation hole 11 to the anti-cooling fin side of the heat sink body 2a. To go. The cooling air that has flowed toward the anti-cooling fin 2c side of the heat sink main body 2a is guided toward the second heat-generating component 10 by the guide 12, takes heat from the second heat-generating component 10, and discharges 13 To the outside of the control device. In this case, since the second heat-generating component 10 is directly cooled by the cooling air, it is not necessary to be in close contact with the heat sink 2, and therefore it is not necessary to tighten the mounting accuracy when mounting on the printed circuit board 8.
[0006]
【The invention's effect】
As described above, according to the present invention, the second heat-generating component can be directly cooled by the cooling air by changing the flow of the cooling air generated by the cooling fan. Therefore, it is not necessary to accurately position the heat-generating component on the printed circuit board and to provide parallelism with the protruding piece. Therefore, the assembly of the control device is extremely simple, and the cooling performance of the control device can be greatly improved.
[Brief description of the drawings]
FIG. 1 is a side sectional view of a control device showing an embodiment of the present invention.
FIG. 2 is a side sectional view of a control device showing a conventional technique.
[Explanation of symbols]
1 control device,
2 heat sink,
2a Heat sink body,
2b Heating part contact surface,
2c cooling fins,
2d protruding piece,
3 Outer frame,
3a partition,
4 Ventilation duct,
5 Cooling fan,
6 Suction port,
7 outlet,
8 Printed circuit board,
9 First heat-generating component,
10 Second heat-generating component,
11 Ventilation holes,
12 guides,
13 Discharge port

Claims (2)

装置枠体と、
前記装置枠体と装置外枠との間に設けた通風ダクトと、
前記通風ダクトの端部に設けた冷却ファンと、
前記装置枠体に取り付けられ、ヒートシンク本体の一方側に発熱部品接触面を設けるとともに、他方側に前記通風ダクト内に突出する冷却フィンを設けたヒートシンクと、
前記ヒートシンクの発熱部品接触面と空隙を介して対向するように、前記装置枠体に取り付けられたプリント基板と、
前記プリント基板上に取り付けられ、上面を前記ヒートシンクの発熱部品接触面に密着させた第1の発熱部品と、
前記プリント基板の上面の反冷却ファン側に取り付けた第2の発熱部品とを有する制御装置の冷却構造において、
前記ヒートシンク本体の、前記第2発熱部品と対向する部分に、前記冷却ファン側と前記発熱部品接触面側を連通する通風穴を設け、前記通風穴の冷却ファン側の周囲に、前記第2発熱部品に向かって延びる傾斜したガイドを設けたことを特徴とする制御装置の冷却構造。
A device frame;
A ventilation duct provided between the device frame and the device outer frame;
A cooling fan provided at an end of the ventilation duct;
A heat sink attached to the device frame, provided with a heat generating component contact surface on one side of the heat sink body, and provided with cooling fins protruding into the ventilation duct on the other side;
A printed circuit board attached to the device frame so as to face the heat-generating component contact surface of the heat sink via a gap;
A first heat generating component mounted on the printed circuit board and having an upper surface in close contact with the heat generating component contact surface of the heat sink;
In the cooling structure of the control device having a second heat generating component attached to the anti-cooling fan side of the upper surface of the printed circuit board,
A ventilation hole that communicates the cooling fan side and the heating component contact surface side is provided in a portion of the heat sink body that faces the second heating component, and the second heat generation is provided around the cooling fan side of the ventilation hole. A cooling structure for a control device, comprising an inclined guide extending toward a component.
前記装置枠体を前記ヒートシンクで構成したことを特徴とする請求項1記載の制御装置の冷却構造。  The control device cooling structure according to claim 1, wherein the device frame is constituted by the heat sink.
JP27356897A 1997-09-19 1997-09-19 Cooling structure of control device Expired - Fee Related JP3994235B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27356897A JP3994235B2 (en) 1997-09-19 1997-09-19 Cooling structure of control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27356897A JP3994235B2 (en) 1997-09-19 1997-09-19 Cooling structure of control device

Publications (2)

Publication Number Publication Date
JPH1197872A JPH1197872A (en) 1999-04-09
JP3994235B2 true JP3994235B2 (en) 2007-10-17

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JP5011016B2 (en) * 2007-07-30 2012-08-29 株式会社日立産機システム Power converter
JP5314481B2 (en) * 2009-04-02 2013-10-16 株式会社ソニー・コンピュータエンタテインメント Electronics
JP2011133789A (en) * 2009-12-25 2011-07-07 Casio Computer Co Ltd Light source apparatus and projector
JP5614542B2 (en) * 2011-03-28 2014-10-29 株式会社安川電機 Motor control device
KR20150025755A (en) 2013-08-30 2015-03-11 엘에스산전 주식회사 Apparatus for cooling inverter
JP6918765B2 (en) * 2018-11-29 2021-08-11 ファナック株式会社 Heat dissipation device
WO2022250494A1 (en) * 2021-05-28 2022-12-01 엘지전자 주식회사 Microwave oven

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