TWI796122B - Electronic device - Google Patents

Abstract

An electronic device includes a casing, a circuit board, and a flow generator, the casing has an accommodation space, a first inlet and an outlet, the first inlet and the outlet are connected to the accommodation space and respectively located at two opposite sides of the casing, the circuit board is located in the accommodation space so as to divide the accommodation space into a first area and a second area, the first inlet corresponds to the first area and the second area , the outlet corresponds to the first area , the flow generator is located in the first area, the casing further has a second inlet connected to the accommodation space and corresponding to the second area.

Description

electronic device

The present invention relates to an electronic device, in particular to an electronic device with an air inlet and an air outlet.

Generally speaking, some electronic components and the like contained in the electronic device (such as a central processing unit) will generate heat energy during operation. In order to prevent the accumulation of heat energy from increasing the operating temperature of the electronic components themselves and the internal environment of the device to an excessively high temperature, most electronic devices are equipped with a heat dissipation system. It is known that air cooling is one of the most common heat dissipation methods, which uses air as a medium to cool objects to be cooled. In some cases, fans can also be introduced into the air-cooling heat dissipation system to create or enhance air flow, so as to achieve the effect of enhanced cooling.

At the same time, with the market trend of electronic products moving towards smaller size and higher performance, the matching heat dissipation system also needs to be able to effectively cool electronic components that generate higher heat energy in an increasingly compact space. Taking ultra-microcomputers as an example, due to the small size of ultra-microcomputers, the configuration in the casing is very compact, and the electronic components in some areas are easily blocked by adjacent components (such as circuit boards) and cannot obtain cooling airflow. In this case, the general method of the system is to increase the fan speed to indirectly affect the temperature in the area that the airflow path cannot reach by improving the heat dissipation of the heat source that the airflow path reaches, but this method is not only limited , There will be noise problems at high fan speeds. When the CPU is running efficiently, the system will further increase the fan speed, making the problem of fan noise more serious.

In view of this, one of the objectives of the present invention is to provide an electronic device that effectively solves the related problems caused by the above-mentioned traditional heat dissipation methods by generating a special airflow distribution. question.

According to some embodiments of the present invention, an electronic device is provided, which includes a casing, a circuit board, and an airflow generator. The housing has an accommodating space, a first air inlet and an air outlet, the first air inlet and the air outlet communicate with the accommodating space and are respectively located on opposite sides of the housing, the circuit board is located in the accommodating space and will accommodate The space area is divided into a first accommodating area and a second accommodating area, the first air inlet corresponds to the first accommodating area and the second accommodating area, and the air outlet corresponds to the first accommodating area, and the airflow generator is located In the first accommodating area, the housing also has a second air inlet, which communicates with the accommodating space and corresponds to the second accommodating area.

According to the electronic device disclosed in the foregoing embodiments of the present invention, since the first air inlet corresponds to the first and second accommodating areas, the air outlet corresponds to the first accommodating area, and the casing also has a first accommodating area corresponding to the second accommodating area. Two air inlets, whereby the airflow generator in the first accommodating area can inhale external air through the first air inlet, and the gas flow generated in the first accommodating area will make the first accommodating area and the second accommodating area The storage area generates a pressure difference, thereby driving the external air to enter the second storage area from the second air inlet connected to the second storage area, whereby the electronic components placed in the first and second storage areas can be Obtain cooling airflow, so that the airflow generator does not need to use the traditional method of increasing the speed to indirectly affect the temperature of the area that the airflow cannot reach, so that it can effectively control the electronic components in different areas at the same time in the lower noise operation mode To dissipate heat.

The above description of the disclosure of the present invention and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the patent application scope of the present invention.

1,1’,1”: electronic device

10: Housing

11: First shell piece

12,12’,12”: the second shell

20: circuit board

30: Airflow generator

41: The first electronic component

42: Second electronic component

43: The third electronic component

111: the first side plate part

112: Second side plate part

121: Second air inlet

122: port opening

1110: The first air inlet

1120: air outlet

S: storage space

A1: The first holding area

A2: Second storage area

A3: Side channel

D1: distance

D2: distance

F: Airflow

H: height

FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present invention.

FIG. 2 is an exploded schematic view of the electronic device in FIG. 1 .

Fig. 3 is a schematic side sectional view along line 3-3 of Fig. 1 .

4-6 are schematic diagrams of the electronic device in FIG. 1 at different viewing angles.

FIG. 7 is a schematic side view of an electronic device according to another embodiment of the present invention.

FIG. 8 is a schematic side sectional view of an electronic device according to another embodiment of the present invention.

Hereinafter, various aspects of the present invention will be described in sufficient detail with some and other embodiments shown in the accompanying drawings, so that those skilled in the art can thoroughly understand and implement the present invention. However, it should be understood that the following description is not intended to limit the present invention to some specific embodiments. On the contrary, it is intended to cover alternatives, modifications, and equivalents within the spirit and scope of the various embodiments as defined by the claims. In addition, for purposes of understanding and viewing, various features in the drawings may not be drawn to actual scale.

Words such as "substantially", "about" and "substantially" may be used in the following text to describe the reasonable or acceptable amount of deviation that may exist in the modified situation or event, but the expected result can still be achieved . Hereinafter, "at least one" may also be used to describe the quantity of the described object, but unless otherwise explicitly stated, it should not be limited to the situation where the quantity is "only one". The term "and/or" may also be used below, which should be understood as including any one and all combinations of one or more of the listed items. Terms such as "connection", "connection", "installation", "fixation", "assembly" and other relative positional relationships of multiple described objects may also be used below, but unless otherwise expressly stated, they should not be limited to the A descriptive object is "connected," "set," "fixed," or "assembled" with another descriptive object directly and without intermediary, and it can be understood that one or more intermediaries may be included between the descriptive objects Condition. Hereinafter, terms such as "communication" may also be used to describe the relationship between two spaces, regions, grooves, passages and/or openings. Unless otherwise specified, "communication" in the following especially refers to the flow of fluids such as air. between the described.

Referring to FIGS. 1-2 , an embodiment of the present invention provides an electronic device 1 , which may include a casing 10 . The casing 10 can be used as an exterior casing of the electronic device 1 and used for accommodating related electronic/non-electronic components. Specifically, the casing 10 may include a first shell 11 and a second shell 12. The first shell 11 may, but is not limited to, have an opening at one end that opens outwards. box-shaped object, the second shell 12 can be, but not limited to, slightly plate-shaped, and the second shell 12 can be detachably assembled to the first shell 11 in any suitable way and cover the opening of the first shell 11 Open your mouth. For example, the second shell 12 can be directly engaged with the first shell 11 or assembled to the first shell 11 by using locking members such as screws and bolts, but the present invention does not use the first shell 11 and the second shell The assembly method of part 12 is limited.

Further, please refer to FIGS. 3-6 following FIGS. 1-2 to understand the content related to the first shell 11 and the second shell 12 in more detail. As shown in the figure, after the first shell 11 and the second shell 12 are assembled, they can jointly define or surround an accommodating space S, and the aforementioned related electronic/non-electronic components can all be accommodated in the accommodating space S. In space S. For example, in this embodiment, the electronic device 1 may further include a circuit board 20 , and the circuit board 20 may be disposed in the accommodating space S. As shown in FIG. Further, the circuit board 20 can be located in the area surrounded by the first shell 11, and roughly divide the accommodation space S into a first accommodation area A1 and a second accommodation area A2, so as to facilitate the accommodation Other electronic/non-electronic components other than the circuit board 20 in the placement space S are allocated spatially.

For example, as shown in the figure, the electronic device 1 of this embodiment may further include a first electronic component 41 and a second electronic component 42 . The first electronic component 41 is, for example, a central processing unit, but the present invention is not limited thereto; for example, in other embodiments, the first electronic component 41 can also be other types of electronic components. The first electronic component 41 can be disposed on the circuit board 20 and disposed in the first accommodating area A1 . The second electronic component 42 is, for example, a hard disk. For example, the second electronic component 42 may be a solid-state storage device suitable for an M.2 connector, but the present invention is not limited thereto; for example, in other embodiments, the second electronic component 42 may also be of other types of electronic components. The second electronic component 42 can be disposed on the other side of the circuit board 20 and disposed in the second accommodating area A2. That is to say, the first electronic component 41 and the second electronic component 42 can be respectively located on opposite sides of the circuit board 20 and located in different regions divided by the circuit board 20 . Moreover, in order to take into account the heat dissipation of the first electronic component 41 and the second electronic component 42 while the first electronic component 41 and the second electronic component 42 are divided into different regions by the circuit board 20, the heat dissipation mechanism adopted by the electronic device 1 has special design.

In detail, it is known that the operation of the central processing unit will generate a large amount of heat energy and affect the operating performance of itself and other surrounding components. Therefore, in the situation where the first electronic component 41 is a central processing unit, the electronic device 1 may further include a The airflow generator 30 is disposed in the first accommodating area A1 , and the first electronic component 41 is interposed between the circuit board 20 and the airflow generator 30 . The airflow generator 30 can be, for example, any suitable radial fan, so as to generate gas flow in the first accommodating area A1. Correspondingly, the housing 10 is respectively provided with air inlets on opposite sides thereof. and an air outlet, so as to ensure that the airflow generated by the airflow generator 30 can cover the first electronic component 41 and the second electronic component 42 . A more detailed description follows.

In this embodiment, the first shell 11 may include a first side plate portion 111 and a second side plate portion 112 . The first side plate portion 111 and the second side plate portion 112 are respectively located on different sides of the first case member 11 . For example, the first side plate portion 111 and the second side plate portion 112 can be opposite to each other and respectively located on opposite sides of the first case member 11 . Moreover, the first side plate portion 111 has at least one first air inlet 1110 connected to the accommodating space S, and the second side plate portion 112 has at least one air outlet 1120 connected to the accommodating space S. The first air inlets 1110 can be, but not limited to, perforations arranged at intervals along a specific direction, but the present invention is not limited to the number and form of the first air inlets 1110 shown in the figure; for example, in other embodiments, the first side plate The number and form of the first air inlet can be adjusted and modified according to actual needs. The air outlets 1120 can be, but not limited to, perforations arranged at intervals along a specific direction, but the present invention is not limited to the number and form of the air outlets 1120 shown in the figure; for example, in other embodiments, the number of air outlets on the second side plate The quantity and form can be adjusted and modified according to actual needs.

The first air inlet 1110 and the air outlet 1120 are respectively located on opposite sides of the first casing 11 (or in other words, opposite sides of the casing 10 ). In this way, the airflow generator 30 can draw external air into the first accommodation area A1 of the accommodation space S through the first air inlet 1110 , thereby generating air from the first air inlet 1110 to the air outlet 1120 in the first accommodation area A1. The air discharged outside flows (the air flow F shown in the figure), and then takes away the heat energy generated by the first electronic component 41 to effectively cool down the first electronic component 41 to maintain or improve the operating performance of the first electronic component 41 Effect.

Furthermore, while the first air inlet 1110 corresponds to the airflow generator 30 in the first accommodating area A1, the first air inlet 1110 also corresponds to the second accommodating area A2. As shown in the figure, the side of the first air inlet 1110 that is relatively far away from the second shell 12 is spaced from the side of the first shell 11 that is relatively far away from the second shell 12 (a distance D1 as shown in the figure), so that A large part of the first air inlet 1110 corresponds to the second accommodation area A2, but part of the first air inlet 1110 also corresponds to the first accommodation area A1, therefore, the first accommodation area A1 of the accommodation space S Both the second accommodating area A2 and the second accommodating area A2 can maintain air communication with the external space through the first air inlet 1110 . However, it should be noted that the distance D1 (or the position and size of the first air inlet 1110 on the first side plate 111 ) can be adjusted according to actual needs, and the present invention is not limited to the content shown in the illustration.

On the other hand, the side of the air outlet 1120 relatively close to the second shell 12 is spaced from the side of the first shell 11 relatively close to the second shell 12 by a distance (distance D2 as shown in the figure), but the air outlet 1120 It only corresponds to the first accommodating area A1 and does not cover the second accommodating area A2. For example, in some embodiments, the air outlet 1120 may not be directly connected to the second accommodating area A2, and this configuration helps to increase the flow rate of the cooling air in the first accommodating area A1. However, it should be noted that the distance D2 (or the position and size of the air outlet 1120 on the second side plate portion 112 ) can be adjusted according to actual needs, and the present invention is not limited to the content shown in the illustration.

In addition, the end edge of the circuit board 20 is spaced apart from the first side plate portion 111 of the first shell member 11, thereby defining a communication between the first accommodating area A1 and the second accommodating area A2 with the first side plate portion 111. The side flow channel A3, whereby the air flow entering the first accommodating area A1 through the first air inlet 1110 can pass through the side flow channel A3 and affect the gas flow in the second accommodating area A2.

In addition, in order to ensure that the influence of the airflow entering the first accommodating area A1 on the second accommodating area A2 can cover the second electronic component 42, the second casing 12 has at least one second airflow connected to the second accommodating area A2. Air inlet 121. The second air inlet 121 can be but not limited to a mesh, but the present invention is not limited to the number and form of the second air inlet 121 shown in the figure; for example, in other embodiments, the number of the second air inlet of the second shell It can be adjusted and modified according to actual needs decorated. The second air inlet 121 can be located on the side of the second shell 12 adjacent to the first air inlet 1110 of the first side plate portion 111, or in other words, the first air inlet 1110 and the second air inlet 121 can be located on the second side respectively. Adjacent two sides of the accommodation area A2. Also, the second air inlet 121 may correspond to the second electronic component 42 . In this way, when the airflow generator 30 draws in external air through the first air inlet 1110, the gas flow generated in the first accommodation area A1 will generate pressure in the first accommodation area A1 and the second accommodation area A2. difference, so that the external air is driven into the second accommodating area A2 from the second air inlet 121 connected to the second accommodating area A2 and passes through the second electronic component 42, and then takes away the accumulated heat energy of the second electronic component 42 to achieve Effective cooling effect of the second electronic component 42 .

With the aforementioned arrangement of the first air inlet 1110, the second air inlet 121 and the air outlet 1120, the first electronic components 41 in the first accommodating area A1 and the second electronic components 42 in the second accommodating area A2 can be The airflow for heat dissipation is obtained, whereby the airflow generator 30 does not need to use the traditional method of increasing the rotation speed to indirectly affect the temperature of the area that the airflow cannot reach, so that it can effectively control the temperature of different areas at the same time in the lower noise operation mode. Electronic components dissipate heat.

Not only that, the aforementioned arrangement of the first air inlet 1110, the second air inlet 121, and the air outlet 1120 can make the airflow generator 30 generate a cooling airflow in the second accommodation area A2 divided by the circuit board 20, and also help to dissipate heat in the second accommodating area A2. The electronic components carried by the second housing part 12 . Specifically, in this embodiment, the second shell 12 of the electronic device 1 can have a height H in appearance, or in other words, a space with a specific depth can be defined or surrounded in the second shell 12 to suit To accommodate at least one third electronic component 43 . The third electronic component 43 can be, for example, a hard disk. For example, the third electronic component 43 may be a solid-state storage device suitable for an M.2 connector, but the present invention is not limited thereto; for example, in other embodiments, the third electronic component 43 may also be of other types of electronic components. In addition, the third electronic component 43 carried by the second casing 12 can be a 2.5-inch internal hard disk, but the present invention is not limited thereto; for example, in other embodiments, the second casing 12 can also carry The two or more third electronic components 43 can be, for example, solid state storage devices with two M.2 connectors.

Since the second shell 12 is of detachable design, the second shell 12 can be The required third electronic component 43 can be disassembled and replaced or added according to the user's requirement, so that the electronic device 1 can expand the required functions. At the same time, since the airflow generator 30 can generate heat-dissipating airflow in the second accommodating area A2, the heat energy generated by the operation of the third electronic component 43 can also be brought to the first accommodating area A1 along with the heat-dissipating airflow, thereby passing through the air outlet 1120 They are exhausted together, so that the electronic device 1 can be equipped with the capability of function expansion, and at the same time, the heat dissipation requirements of the expanded electronic components can also be taken into account.

It should be noted here that the aforementioned second shell 12 and the electronic components carried therein (ie, the third electronic component 43 ) are for illustrative purposes only, and the present invention is not limited to the contents shown in the aforementioned embodiments. For example, referring to FIG. 7 , another embodiment of the present invention proposes an electronic device 1 ', which differs from the electronic device of the previous embodiment only in its second casing 12 ', so the following only focuses on the second Part of the housing 12' is described. As shown in the figure, based on the type of electronic components carried in the second shell 12', at least one connection port opening 122 can be opened on the second shell 12', so that the connection ports of the carried electronic components (not shown) Reference numerals) can be exposed to the outside through the port opening 122 .

Alternatively, in some other embodiments, no electronic components may be carried on the second casing. For example, please refer to Fig. 8, another embodiment of the present invention proposes an electronic device 1 ", and its difference with the electronic device of the preceding embodiment only lies in its second casing 12 ", so the following only focuses on the second The part of the shell 12 ″ will be described. As shown in the figure, the second shell 12 ″ can present a relatively flat plate shape without carrying any electronic components.

According to the electronic device disclosed in the foregoing embodiments of the present invention, since the first air inlet corresponds to the first and second accommodating areas, the air outlet corresponds to the first accommodating area, and the casing also has an opening corresponding to the second accommodating area. The second air inlet, whereby the airflow generator in the first accommodation area can suck in external air through the first air inlet, and the gas flow generated in the first accommodation area will make the first accommodation area and the second The accommodating area generates a pressure difference, thereby driving the external air to enter the second accommodating area from the second air inlet connected to the second accommodating area, whereby the electronic components placed in the first and second accommodating areas are equally The heat dissipation airflow can be obtained, thus, the airflow generator can not use the traditional method of indirect by increasing the rotation speed A means to affect the temperature of areas that cannot be reached by the airflow, so that the electronic components in different areas can be effectively dissipated at the same time in a low-noise operation mode.

Not only that, due to the aforementioned arrangement of the first air inlet, the second air inlet and the air outlet, the airflow generator can generate heat dissipation airflow in the second accommodating area divided by the circuit board, so that the electronic components can be arranged in the second housing. The application of components, plus the second shell is a detachable design, so the second shell can be disassembled according to the user's needs to replace or add the required electronic components, so that the electronic device can be expanded in the function At the same time, the heat dissipation requirements of the expanded electronic components are taken into consideration.

Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Changes and modifications made without departing from the spirit and scope of the present invention all belong to the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.

1: Electronic device

10: Housing

11: First shell piece

12: The second shell

121: Second air inlet

1110: The first air inlet

Claims (10)

An electronic device, comprising: a casing having an accommodating space, a first air inlet and an air outlet, wherein the first air inlet and the air outlet communicate with the accommodating space and are respectively located at opposite sides of the casing two sides; a circuit board, located in the accommodating space and dividing the accommodating space into a first accommodating area and a second accommodating area, wherein the first air inlet corresponds to the first accommodating area and the The second accommodating area, and the air outlet corresponds to the first accommodating area; and an air flow generator, located in the first accommodating area; wherein, the casing also has a second air inlet, the second air inlet The air inlet communicates with the accommodating space and corresponds to the second accommodating area, the first air inlet and the second air inlet are respectively located on adjacent two sides of the housing, the circuit board and the housing are provided with the first One of the first side plate parts of the air inlet is spaced apart to jointly define a side channel connecting the first accommodating area and the second accommodating area, and both the first air inlet and the second air inlet pass through the side The flow channel communicates with the air outlet. The electronic device as claimed in claim 1, wherein the airflow generator is a radial fan. The electronic device according to claim 1, wherein the housing includes a first shell and a second shell, the first air inlet and the air outlet are respectively located on opposite sides of the first shell, the first The two air inlets are located on the second casing, and the second casing is detachably assembled to the first casing to surround the accommodating space together with the first casing. The electronic device as claimed in claim 3, wherein the first casing includes the first side plate portion and a second side plate portion opposite to each other, the first air inlet and the air outlet are respectively located on the first side plate portion and the second side plate portion the second side panel. The electronic device as described in claim 1 further includes a first electronic component and a second electronic component, the first electronic component is located in the first accommodation area and is between the airflow generator and the circuit board, The second electronic component is located in the second accommodating area, and the second air inlet corresponds to the second electronic component. The electronic device according to claim 5, wherein the first air inlet and the second air inlet respectively correspond to adjacent two sides of the second electronic component. The electronic device as claimed in claim 4 further includes at least one electronic component disposed on the second casing. The electronic device according to claim 4, wherein a side of the first air inlet relatively far away from the second casing is spaced from a side of the first casing relatively far away from the second casing. The electronic device according to claim 4, wherein a side of the air outlet relatively close to the second casing is spaced from a side of the first casing relatively close to the second casing. The electronic device according to claim 9, wherein the air outlet is not directly connected to the second accommodating area.

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