JP2585021Y2 - Power supply board cooling structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for cooling a power supply board in an electronic device, and more particularly to a structure for forcibly cooling a power supply board provided in a housing by a fan.

[0002]

2. Description of the Related Art In electronic equipment such as a personal computer and a word processor, a housing for accommodating a power supply board inside the equipment in order to efficiently cool a power supply board and eliminate thermal influence on other components in the equipment. A body is provided, and an exhaust fan is attached to the housing to forcibly cool the power supply board.

FIGS. 3 and 4 are plan views showing a conventional power supply device 20. FIG. As shown in the figure, the housing 1 has an air inlet 5 formed on an end face 13 thereof and a side face 11.
Is provided with an exhaust fan 2. On the other hand, a column 4 is provided on the side surface 12 facing the side surface 11, and the substrate 3 is attached by the column 4.
Further, in another conventional example shown in FIG. 4, another suction port 51 is formed in the side surface 12, and is used to simultaneously cool other components arranged outside the suction port 51. Although power supply components are actually mounted on the surface of the substrate 3, they are omitted in the figure for easy understanding.

When the fan 2 is operated in the conventional power supply device 20, a linear airflow is generated as shown by an arrow in the figure, thereby cooling the substrate 3 and the power supply components on the substrate. As described above, in the related art, in order to increase the exhaust efficiency of the fan 2, the suction port 5 is arranged so that a linear airflow is generated as much as possible.

[0005]

In the example shown in FIG. 3, there is a problem that the air near the end B of the substrate 3 is not sufficiently cooled because the air flows straight from the suction port 5 toward the fan 2. there were. Further, if the heat generating components other than the power supply board 3, for example, the hard disk device are to be simultaneously cooled by the fan 2, it is necessary to arrange the hard disk device immediately before the suction port 5, so that the overall length becomes long, and This hindered miniaturization.

Therefore, as shown in FIG. 4, another suction port 51 is formed in the side surface 12 of the housing 1 and a hard disk device or the like is arranged outside the suction port 51 so that the device and the substrate 3 And was to be cooled at the same time. As a result, the size of the device could be reduced, but the cooling efficiency was reduced due to the split air flow, and there was a problem that the substrate 3 and other heat-generating components were not sufficiently cooled.

Further, it is most efficient to install other heat-generating components near the suction port, but there is a problem that the installation location of the components is restricted. Therefore, an object of the present invention is to provide a cooling structure for a power supply board in which the entire power supply board in a housing can be efficiently cooled, other heat-generating components can be cooled by one fan, and the arrangement of components is less restricted. And

[0008]

According to the present invention, there is provided a power supply device in which a power supply component is mounted on a substrate, the substrate is provided in a housing, and the housing is provided with an exhaust fan and an air inlet. The inside of the housing is divided into two parts by the board, and at this time, the part mounting surface side of the board is divided so as to be larger, and the housing facing the part mounting surface on the part mounting surface side The exhaust fan is provided on a side surface of the housing, while the suction port is provided on a side surface of the housing facing a surface opposite to a component mounting surface of the substrate, and the substrate is entirely between the housing and the housing. The gap is provided substantially uniformly over the circumference.

[0009]

[0010]

According to the present invention, the air in the housing is exhausted by the exhaust fan, so that the external air is sucked from the suction port. The sucked air spreads in all directions along the back surface of the substrate, flows through a space between the back surface of the substrate and the housing, and cools the substrate. Then, it flows through the gap between the end surface of the substrate and the housing, flows into the front surface side of the substrate, and cools the power supply components mounted on the substrate.

[0011]

FIG. 1 is a plan view showing a mounting structure of a power supply device 20 in a personal computer of the present embodiment, and FIG. 2 is a perspective view thereof. A partition 81 is provided inside the frame 80, and a cutout 82 is formed in the partition 81. The partition 81 divides the inside of the frame 80 into a first space 83 and a second space 84. An opening 85 is formed on a side surface of the frame 80. In addition, frame 8
A slit 86 for taking in air into the second space 84 is formed on the front surface of the second space 84.

The housing 1 of the power supply device 20 has a first space 83
It is a rectangular parallelepiped of approximately the same size as
An exhaust fan 2 is attached. In addition, a suction port 5 is formed on a side surface 12 facing the side surface 11, and columns 4 are provided at four corners. A power supply component 6 such as a transistor or a capacitor is mounted on the surface of the substrate 3.
Are attached to the substrate 3 at right angles. Then, the substrate 3 is fixed to the side surface 12 by the support 4,
A space 16 is formed. At this time, a substantially equal gap 15 is formed around the substrate 3 over the entire circumference with the housing 1.

When the housing 1 is installed in the first space, the fan 2 and the suction port 5 are connected to the opening 85 and the notch 82.
Are installed facing each other. Also, the second space 8
4, electric components other than the power supply device 20 are installed. A hard disk drive 90 that generates a particularly large amount of heat is provided along the partition wall 81 and immediately before the notch 82.

In the power supply device 20 configured as described above, when the fan 2 is operated, the air inside the housing 1 is discharged to the outside through the opening 85. Then, along with this, air is sucked into the second space 84 through the slit 86, and further, through the notch 82 and the suction port 5,
Is sucked into the housing 1 from the space 84. The sucked air spreads along the back surface of the substrate 3 and the space 1
6, the entire substrate 3 is cooled. Then, as shown by an arrow A, air flows into the front surface side of the substrate 3 through the gap 15. The flowing air flows on the surface of the heat radiating plate 7, so that the air is efficiently cooled.

Since the hard disk drive 90 is provided immediately outside the suction port 5, the substrate 3
The hard disk device 90 is simultaneously cooled by the fan 2. In addition, the air is sucked from the inlet 5 and the space 1
6, the air flowing toward the surface of the substrate 3 as shown by the arrow A has a substantially uniform flow over the entire circumference of the substrate 3 because the gap 15 is narrow. This is not affected by the position of the suction port 5, so that the position of the suction port 5 may be anywhere on the side surface 12 as long as the back surface of the substrate 3.

[0016]

According to the present invention, a uniform air flow is generated over the entire circumference of the power supply board, so that the entire power supply board can be uniformly cooled. In addition, the position of the suction port does not affect the flow of air, so that it may be provided anywhere, which increases the degree of freedom in design.

[0017]

[Brief description of the drawings]

FIG. 1 is a plan view showing a mounting structure of a power supply device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the power supply device according to the embodiment of the present invention;

FIG. 3 is a plan view showing an example of a conventional power supply device.

FIG. 4 is a plan view showing another example of a conventional power supply device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 Fan 3 Substrate 5 Suction port 7 Heat sink 20 Power supply device 80 Frame 85 Opening 90 Hard disk device

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hiroshi Sato 2-18-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (56) References JP-A-4-139897 (JP, A) JP-A 5-160591 (JP, A) Japanese Utility Model 1983-193694 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 7/20 G06F 1/20

Claims (1)

(57) [Scope of request for utility model registration] 1. A power supply device in which a power supply component is mounted on a substrate, the substrate is provided in a housing, and the housing is provided with an exhaust fan and an air intake port. Is divided into two parts. At this time, the side of the component mounting surface of the substrate is enlarged , and is extended all around the substrate.
So that a gap is formed substantially identically with the housing.
The exhaust fan is provided on a side surface of the housing facing the component mounting surface of the board and facing the component mounting surface, while the housing facing the surface of the housing opposite to the component mounting surface. A cooling structure for a power supply board, wherein the suction port is provided on a side surface of a body.