JPH0946077A - Air-cooling equipment in cabinet - Google Patents

Air-cooling equipment in cabinet

Info

Publication number
JPH0946077A
JPH0946077A JP19033295A JP19033295A JPH0946077A JP H0946077 A JPH0946077 A JP H0946077A JP 19033295 A JP19033295 A JP 19033295A JP 19033295 A JP19033295 A JP 19033295A JP H0946077 A JPH0946077 A JP H0946077A
Authority
JP
Japan
Prior art keywords
air
heat source
chamber
housing
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19033295A
Other languages
Japanese (ja)
Inventor
Nobuhiro Horii
信裕 堀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP19033295A priority Critical patent/JPH0946077A/en
Publication of JPH0946077A publication Critical patent/JPH0946077A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide air-cooling equipment in a cabinet which can effectively reduce noise while restraining the dimensional increase of the cabinet. SOLUTION: A cabinet 1 is divided into a first heat source chamber 2, an air chamber 3, and a second heat source chamber 4. A suction fan 5 is installed between the first heat source chamber 2 and the air chamber 3. An exhaust fan 6 is installed between the air chamber 3 and the second heat source chamber 4. When an air flow is generated by operating the suction fan 5 and the exhaust fan 6, the air is introduced into the first heat source chamber 2 from a first vent hole 1a, passes the peripheral parts of circuit boards 7, and inhaled into the air chamber 3 through the suction fan 5. The air then is introduced into the second heat source chamber 4 from the air chamber 3 through the exhaust fan 6, passes the peripheral part of a power supply 9, and discharged from a second vent hole 1b. Thereby the respective circuit boards 7 and the power supply 9 are cooled.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、筐体に内蔵され
た複数の熱源、例えば各種の回路基板や電源等を空冷す
る筐体内の空冷装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air cooling device in a housing for air cooling a plurality of heat sources contained in the housing, such as various circuit boards and power supplies.

【0002】[0002]

【従来の技術】この種の空冷装置は、例えば電子装置を
内蔵する筐体に付設され、各種の回路基板や電源等の冷
却を行うものである。図4(a)及び(b)は、その一
例を側方及び上方から見て概略的に示している。ここで
は、複数の回路基板101、これらの回路基板101を
相互に接続するコネクタ基板102、及び電源103を
筐体104に内蔵し、この筐体104の壁に吸気ファン
105及び排気ファン106を取り付けている。この筐
体104においては、吸気ファン105から排気ファン
106に至る空気の流れが発生し、この空気の流れによ
って、各回路基板101や電源103等が冷却される。
2. Description of the Related Art An air-cooling device of this type is attached to, for example, a housing containing an electronic device to cool various circuit boards, power supplies and the like. 4 (a) and 4 (b) schematically show one example thereof as seen from the side and the upper side. Here, a plurality of circuit boards 101, a connector board 102 connecting these circuit boards 101 to each other, and a power source 103 are built in a housing 104, and an intake fan 105 and an exhaust fan 106 are attached to the wall of the housing 104. ing. In the housing 104, a flow of air is generated from the intake fan 105 to the exhaust fan 106, and the circuit board 101, the power supply 103, and the like are cooled by the flow of air.

【0003】このように筐体の壁に吸気ファンや排気フ
ァンを取り付けることが多く、これらのファンによって
空気の流れを発生させて、この筐体内の各熱源を冷却し
ていた。
As described above, the intake fan and the exhaust fan are often attached to the wall of the housing, and these fans generate a flow of air to cool each heat source in the housing.

【0004】ところが、筐体の壁にファンを取り付ける
場合は、このファンから発生する騒音が大きく、耳障り
であった。
However, when the fan is attached to the wall of the housing, the noise generated from the fan is loud and annoying.

【0005】このため、例えば図5に示すように吸気フ
ァン111及び排気ファン112を筐体113の内側に
移動させ、吸気ファン111と排気ファン112の間
に、複数の回路基板114、コネクタ基板115、及び
電源116等を配置した。この場合は、吸気ファン11
1及び排気ファン112の騒音が筐体の壁に直接響かな
いので、騒音を低減させることができる。
Therefore, as shown in FIG. 5, for example, the intake fan 111 and the exhaust fan 112 are moved to the inside of the casing 113, and a plurality of circuit boards 114 and connector boards 115 are provided between the intake fan 111 and the exhaust fan 112. , And a power supply 116 and the like. In this case, the intake fan 11
The noise of the exhaust fan 1 and the exhaust fan 112 does not directly resonate with the wall of the housing, so that the noise can be reduced.

【0006】しかしながら、吸気ファン111と筐体1
13の吸気口113aの間、及び排気ファン112と筐
体113の排気口113bの間に、何の部品も無けれ
ば、これらのファン111,112の騒音が筐体113
の外部に漏れ易く、大きな効果が得られなかった。ま
た、各ファン111,112と吸気口113a及び排気
口113bの間が無駄なスペースとなって、筐体113
の大型化を招くという欠点があった。
However, the intake fan 111 and the housing 1
If there are no components between the intake ports 113a of the fan 13 and between the exhaust fan 112 and the exhaust port 113b of the housing 113, the noises of these fans 111 and 112 will not be heard.
It was easy to leak to the outside and no great effect was obtained. In addition, a space is wasted between the fans 111 and 112 and the intake port 113a and the exhaust port 113b, so that the housing 113
However, there is a drawback that it leads to an increase in size.

【0007】このような欠点を解消するために、図6に
示すような筐体121内の配置構成が提案された。この
筐体121においては、ファン122を各回路基板12
3と電源124の間に配設しており、ファン122によ
って、空気を各回路基板123の周囲を通じて吸入する
とともに、空気を電源124の周囲を通じて排出する。
この場合は、ファン122の吸排気側に配置された各回
路基板123及び電源124によって、ファン122の
騒音がある程度遮断されるので、この騒音が外部に漏れ
難くなる。また、スペースを無駄に必要としないので、
筐体121の大型化を招かずに済む。
In order to eliminate such drawbacks, an arrangement configuration inside the casing 121 as shown in FIG. 6 has been proposed. In this case 121, the fan 122 is connected to each circuit board 12
3 and the power source 124, the fan 122 sucks air through the periphery of each circuit board 123 and discharges the air through the periphery of the power source 124.
In this case, the noise of the fan 122 is blocked to some extent by the circuit boards 123 and the power source 124 arranged on the intake / exhaust side of the fan 122, and this noise is less likely to leak to the outside. Also, because it doesn't waste space,
It is not necessary to increase the size of the housing 121.

【0008】また、ここでは、ファン122の吸気側に
各回路基板123を配置し、ファン122の排気側に電
源124を配置することにより、効果的な冷却を行って
いる。つまり、各回路基板123上には、熱源となる集
積回路や抵抗等の素子が散在し、これらの素子の熱が広
く分散している。この広い範囲を冷却するには、ファン
122の吸気による分散した空気の流れを利用するのが
良い。また、電源124には、パワートランジスタやト
ランス等の発熱し易い部品が集中的に配置され、これら
の部品の熱が一部分に集中している。この一部分を冷却
するには、ファン122の排気側の空気を吹き付けるの
が良い。
Further, here, each circuit board 123 is arranged on the intake side of the fan 122, and the power source 124 is arranged on the exhaust side of the fan 122, thereby performing effective cooling. That is, elements such as integrated circuits and resistors serving as heat sources are scattered on each circuit board 123, and the heat of these elements is widely dispersed. In order to cool this wide range, it is preferable to utilize the dispersed air flow by the intake air of the fan 122. Further, in the power supply 124, components that easily generate heat, such as a power transistor and a transformer, are arranged intensively, and the heat of these components is concentrated in a part. To cool this part, it is preferable to blow air on the exhaust side of the fan 122.

【0009】しかしながら、図6に示す配置構成では、
ファン122の吸気側及び排気側に、各回路基板123
及び電源124を配置するので、吸排気側共に空気抵抗
が大きく、空気が速やかに流れない。これに対処するに
は、ファン122を大型化して、風量を増加させるしか
なく、この結果として、騒音の低減を達成することが難
しくなった。
However, in the arrangement shown in FIG.
Each circuit board 123 is provided on the intake side and the exhaust side of the fan 122.
Since the power supply 124 is provided, the air resistance is large on both the intake and exhaust sides, and the air does not flow quickly. In order to deal with this, the fan 122 must be increased in size to increase the air volume, and as a result, it has become difficult to achieve noise reduction.

【0010】[0010]

【発明が解決しようとする課題】このように上記従来の
各空冷装置では、騒音が大きかったり、騒音を小さくす
る工夫をしても、騒音を効果的に低減させることができ
なかったり、筐体の大型化を招いた。
As described above, in each of the conventional air-cooling devices described above, the noise is large, or even if the noise is reduced, the noise cannot be effectively reduced, Led to an increase in size.

【0011】そこで、この発明の課題は、筐体の大型化
を抑えつつ、騒音を効果的に低減することが可能な筐体
内の空冷装置を提供することにある。
Therefore, an object of the present invention is to provide an air-cooling device in a housing which can effectively reduce noise while suppressing an increase in the size of the housing.

【0012】[0012]

【課題を解決するための手段】上記課題を解決するため
に、この発明の筐体内の空冷装置においては、筐体は、
各熱源を別々に内蔵する複数の熱源室と、これらの熱源
室の間に介在する少なくとも1つの空気室と、この空気
室と該空気室に隣接する各熱源室間に配設された吸気フ
ァン及び排気ファンとを備え、空気室の吸気ファン及び
排気ファンによって、空気を該筐体内に吸入して、この
空気を各熱源室と空気室に交互に通過させ、この空気を
該筐体から排出する。
In order to solve the above-mentioned problems, in the air-cooling device in the housing of the present invention, the housing is
A plurality of heat source chambers containing the respective heat sources separately, at least one air chamber interposed between these heat source chambers, and an intake fan arranged between the air chambers and each heat source chamber adjacent to the air chambers. And an exhaust fan, and sucks air into the housing by an intake fan and an exhaust fan for the air chamber, passes the air alternately through the heat source chambers and the air chamber, and discharges the air from the housing. To do.

【0013】すなわち、空気は、1つの熱源室を通じて
吸気ファンによって吸入され、空気室に至る。そして、
この空気室の空気は、排気ファンによって、他の1つの
熱源室を通じて外部に排出される。
That is, the air is drawn into the air chamber by the intake fan through one heat source chamber. And
The air in the air chamber is discharged to the outside through the other heat source chamber by the exhaust fan.

【0014】ここで、吸気ファンは、1つの熱源室を通
じて空気を吸入するので、この吸気ファンには、この熱
源室の空気抵抗に基づく負荷が加わる。また、排気ファ
ンは、他の1つの熱源室を通じて空気を排出するので、
この排気ファンには、この他の熱源室の空気抵抗に基づ
く負荷が加わる。したがって、吸気ファン及び排気ファ
ンは、各熱源室の空気抵抗に基づくそれぞれの負荷を分
担する。また、各熱源室の間に介在する空気室は、空気
の流れの緩衝部となり、空気抵抗を軽減する。このた
め、これらのファンとして小型のものを適用することが
でき、これらのファンから発生する騒音を低く抑えるこ
とができる。
Since the intake fan draws in air through one heat source chamber, a load based on the air resistance of the heat source chamber is applied to this intake fan. Further, since the exhaust fan discharges air through the other heat source chamber,
A load based on the air resistance of the other heat source chamber is applied to the exhaust fan. Therefore, the intake fan and the exhaust fan share respective loads based on the air resistance of the heat source chambers. In addition, the air chamber interposed between the heat source chambers serves as a buffer for the flow of air to reduce air resistance. Therefore, small fans can be applied as these fans, and the noise generated from these fans can be suppressed to a low level.

【0015】また、吸気ファン及び排気ファンの騒音
は、それぞれの熱源室を通って外部に漏れるが、これら
の熱源室を通るときに低減される。
Further, noises of the intake fan and the exhaust fan leak to the outside through the respective heat source chambers, but are reduced when passing through these heat source chambers.

【0016】このように吸気ファン及び排気ファンとし
て小型のものを適用し、これらのファンから発生する騒
音を各熱源室によって低減するので、筐体外部に漏れる
騒音を十分に低く抑えることができる。
As described above, small intake fans and exhaust fans are applied, and the noise generated from these fans is reduced by each heat source chamber, so that the noise leaking to the outside of the housing can be suppressed sufficiently low.

【0017】また、空気室には、外部に通じる微小な通
気孔を形成しても構わない。この微小な通気孔は、吸気
ファン及び排気ファンの騒音を外部に殆ど漏らさずに、
吸気ファン及び排気ファンによる空気の吸排気を速やか
にする。
Further, minute vent holes communicating with the outside may be formed in the air chamber. This minute air vent hardly leaks the noise of the intake fan and the exhaust fan to the outside,
Makes intake and exhaust of air by the intake and exhaust fans quick.

【0018】さらに、吸気ファン及び排気ファンを一体
化し、吸気ファン及び排気ファンを着脱自在に取り付け
ても良い。この場合は、吸気ファン及び排気ファンの保
守点検が容易になる。
Further, the intake fan and the exhaust fan may be integrated, and the intake fan and the exhaust fan may be detachably attached. In this case, maintenance and inspection of the intake fan and the exhaust fan becomes easy.

【0019】例えば筐体に電子装置を内蔵する場合は、
各熱源が回路基板及び電源であり、これらの回路基板及
び電源をそれぞれの熱源室に内蔵することとなる。
For example, when the electronic device is built in the housing,
Each heat source is a circuit board and a power supply, and these circuit boards and power supplies are built in each heat source chamber.

【0020】また、空気室を筐体の1つの壁に沿って設
け、第1及び第2熱源室を並べて該空気室に隣接させ、
空気室と第1熱源室間に吸気ファンを配設するととも
に、空気室と第2熱源室間に排気ファンを配設し、吸気
ファン及び排気ファンによって、空気を該筐体内に吸入
して、この空気を第1熱源室、空気室、及び第2熱源室
という順序で循環させ、この空気を該筐体から排出す
る。
Further, an air chamber is provided along one wall of the housing, and the first and second heat source chambers are arranged side by side and adjacent to the air chamber,
An intake fan is provided between the air chamber and the first heat source chamber, an exhaust fan is provided between the air chamber and the second heat source chamber, and the intake fan and the exhaust fan draw air into the housing, This air is circulated in the order of the first heat source chamber, the air chamber, and the second heat source chamber, and this air is discharged from the housing.

【0021】このような構成においては、第1及び第2
熱源室を並設し、これらの熱源室を空気室に重ね合わせ
るので、筐体が纏まり易く、この筐体の設置スペースの
節減を図ることができる。
In such a configuration, the first and second
Since the heat source chambers are arranged side by side and these heat source chambers are superposed on the air chamber, the housing can be easily assembled, and the installation space of this housing can be reduced.

【0022】例えば第1熱源室に回路基板を内蔵し、第
2熱源室に電源を内蔵すれば、回路基板の分散した熱を
吸気ファン側の分散した空気の流れによって冷却し、電
源の集中した熱を排気ファンの空気の吹き付けによって
冷却することができ、効果的な冷却を行うことができ
る。
For example, if a circuit board is built in the first heat source chamber and a power source is built in the second heat source chamber, the dispersed heat of the circuit board is cooled by the dispersed air flow on the intake fan side to concentrate the power source. The heat can be cooled by blowing air from the exhaust fan, and effective cooling can be performed.

【0023】[0023]

【発明の実施の形態】以下、この発明の実施の形態を添
付図面を参照して説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings.

【0024】図1は、この発明の筐体内の空冷装置を実
施した第1形態を概略的に示している。同図(a)は、
側方から見て示し、同図(b)は、上方から見て示す。
FIG. 1 schematically shows a first embodiment in which the air-cooling device in the housing of the present invention is implemented. The figure (a) is
The figure is viewed from the side, and the figure (b) is viewed from above.

【0025】この空冷装置は、筐体1に内蔵されている
電子装置を空冷するものである。この筐体1は、第1熱
源室2、空気室3、及び第2熱源室4に分割されてお
り、第1熱源室2と空気室3の間に吸気ファン5を設
け、空気室3と第2熱源室4の間に排気ファン6を設け
ている。
The air-cooling device is for cooling the electronic device built in the housing 1. The housing 1 is divided into a first heat source chamber 2, an air chamber 3, and a second heat source chamber 4, and an intake fan 5 is provided between the first heat source chamber 2 and the air chamber 3 to separate the air chamber 3 from the air chamber 3. An exhaust fan 6 is provided between the second heat source chambers 4.

【0026】第1熱源室2には、複数の回路基板7、及
びコネクタ基板8が内蔵されており、各回路基板7をコ
ネクタ基板8に着脱自在に取り付け、これらの回路基板
7をコネクタ基板8を介して相互に接続している。ま
た、第2熱源室4には、各回路基板7に電力を供給する
電源9が内蔵されている。
A plurality of circuit boards 7 and a connector board 8 are built in the first heat source chamber 2. Each circuit board 7 is detachably attached to the connector board 8, and these circuit boards 7 are attached to the connector board 8. Are connected to each other via. Further, the second heat source chamber 4 has a built-in power source 9 for supplying electric power to each circuit board 7.

【0027】なお、吸気ファン5及び排気ファン6を空
気室3と一体化して、空気室3を筐体1に着脱自在に取
り付ける構造が好ましく、これにより吸気ファン5及び
排気ファン6の保守管理が容易になる。
It is preferable that the intake fan 5 and the exhaust fan 6 are integrated with the air chamber 3 and the air chamber 3 is detachably attached to the housing 1. This allows maintenance of the intake fan 5 and the exhaust fan 6. It will be easier.

【0028】さて、吸気ファン5及び排気ファン6を作
動させて、空気の流れを発生させると、空気は、筐体1
の第1通気口1aから第1熱源室2内に導入され、各回
路基板7の周囲を通過し、吸気ファン5を通じて空気室
3に吸入される。そして、この空気は、空気室3から排
気ファン6を通じて第2熱源室4に導入され、電源9の
周囲を通過し、第2通気口1bから排出される。これに
より、各回路基板7及び電源9が冷却される。
Now, when the intake fan 5 and the exhaust fan 6 are operated to generate a flow of air, the air flows into the housing 1.
Is introduced into the first heat source chamber 2 through the first ventilation port 1a, passes around each circuit board 7, and is sucked into the air chamber 3 through the intake fan 5. Then, this air is introduced into the second heat source chamber 4 from the air chamber 3 through the exhaust fan 6, passes around the power source 9, and is discharged from the second ventilation port 1b. As a result, each circuit board 7 and the power supply 9 are cooled.

【0029】ここでは、各回路基板7の分散した熱を吸
気ファン5の吸気側の分散した空気の流れによって冷却
し、電源9の集中した熱を排気ファン6の空気の吹き付
けによって冷却し、これにより冷却を効果的に行ってい
る。
Here, the dispersed heat of each circuit board 7 is cooled by the dispersed air flow on the intake side of the intake fan 5, and the concentrated heat of the power source 9 is cooled by the air blow of the exhaust fan 6, To effectively cool down.

【0030】このような構成において、空気室3の容量
が十分に大きければ、この空気室3が緩衝部となって、
空気抵抗が軽減され、吸気ファン5及び排気ファン6に
対するそれぞれの負担が軽くなる。あるいは、空気室3
の容量が小さくても、この空気室3に微小な通気孔を形
成すれば、吸気ファン5及び排気ファン6の負担が軽く
なる。また、第1通気口1aから空気室3まで空気を流
す役目、及び空気室3から第2通気口1bまで空気を流
す役目を吸気ファン5及び排気ファン6に分担すること
によっても、吸気ファン5及び排気ファン6の負担が軽
くなる。このため、吸気ファン5及び排気ファン6とし
て小型のものを適用することができ、これらのファン
5,6の騒音を抑えることができる。
In such a structure, if the capacity of the air chamber 3 is sufficiently large, the air chamber 3 serves as a buffer,
The air resistance is reduced, and the load on the intake fan 5 and the exhaust fan 6 is lightened. Alternatively, the air chamber 3
Even if the capacity is small, if the minute vent holes are formed in the air chamber 3, the load on the intake fan 5 and the exhaust fan 6 can be lightened. In addition, the intake fan 5 and the exhaust fan 6 can also share the role of flowing air from the first ventilation port 1a to the air chamber 3 and the function of flowing air from the air chamber 3 to the second ventilation port 1b. Also, the load on the exhaust fan 6 is reduced. Therefore, small-sized intake fans 5 and exhaust fans 6 can be applied, and noise of these fans 5, 6 can be suppressed.

【0031】また、吸気ファン5の騒音は、第1熱源室
2を通って外部に漏れるが、この第1熱源室2内の各回
路基板7及びコネクタ基板8によって、この吸気ファン
5の騒音がある程度遮断される。同様に、第2熱源室3
内の電源9によって、排気ファン6の騒音がある程度遮
断される。
Further, although the noise of the intake fan 5 leaks to the outside through the first heat source chamber 2, the noise of the intake fan 5 is caused by each circuit board 7 and the connector substrate 8 in the first heat source chamber 2. To some extent blocked. Similarly, the second heat source chamber 3
The internal power source 9 shuts off the noise of the exhaust fan 6 to some extent.

【0032】このように吸気ファン5及び排気ファン6
として小型のものを適用して、それらの騒音を抑え、こ
れらの騒音を各回路基板7及びコネクタ基板8や、電源
9によってある程度遮断するので、この筐体1から漏れ
る騒音を極めて低く抑えることができる。
In this way, the intake fan 5 and the exhaust fan 6
As such, a small one is applied to suppress these noises, and these noises are cut off to some extent by the circuit board 7, the connector board 8 and the power supply 9, so that the noise leaking from the housing 1 can be suppressed to an extremely low level. it can.

【0033】図2(a),(b)は、この発明の筐体内
の空冷装置を実施した第2形態を概略的に示している。
なお、同図において、図1の装置と同様の作用を果たす
部位には同じ符号を付している。
2 (a) and 2 (b) schematically show a second embodiment in which the air-cooling device in the housing of the present invention is implemented.
Note that, in the figure, the same reference numerals are given to the portions that perform the same operations as those of the device in FIG.

【0034】この実施形態の空冷装置では、空気室11
を筐体12の底に沿って設け、第1熱源室13及び第2
熱源室14を並べて空気室11に重ね合せ、空気室11
と第1熱源室13の間に吸気ファン5を配設し、空気室
11と第2熱源室14の間に排気ファン6を配設してい
る。
In the air cooling device of this embodiment, the air chamber 11
Is provided along the bottom of the housing 12, and the first heat source chamber 13 and the second heat source chamber 13 are provided.
The heat source chambers 14 are arranged side by side and superposed on the air chamber 11,
The intake fan 5 is arranged between the first heat source chamber 13 and the first heat source chamber 13, and the exhaust fan 6 is arranged between the air chamber 11 and the second heat source chamber 14.

【0035】第1熱源室13には、複数の回路基板7、
及びコネクタ基板8が内蔵されている。各回路基板7
は、垂直に立てられた状態で、コネクタ基板8に接続さ
れている。コネクタ基板8は、第1及び第2熱源室1
3,14の間の隔壁を兼ねている。第2熱源室14に
は、電源9が図1とは異なる姿勢で配置されている。
In the first heat source chamber 13, a plurality of circuit boards 7,
Also, the connector board 8 is built in. Each circuit board 7
Are connected to the connector board 8 in a vertically standing state. The connector board 8 includes the first and second heat source chambers 1.
It also serves as a partition wall between 3 and 14. The power source 9 is arranged in the second heat source chamber 14 in a posture different from that in FIG. 1.

【0036】また、空気室11の壁には、微小な通気孔
11aが形成されている。この通気孔11aは、吸気フ
ァン5及び排気ファン6の騒音を外部に殆ど漏らさず
に、空気を空気室11に吸入したり排出する。これによ
り、吸気ファン5及び排気ファン6の送風量の差が補償
され、これらのファン5,6による速やかなる吸排気が
可能となる。なお、通気孔11aの代わりに、細いスリ
ットを空気室11の壁に形成しても構わない。
A minute vent hole 11a is formed in the wall of the air chamber 11. The ventilation hole 11a sucks or discharges air into the air chamber 11 while hardly leaking noise of the intake fan 5 and the exhaust fan 6 to the outside. As a result, the difference in the amount of air blown between the intake fan 5 and the exhaust fan 6 is compensated for, and quick intake and exhaust by these fans 5 and 6 are possible. A thin slit may be formed in the wall of the air chamber 11 instead of the ventilation hole 11a.

【0037】このような構成において、吸気ファン5及
び排気ファン6を作動させると、空気は、筐体12の第
1通気口12a→第1熱源室13→吸気ファン5→空気
室11→排気ファン6→第2熱源室14→筐体12の第
2通気口12bという経路で通過し、その途中で各回路
基板7及び電源9を冷却する。
In such a structure, when the intake fan 5 and the exhaust fan 6 are operated, the air flows from the first ventilation port 12a of the housing 12 to the first heat source chamber 13 to the intake fan 5 to the air chamber 11 to the exhaust fan. 6 → Second heat source chamber 14 → Passes through the path of the second ventilation port 12b of the housing 12, and cools each circuit board 7 and the power supply 9 in the middle thereof.

【0038】このように筐体12の底に空気室11を設
け、第1熱源室13及び第2熱源室14を並べて空気室
11に重ね合せた構造の場合は、筐体12の設置スペー
スが小さくて済む。
In the case where the air chamber 11 is provided at the bottom of the casing 12 and the first heat source chamber 13 and the second heat source chamber 14 are arranged side by side and superposed on the air chamber 11 as described above, the installation space of the casing 12 is small. It can be small.

【0039】ここで、図1の筐体1の寸法と、図2の筐
体12の寸法を比較する。この比較のために、各回路基
板7の寸法(縦×横×高さ)をA×B×Cとし、空気室
3(及び空気室11)の幅をDとし、電源9の寸法(縦
×横×高さ)をE×F×Gとする。ただし、一般的に
は、各回路基板7の方が電源9よりも大きく、A>E、
B>F、C>Gである。
Here, the dimensions of the housing 1 of FIG. 1 and the dimensions of the housing 12 of FIG. 2 are compared. For this comparison, the dimensions (length × width × height) of each circuit board 7 are A × B × C, the width of the air chamber 3 (and the air chamber 11) is D, and the dimensions of the power supply 9 (length × length). The width × height) is defined as E × F × G. However, in general, each circuit board 7 is larger than the power source 9, and A> E,
B> F and C> G.

【0040】この場合、筐体1の最小の寸法(縦×横×
高さ)は、(A+D+E)×B×Cとなる。これに対
し、筐体12の最小の寸法(縦×横×高さ)は、(B+
G)×C×(A+D)となる。したがって、筐体12
は、高くなるものの、その縦幅を短くし易い。このた
め、筐体12の方が、設置スペースの節減を図り易い。
In this case, the minimum size of the housing 1 (length x width x
The height is (A + D + E) × B × C. On the other hand, the minimum size (length x width x height) of the housing 12 is (B +
G) × C × (A + D). Therefore, the housing 12
Is high, but it is easy to shorten its vertical width. Therefore, the housing 12 is easier to save the installation space.

【0041】なお、この発明は、上記各実施形態に限定
されるものでなく、多様な変形が可能である。例えば、
1つの空気室に3つ以上の熱源室を隣接させて、空気室
と各熱源室の間に3つ以上のファンを設け、空気を循環
させることができる。あるいは、複数の空気室を3つ以
上の熱源室の間に介在させ、各空気室と各熱源室の間に
それぞれのファンを配設し、空気を各空気室と各熱源室
に交互に通過させても構わない。さらに、空気室と熱源
室の間に、複数の吸気ファン、または複数の排気ファン
を並設しても良い。また、空気室のスペースに部品を適
宜に配置しても構わない。さらに、熱源は、回路基板や
電源だけでなく、他の種類のものであっても良い。
The present invention is not limited to the above-mentioned embodiments, and various modifications can be made. For example,
It is possible to circulate air by providing three or more heat source chambers adjacent to one air chamber and providing three or more fans between the air chambers and each heat source chamber. Alternatively, a plurality of air chambers are interposed between three or more heat source chambers, fans are arranged between the air chambers and the heat source chambers, and air is alternately passed through the air chambers and the heat source chambers. I don't mind. Further, a plurality of intake fans or a plurality of exhaust fans may be installed in parallel between the air chamber and the heat source chamber. Further, the components may be appropriately arranged in the space of the air chamber. Further, the heat source is not limited to the circuit board and the power source, but may be another type.

【0042】[0042]

【実施例】図3は、この発明の筐体内の空冷装置の一実
施例を示している。同図に示す筐体31の底には、空気
室32が設けられており、この空気室32の上に、第1
及び第2熱源室33,34を並設している。空気室32
の壁には、スリット群32aを形成している。第1熱源
室33には、複数の回路基板35を垂直に立てて挿入
し、これらの回路基板35をコネクタ基板36に接続す
る。また、第2熱源室34には、1組の電源37,38
を内蔵している。空気室32と第1熱源室33の間に
は、3つの吸気ファン39が配設され、空気室32と第
2熱源室34の間には、2つの排気ファン40が配設さ
れている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 3 shows an embodiment of the air cooling device in the housing of the present invention. An air chamber 32 is provided at the bottom of the casing 31 shown in FIG.
The second heat source chambers 33 and 34 are arranged side by side. Air chamber 32
A slit group 32a is formed on the wall of the. A plurality of circuit boards 35 are vertically set and inserted into the first heat source chamber 33, and the circuit boards 35 are connected to the connector board 36. Further, in the second heat source chamber 34, a pair of power sources 37, 38
Built-in. Three intake fans 39 are arranged between the air chamber 32 and the first heat source chamber 33, and two exhaust fans 40 are arranged between the air chamber 32 and the second heat source chamber 34.

【0043】空気は、筐体31の第1スリット群31a
から第1熱源室33内に導入され、各回路基板35の周
囲を通過し、各吸気ファン39を通じて空気室32に吸
入される。そして、この空気は、空気室32から各排気
ファン40を通じて第2熱源室34に導入され、各電源
37,38の周囲を通過し、筐体31の第2スリット群
31bから排出される。
Air is the first slit group 31a of the housing 31.
Is introduced into the first heat source chamber 33, passes around each circuit board 35, and is sucked into the air chamber 32 through each intake fan 39. Then, this air is introduced into the second heat source chamber 34 from the air chamber 32 through each exhaust fan 40, passes around the power sources 37 and 38, and is discharged from the second slit group 31b of the housing 31.

【0044】[0044]

【効果】以上説明したように、この発明の空冷装置は、
吸気ファン及び排気ファンとして小型のものを適用する
ことができ、これらのファンによって発生される騒音を
各熱源室によってある程度遮断するので、筐体外部に漏
れる騒音を十分に低く抑えることができる。また、無駄
な空間が少なく、空気室を筐体の底に配せば、筐体の設
置スペースが増大することも無い。
As described above, the air cooling device of the present invention is
Small-sized intake and exhaust fans can be applied, and the noise generated by these fans is blocked to some extent by each heat source chamber, so that the noise leaking to the outside of the housing can be suppressed sufficiently low. In addition, there is little wasted space, and by disposing the air chamber at the bottom of the housing, the installation space of the housing does not increase.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1(a)は、この発明の筐体内の空冷装置を
実施した第1形態を概略的に示す側面図、図1(b)
は、この第1形態を概略的に示す平面図
FIG. 1 (a) is a side view schematically showing a first embodiment in which an air cooling device in a housing of the present invention is implemented, FIG. 1 (b).
Is a plan view schematically showing the first embodiment.

【図2】図2(a)は、この発明の筐体内の空冷装置を
実施した第2形態を概略的に示す側面図、図2(b)
は、この第2形態を概略的に示す平面図
FIG. 2 (a) is a side view schematically showing a second embodiment in which the air-cooling device in the housing of the present invention is implemented, FIG. 2 (b).
Is a plan view schematically showing the second mode.

【図3】この発明の筐体内の空冷装置の一実施例を示す
斜視図
FIG. 3 is a perspective view showing an embodiment of an air cooling device in the housing of the present invention.

【図4】図4(a)は、従来の空冷装置の一例を概略的
に示す側面図、図4(b)は、この従来例を概略的に示
す平面図
FIG. 4 (a) is a side view schematically showing an example of a conventional air cooling device, and FIG. 4 (b) is a plan view schematically showing this conventional example.

【図5】従来の空冷装置の他の例を概略的に示す平面図FIG. 5 is a plan view schematically showing another example of a conventional air cooling device.

【図6】従来の空冷装置の別の例を概略的に示す側面図FIG. 6 is a side view schematically showing another example of the conventional air cooling device.

【符号の説明】[Explanation of symbols]

1,12 筐体 2,13 第1熱源室 3,11 空気室 4,14 第2熱源室 5 吸気ファン 6 排気ファン 7 回路基板 8 コネクタ基板 9 電源 1, 12 Housing 2, 13 First heat source chamber 3, 11 Air chamber 4, 14 Second heat source chamber 5 Intake fan 6 Exhaust fan 7 Circuit board 8 Connector board 9 Power supply

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 筐体に内蔵された複数の熱源を空冷する
筐体内の空冷装置において、 筐体は、各熱源を別々に内蔵する複数の熱源室と、これ
らの熱源室の間に介在する少なくとも1つの空気室と、
この空気室と該空気室に隣接する各熱源室間に配設され
た吸気ファン及び排気ファンとを備え、 空気室の吸気ファン及び排気ファンによって、空気を該
筐体内に吸入して、この空気を各熱源室と空気室に交互
に通過させ、この空気を該筐体から排出する筐体内の空
冷装置。
1. In an air-cooling device in a housing for air-cooling a plurality of heat sources contained in the housing, the housing is provided between a plurality of heat source chambers in which each heat source is separately housed and between these heat source chambers. At least one air chamber,
The air chamber is provided with an intake fan and an exhaust fan arranged between the heat source chambers adjacent to the air chamber, and the air is sucked into the housing by the intake fan and the exhaust fan of the air chamber. The air-cooling device in the housing for alternately passing the heat source chamber and the air chamber and discharging the air from the housing.
【請求項2】 空気室には、外部に通じる微小な通気孔
を形成してなる請求項1に記載の筐体内の空冷装置。
2. The air-cooling device in the housing according to claim 1, wherein the air chamber is formed with minute air vents communicating with the outside.
【請求項3】 空気室の吸気ファン及び排気ファンを一
体化し、吸気ファン及び排気ファンを着脱自在に取り付
けてなる請求項1に記載の筐体内の空冷装置。
3. The air cooling device in the housing according to claim 1, wherein the intake fan and the exhaust fan of the air chamber are integrated, and the intake fan and the exhaust fan are detachably attached.
【請求項4】 筐体は、電子装置を内蔵しており、各熱
源が回路基板及び電源である請求項1乃至3のうちのい
ずれかに記載の筐体内の空冷装置。
4. The air cooling device in the housing according to claim 1, wherein the housing contains an electronic device, and each heat source is a circuit board and a power supply.
【請求項5】 空気室を筐体の1つの壁に沿って設け、
第1及び第2熱源室を並べて該空気室に隣接させ、空気
室と第1熱源室間に吸気ファンを配設するとともに、空
気室と第2熱源室間に排気ファンを配設し、 吸気ファン及び排気ファンによって、空気を該筐体内に
吸入して、この空気を第1熱源室、空気室、及び第2熱
源室という順序で循環させ、この空気を該筐体から排出
する請求項1乃至3のうちのいずれかに記載の筐体内の
空冷装置。
5. An air chamber is provided along one wall of the housing,
The first and second heat source chambers are arranged side by side adjacent to the air chamber, an intake fan is disposed between the air chamber and the first heat source chamber, and an exhaust fan is disposed between the air chamber and the second heat source chamber. A fan and an exhaust fan draw in air into the housing, circulate the air in the order of the first heat source chamber, the air chamber, and the second heat source chamber, and discharge the air from the housing. 4. The air cooling device in the housing according to any one of 3 to 3.
【請求項6】 第1熱源室には、回路基板を内蔵し、第
2熱源室には、電源を内蔵してなる請求項5に記載の筐
体内の空冷装置。
6. The air-cooling device in the housing according to claim 5, wherein the first heat source chamber has a built-in circuit board, and the second heat source chamber has a built-in power source.
JP19033295A 1995-07-26 1995-07-26 Air-cooling equipment in cabinet Pending JPH0946077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19033295A JPH0946077A (en) 1995-07-26 1995-07-26 Air-cooling equipment in cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19033295A JPH0946077A (en) 1995-07-26 1995-07-26 Air-cooling equipment in cabinet

Publications (1)

Publication Number Publication Date
JPH0946077A true JPH0946077A (en) 1997-02-14

Family

ID=16256436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19033295A Pending JPH0946077A (en) 1995-07-26 1995-07-26 Air-cooling equipment in cabinet

Country Status (1)

Country Link
JP (1) JPH0946077A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140970A (en) * 1997-07-17 1999-02-12 Yaesu Musen Co Ltd Cooling method for electronic device
JP2011196671A (en) * 2010-02-24 2011-10-06 Takenaka Komuten Co Ltd High-load air conditioning system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1140970A (en) * 1997-07-17 1999-02-12 Yaesu Musen Co Ltd Cooling method for electronic device
JP2011196671A (en) * 2010-02-24 2011-10-06 Takenaka Komuten Co Ltd High-load air conditioning system

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