JPH01286498A - Electronic component apparatus - Google Patents

Electronic component apparatus

Info

Publication number
JPH01286498A
JPH01286498A JP63117368A JP11736888A JPH01286498A JP H01286498 A JPH01286498 A JP H01286498A JP 63117368 A JP63117368 A JP 63117368A JP 11736888 A JP11736888 A JP 11736888A JP H01286498 A JPH01286498 A JP H01286498A
Authority
JP
Japan
Prior art keywords
cooling air
electronic component
casing
circuit boards
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63117368A
Other languages
Japanese (ja)
Inventor
Taisuke Matsugi
眞継　泰典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP63117368A priority Critical patent/JPH01286498A/en
Publication of JPH01286498A publication Critical patent/JPH01286498A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Abstract

PURPOSE:To enable electronic components mounted on circuit boards to be cooled efficiently without increasing the size of a cooling apparatus by concentrating cooling air to cooling air passing holes provided in circuit boards so that the electronic components are cooled by the cooling air thus concentrated. CONSTITUTION:In a casing 10, an intake port 12 having a fan 11 serving as a cooling air generating mechanism is provided on the upper wall while a discharge port 13 is provided on the lower wall. Circuit boards 14 are provided with a hole for passing cooling air 15 in the region where an electronic component 16 is to be mounted. Such circuit boards are arranged in the casing 10 so as to define three spaces in total, namely the first space 17 at the top, the second space 18 in the middle and the third space 19 at the bottom which are substantially independent from each other. By providing the circuit boards 11 in the casing 10, a ventilation path is defied from the inlet port 12 to the discharge port 13 within the casing 10 while each of the first, second and third spaces 17, 18 and 19 provides an air duct.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、回路基板上にトランジスタとか抵抗等の電子
部品を搭載してなる電子部品装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component device in which electronic components such as transistors and resistors are mounted on a circuit board.

（従来の技術） 上記の電子部品装置においては、その使用時における電
子部品の発熱に対応するように、電子部品を冷却するこ
とが必要なことがある。(Prior Art) In the electronic component device described above, it may be necessary to cool the electronic component to cope with the heat generated by the electronic component during use.

第３図は、電子部品を冷却する冷却機構を備えた従来例
の電子部品装置の断面図である。同図において、符号ｌ
はそれぞれ回路基板、２はそれぞれその本体３の両側か
らリード端子４が突出した構造の電子部品であり、それ
ぞれの電子部品２は回路基板１にそれのリード端子４が
固定されて取り付けられている。各回路基板ｌは図で上
下３段の配置状態でケーシング５の内部に収納されてい
る。FIG. 3 is a sectional view of a conventional electronic component device equipped with a cooling mechanism for cooling electronic components. In the figure, the symbol l
2 are circuit boards, and 2 are electronic components each having lead terminals 4 protruding from both sides of the main body 3. Each electronic component 2 is attached to the circuit board 1 with its lead terminals 4 fixed. . Each circuit board l is housed inside the casing 5 in an arrangement of three levels, upper and lower, as shown in the figure.

上記ケーシング５において、各回路基板１の図で左側の
一端側に相対する側壁には、モータ付きのファン６が装
着された吸気ロアが設けられ、また、回路基板ｌの図で
右側となる他端側に相対する側壁には、排気口８が設け
られている。In the casing 5, an intake lower on which a motor-equipped fan 6 is mounted is provided on the side wall opposite to one end on the left side of each circuit board 1 in the figure, and the other end on the right side in the figure of the circuit board l is provided. An exhaust port 8 is provided in the side wall facing the end side.

このような構成において、モータが回転してファン６が
作動されると、吸気ロアを介してケーシング５の内部へ
取り入れられた冷却風は排気口８側へ向けて各回路基板
１に沿って矢印で示す向きに流動させられ、その流動の
途中において各電子部品２を冷却して、電子部品２から
の発生熱を排気口８を介してケーシング５外部に放出さ
せられるようになっている。In such a configuration, when the motor rotates and the fan 6 is operated, the cooling air taken into the casing 5 through the intake lower is directed toward the exhaust port 8 side along each circuit board 1 in the direction of the arrow. During the flow, each electronic component 2 is cooled, and the heat generated from the electronic component 2 is released to the outside of the casing 5 through the exhaust port 8.

（発明が解決しようとする課題） しかしながら、このような従来例の電子部品装置におい
ては、吸気ロアからの冷却風の多くはケーシング５内の
電子部品２が存在しない空間部ａ。(Problem to be Solved by the Invention) However, in such a conventional electronic component device, most of the cooling air from the intake lower is in the space a in the casing 5 where the electronic component 2 does not exist.

ｂ　、ｃ　、ｄ部分を通過してしまうことから、電子部
品２に直接触れてその発生熱を奪う量が少なくなる。し
たがって、これでは電子部品２の冷却が効率良く行われ
ず、発熱量がより大きい電子部品が搭載されている装置
の場合では、より大型のファンを用いて大型の冷却風を
送り込むような構成としなければならないので、装置が
大型化してくるという課題があった。Since the heat passes through portions b, c, and d, the amount of heat that is directly touched by the electronic component 2 and removed from it is reduced. Therefore, in this case, the electronic components 2 are not efficiently cooled, and in the case of devices equipped with electronic components that generate a large amount of heat, a configuration must be adopted in which a larger fan is used to send in a larger amount of cooling air. Therefore, there was a problem in that the equipment became larger.

本発明は、上記課題に鑑みてなされたものであって、装
置を大型化することなく回路基板上に設けられた電子部
品の冷却を効率良く行える電子部品装置を提供すること
を目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component device that can efficiently cool electronic components provided on a circuit board without increasing the size of the device.

（課題を解決するための手段） 本発明においては、上記課題を解決するために、回路基
板上に電子部品を搭載してなる電子部品装置において、
冷却風発生機構と、前記回路基板上における前記電子部
品の搭載位置に設けられた冷却風貫流孔と、前記冷却風
発生機構による冷却風を前記冷却風貫流孔に導く導風路
とが設けられてなる構成とした。(Means for Solving the Problems) In order to solve the above problems, the present invention provides an electronic component device in which electronic components are mounted on a circuit board.
A cooling air generation mechanism, a cooling air flow hole provided at a mounting position of the electronic component on the circuit board, and an air guide path that guides the cooling air from the cooling air generation mechanism to the cooling air flow hole. The structure is as follows.

（作用） 上記構成により、冷却風発生機構が作動されると、導風
路に導かれた冷却風は冷却風貫流孔に集中し、その集中
冷却風により電子部品は冷却される。(Function) With the above configuration, when the cooling air generation mechanism is activated, the cooling air guided to the air guide path is concentrated in the cooling air passage hole, and the electronic components are cooled by the concentrated cooling air.

（実施例） 以下、本発明の一実施例を図面に基づいて詳細に説明す
る。第１図はその実施例に係る電子部品装置の断面図で
ある。(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings. FIG. 1 is a sectional view of an electronic component device according to the embodiment.

同図において、符号１０はケーシングであり、そのケー
シング１０における上壁部に冷却風発生機構としてのフ
ァン１１が装着された吸気口１２が、また、下壁部に排
気口１３がそれぞれ設けられている。１４はそれぞれ回
路基板であり、各回路基板１４における電子部品１６の
各搭載位置には冷却風貫流孔１５がそれぞれ設けられて
いる。In the figure, reference numeral 10 is a casing, and the upper wall of the casing 10 is provided with an intake port 12 equipped with a fan 11 as a cooling air generation mechanism, and the lower wall thereof is provided with an exhaust port 13. There is. Each circuit board 14 is provided with a cooling air passage hole 15 at each mounting position of the electronic component 16 on each circuit board 14 .

各回路基板１４は、ケーシングｌＯ内に上方から下方に
かけて第１空間１７、第２空間１８、および第３空間１
９の合計３つのほぼ独立した空間が構成されるように配
置されている。上記のように各回路基板１４のそれぞれ
が設けられることにより、ケーシング１０において吸気
口１２−第１空間１７−上段回路基板１４の冷却風貫流
孔１５→第２空間■８−下段回路基板１４の冷却風貫流
孔１５−第３空間１９−排気ロ１３というこの記載順序
に従う密閉通風路が形成され、上記における第１空間１
７、第２空間１８、第３空間１９のそれぞれが本発明に
おける導風路を構成する。Each circuit board 14 has a first space 17, a second space 18, and a third space 1 in the casing lO from above to below.
9, so that a total of three almost independent spaces are constructed. By providing each of the circuit boards 14 as described above, in the casing 10, the air intake port 12 - the first space 17 - the cooling air passage hole 15 of the upper stage circuit board 14 -> the second space 8 - the lower stage circuit board 14. A closed ventilation passage according to the order of description of cooling air passage hole 15 - third space 19 - exhaust hole 13 is formed, and the first space 1 in the above
7, the second space 18, and the third space 19 each constitute an air guide path in the present invention.

次に、冷却動作を説明する。Next, the cooling operation will be explained.

モータが回転してファン１１が作動されて吸気口１２か
らケーシングｌＯ内へ吸い込まれた冷却風は、上記密閉
通風路を流動して下部の排気口１３を介してケーシング
ｌＯの外部に排気される。When the motor rotates and the fan 11 is operated, the cooling air sucked into the casing 10 from the intake port 12 flows through the sealed ventilation passage and is exhausted to the outside of the casing 10 through the lower exhaust port 13. .

そして、冷却風はその流動途中においてそれぞれの冷却
風貫流孔Ｉ５を貫流する際に、その貫流孔！５の上部に
位置する電子部品！６それぞれの冷却を行う。この冷却
は冷却風貫流孔１５に集中する冷却風により行われるの
で、効率良くなされる。Then, when the cooling air flows through each of the cooling air through holes I5 during its flow, the through holes! Electronic components located at the top of 5! 6. Perform each cooling. This cooling is performed efficiently by the cooling air concentrated in the cooling air flow holes 15.

第２図は他の実施例に係る電子部品装置の断面図である
。同図に示される電子部品装置ではケーシングを用いて
おらず、回路基板２０の下面側にシート２１を配設し、
そのシート２！の一端２２側を回路基板２０に密着固定
させており、上記導風路を回路基板２０とシート２１と
の間に構成される隙間２３で構成している。FIG. 2 is a sectional view of an electronic component device according to another embodiment. In the electronic component device shown in the figure, a casing is not used, and a sheet 21 is arranged on the lower surface side of a circuit board 20.
That sheet 2! One end 22 side of the sheet is closely fixed to the circuit board 20, and the air guide path is formed by a gap 23 formed between the circuit board 20 and the sheet 21.

このような構成において、シート２１と回路基板２０と
の間の隙間２３に、図で左側の開放他端側から図示しな
いファンにより冷却風が流入されると、その冷却風は隙
間２３からそれぞれの冷却風貫流孔２４を貫流し、その
上方に位置する電子部品２５のそれぞれを冷却する。In such a configuration, when cooling air is flowed into the gap 23 between the sheet 21 and the circuit board 20 from the other open end on the left side in the figure by a fan (not shown), the cooling air flows from the gap 23 into each of the gaps 23. The cooling air flows through the cooling air passage hole 24 and cools each of the electronic components 25 located above it.

また、上記各実施例においては、電子部品１個に対して
１個の冷却風貫流孔を設ける構成とじたが、複数の電子
部品に対して共通の大きい冷却風貫流孔を設けるように
してもよい。Further, in each of the above embodiments, one cooling air passage hole is provided for one electronic component, but a common large cooling air passage hole may be provided for multiple electronic components. good.

（発明の効果） 以上のように、本発明によれば、冷却風を回路基板に設
けられた冷却風貫流孔に集中させ、その集中冷却風によ
り電子部品を冷却するように構成したから、装置を大型
化することなく電子部品の冷却を効率良く行なうことが
できるようになった。(Effects of the Invention) As described above, according to the present invention, the cooling air is concentrated in the cooling air flow holes provided in the circuit board, and the electronic components are cooled by the concentrated cooling air. It has become possible to efficiently cool electronic components without increasing the size of the device.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図は本発明に係り、第１図は一実施例
に係る電子部品装置の断面図、第２図は他の実施例に係
る電子部品装置の断面図である。 第３図は従来例の断面図である。 １１・・・ファン（冷却風発生機構）、１４・・・回路
基板、１５・・・冷却風貫流孔、１６・・・電子部品。 なお、図中、同一符号は同一ないしは相当部分を示して
いる。1 and 2 relate to the present invention; FIG. 1 is a cross-sectional view of an electronic component device according to one embodiment, and FIG. 2 is a cross-sectional view of an electronic component device according to another embodiment. FIG. 3 is a sectional view of a conventional example. 11...Fan (cooling air generation mechanism), 14...Circuit board, 15...Cooling air flow hole, 16...Electronic component. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] （１）回路基板上に電子部品を搭載してなる電子部品装
置において、 冷却風発生機構と、 前記回路基板上における前記電子部品の搭載位置に設け
られた冷却風貫流孔と、 前記冷却風発生機構による冷却風を前記冷却風貫流孔に
導く導風路 とを具備したことを特徴とする電子部品装置。(1) An electronic component device in which electronic components are mounted on a circuit board, comprising: a cooling air generation mechanism; a cooling air flow hole provided at a mounting position of the electronic component on the circuit board; and the cooling air generation mechanism. An electronic component device comprising: an air guide path that guides cooling air from the mechanism to the cooling air passage hole.
JP63117368A 1988-05-13 1988-05-13 Electronic component apparatus Pending JPH01286498A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63117368A JPH01286498A (en) 1988-05-13 1988-05-13 Electronic component apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63117368A JPH01286498A (en) 1988-05-13 1988-05-13 Electronic component apparatus

Publications (1)

Publication Number Publication Date
JPH01286498A true JPH01286498A (en) 1989-11-17

Family

ID=14709932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63117368A Pending JPH01286498A (en) 1988-05-13 1988-05-13 Electronic component apparatus

Country Status (1)

Country Link
JP (1) JPH01286498A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2382932A (en) * 2001-12-05 2003-06-11 Semikron Ltd Apertured printed circuit board for cooling air flow
US7218517B2 (en) 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
GB2512409A (en) * 2013-03-28 2014-10-01 Control Tech Ltd Devices and methods for cooling components on a PCB
CN113692117A (en) * 2021-08-10 2021-11-23 维沃移动通信有限公司 Circuit board assembly and electronic equipment thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2382932A (en) * 2001-12-05 2003-06-11 Semikron Ltd Apertured printed circuit board for cooling air flow
GB2382932B (en) * 2001-12-05 2005-09-07 Semikron Ltd Air flow cooling control
US7218517B2 (en) 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
GB2512409A (en) * 2013-03-28 2014-10-01 Control Tech Ltd Devices and methods for cooling components on a PCB
GB2512409B (en) * 2013-03-28 2015-08-26 Control Tech Ltd Devices and methods for cooling components on a PCB
CN113692117A (en) * 2021-08-10 2021-11-23 维沃移动通信有限公司 Circuit board assembly and electronic equipment thereof

Similar Documents

Publication Publication Date Title
US9861005B2 (en) Cooling system for a hand-held electronic device
US5691883A (en) Multiple intake duct microprocessor cooling system
US7193846B1 (en) CPU fan assembly
JP2002217577A (en) Apparatus for cooling component
JPH11112177A (en) Cooling device for electronic equipment
JPH01286498A (en) Electronic component apparatus
JP3815559B2 (en) Electronic equipment
JP2002237178A (en) Disk array device
JP2001111275A (en) Electronic apparatus with reduced fan noise
JPH1197872A (en) Structure for cooling control device
JP2000059061A (en) Electronic equipment housing device and electric equipment housing case
JP3787987B2 (en) Inverter electrical parts of air conditioner
JPH06120386A (en) Method for cooling lsi and electronic circuit packaging
JPH10117079A (en) Fan-fitting structure for electronic apparatus
JPH0385796A (en) Cooling device for electronic equipment
JP2004014825A (en) Cooling mechanism of electronic equipment
JP4581310B2 (en) Control device
JP2000029559A5 (en) Expansion device
JP2758317B2 (en) Electronic device cooling structure
KR100200548B1 (en) Outdoors machine control box heat radiating structure of separation type airconditioner
JP2585021Y2 (en) Power supply board cooling structure
JPH04155164A (en) Cooling structure for electronic apparatus
JPH0946077A (en) Air-cooling equipment in cabinet
JPH09283960A (en) Rack structure for electronic equipment
JPH01191917A (en) Cooling structure for electronic equipment