TWI796122B - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- TWI796122B TWI796122B TW111103489A TW111103489A TWI796122B TW I796122 B TWI796122 B TW I796122B TW 111103489 A TW111103489 A TW 111103489A TW 111103489 A TW111103489 A TW 111103489A TW I796122 B TWI796122 B TW I796122B
- Authority
- TW
- Taiwan
- Prior art keywords
- air inlet
- casing
- electronic device
- accommodating area
- area
- Prior art date
Links
Images
Landscapes
- Measuring Volume Flow (AREA)
- Surgical Instruments (AREA)
- Valve Device For Special Equipments (AREA)
- Noodles (AREA)
Abstract
Description
本發明係關於一種電子裝置,特別係關於一種具有進風口與出風口的電子裝置。 The present invention relates to an electronic device, in particular to an electronic device with an air inlet and an air outlet.
一般來說,電子裝置內所容置的一些電子元件等(例如中央處理器),會於運轉時產生熱能。為了避免熱能累積而使電子元件本身及裝置內部環境提升至過高的工作溫度,大多數的電子裝置搭配有散熱系統。已知氣冷(air cooling)是最普遍的散熱手段之一,其係利用空氣作為媒介來冷卻需要冷卻的物體。在一些情況中,氣冷散熱系統中還可引進風扇來製造或加強空氣流動,從而達到強化冷卻的效果。 Generally speaking, some electronic components and the like contained in the electronic device (such as a central processing unit) will generate heat energy during operation. In order to prevent the accumulation of heat energy from increasing the operating temperature of the electronic components themselves and the internal environment of the device to an excessively high temperature, most electronic devices are equipped with a heat dissipation system. It is known that air cooling is one of the most common heat dissipation methods, which uses air as a medium to cool objects to be cooled. In some cases, fans can also be introduced into the air-cooling heat dissipation system to create or enhance air flow, so as to achieve the effect of enhanced cooling.
同時,隨著電子產品朝向小體積且更高效能的市場趨勢,所搭配的散熱系統還需要能夠在越來越緊湊的空間內有效地冷卻產生更高熱能的電子元件。以超微型電腦為例來說,由於超微型電腦的體積小,其機殼內的配置非常緊湊,有些區域的電子元件容易受到相鄰的構件(如電路板)的阻隔而無法獲得散熱氣流,在此情況下,系統一般的做法是提高風扇轉速,以藉由提高對氣流所及之熱源的散熱的方式,間接地去影響氣流路徑無法觸及之區域內的溫度,可是這種做法不僅成效有限,風扇高轉速下還會產生噪音的問題。在中央處理器高效運轉時,系統會更進一步提高風扇轉速,使得風扇噪音的問題變得更加嚴重。 At the same time, with the market trend of electronic products moving towards smaller size and higher performance, the matching heat dissipation system also needs to be able to effectively cool electronic components that generate higher heat energy in an increasingly compact space. Taking ultra-microcomputers as an example, due to the small size of ultra-microcomputers, the configuration in the casing is very compact, and the electronic components in some areas are easily blocked by adjacent components (such as circuit boards) and cannot obtain cooling airflow. In this case, the general method of the system is to increase the fan speed to indirectly affect the temperature in the area that the airflow path cannot reach by improving the heat dissipation of the heat source that the airflow path reaches, but this method is not only limited , There will be noise problems at high fan speeds. When the CPU is running efficiently, the system will further increase the fan speed, making the problem of fan noise more serious.
有鑑於此,本發明之其中一目的在於提供一種電子裝置,其透過產生特殊的氣流分布來有效地解決前述傳統散熱手段所產生的相關問 題。 In view of this, one of the objectives of the present invention is to provide an electronic device that effectively solves the related problems caused by the above-mentioned traditional heat dissipation methods by generating a special airflow distribution. question.
根據本發明之一些實施例提供了一種電子裝置,其包括一殼體、一電路板以及一氣流產生器。殼體具有一容置空間、一第一進風口及一出風口,第一進風口與出風口連通於容置空間且分別位於殼體的相對兩側,電路板位於容置空間並將容置空間區分為一第一容置區及一第二容置區,第一進風口對應於第一容置區與第二容置區,而出風口對應於第一容置區,氣流產生器位於第一容置區,殼體還具有一第二進風口,第二進風口連通容置空間並對應於第二容置區。 According to some embodiments of the present invention, an electronic device is provided, which includes a casing, a circuit board, and an airflow generator. The housing has an accommodating space, a first air inlet and an air outlet, the first air inlet and the air outlet communicate with the accommodating space and are respectively located on opposite sides of the housing, the circuit board is located in the accommodating space and will accommodate The space area is divided into a first accommodating area and a second accommodating area, the first air inlet corresponds to the first accommodating area and the second accommodating area, and the air outlet corresponds to the first accommodating area, and the airflow generator is located In the first accommodating area, the housing also has a second air inlet, which communicates with the accommodating space and corresponds to the second accommodating area.
根據本發明前述實施例所揭露電子裝置,由於第一進風口對應於第一與第二容置區、出風口對應於第一容置區、且殼體還具有對應第二容置區的第二進風口,藉此,在第一容置區的氣流產生器可經由第一進風口吸入外部空氣而在第一容置區中所產生的氣體流動會使第一容置區與第二容置區產生壓力差,從而驅使外部空氣從連通於第二容置區之第二進風口進入第二容置區,藉此,擺放於第一與第二容置區中之電子元件均可獲得散熱氣流,從而,氣流產生器可無需採用傳統藉由提高轉速以間接影響氣流無法觸及之區域的溫度的手段,從而能在較低噪音的運轉模式下,同時有效地對不同區域的電子元件進行散熱。 According to the electronic device disclosed in the foregoing embodiments of the present invention, since the first air inlet corresponds to the first and second accommodating areas, the air outlet corresponds to the first accommodating area, and the casing also has a first accommodating area corresponding to the second accommodating area. Two air inlets, whereby the airflow generator in the first accommodating area can inhale external air through the first air inlet, and the gas flow generated in the first accommodating area will make the first accommodating area and the second accommodating area The storage area generates a pressure difference, thereby driving the external air to enter the second storage area from the second air inlet connected to the second storage area, whereby the electronic components placed in the first and second storage areas can be Obtain cooling airflow, so that the airflow generator does not need to use the traditional method of increasing the speed to indirectly affect the temperature of the area that the airflow cannot reach, so that it can effectively control the electronic components in different areas at the same time in the lower noise operation mode To dissipate heat.
以上之關於本發明揭露內容之說明及以下之實施方式之說明,係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the disclosure of the present invention and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.
1,1’,1”:電子裝置 1,1’,1”: electronic device
10:殼體 10: Housing
11:第一殼件 11: First shell piece
12,12’,12”:第二殼件 12,12’,12”: the second shell
20:電路板 20: circuit board
30:氣流產生器 30: Airflow generator
41:第一電子元件 41: The first electronic component
42:第二電子元件 42: Second electronic component
43:第三電子元件 43: The third electronic component
111:第一側板部 111: the first side plate part
112:第二側板部 112: Second side plate part
121:第二進風口 121: Second air inlet
122:連接埠開口 122: port opening
1110:第一進風口 1110: The first air inlet
1120:出風口 1120: air outlet
S:容置空間 S: storage space
A1:第一容置區 A1: The first holding area
A2:第二容置區 A2: Second storage area
A3:側流道 A3: Side channel
D1:距離 D1: distance
D2:距離 D2: distance
F:氣流 F: Airflow
H:高度 H: height
圖1係為依據本發明之一實施例之電子裝置的立體示意圖。 FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present invention.
圖2係為圖1之電子裝置的分解示意圖。 FIG. 2 is an exploded schematic view of the electronic device in FIG. 1 .
圖3係為沿圖1之線3-3的側剖示意圖。 Fig. 3 is a schematic side sectional view along line 3-3 of Fig. 1 .
圖4~6係為圖1之電子裝置於不同視角的示意圖。 4-6 are schematic diagrams of the electronic device in FIG. 1 at different viewing angles.
圖7係為依據本發明之另一實施例之電子裝置的側視示意圖。 FIG. 7 is a schematic side view of an electronic device according to another embodiment of the present invention.
圖8係為依據本發明之另一實施例之電子裝置的側剖示意圖。 FIG. 8 is a schematic side sectional view of an electronic device according to another embodiment of the present invention.
以下,將搭配附圖所示之一些與其他實施例對本發明各方面提供足夠詳細的描述,使本領域具有通常知識者能夠透徹理解本發明並據以實施。但應當理解地,以下的描述並不旨在將本發明限定為某些特定的實施例。相反地,其旨在涵蓋由申請專利範圍所界定之各種實施例的精神和範圍的替換物、修飾及等同物。此外,為達到便於理解與觀看等目的,附圖中的各種特徵可能非按實際比例繪製。 Hereinafter, various aspects of the present invention will be described in sufficient detail with some and other embodiments shown in the accompanying drawings, so that those skilled in the art can thoroughly understand and implement the present invention. However, it should be understood that the following description is not intended to limit the present invention to some specific embodiments. On the contrary, it is intended to cover alternatives, modifications, and equivalents within the spirit and scope of the various embodiments as defined by the claims. In addition, for purposes of understanding and viewing, various features in the drawings may not be drawn to actual scale.
下文中可能使用如「實質上」、「約」及「大致上」等用語,以用於描述所修飾之情況或事件可能存在的合理或可接受的偏差量,但仍可達到所預期的結果。下文中也可能使用「至少一」來描述被描述物的數量,但除非另有明確說明,其不應僅限於數量為「僅有一」的情況。下文中也可能使用「及/或」的用語,其應被理解為包括所列出項目中之任一者及一或多者之所有組合。下文也可能使用「銜接」、「連接」、「設置」、「固定」、「組裝」等關於多個被描述物之相對位置關係的用語,但除非另有明確說明,其不應僅限於被描述物以直接而無中間媒介的方式「連接」、「設置」、「固定」或「組裝」於另一被描述物,而可理解為被描述物之間可包括一或多個中間媒介的情況。下文中還可能使用如「連通」等用語來描述兩個空間、區域、槽、通道及/或開口之間的關係,若無特別聲明,「連通」於下文中特別是指空氣等流體可流動於所描述物之間。 Words such as "substantially", "about" and "substantially" may be used in the following text to describe the reasonable or acceptable amount of deviation that may exist in the modified situation or event, but the expected result can still be achieved . Hereinafter, "at least one" may also be used to describe the quantity of the described object, but unless otherwise explicitly stated, it should not be limited to the situation where the quantity is "only one". The term "and/or" may also be used below, which should be understood as including any one and all combinations of one or more of the listed items. Terms such as "connection", "connection", "installation", "fixation", "assembly" and other relative positional relationships of multiple described objects may also be used below, but unless otherwise expressly stated, they should not be limited to the A descriptive object is "connected," "set," "fixed," or "assembled" with another descriptive object directly and without intermediary, and it can be understood that one or more intermediaries may be included between the descriptive objects Condition. Hereinafter, terms such as "communication" may also be used to describe the relationship between two spaces, regions, grooves, passages and/or openings. Unless otherwise specified, "communication" in the following especially refers to the flow of fluids such as air. between the described.
請參閱圖1~2,本發明之一實施例提出了一種電子裝置1,其可包括一殼體10。所述殼體10可作為電子裝置1的外觀殼件,並用於容置相關的電子/非電子構件。具體來看,殼體10可包括一第一殼件11以及一第二殼件12,第一殼件11可以但不限於為一端具有向外開通之開口
的盒狀物體,第二殼件12可以但不限於略呈板狀,且第二殼件12可利用任何合適方式可拆卸地組裝於第一殼件11並覆蓋第一殼件11對外開通的開口。舉例來說,第二殼件12可直接卡合於第一殼件11或利用螺絲、螺栓等鎖附構件組裝於第一殼件11,但本發明並非以第一殼件11與第二殼件12的組裝方式為限。
Referring to FIGS. 1-2 , an embodiment of the present invention provides an
進一步地,請接續圖1~2進一步參閱圖3~6,以更具體地了解與第一殼件11及第二殼件12相關的內容。如圖所示,第一殼件11與第二殼件12相組裝後可共同定義或圍繞出一容置空間S,前述之相關的電子/非電子構件可均被容置於所述容置空間S中。舉例來說,於本實施例中,電子裝置1還可包括一電路板20,電路板20可配置於容置空間S中。進一步來看,電路板20可位於第一殼件11所圍繞的區域中,並將容置空間S大致上區分為一第一容置區A1以及一第二容置區A2,藉以利於將容置空間S內除了電路板20以外的其他電子/非電子構件進行空間上的分配。
Further, please refer to FIGS. 3-6 following FIGS. 1-2 to understand the content related to the
舉例來說,如圖所示,本實施例之電子裝置1還可包括一第一電子元件41以及一第二電子元件42。第一電子元件41例如為一中央處理器,但本發明並非以此為限;例如於其他實施例中,第一電子元件41也可為其他類型的電子元件。第一電子元件41可設置於電路板20上並被配置於第一容置區A1中。第二電子元件42例如為一硬碟。舉例來說,第二電子元件42可例如為適用於M.2連接器的固態儲存裝置,但本發明並非以此為限;例如於其他實施例中,第二電子元件42也可為其他類型的電子元件。第二電子元件42可設置於電路板20之另一側並被配置於第二容置區A2。也就是說,第一電子元件41與第二電子元件42可分別位於電路板20的相對兩側而分別位於電路板20所劃分的不同區域中。並且,為了在第一電子元件41與第二電子元件42被電路板20劃分在不同區域的同時,兼顧第一電子元件41與第二電子元件42的散熱,電子裝置1所採用的散熱機制具有特殊的設計。
For example, as shown in the figure, the
詳細來說,已知中央處理器的運轉會產生大量熱能而影響其自身及周圍其他構件的運轉效能,因此,在第一電子元件41為中央處理器的情境中,電子裝置1還可包括一氣流產生器30,氣流產生器30配置於第一容置區A1,且第一電子元件41介於電路板20與氣流產生器30之間。所述氣流產生器30可例如是任何合適的徑流式風扇(radial fan),藉以在第一容置區A1內產生氣體流動,相應於此,殼體10在其相對兩側分別設有進風口與出風口,藉以確保由氣流產生器30所產生的氣流能涵蓋第一電子元件41與第二電子元件42。更詳細的說明如下。
In detail, it is known that the operation of the central processing unit will generate a large amount of heat energy and affect the operating performance of itself and other surrounding components. Therefore, in the situation where the first
於本實施例中,第一殼件11可包括一第一側板部111以及一第二側板部112。第一側板部111與第二側板部112分別位於第一殼件11的相異側。舉例來說,第一側板部111與第二側板部112可彼此相對而分別位於第一殼件11的相對兩側。並且,第一側板部111具有連通於容置空間S的至少一第一進風口1110,第二側板部112具有連通於容置空間S的至少一出風口1120。第一進風口1110可以但不限於是沿一特定方向相間隔排列的穿孔,但本發明並非圖示之第一進風口1110的數量與形式為限;例如於其他實施例中,第一側板部之第一進風口的數量與形式均可依據實際需求進行調整與修飾。出風口1120可以但不限於是沿一特定方向相間隔排列的穿孔,但本發明並非圖示之出風口1120的數量與形式為限;例如於其他實施例中,第二側板部之出風口的數量與形式均可依據實際需求進行調整與修飾。
In this embodiment, the
第一進風口1110與出風口1120分別位於第一殼件11的相對兩側(或者說,殼體10的相對兩側)。藉此,氣流產生器30可經由第一進風口1110將外部空氣吸入容置空間S之第一容置區A1,從而在第一容置區A1內產生自第一進風口1110往出風口1120排出於外的氣體流動(如圖所示之氣流F),進而將第一電子元件41所產生的熱能帶走,達到有效降溫第一電子元件41以維持或提升第一電子元件41的運轉效能的效果。
The
更進一步來看,在第一進風口1110對應於第一容置區A1內之氣流產生器30的同時,第一進風口1110還同時對應於第二容置區A2。如圖所示,第一進風口1110相對遠離第二殼件12之一側與第一殼件11相對遠離第二殼件12之一側間隔一距離(如圖所示之距離D1),使得較大部分的第一進風口1110對應於第二容置區A2,但局部的第一進風口1110也同時對應於第一容置區A1,因此,容置空間S之第一容置區A1與第二容置區A2均可經由第一進風口1110與外部空間保持氣體連通。但需聲明的是,所述之距離D1(或者說,第一進風口1110於第一側板部111上的位置與大小)可以依據實際需求進行調整,本發明並非以圖示內容為限。
Furthermore, while the
另一方面,出風口1120相對靠近第二殼件12之一側與第一殼件11相對靠近第二殼件12之一側間隔一距離(如圖所示之距離D2),但出風口1120僅對應於第一容置區A1而未涵蓋第二容置區A2。舉例來說,於一些實施例中,出風口1120可未直接連通於第二容置區A2,此配置有助於提升第一容置區A1內之散熱氣流的流速。但需聲明的是,所述之距離D2(或者說,出風口1120於第二側板部112上的位置與大小)可以依據實際需求進行調整,本發明並非以圖示內容為限。
On the other hand, the side of the
此外,電路板20之端緣與第一殼件11之第一側板部111相間隔開,從而與第一側板部111之間定義出可連通第一容置區A1與第二容置區A2的一側流道A3,藉此,通過第一進風口1110而進入第一容置區A1的氣流可透過側流道A3而連帶影響第二容置區A2的氣體流動。
In addition, the end edge of the
另外,為了確保進入第一容置區A1的氣流對第二容置區A2的影響能涵蓋到第二電子元件42,第二殼件12具有連通於第二容置區A2的至少一第二進風口121。第二進風口121可以但不限於是網孔,但本發明並非圖示之第二進風口121的數量與形式為限;例如於其他實施例中,第二殼件之第二進風口的數量與形式均可依據實際需求進行調整與修
飾。所述第二進風口121可位於第二殼件12鄰近於第一側板部111之第一進風口1110的一側,或者說,第一進風口1110與第二進風口121可分別位於第二容置區A2的相鄰兩側。並且,第二進風口121可對應於第二電子元件42。藉此,氣流產生器30經由第一進風口1110吸入外部空氣的過程中,在第一容置區A1中所產生的氣體流動會使第一容置區A1與第二容置區A2產生壓力差,從而驅使外部空氣從連通於第二容置區A2之第二進風口121進入第二容置區A2而通過第二電子元件42,進而帶走第二電子元件42所累積的熱能,達到有效降溫第二電子元件42的效果。
In addition, in order to ensure that the influence of the airflow entering the first accommodating area A1 on the second accommodating area A2 can cover the second
藉由第一進風口1110、第二進風口121與出風口1120的前述配置,第一容置區A1中之第一電子元件41與第二容置區A2中之第二電子元件42均可獲得散熱氣流,藉此,氣流產生器30可無需採用傳統藉由提高轉速以間接影響氣流無法觸及之區域的溫度的手段,從而能在較低噪音的運轉模式下,同時有效地對不同區域的電子元件進行散熱。
With the aforementioned arrangement of the
不僅如此,第一進風口1110、第二進風口121與出風口1120的前述配置可使氣流產生器30在電路板20所劃分之第二容置區A2產生散熱氣流,還有助於散熱第二殼件12所承載的電子元件。具體來說,於本實施例中,電子裝置1之第二殼件12於外觀上可具有一高度H,或者說,第二殼件12內可定義或圍繞出具有特定深度的空間,以適於容納至少一第三電子元件43。所述第三電子元件43可例如為一硬碟。舉例來說,第三電子元件43可例如為適用於M.2連接器的固態儲存裝置,但本發明並非以此為限;例如於其他實施例中,第三電子元件43也可為其他類型的電子元件。此外,第二殼件12所承載的第三電子元件43可為一個2.5吋內接式硬碟,但本發明並非以此為限;例如於其他實施例中,第二殼件12也可承載二個或以上的第三電子元件43,例如可為兩個M.2連接器的固態儲存裝置。
Not only that, the aforementioned arrangement of the
由於第二殼件12為可拆卸式設計,因此第二殼件12可依據
使用者的需求拆卸而替換或增設所需的第三電子元件43,從而使電子裝置1得以進行所需的功能擴充。同時,由於氣流產生器30在第二容置區A2可產生散熱氣流,因此第三電子元件43運轉所產生的熱能也可隨著散熱氣流帶往第一容置區A1,從而經由出風口1120一併排出於外,因此還可在使電子裝置1具備功能擴充能力的同時,兼顧所擴充之電子元件的散熱需求。
Since the
於此需聲明的是,前述第二殼件12及其所承載之電子元件(即第三電子元件43)僅為示意之用,本發明並非以前述實施例所繪示之內容為限。舉例來說,請參閱圖7,本發明之另一實施例提出了一種電子裝置1’,其與前述實施例之電子裝置的差異僅在於其第二殼件12’,因此以下僅針對第二殼件12’的部分進行說明。如圖所示,基於第二殼件12’內所承載之電子元件的類型,第二殼件12’上可開設有至少一連接埠開口122,藉以使所承載之電子元件的連接埠(未標號)能經由連接埠開口122暴露於外。
It should be noted here that the aforementioned
或者,於一些其他實施例之第二殼件上也可未承載任何電子元件。舉例來說,請參閱圖8,本發明之另一實施例提出了一種電子裝置1”,其與前述實施例之電子裝置的差異僅在於其第二殼件12”,因此以下僅針對第二殼件12”的部分進行說明。如圖所示,第二殼件12”內可無需承載任何電子元件而可呈現較為平坦的板狀。
Alternatively, in some other embodiments, no electronic components may be carried on the second casing. For example, please refer to Fig. 8, another embodiment of the present invention proposes an
根據本發明前述實施例所揭露的電子裝置,由於第一進風口對應於第一與第二容置區、出風口對應於第一容置區、且殼體還具有對應第二容置區的第二進風口,藉此,在第一容置區的氣流產生器可經由第一進風口吸入外部空氣而在第一容置區中所產生的氣體流動會使第一容置區與第二容置區產生壓力差,從而驅使外部空氣從連通於第二容置區之第二進風口進入第二容置區,藉此,擺放於第一與第二容置區中之電子元件均可獲得散熱氣流,從而,氣流產生器可無需採用傳統藉由提高轉速以間接 影響氣流無法觸及之區域的溫度的手段,從而能在較低噪音的運轉模式下,同時有效地對不同區域的電子元件進行散熱。 According to the electronic device disclosed in the foregoing embodiments of the present invention, since the first air inlet corresponds to the first and second accommodating areas, the air outlet corresponds to the first accommodating area, and the casing also has an opening corresponding to the second accommodating area. The second air inlet, whereby the airflow generator in the first accommodation area can suck in external air through the first air inlet, and the gas flow generated in the first accommodation area will make the first accommodation area and the second The accommodating area generates a pressure difference, thereby driving the external air to enter the second accommodating area from the second air inlet connected to the second accommodating area, whereby the electronic components placed in the first and second accommodating areas are equally The heat dissipation airflow can be obtained, thus, the airflow generator can not use the traditional method of indirect by increasing the rotation speed A means to affect the temperature of areas that cannot be reached by the airflow, so that the electronic components in different areas can be effectively dissipated at the same time in a low-noise operation mode.
不僅如此,由於第一進風口、第二進風口與出風口的前述配置可使氣流產生器在電路板所劃分之第二容置區產生散熱氣流,因而可產生將電子元件設置於第二殼件的應用,在加上第二殼件為可拆卸式設計,因此第二殼件可依據使用者的需求拆卸而替換或增設所需的電子元件,從而使電子裝置得以在具備功能擴充能力的同時,兼顧所擴充之電子元件的散熱需求。 Not only that, due to the aforementioned arrangement of the first air inlet, the second air inlet and the air outlet, the airflow generator can generate heat dissipation airflow in the second accommodating area divided by the circuit board, so that the electronic components can be arranged in the second housing. The application of components, plus the second shell is a detachable design, so the second shell can be disassembled according to the user's needs to replace or add the required electronic components, so that the electronic device can be expanded in the function At the same time, the heat dissipation requirements of the expanded electronic components are taken into consideration.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍所為之更動與潤飾,均屬於本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。 Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Changes and modifications made without departing from the spirit and scope of the present invention all belong to the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.
1:電子裝置 1: Electronic device
10:殼體 10: Housing
11:第一殼件 11: First shell piece
12:第二殼件 12: The second shell
121:第二進風口 121: Second air inlet
1110:第一進風口 1110: The first air inlet
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111103489A TWI796122B (en) | 2022-01-27 | 2022-01-27 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111103489A TWI796122B (en) | 2022-01-27 | 2022-01-27 | Electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI796122B true TWI796122B (en) | 2023-03-11 |
TW202331111A TW202331111A (en) | 2023-08-01 |
Family
ID=86692339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111103489A TWI796122B (en) | 2022-01-27 | 2022-01-27 | Electronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI796122B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060120043A1 (en) * | 2004-12-07 | 2006-06-08 | International Business Machines Corp. | Cooling apparatus for vertically stacked printed circuit boards |
CN203675125U (en) * | 2014-01-17 | 2014-06-25 | 博信通信股份有限公司 | 4G-based Multi-service digital distributed access system outdoor far-end unit |
-
2022
- 2022-01-27 TW TW111103489A patent/TWI796122B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060120043A1 (en) * | 2004-12-07 | 2006-06-08 | International Business Machines Corp. | Cooling apparatus for vertically stacked printed circuit boards |
CN203675125U (en) * | 2014-01-17 | 2014-06-25 | 博信通信股份有限公司 | 4G-based Multi-service digital distributed access system outdoor far-end unit |
Also Published As
Publication number | Publication date |
---|---|
TW202331111A (en) | 2023-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7255532B2 (en) | Bi-directional blowers for cooling computers | |
US5440450A (en) | Housing cooling system | |
JP5314481B2 (en) | Electronics | |
TWI763256B (en) | Heat dissipation system of portable electronic device | |
US7236360B2 (en) | Tower PC configuration | |
US7286357B2 (en) | Computer system with cooling device for CPU | |
JP2007047998A (en) | Electronic component cooling structure and information processor | |
JP2000188492A (en) | Hybrid air cooler and electrical component having it | |
US20070041159A1 (en) | Electronic cooling apparatus | |
TWM508885U (en) | Electronic device and the liquid cooling type heat dissipation structure thereof | |
TWI457529B (en) | Heat exchanger | |
TW201304667A (en) | Heat dissipating system for electronic device | |
TW201639432A (en) | Enclosure of electronic device | |
KR20190023336A (en) | Slim Type Computer Body Case | |
TWI796122B (en) | Electronic device | |
TW202218523A (en) | Heat dissipation system of portable electronic device | |
JP2009086704A (en) | Electronic device | |
TW200809471A (en) | Fluid providing module and electronic device using the same | |
CN116567986A (en) | Electronic device | |
US11085709B2 (en) | Heat exchange device for closed electrical apparatus | |
JP2004020171A (en) | Cooling device in cabinet for information communication loaded with computer | |
TWM481581U (en) | Integrated water-cooling assembly | |
TWM463384U (en) | All-in-one computer | |
TWI820739B (en) | Heat dissipation structure | |
TWM653042U (en) | Electronic device |