JPH05160591A - Cooling mechanism for stack type in-circuit emulator - Google Patents

Abstract

PURPOSE:To ensure a stable temperature environment by providing a fan unit having a cooling fan at the uppermost part of stacked cases, and connecting passages to be sequentially passing through upper and lower surfaces of a circuit board disposed therein when the cases are stacked. CONSTITUTION:An inlet 21e is connected to an outlet 22d, an inlet 22e is connected to an outlet 25d and an inlet 25e is connected to an outlet 24d of cases from above in a state that units are stacked, and passages 22c, 25c, 24c passing through the units are connected. Thus, when a small-sized axial-flow fan 21c is rotated, the air flows from a lower bottom cover 30 side into an inlet 24e in a direction of an arrow A, then passes through the passages 24c, 25c, 22c through the fan 21c and from an inlet 21d in a direction of an arrow B. Accordingly, provided circuit boards 24b, 25b, 22b are efficiently cooled from both side surfaces to ensure a stable temperature environment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling mechanism for a stack type in-circuit emulator in which an in-circuit emulator is housed as a single unit for each function in the same case, and these are combined to form a stacked structure. ..

[0002]

2. Description of the Related Art An in-circuit emulator has a function of monitoring a memory access of a microprocessor, detecting a trigger point or a break point, and stopping the operation of a target microprocessor or stopping a trace. It is used as a development support device.

[0003]

By the way, in recent years, even in-circuit emulators have been required to deal with high-speed processors with high reliability. For this reason, it is necessary to eliminate wiring delay. Therefore, it is common knowledge to arrange the emulation CPU on the tip side as close to the target side as possible. As a result, the interface condition with the target system is dramatically improved, but the timing on the side controlling the emulator becomes strict, so that it becomes necessary to bring the functional unit on the main body side as close as possible to the emulation CPU.

However, in the case where it is realized by the conventional structure, the main body side includes the power supply circuit, so that there is a limit to downsizing, and only truly necessary units can be selectively used. Because it wasn't configured, extra space could get in the way. Furthermore, since the circuit board that constitutes the functional unit is attached to and detached from the main body,
The operability was sometimes impaired.

On the other hand, the inventors of the present invention can easily select a system according to the application, downsize the functional unit so as to correspond to high speed, and improve operability for each function. We have proposed a unitized in-circuit emulator.

However, the circuit board of each functional unit is
Since it is configured to be housed in a case of the same size, it is necessary to ensure stable operation even with a heat generation problem.

Therefore, an object of the present invention is to provide a cooling mechanism for a stack type in-circuit emulator which can secure a stable temperature environment in an in-circuit emulator having a stack structure in which each function is unitized.

[0008]

In order to achieve the above object, the cooling mechanism of the stack type in-circuit emulator of the present invention accommodates a plurality of circuit boards in single and individual cases, and stacks these cases. In the stack type in-circuit emulator, a fan unit equipped with a cooling fan is provided on the uppermost part of the stacked cases, and when the cases are stacked, the circuit boards arranged inside each are The flow passages that sequentially pass through the upper and lower surfaces are connected.

[0009]

According to the present invention, since the fan for cooling the fan unit provided at the uppermost portion of the case causes the air to flow through the flow passages that sequentially pass through the upper and lower surfaces of the circuit board arranged inside, the air flows in the respective fan units. The circuit board is cooled from the upper and lower surfaces to ensure a stable temperature environment.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to an embodiment shown in the drawings. FIG. 2 is a perspective view illustrating the overall configuration of the in-circuit emulator according to the embodiment of the present invention.

In the figure, the in-circuit emulator 10 of this embodiment is connected to a host computer 11 by a cable 12, and a power supply device 13 for supplying power to each unit is connected by a cable 14. The power supply device 13 has a sufficient power supply capacity even when an optional unit is added in the future, and is formed in a compact shape that can be arranged anywhere. For example, an external distance of about 6 mm is provided between the power supply device 13 and the in-circuit emulator 10. Diameter and length are 1.
They are connected by a flexible round cable 14 of about 5M, and are configured to be remotely controlled by the power supply of the host computer 11. In addition, the in-circuit emulator 10 stores several typical functions necessary for its implementation in a single and individual case of the same size into a unit, and selectively combines and stacks these (stack). It is structured into a structure.

FIG. 3 is an exploded perspective view of the in-circuit emulator of the embodiment of the present invention. In this embodiment, the fan unit 21, the trace unit 22, the execution unit (probe unit) 23, and the emulation memory unit are arranged from the top. And 24. The execution unit 23 is separated into an analyzer bus on the upper side and an emulation memory bus on the lower side, and connected to the upper and lower units, respectively.

As described in detail later, the fan unit 21 is equipped with a cooling fan inside to cool all the units when the units are stacked and connected. A status LED for confirming the operating state of the system and an outlet for cooling air are provided on the upper surface. When the fan unit 21 is not connected, the power supply unit 13 is connected to all units.
It is designed so that power is not supplied from it.

The trace unit 22 is a unit having a function of storing the execution state of the emulation CPU in real time through the common bus of the execution unit 23, and is composed of a control gate array and a memory for highly functional storage. ing.

The execution unit 23 is a unit for controlling the execution of the CPU, and is the host computer 1.
1. A probe base unit 25 in which an interface circuit with an emulator-controlled host card (not shown), a pin status port of the CPU, a control switch port for control signals, an interface circuit with the trace unit 22, etc. And a probe tip portion 26 on which a control circuit such as a control gate array is mounted are connected by a flexible cable 27. Further, a connector (not shown) for connecting the cables 12 and 14 is provided on the end surface of the execution unit 23 on the side opposite to the flexible cable 27.

The emulation memory unit 24
Is a unit for emulating a memory, and is composed of a control circuit such as a memory mapper gate array and a bus swapper gate array, and a memory. This memory is, for example, high-speed SRAM (static RAM).
Is used, and the storage capacity from 256K to a maximum of 4MB can be selected.

On the upper surface and corresponding lower surface of each unit, connectors 28 for electrically connecting the upper and lower units to each other on both sides in the longitudinal direction, a detaching mechanism 29 for locking and separating the upper and lower units from each other, and A flow port for the cooling mechanism to be described is provided. The connector 28 is, for example, a half-pitch dual-row connector having 160-pole signal pins and terminals for power supply, and is a high-speed transmission connector with shield measures between the pin rows to prevent interference due to crosstalk. is there.

FIG. 1 is a sectional view illustrating a cooling mechanism of a stack type in-circuit emulator according to an embodiment of the present invention. In the figure, the in-circuit emulator 10
Is a fan unit 21 and a trace unit 2 from the top.
2, the probe base unit 25 of the execution unit 23,
The emulation memory units 24 are sequentially stacked and connected. Case 21 of the fan unit 21
On one side of a, a support plate 21b is provided with a small DC axial fan 21c, and the small axial fan 2c
A wind outlet 21d and an inlet 2 are provided at the upper and lower portions of 1c.
1e is formed. This small axial fan 21c
The air is rotated so as to flow from the inlet 21e toward the outlet 21d. A flow passage 22c is formed in the case 22a of the trace unit 22 from the lower side to the upper side of the circuit board 22b as a boundary, and the flow outlet 22d is formed in the case 22a corresponding to the flow inlet 21e. Is formed, and an inflow port 22e is formed in the case 22a below the outflow port 22d. Similarly, a flow passage 25c is formed inside the case 25a of the probe base unit 25 with the circuit board 25b as a boundary, and a flow outlet 25d and a flow inlet 25e are formed in the case 25a. Similarly, the emulation memory unit 24
In the case 24a, a flow passage 24c is formed with the circuit board 24b as a boundary, and the case 24a has a flow outlet 24c.
d and the inflow port 24e are formed. A bottom cover 30 is provided below the case 24a.

According to the cooling mechanism of the stack type in-circuit emulator having the above-mentioned structure, in the state where the units are stacked, the inlet port 2 between the upper part and the case respectively.
1e and the outflow port 22d, the inflow port 22e and the outflow port 25d, the inflow port 25e and the outflow port 24d are connected, and the flow paths 22c, 25c, and 24c that pass between the respective units are connected. Thus, when the small axial fan 21c rotates, air flows into the inflow port 24e from the lower bottom cover 30 side in the direction of arrow A, and then the flow passages 24c, 25.
c, 22c, small axial fan 21c, and outlet 2
It flows out from 1d in the direction of arrow B. Therefore, the flow passage 24
When passing through c, 25c, and 22c, the circuit boards 24b, 25b, and 22b provided respectively are efficiently cooled from both sides, and a stable temperature environment can be secured.

In the above embodiment, the trace unit 22, the execution unit 23, and the emulation memory unit 24 are stacked below the fan unit 21, but the present invention is not limited to this, and the flow passages having the same structure communicate with each other. You may add another unit which did so.

[0021]

As described above, according to the present invention, the fan for cooling the fan unit provided at the uppermost part of the case allows the flow path to sequentially pass through the upper and lower surfaces of the circuit board arranged inside. As a result, air flows, so that the respective circuit boards are cooled from the upper and lower surfaces, and a stable temperature environment can be secured.

[Brief description of drawings]

FIG. 1 is a sectional view illustrating a cooling mechanism of a stack type in-circuit emulator according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating the overall configuration of the in-circuit emulator according to the embodiment of the present invention.

FIG. 3 is an exploded perspective view of the in-circuit emulator according to the embodiment of the present invention.

[Explanation of symbols]

 10 In-Circuit Emulator 21 Fan Unit 21a Case 21c Small Axial Flow Fan 22 Trace Unit 22a Case 22b Circuit Board 22c Flow Path 23 Execution Unit (Probe Unit) 24 Emulation Memory Unit 24a Case 24b Circuit Board 24c Flow Path 25 Probe Base Unit 25a Case 25b Circuit board 25c Flow path 26 Probe tip 27 Flexible cable 28 Connector 29 Attachment / detachment mechanism

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromi Asama 6-2 Minamikurokawa, Aso-ku, Kawasaki-shi, Kanagawa Sofia Systems Microcomputer City Office

Claims (1)

[Claims] 1. A stack-type in-circuit emulator in which a plurality of circuit boards are housed in respective single and individual cases, and the cases are stacked, and a cooling fan is provided at the top of the stacked cases. When the fan units are provided and the cases are stacked, the cooling passages for the stack-type in-circuit emulator are characterized in that the flow passages that sequentially pass through the upper and lower surfaces of the circuit boards arranged inside are communicated with each other. ..