JPH08241149A - Cooling structure of electronic equipment device - Google Patents

Abstract

PURPOSE: To locally cool a heat generating body on a package which has high temperature locally by providing air direction plates in the center shelf part of a housing and then securing a mount area without exerting influence on a package mount area. CONSTITUTION: The housing center shelf part 13 is provided with air direction plates 14a and 14b and air is supplied toward the heat generating body 16 on packages 16a and 15b to cool the heat generating body 16 locally. At this time, the air direction plates 14a and 14b secure the mount area without affecting the package mount area by being added in the housing center shelf part 13. The air direction plates 14a and 14b are set above the package 15b in the lowest stage which is mounted horizontal on the housing 9 so that the air does not flow to unnecessary places for cooling such as the space formed between the package 15b in the lowest stage and the bottom plate of the housing. The air direction plate 14b prevents a turbulence in the housing center shelf part 13 together with a shield plate and also prevents the air flow rate from decreasing due to an increase in air ventilation resistance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure which is effective for an electronic device in which packages having different sizes are horizontally mounted at high density and where locally high temperatures are generated.

[0002]

2. Description of the Related Art FIG. 1 is a perspective view showing a conventional cooling structure. In FIG. 1, an overall cooling fan 2 is installed near the air inlet on the front surface of the housing 1, and the air sucked from the front surface of the housing 1 is pumped to the power supply unit 3 and the logic unit 4 and exhausted from the side surface of the housing 1. To do.
At this time, in order to prevent an increase in the ventilation resistance of the wind due to the two obstacles of the guide rail 5 and the housing central shelf portion 6, the guide rail 5 mounting portion of the housing 1 and the housing central shelf portion 6 are Ventilation holes 8 are formed as much as possible around the guide rail 5 as shown in 2 and 3, and the required air volume is supplied to the packages 7e and 7f near the exhaust holes.

[0003]

The above-mentioned conventional technique is shown in FIG.
As shown in FIG. 5, the arrangement interval of the packages 7a to 7f is narrow inside the case, especially in the logic section 4, and it is difficult to secure a flow passage for the wind. Due to such obstacles, the increase in ventilation resistance caused a decrease in air volume. Furthermore, when the whole cooling fan 2 is arranged on the inlet side and the air is pressure-fed to the power supply 3 and the logic unit 4, on the discharge side of the whole cooling fan 2,
The wind speed is directional, and air stagnates inside the housing,
In particular, the heating elements on the packages 7e and 7f mounted at a position farther from the general cooling fan 2 have a locally high temperature portion. An object of the present invention is to provide a cooling structure for an electronic device which is effective for solving the above problems.

[0004]

In order to achieve the above-mentioned object, an air flow direction plate is provided in the space inside the central shelf of the housing, and the heating element on the package at the portion where the air volume drops is locally cooled. The cooling effect was improved. Further, the wind direction plate was arranged so that the wind would not be bypassed to a place unnecessary for cooling, such as a space between the bottom of the package horizontally mounted on the housing and the bottom surface of the housing. Furthermore, a shield plate was provided inside the central shelf of the housing to prevent an increase in ventilation resistance due to the occurrence of turbulence in the central shelf of the housing.

[0005]

According to the above-mentioned means of the present invention, by providing the wind direction plate inside the central shelf of the housing, the mounting area can be secured without affecting the mounting area of the package, and the package becomes locally high in temperature. -It is possible to locally cool the heating element on the top. Further, when a system is adopted in which a fan for cooling the entire body is arranged on the inlet side and pressure is fed to the heat generating portion, the cooling efficiency can be improved by the above-mentioned means.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.

The front side of the casing 9 is the inlet side, and a fan 10 for cooling the whole is installed in the vicinity thereof, and a power source section 11 and a logic section 12 are provided.
It cools by the method of blowing the sucked air to the heat generating part. However, this method has some problems as described above, and a solution to the problem is shown below.

On the central shelf 13 of the housing, the wind direction plate 14
a and 14b are provided, and air is blown in the direction in which the heating elements on the packages 15a and 15b are present.
The heating element 16 on a and 15b is locally cooled. At this time,
The wind direction plates 14a and 14b are added to the inside of the housing central shelf 13 to secure the mounting area without affecting the package mounting area. Also, the wind direction plates 14a and 14b
Is a package at the bottom so that the wind does not bypass to a place unnecessary for cooling, such as a space 17 between the bottom package 15b of the package horizontally mounted on the casing 9 and the bottom of the casing. -Set it higher than J. Further, the wind direction plate 14b, together with the shield plate 18, prevents turbulence from occurring in the housing central shelf portion 13 and prevents a decrease in air volume due to an increase in ventilation resistance.

[0009]

According to the present invention, by providing the wind direction plate inside the central shelf of the housing, the mounting area can be secured without affecting the mounting area of the package, and the package becomes locally high in temperature. It is possible to locally cool the heating element on the heater. Further, by adding the shield plate inside the housing central shelf portion, it is possible to prevent an increase in ventilation resistance due to the occurrence of turbulence in the housing central shelf portion. Furthermore, when a system for arranging a fan for cooling the whole body on the inlet side and pressure-feeding the fan to the heat generating portion, the cooling efficiency can be improved by the above-mentioned means.

[Brief description of drawings]

FIG. 1 is a perspective view of a conventional cooling structure.

FIG. 2 is a detailed view of a conventional cooling structure.

FIG. 3 is a detailed view of a conventional cooling structure.

FIG. 4 is a perspective view of the cooling structure of the present invention.

FIG. 5 is a detailed view of the cooling structure of the present invention.

FIG. 6 is a detailed view of the cooling structure of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Casing 2 ... Whole cooling fan 3 ... Power supply part 4 ... Logic part 5 ... Guide rail 6 ... Casing center shelf part 7a-7f ... Package 8 ... Vent hole 9 ... Casing 10 ... Whole cooling Fan 11 ... Power supply part 12 ... Logic part 13 ... Housing center shelf 14a-14b ... Wind direction plate 15a-15b ... Package 16 ... Heating element 17 ... Space 18 ... Shielding plate

 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Miya ▲ saki ▼ Masayoshi 810 Shimoimaizumi, Ebina City, Kanagawa Prefecture Hitachi Systems Office Systems Division (72) Masao Miyawaki 810 Shimoimaizumi, Ebina City, Ebina, Kanagawa Hitachi Systems Office Systems Division

Claims (5)

[Claims] 1. An electronic device in which a plurality of packages having different sizes are horizontally mounted, and a package is attached to a shelf portion in the center of the housing for mounting the package having a small width, which is a factor of increasing ventilation resistance. A cooling structure characterized by locally cooling the heating element on the package by adding a wind direction plate that blows air in the direction of the heating element on the package. 2. In an electronic device in which packages of different sizes are mounted in high density, the package mounting area is affected by adding the wind direction plate inside the central shelf of the housing. Cooling structure characterized by securing the mounting area without 3. The wind direction plate provided on the shelf in the center of the housing is unnecessary for cooling, such as the space between the bottommost package of the package horizontally mounted on the housing and the bottom surface of the housing. Cooling structure characterized by being installed in a position where the wind does not bypass to various places. 4. A shelf plate in the center of the housing according to any one of claims 1, 2 and 3, wherein a shield plate is added to prevent an increase in ventilation resistance due to the occurrence of turbulence in the shelf part in the housing center. Characteristic cooling structure. 5. When the fan for cooling the whole is arranged on the inlet side and pressure-fed to the heat generating portion, air stagnates inside the housing because the wind speed is directional on the outlet side of the fan. . At this time, the cooling efficiency is improved by adding the above-mentioned claims 1, 2, 3, and 4 to the housing.