GB2382932A - Apertured printed circuit board for cooling air flow - Google Patents

Apertured printed circuit board for cooling air flow Download PDF

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Publication number
GB2382932A
GB2382932A GB0228207A GB0228207A GB2382932A GB 2382932 A GB2382932 A GB 2382932A GB 0228207 A GB0228207 A GB 0228207A GB 0228207 A GB0228207 A GB 0228207A GB 2382932 A GB2382932 A GB 2382932A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
air
flow
circuit board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0228207A
Other versions
GB2382932B (en
GB0228207D0 (en
Inventor
Paul Newman
Edward Stradling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Ltd
Original Assignee
Semikron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Ltd filed Critical Semikron Ltd
Publication of GB0228207D0 publication Critical patent/GB0228207D0/en
Publication of GB2382932A publication Critical patent/GB2382932A/en
Application granted granted Critical
Publication of GB2382932B publication Critical patent/GB2382932B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0272Adaptations for fluid transport, e.g. channels, holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A printed circuit board is provided with at least one hole 11,12,13 therethrough for the passage of cooling air. The PCB is particularly applicable to an installation in which boards are mounted in units (3, Fig 1) within a main housing (4), each unit having its own housing (6). The holes in the PCB are large enough to allow adequate air flow within the individual housing while still maintaining a back pressure to ensure that air flows to the other PCBs inthe installation.

Description

<Desc/Clms Page number 1>
AIR FLOW COOLING CONTROL This invention relates to arrangements for and apparatus for air flow cooling of apparatus that generates undesired heat during its usage.
It is a common present day practice to produce electric/electronic apparatus which incorporates a number of components operationally provided upon or in operational relation to printed circuit boards. Generally such printed circuit boards and the associated components are enclosed in an appropriate housing to prevent damage to the boards and the components. In practice the amount of heat is related to the current consumption of the components mounted to the board.
! Since heat is produced it follows that arrangements need to be provided to ensure that excessive or overheating does not occur even thought the apparatus may be operational for long periods of time.
In many cases particularly for a single piece of apparatus adequate cooling can be achieved by reason of the freedom by which air is able to circulate with respect to the printed circuit board and any components mounted thereupon. Such cooling can be aided by the provision of heat sinks specifically associated with those components that are prone to the generate of significant amounts of heat and thus very likely to result in overheating damage.
Whilst in the case of a single electrical/electronic unit, as suggested, adequate cooling can be adequately achieved it has been found that cooling difficulties can arise when the apparatus in question comprises two or more individual units each involving a printed circuit board and components mounted thereupon and as is usually the case each unit is contained in its own housing, with all of the individual units housed in a larger outer supporting rack and housing assembly.
<Desc/Clms Page number 2>
Such an arrangement can arise such as, for example, in relation to a complex lighting system switchboard arrangement in which for example some forty eight individual lights control units are rack mounted with each such individual unit involving a printed circuit board and associated components located within a local housing. In addition to the individual housings the rack and the individual light control units would be at least partially enclosed, particularly in those regions where electrical connections are made between the any equipment provided upon the rack to and the vanous light control units.
It has been found that the overall effect of the use of what is effectively a double housing arrangement is to restrict the flow of cooling air around the various light controls units and particularly within the housings of the latter. Furthermore, even in situations where arrangements are provided for producing a forced air flow through out the rack housing and these arrangements are of such nature as to intend to distribute a balanced supply of air to each of the individual unit the provision of printed circuit boards within the individual unit housings, in so far as the air flow is concerned, has been found effectively to act as a banner to air flow within the individual housings and as a result upsetting the balancing of air flows necessary to ensure adequate distribution of air through out the complete assembly and through each unit.
It is an object of the present invention to at least reduce the risk of insufficient air flow through the installation and individual units.
According to a first aspect of the invention there is provided a method of facilitating the cooling of printed circuit boards involved in an installation including a plurality of the individual electronic circuit units each including at least one printed circuit board, wherein the printed circuit boards are especially apertured to allow the passage of air there through thereby to prevent the printed
<Desc/Clms Page number 3>
circuit board acting as a total block to air flow from one side of the board to the other.
Preferably the areal size of the apertures in the printed circuit boards are so selected that the air flow through any one unit is such as to ensure the air flow relative to any one unit does not reduce the air pressure to an extent that air flows through other units becomes inadequate.
A further aspect of the invention provides a method of controlling a forced flow of air within an installation incorporating a main housing at least partially enclosing a plurality separate units each including a printed circuit board located within its own individual housing and each effectively acting as a barner to air flow of air through the associated individual housing, including the step of providing at least one aperture within the printed circuit board of such aril size as to allow adequate flow of air through the individual housing whilst at the same time maintaining a back pressure in the installation sufficient to ensure that the air pressure of the flow of air remains sufficient to flow through all of the other printed circuit boards included in the installation..
A further aspect of the invention provides apparatus for controlling a forced flow of air within an installation incorporating a main housing at least partially enclosing a plurality separate units each including a printed circuit board located within its own individual housing and each effectively acting as a barrier to air flow of air through the associated individual housing, including a printed circuit board having at least one aperture therein of such areal size as to allow adequate flow of air through the individual housing whilst at the same time maintaining a back pressure in the installation sufficient to ensure that the air pressure of the flow of air remains sufficient to flow through all of the other printed circuit boards included in the installation.
<Desc/Clms Page number 4>
According to a further aspect of the invention there is provided a printed circuit board including at least one aperture therein that is not associated with aperture required for receiving any element of electrical wiring, for mounting the board to a support or for mounting a component to the board any circuit arrangements provided upon the board, the aperture being of such dimentsions as to facilitate the flow of cooling air with respect to the printed circuit board.
For a better understanding of the invention and to show how to carry the same into effect reference will now be made to the accompanying drawings in which: Figure I is an oblique fragmentary view of an electrical/electronic installation including a plurality of rack mounted units within a housing; Figure 2 illustrates a first embodiment of a printed circuit board incorporating the concepts of the invention and; Figure 3 illustrates a second embodiment of a printed circuit board incorporating the concepts of the invention.
Referring now to Figure I the installation I shown therein includes a rack framing arrangement 2 mounting a plurality of rows and columns of individual electrical/electronic circuit units 3. In practice the units 3 can be of the plug-in type in that they are adapted to plug into associated electrical connections provided as part of the rack framing arrangement 2. In practice, at least this part of the arrangement 2 is totally enclosed by a housing 4, the latter being shown part cut away in the Figure 1. To provide for forced air cooling of the installation a fan unit 5 is associated with the housing 4. The air introduced by the fan unit 5 distributes throughout the interior of the housing.
<Desc/Clms Page number 5>
Each one of the individual units 3 is shown as including a rectangular block like housing 6. Each unit housing is provided with a number of openings 7 to allow air produced by the fan 5 to be introduced into the units. In the case of two of the units the housings are shown part cutaway to reveal the interior of the associated units. Each unit 3 incorporates a printed circuit board 8 which effectively divides the interior of the unit housing into two separate sections 9 and 10, of which the section 9 is in that part of the housing 6 having the apertures 7 whereby this part of the housing can receive the air being circulated by the fan unit 5. Whilst it might be possible for air to circulate through various apertures as a result of the design of the circuitry of the printed circuit board. This possibility is usually remote since any holes provided in a printed circuit board are normally intended to be location holes for receiving locating screws or connecting elements of components to be mounted to the boards. In practice any residual gaps/spaces offer very limited space for air flows. It will thus be apparent that by and large the board effectively acts as an effective barrier to air flows that are essential to the operational safety of the boards and any associated circuit components mounted thereupon To counteract this problem the printed circuit boards are especially apertured to provide openings 11,12 and 13, as is illustrated in the Figures 2 and 3. It should be mentioned that the remaining apertures depicted on the Figures 2 and 3 are those associated with the mounting of the board to its associated support apparatus/chassis and/or components or the like to be upon the printed circuit board and would in use be effectively closed against air flow there through.
The dimensional size and the number of the apertures such as apertures 11, 12 and 13 are such that the flow of air there through is effectively set to a level which is such that the air flow through any printed circuit board irrespective of the positioning of its associated unit is constrained to be at a flow rate that, whilst
<Desc/Clms Page number 6>
allowing an adequate air flow for cooling purposes, is of a magnitude which ensures that all of the units 3 are able to receive an adequate supply of air.
Referring in particular to the Figures 2 and 3 it will be noted that the dimensions of the apertures 11, 12, and 13 of Figure 2 differ from the corresponding apertures of Figure 3.
Whilst the Figures 2 and 3 illustrate differently dimensioned apertures it should be appreciated that in some installations it is possible to provide the same sized apertures Il, 12 and 13 for all of the printed circuit board units involved.
Furthermore, whilst the Figures 2 and 3 have illustrated the same number of apertures for the printed circuit boards the numbers of apertures provided can differ by providing printed circuit boards with more or less than three apertures Also the apertures can be other than rectangular or mixtures of different shapes,

Claims (16)

1. A method of facilitating the cooling of printed circuit boards involved in an installation including a plurality of the individual electronic circuit units each including at least one printed circuit board, wherein the printed circuit boards are especially apertured to allow the passage of air there through thereby to prevent the printed circuit board acting as a total block to air flow from one side of the board to the other.
2. A method as claimed in claim !, in which the areal size of the apertures in the printed circuit boards are so selected that the air flow through any one unit is such as to ensure the air flow relative to any one unit does not reduce the air pressure to an extent that air flows through other units becomes inadequate.
3. A method of controlling a forced flow of air within an installation incorporating a main housing at least partially enclosing a plurality separate units each including a printed circuit board located within its own individual housing and each effectively acting as a barrier to air flow of air through the associated individual housing, including the step of providing at least one aperture within the printed circuit board of such aril size as to allow adequate flow of air through the individual housing whilst at the same time maintaining a back pressure in theinstallation sufficient to ensure that the air pressure of the flow of air remains sufficient to flow through all of the other printed circuit boards included in the installation..
4. A method as claimed in claim 3, and in which at least two apertures presenting the a similar area to a flow of air.
<Desc/Clms Page number 8>
5. A method as claimed in claim 3, and in which differently dimensioned apertures are provided in the printed circuit board
6. A method as claimed in claim 4 or 5 and in which differently shaped apertures are provided in the printed circuit boards.
7. A method of controlling a forced flow of air within an installation incorporating a main housing at least partially enclosing a plurality separate units each including a printed circuit board located within its own individual housing and each effectively acting as a barrier to air flow of air through the associated individual housing, substantially as herein before described with reference to the accompanying drawings.
8. Apparatus for controlling a forced flow of air within an installation incorporating a main housing at least partially enclosing a plurality separate units each including a printed circuit board located within its own individual housing and each effectively acting as a barrier to air flow of air through the associated individual housing, including a printed circuit board having at least one aperture therein of such areal size as to allow adequate flow of air through the individual housing whilst at the same time maintaining a back pressure in the installation sufficient to ensure that the air pressure of the flow of air remains sufficient to flow through all of the other printed circuit boards Included in the installation.
9. An installation including at least one unit incorporating at least one printed circuit board, wherein at least selected ones of the printed circuit boards associated therewith include at least one aperture therein that is not associated with any apertures required for receiving any element of electrical wiring, for mounting the board to a support or for mounting a component to the board any circuit arrangements provided upon the board, the aperture being of such
<Desc/Clms Page number 9>
dimentsions as to facilitate the flow of cooling air with respect to the printed circuit board.
10. An installation as claimed in claim 9, and wherein the board includes at least two differently dimensioned apertures.
11. An installation board as claimed in claim 9, and wherein the board has at least two apertures of different dimensions and/or shapes.
12. An installation incorporating a method of controlling a forced flow of air within an installation incorporating a main housing at least partially enclosing a plurality separate units each including a printed circuit board located within its own individual housing and each effectively acting as a barrier to air flow of air through the associated individual housing substantially as herein before described with reference to the accompanying drawings.
13. A printed circuit board including at least one aperture therein that is not associated with aperture required for receiving any element of electrical wiring, for mounting the board to a support or for mounting a component to the board any circuit arrangements provided upon the board, the aperture being of such dimentsions as to facilitate the flow of cooling air with respect to the printed circuit board.
14. A printed circuit board as claimed in claim 13, and wherein the board includes at least two differently dimensioned apertures.
15. A printed circuit board as claimed in claim 13, and wherein the board has at least two apertures of different dimensions and/or shapes.
<Desc/Clms Page number 10>
16. A printed circuit board, constructed and arranged to operate substantially as herein before described with reference to the accompanying drawings.
GB0228207A 2001-12-05 2002-12-04 Air flow cooling control Expired - Fee Related GB2382932B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0129042A GB0129042D0 (en) 2001-12-05 2001-12-05 Air flow cooling control

Publications (3)

Publication Number Publication Date
GB0228207D0 GB0228207D0 (en) 2003-01-08
GB2382932A true GB2382932A (en) 2003-06-11
GB2382932B GB2382932B (en) 2005-09-07

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Family Applications (2)

Application Number Title Priority Date Filing Date
GB0129042A Ceased GB0129042D0 (en) 2001-12-05 2001-12-05 Air flow cooling control
GB0228207A Expired - Fee Related GB2382932B (en) 2001-12-05 2002-12-04 Air flow cooling control

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0129042A Ceased GB0129042D0 (en) 2001-12-05 2001-12-05 Air flow cooling control

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GB (2) GB0129042D0 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1564580A1 (en) * 2004-02-16 2005-08-17 Seiko Epson Corporation Optical projector
US7218517B2 (en) 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
GB2512409A (en) * 2013-03-28 2014-10-01 Control Tech Ltd Devices and methods for cooling components on a PCB
US9398682B2 (en) 2013-03-28 2016-07-19 Control Techniques Limited Devices and methods for cooling components on a PCB

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4399484A (en) * 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
JPH01286498A (en) * 1988-05-13 1989-11-17 Mitsubishi Electric Corp Electronic component apparatus
JPH02194598A (en) * 1989-01-23 1990-08-01 Hitachi Ltd Cooling structure for printed circuit board
JPH0918178A (en) * 1995-06-30 1997-01-17 Nec Corp Multichip module
JPH09199881A (en) * 1996-01-19 1997-07-31 Oki Electric Ind Co Ltd Fan unit for electronic equipment
JPH1187960A (en) * 1997-09-16 1999-03-30 Fujitsu Denso Ltd Heat sink mounting structure for electronic component
US6027535A (en) * 1996-02-27 2000-02-22 Metabowerke Gmbh & Co. Battery charger for power tools
JP2000174473A (en) * 1998-12-01 2000-06-23 Matsushita Electric Ind Co Ltd Enclosure structure of printed-circuit board
JP2001217578A (en) * 2000-02-02 2001-08-10 Sony Corp Electric apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4399484A (en) * 1981-03-10 1983-08-16 The United States Of America As Represented By The Secretary Of The Air Force Integral electric module and assembly jet cooling system
JPH01286498A (en) * 1988-05-13 1989-11-17 Mitsubishi Electric Corp Electronic component apparatus
JPH02194598A (en) * 1989-01-23 1990-08-01 Hitachi Ltd Cooling structure for printed circuit board
JPH0918178A (en) * 1995-06-30 1997-01-17 Nec Corp Multichip module
JPH09199881A (en) * 1996-01-19 1997-07-31 Oki Electric Ind Co Ltd Fan unit for electronic equipment
US6027535A (en) * 1996-02-27 2000-02-22 Metabowerke Gmbh & Co. Battery charger for power tools
JPH1187960A (en) * 1997-09-16 1999-03-30 Fujitsu Denso Ltd Heat sink mounting structure for electronic component
JP2000174473A (en) * 1998-12-01 2000-06-23 Matsushita Electric Ind Co Ltd Enclosure structure of printed-circuit board
JP2001217578A (en) * 2000-02-02 2001-08-10 Sony Corp Electric apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1564580A1 (en) * 2004-02-16 2005-08-17 Seiko Epson Corporation Optical projector
US7213925B2 (en) 2004-02-16 2007-05-08 Seiko Epson Corporation Optical modulator, optical device and projector
US7218517B2 (en) 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
GB2512409A (en) * 2013-03-28 2014-10-01 Control Tech Ltd Devices and methods for cooling components on a PCB
GB2512409B (en) * 2013-03-28 2015-08-26 Control Tech Ltd Devices and methods for cooling components on a PCB
US9398682B2 (en) 2013-03-28 2016-07-19 Control Techniques Limited Devices and methods for cooling components on a PCB

Also Published As

Publication number Publication date
GB0129042D0 (en) 2002-01-23
GB2382932B (en) 2005-09-07
GB0228207D0 (en) 2003-01-08

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20061204